CN108258145B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN108258145B CN108258145B CN201810039512.7A CN201810039512A CN108258145B CN 108258145 B CN108258145 B CN 108258145B CN 201810039512 A CN201810039512 A CN 201810039512A CN 108258145 B CN108258145 B CN 108258145B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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Abstract
The invention discloses a display panel and a display device, wherein the display panel comprises a display substrate and a thin film packaging layer packaged on the display substrate; the display substrate is divided into a display area and a non-display area, a cofferdam area is arranged in the non-display area, a first groove is formed in the display substrate of the cofferdam area, and the edge of the thin film packaging layer is packaged in the first groove. The display panel comprises a display substrate and a thin film packaging layer packaged on the display substrate, wherein a first groove is formed in a cofferdam area of a non-display area of the display substrate, the edge of the thin film packaging layer is packaged in the first groove, the edge of the thin film packaging layer is prevented from being directly contacted with the surface of the display substrate, and the thin film packaging layer is prevented from being separated from the display substrate in the cutting or bending process of the display panel. The packaging success rate is improved, and meanwhile, the product yield is also improved.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
In the process of manufacturing Quantum Dot Light Emitting Diodes (QLED) devices or Organic Light Emitting Diodes (OLED) devices, cracks are likely to occur on display devices during cutting processing, and some cracks may further spread to one side close to a display area, resulting in separation of the edge of an encapsulation layer from a display substrate, causing failure of encapsulation, and further causing poor display.
In the prior art, in order to prevent cracks generated by cutting from spreading to the display area and causing packaging failure, grooves 1' are generally formed in the peripheral area of the display panel, as shown in fig. 1, however, the grooves cannot completely prevent the cracks from spreading to the display area and causing packaging failure. When the display panel is subjected to cutting stress or bent, the edge of the film packaging layer is packaged on the surface of the display substrate, and the edge of the packaging layer is separated from the display substrate in the cutting or bending process, so that packaging failure is caused, and poor display is further caused.
Disclosure of Invention
The invention provides a display panel and a display device, which aim to solve the problem of packaging failure caused by separation of the edge of a packaging layer from a display substrate in the prior art.
In a first aspect, the present invention provides a display panel, including a display substrate and a thin film encapsulation layer encapsulated on the display substrate;
the display substrate is divided into a display area and a non-display area, a cofferdam area is arranged in the non-display area, a first groove is formed in the display substrate of the cofferdam area, and the edge of the thin film packaging layer is packaged in the first groove.
Optionally, the display substrate includes a substrate and at least one cofferdam located above the substrate in the cofferdam region, the first groove is located on the substrate on a side of the cofferdam away from the display region, and a depth of the first groove is smaller than a thickness of the substrate.
Optionally, the display substrate includes a substrate and at least one cofferdam located above the substrate in the cofferdam area, the first groove is located at the top of the cofferdam far away from the display area, and the depth of the first groove is smaller than the thickness of the cofferdam.
Optionally, an encapsulation component is further disposed in the first groove, and the encapsulation component covers an edge of the thin film encapsulation layer.
Optionally, the encapsulation component is an inorganic encapsulation component.
Optionally, the number of the cofferdams is two, and a second groove is arranged at least at one of the following positions:
the cofferdam is arranged on the substrate between the cofferdams, on the substrate at one side of the cofferdam close to the display area and close to the top of the cofferdam of the display area;
wherein the thin film encapsulation layer covers the second groove.
Optionally, the cofferdam is arranged in an orthographic projection area of the substrate, a third groove is arranged on the substrate, and an organic material is filled in the third groove.
Optionally, a pixel defining layer is arranged on the substrate of the display area;
the pixel defining layer is arranged in an orthographic projection area on the substrate, a fourth groove is arranged on the substrate, and the fourth groove is filled with the material of the pixel defining layer.
Optionally, the thin film encapsulation layer comprises at least two inorganic thin film encapsulation layers.
In a second aspect, the invention further provides a display device comprising the display panel.
Compared with the prior art, the embodiment of the invention has the following advantages:
the display panel comprises a display substrate and a thin film packaging layer packaged on the display substrate, wherein a first groove is formed in a cofferdam area of a non-display area of the display substrate, the edge of the thin film packaging layer is packaged in the first groove, the edge of the thin film packaging layer is prevented from being directly contacted with the surface of the display substrate, and the thin film packaging layer is prevented from being separated from the display substrate in the cutting or bending process of the display panel. The packaging success rate is improved, and meanwhile, the product yield is also improved.
Drawings
FIG. 1 is a schematic diagram of a prior art display panel;
fig. 2 is a schematic structural diagram of a display panel according to an embodiment of the invention;
fig. 3 is a schematic structural diagram of another display panel according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention provides a display panel, which comprises a display substrate and a film packaging layer packaged on the display substrate, wherein the display substrate is divided into a display area and a non-display area, the non-display area is usually arranged around the display area, a weir area is arranged in the non-display area, a first groove is arranged on the display substrate of the weir area, and the edge of the film packaging layer is packaged in the first groove.
It is understood that, in the cofferdam area, the display substrate may include a substrate and one or more cofferdams located on the substrate, the first groove may be located on the substrate or on the cofferdam, of course, if other structures are also located on the substrate in the cofferdam area, the first groove may also be located on other structures, and the specific position of the first groove is not limited in the present invention.
The display panel comprises a display substrate and a film packaging layer packaged on the display substrate, wherein a first groove is formed in a cofferdam area of a non-display area of the display substrate, the edge of the film packaging layer is packaged in the first groove, the edge of the film packaging layer is prevented from being directly contacted with the surface of the display substrate, and the film packaging layer is prevented from being separated from the display substrate in the cutting or bending process of the display panel. The packaging success rate is improved, and meanwhile, the product yield is also improved.
In one embodiment of the present invention, as shown in fig. 2, the display panel includes a display substrate and a thin film encapsulation layer 4 encapsulated on the display substrate. The display substrate is divided into a display area 1 and a non-display area 2, and a weir area 21 is provided in the non-display area 2.
The display substrate comprises a substrate 51 and at least one cofferdam 211 arranged above the substrate in the cofferdam area 21, and the first groove 31 is arranged on the substrate at the side of the cofferdam 211 far away from the display area. It is understood that the depth of the first groove 31 is smaller than the thickness of the substrate, specifically, the substrate 51 may include a multi-layer structure of a substrate 511, a barrier layer 512, a gate insulating layer 513, an interlayer insulating layer 514, a first passivation layer 515, and the like, and the present invention is not limited to the specific structure of the substrate 51, and the first groove 31 may extend into any layer structure of the substrate 51. In this way, encapsulating the edge of the thin film encapsulation layer 4 inside the substrate 51 may effectively prevent the edge of the thin film encapsulation layer 4 from peeling off from the substrate 51 due to the diffusion of the cutting stress, or may effectively prevent peeling from occurring between the multilayer encapsulation film engagement surfaces (e.g., the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42) of the thin film encapsulation layer 4.
Further, a packaging component 311 is further disposed in the first groove 31, the packaging component 311 covers the edge of the film packaging layer 4 to seal the edge of the film packaging layer 4, so that water and oxygen can be effectively prevented from entering the display panel to cause packaging failure, especially when the packaging component is bent, the edge of the film packaging layer 4 is easily separated from the display substrate by a stress interface, and a joint surface between multiple layers of packaging films is easily separated. The encapsulation member may be an organic encapsulation member, an inorganic encapsulation member, or a hybrid of inorganic and organic encapsulation members, but generally inorganic encapsulation members are more effective against water oxygen ingress.
Further, two banks 211 are provided on the substrate 51 of the bank area 21, and the second groove 32 is provided at least at one of the following positions: on the substrate 51 between the banks 211, on the substrate 51 at a side of the banks 211 close to the display region 1, and on the top of the banks 211, and the thin film encapsulation layer 4 covers the second recess 32 and is encapsulated in the first recess 31. The length of the film packaging layer can be increased by the arrangement of the second groove 32, the contact area between the film packaging layer 4 and the display substrate is increased, the influence of cutting cracks on the packaging film is effectively prevented, the water and oxygen running path can be further increased, and the influence of water and oxygen on the display device is prevented. Moreover, the second grooves 32 between or on both sides of the banks 211 can disperse the cutting stress, preventing the cutting cracks from spreading to the display region 1; the second groove 32 located at the top of the dam 211 can enhance the flexibility of the display substrate, and the thin film encapsulation layer is not easily separated from the display substrate when the display panel is bent.
It is understood that the depth of the second groove 32 on the substrate 51 is smaller than the thickness of the substrate 51 at its corresponding position; the depth of second recess 32 at the top of dam 211 is less than the thickness of dam 211.
Further, the bank 211 is provided with a third groove 33 on the substrate 51 in the orthographic projection region on the substrate 51, the third groove 33 is filled with an organic material, the filled organic material may be specifically the same as the material of the bank 211, and the organic material has a function of absorbing stress, so that the cutting crack can be further prevented from being diffused to the display region. It will be appreciated that the depth of the third recess 33 should be less than the thickness of the substrate 51 at the location corresponding to the third recess 33.
Further, a pixel defining layer 11 is provided on the substrate 51 of the display region 1. The pixel defining layer 11 is provided with a fourth groove 34 on the substrate 51 in the orthographic projection region on the substrate 51, and the fourth groove 34 is filled with the material of the pixel defining layer 11. The fourth groove 34 is added in the display area to further disperse the stress and enhance the flexibility of the display panel, and meanwhile, the material of the pixel defining layer 11 is usually an organic material, which also has the function of absorbing the stress and further prevents the cutting stress from affecting the display area. It is understood that the depth of the fourth groove 34 is smaller than the thickness of the substrate 51 at the corresponding position of the fourth groove 34.
In another embodiment of the present invention, as shown in fig. 3, the display panel includes a display substrate and a thin film encapsulation layer 4 encapsulated on the display substrate. The display substrate is divided into a display area 1 and a non-display area 2, and a weir area 21 is provided in the non-display area 2.
The display substrate comprises a substrate 51 and at least one cofferdam 211 positioned above the substrate 51 in the cofferdam area 21, the first groove 31 is positioned at the top of the cofferdam 211 far away from the display area 1, and the depth of the first groove 31 is less than the thickness of the cofferdam 211. The edges of the film packaging layer 4 are packaged in the grooves at the top of the cofferdam 21, so that the edges of the film packaging layer 4 can be effectively prevented from being peeled from the substrate 51 due to the diffusion of cutting stress.
Further, a packaging component 311 is further disposed in the first groove 31, the packaging component 311 covers the edge of the film packaging layer 4 to seal the edge of the film packaging layer 4, so as to effectively prevent water and oxygen from entering the display panel to cause packaging failure, especially when the display panel is bent, the edge of the film packaging layer 4 is easily separated from the display substrate by a stress interface, and the connecting surface of the multilayer packaging film is easily separated. The encapsulation member may be an organic encapsulation member, an inorganic encapsulation member, or a hybrid of inorganic and organic encapsulation members, but generally inorganic encapsulation members are more effective against water oxygen ingress.
Further, two banks 211 are provided on the substrate 51 of the bank area 21, and the second groove 32 is provided at least at one of the following positions: the substrate 51 between the banks 211, the substrate 51 at the side of the banks 211 adjacent to the display area 1, and the top of the banks 211 adjacent to the display area 1, and the thin film encapsulation layer 4 covers the second recess 32 and is encapsulated in the first recess 31. The length of the film packaging layer 4 can be increased by the arrangement of the second groove 32, the contact area between the film packaging layer 4 and the display substrate is increased, the influence of cutting cracks on the packaging film is effectively prevented, the water and oxygen running path can be further increased, and the influence of water and oxygen on the display device is prevented. Moreover, the second grooves 32 located between or on both sides of the banks 211 can disperse the cutting stress, preventing the cutting cracks from spreading toward the display region 1; the second groove 32 located at the top of the dam 211 can enhance the flexibility of the display substrate, and the thin film encapsulation layer is not easily separated from the display substrate when the display panel is bent.
It is understood that the depth of the second groove 32 on the substrate 51 is smaller than the thickness of the substrate 51 at its corresponding position; the depth of second recess 32 at the top of dam 211 is less than the thickness of dam 211.
Further, the bank 211 is provided with a third groove 33 on the substrate 51 in the orthographic projection region on the substrate 51, the third groove 33 is filled with an organic material, the filled organic material may be specifically the same as the material of the bank 211, and the organic material has a function of absorbing stress, so that the cutting crack can be further prevented from being diffused to the display region 1. It will be appreciated that the depth of the third recess 33 should be less than the thickness of the substrate 51 at the location corresponding to the third recess 33.
Furthermore, a pixel defining layer 11 is further provided on the substrate 51 of the display region 1, a fourth groove 34 is provided on the substrate 51 in an orthographic projection region of the pixel defining layer 11 on the substrate 51, and the fourth groove 34 is filled with the material of the pixel defining layer 11. The fourth groove 34 is added in the display area to further disperse the stress and enhance the flexibility of the display panel, and meanwhile, the material of the pixel defining layer 11 is usually an organic material, which also has the function of absorbing the stress and further prevents the cutting stress from affecting the display area. It is understood that the depth of the fourth groove 34 is smaller than the thickness of the substrate 51 at the corresponding position of the fourth groove 34.
The film encapsulation layer 4 of the above embodiment at least includes two inorganic film encapsulation layers, such as a first inorganic encapsulation layer 41 and a second inorganic encapsulation layer 42 shown in fig. 2 and fig. 3, and an organic encapsulation layer 43 may be further disposed between the two inorganic encapsulation layers, and an interface joint of the first inorganic encapsulation layer 41 and the second inorganic encapsulation layer 42 is located in the first groove 31 and encapsulated by the encapsulation component 311. The thin film encapsulation layer 4 is not limited to the three-layer structure, and may be a thin film encapsulation layer composed of a plurality of organic and/or inorganic thin films.
The display panel in the above embodiment may be a display base panel of an OLED, or may also be a display panel of a QLED, and the present invention is not limited thereto, and may also be a flexible display panel, or may also be a non-flexible display panel, and the present invention is not limited thereto.
The embodiment of the invention also provides a display device, which comprises the display panel of the embodiment, and the display device can be any product or component with a display function, such as a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator, electronic paper and the like.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system embodiment, since it is basically similar to the method embodiment, the description is simple, and for the relevant points, refer to the partial description of the method embodiment.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The display panel is characterized by comprising a display substrate and a thin film packaging layer packaged on the display substrate;
the display substrate is divided into a display area and a non-display area, a cofferdam area is arranged in the non-display area, the display substrate comprises a substrate and at least one cofferdam arranged above the substrate in the cofferdam area, a first groove is arranged on the substrate on one side of the cofferdam far away from the display area or on the top of the cofferdam far away from the display area, and the edge of the thin film packaging layer is packaged in the first groove.
2. The display panel according to claim 1, wherein when the first groove is located on the substrate on the side of the dam away from the display area, the depth of the first groove is smaller than the thickness of the substrate.
3. The display panel according to claim 1, wherein when the first groove is located at the top of the bank away from the display region, the depth of the first groove is smaller than the thickness of the bank.
4. The display panel according to claim 2 or 3, wherein an encapsulation member is further disposed in the first groove, and the encapsulation member covers an edge of the thin film encapsulation layer.
5. The display panel according to claim 4, wherein the sealing member is an inorganic sealing member.
6. The display panel according to claim 4, wherein the number of the banks is two, and the second groove is provided at least at one of the following positions:
the cofferdam is arranged on the substrate between the cofferdams, on the substrate at one side of the cofferdam close to the display area and close to the top of the cofferdam of the display area;
wherein the thin film encapsulation layer covers the second groove.
7. The display panel according to claim 6, wherein the bank is in an orthographic projection area on the substrate, a third groove is provided on the substrate, and an interior of the third groove is filled with an organic material.
8. The display panel according to claim 7, wherein the display region has a pixel defining layer on a substrate;
the pixel defining layer is arranged in an orthographic projection area on the substrate, a fourth groove is arranged on the substrate, and the fourth groove is filled with the material of the pixel defining layer.
9. The display panel of claim 1, wherein the thin film encapsulation layer comprises at least two inorganic thin film encapsulation layers.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
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CN201810039512.7A CN108258145B (en) | 2018-01-16 | 2018-01-16 | Display panel and display device |
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CN108258145B true CN108258145B (en) | 2020-04-10 |
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CN108364987B (en) * | 2018-02-24 | 2021-01-26 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
CN109065749A (en) * | 2018-07-23 | 2018-12-21 | 武汉华星光电半导体显示技术有限公司 | OLED display |
CN109461837A (en) * | 2018-10-17 | 2019-03-12 | 武汉华星光电半导体显示技术有限公司 | A kind of OLED thin-film packing structure |
CN110176474B (en) | 2018-11-16 | 2022-04-15 | 京东方科技集团股份有限公司 | Display panel, manufacturing method thereof and display device |
CN109585680B (en) * | 2018-12-03 | 2020-04-10 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED panel |
WO2020118626A1 (en) * | 2018-12-13 | 2020-06-18 | 深圳市柔宇科技有限公司 | Flexible display panel and flexible display apparatus |
CN110211995A (en) * | 2019-05-24 | 2019-09-06 | 昆山国显光电有限公司 | Display panel |
CN110335961A (en) * | 2019-06-19 | 2019-10-15 | 武汉华星光电半导体显示技术有限公司 | Luminescent panel and display device |
CN110416266B (en) * | 2019-07-29 | 2022-07-22 | 京东方科技集团股份有限公司 | Display substrate and display panel comprising same |
CN110391350B (en) * | 2019-07-29 | 2022-08-05 | 云谷(固安)科技有限公司 | Display panel and display device |
CN110600515B (en) * | 2019-08-29 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Foldable display panel |
CN110635064A (en) * | 2019-09-24 | 2019-12-31 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
CN110797377A (en) * | 2019-10-11 | 2020-02-14 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
CN111162097B (en) * | 2020-01-03 | 2022-03-29 | 武汉天马微电子有限公司 | Display panel and display device |
CN114639792A (en) * | 2020-11-30 | 2022-06-17 | 京东方科技集团股份有限公司 | Display panel, display device and manufacturing method |
CN113517328B (en) * | 2021-07-12 | 2024-06-18 | 京东方科技集团股份有限公司 | Display panel and display device |
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CN103474561B (en) * | 2013-09-10 | 2016-08-10 | 京东方科技集团股份有限公司 | A kind of encapsulating structure of OLED |
CN203481275U (en) * | 2013-09-10 | 2014-03-12 | 京东方科技集团股份有限公司 | Packaging structure of OLED device |
KR102250048B1 (en) * | 2014-09-16 | 2021-05-11 | 삼성디스플레이 주식회사 | Organic light emitting display device |
CN106876428B (en) * | 2017-02-03 | 2019-10-08 | 上海天马微电子有限公司 | flexible display panel, manufacturing method thereof and display device |
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