CN112366193B - 一种桥接芯片及半导体封装结构 - Google Patents
一种桥接芯片及半导体封装结构 Download PDFInfo
- Publication number
- CN112366193B CN112366193B CN202011204446.8A CN202011204446A CN112366193B CN 112366193 B CN112366193 B CN 112366193B CN 202011204446 A CN202011204446 A CN 202011204446A CN 112366193 B CN112366193 B CN 112366193B
- Authority
- CN
- China
- Prior art keywords
- chip
- wiring layer
- power supply
- layer group
- bridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011204446.8A CN112366193B (zh) | 2020-11-02 | 2020-11-02 | 一种桥接芯片及半导体封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011204446.8A CN112366193B (zh) | 2020-11-02 | 2020-11-02 | 一种桥接芯片及半导体封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112366193A CN112366193A (zh) | 2021-02-12 |
CN112366193B true CN112366193B (zh) | 2021-09-17 |
Family
ID=74512634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011204446.8A Active CN112366193B (zh) | 2020-11-02 | 2020-11-02 | 一种桥接芯片及半导体封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112366193B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113506791A (zh) * | 2021-07-09 | 2021-10-15 | 世芯电子(上海)有限公司 | 一种基于冗余金属的电磁防护方法 |
CN113887732B (zh) * | 2021-09-24 | 2022-07-26 | 材料科学姑苏实验室 | 一种量子芯片及抑制量子芯片中信号串扰的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101131976A (zh) * | 2006-08-23 | 2008-02-27 | 恩益禧电子股份有限公司 | 半导体装置及半导体封装件 |
CN104103600A (zh) * | 2013-04-15 | 2014-10-15 | 株式会社东芝 | 半导体封装体 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8773866B2 (en) * | 2010-12-10 | 2014-07-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Radio-frequency packaging with reduced RF loss |
CN105374793A (zh) * | 2013-05-08 | 2016-03-02 | 日月光半导体制造股份有限公司 | 具桥接结构的半导体封装构造及其制造方法 |
CN205320364U (zh) * | 2015-11-13 | 2016-06-15 | 唐水 | 一种pcb板结构 |
CN105428347A (zh) * | 2015-12-28 | 2016-03-23 | 中南大学 | 一种微系统三维芯片叠层封装的改进方法 |
CN109087905B (zh) * | 2017-06-14 | 2020-09-29 | 创意电子股份有限公司 | 半导体封装装置及其半导体配线基板 |
-
2020
- 2020-11-02 CN CN202011204446.8A patent/CN112366193B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101131976A (zh) * | 2006-08-23 | 2008-02-27 | 恩益禧电子股份有限公司 | 半导体装置及半导体封装件 |
CN104103600A (zh) * | 2013-04-15 | 2014-10-15 | 株式会社东芝 | 半导体封装体 |
Also Published As
Publication number | Publication date |
---|---|
CN112366193A (zh) | 2021-02-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10804139B2 (en) | Semiconductor system | |
US10229900B2 (en) | Semiconductor memory device including stacked chips and memory module having the same | |
US7456505B2 (en) | Integrated circuit chip and integrated device | |
CN109087905B (zh) | 半导体封装装置及其半导体配线基板 | |
CN112366193B (zh) | 一种桥接芯片及半导体封装结构 | |
US6011695A (en) | External bus interface printed circuit board routing for a ball grid array integrated circuit package | |
US10490506B2 (en) | Packaged chip and signal transmission method based on packaged chip | |
US10418315B2 (en) | Semiconductor device and manufacturing method thereof | |
US9811627B2 (en) | Method of component partitions on system on chip and device thereof | |
US20120127774A1 (en) | Semiconductor device and electronic device | |
US11682627B2 (en) | Semiconductor package including an interposer | |
CN112366194B (zh) | 一种桥接芯片及半导体封装结构 | |
US6662250B1 (en) | Optimized routing strategy for multiple synchronous bus groups | |
CN110911384A (zh) | 一种嵌入式无源桥接芯片及其应用 | |
US11916042B2 (en) | Semiconductor package having chip stack | |
CN109509737B (zh) | 电子封装构件以及电路布局结构 | |
KR20100104855A (ko) | 퓨즈를 포함하는 반도체 소자 패키지 | |
US9318470B2 (en) | Semiconductor device | |
US11901300B2 (en) | Universal interposer for a semiconductor package | |
CN211376635U (zh) | 一种嵌入式无源桥接芯片及其封装结构 | |
CN217426742U (zh) | 电子器件 | |
US20230238359A1 (en) | Semiconductor package | |
US11869846B1 (en) | Interposer routing structure and semiconductor package | |
KR100732123B1 (ko) | 고밀도 플립-칩 상호접속 | |
WO2024088210A1 (en) | Dense via pitch interconnect to increase wiring density |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: He Yongsong Inventor after: Chen Xiaoqiang Inventor after: Yu Jinjin Inventor after: Qin Zheng Inventor after: Gu Donghua Inventor after: Yin Pengyue Inventor after: Chai Jing Inventor after: Qiu Xuesong Inventor before: He Yongsong Inventor before: Chen Xiaoqiang Inventor before: Yu Jinjin Inventor before: Qin Zheng Inventor before: Gu Donghua Inventor before: Yin Pengyue Inventor before: Chai Jing Inventor before: Qiu Xuesong |
|
GR01 | Patent grant | ||
GR01 | Patent grant |