CN112351849A - Pcbn烧结坯 - Google Patents
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
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- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
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Abstract
本申请是在可以被用来制造切削工具的细粒立方氮化硼烧结坯上的新改善。所述坯包含至少80体积％cBN以及金属粘结剂体系并在HPHT条件下烧结。所述改善在所述金属粘结剂体系中引入了铝的合金。本发明在铸铁的机加工中被证明是有益的。
Description
发明内容
多晶立方氮化硼(PcBN)坯(compact)包含以体积百分比计约80％至约95％的cBN；以及金属粘结剂体系。所述PcBN坯在将铸铁和类似的化学反应性部件机加工中尤其有用。
附图说明
图1是切削元件的总示意图。
图2是与线扫描对照的材料立方氮化硼(cBN)和WC的横截面图的对比组合。
图3是反应区内微结构的图像。
图4是反应区内微结构的图像。
背景技术
通过高压/高温(HP/HT)工序制造cBN是本领域中已知的并被在美国专利号2947617中解释。在美国专利41888194中描述了在没有催化剂存在时利用热解的六方氮化硼(HBN)制造烧结的多晶cBN坯的工序。对这样的直接转化工序的改进在美国专利号4289503中被描述，其中在所述转化工序之前从HBN粉末的表面移除了硼氧化物。
在切削器领域中使用的坯包含大量以自粘结关系、借助于粘结介质或借助于其组合而粘结在一起的磨粒。复合坯是粘结至基底材料例如硬质合金的坯。美国专利号3918219描述了六方氮化硼(HBN)与碳化物块接触时向cBN催化转化以形成复合cBN坯。坯或复合坯可以用在用于切削工具、钻头、修整工具和耐磨部件的毛坯(blanks)中。
具体实施方式
在低于溶剂闪点的温度下干燥掺合的混合物以移除溶剂例如异丙醇、丙酮。随后将粉末粒化以有助于进一步加工。可以修改该掺合材料的组成使得成分的相对含量符合所需的范围。
可以用例如上文所述本领域中广为人知的常规HPHT技术和装置来烧结所述粉末。在难熔的金属杯例如Ta或Nb中装载所述粉末。所述杯的尺寸限制了最终烧结坯的尺寸。如本领域已知的，粉末或坯中的背衬基底材料可以被装载入所述杯中以原位粘结至所述烧结cBN坯。适合的基底包括，例如，硬质合金例如具有钴(Co)或其它VIII族粘结剂的碳化钨(WC)。在所述基底的边缘压弯所述杯材料来密封所述杯。在本发明中，选择硬质合金基底的组成来改善所述切削工具的性能。
该密封的杯组件随后被装载到由压力传递和压力密封材料组成的高压腔室(cell)中，然后经受高压例如4.5-6.5GPa和高于1200℃的高温10-40分钟以烧结所述粉末混合物并将其粘结至所述基底。从所述腔室移除所述烧结毛坯并机加工以移除所述杯材料并将其变成所需的尺寸。例如通过放电加工(EDM)或通过激光来切削所完成的毛坯，变成适合于制造用于对粉末金属铁和其它类似材料进行机加工的切削工具的形状和尺寸。所描述的烧结毛坯的尺寸和形状可以通过改变部件的尺寸而变化并且在尺寸方面主要受限于用来促进所述烧结工序的高压/高温(HPHT)设备。
所述烧结cBN坯产物包含在约80体积％和95体积％之间的具有小于5微米(μm)的平均尺寸的cBN颗粒，剩余部分为均匀分散在所述cBN颗粒之间的由所述粘结剂相组成的材料。在所述HPHT工序期间，在研磨和掺合步骤中添加至所述粉末中的含铝化合物开始与所述立方氮化硼反应并且开始烧结。源自所述硬质合金基底的钴和铬也在HPHT期间液化并渗入粉末床，消除了任何孔隙并进一步有助于烧结。
图1呈现了切削元件的总示意图，包含基底和PcBN材料层。所述PcBN材料层包含在第一表面处的工作面。在相反的第二表面处，所述PcBN材料层烧结至所述基底。所述PcBN材料层具有的组成包含cBN；含铝化合物；VIII族粘结剂金属或其合金；和来自V族、VI族或VII族的金属。在一个实例中，所述PcBN材料层具有的组成包含钴和铬。
切削元件100包含基底102和PcBN材料层104，它们在界面106接触。超硬材料层104中远离界面106的区域110具有的组成基本上是块状(bulk)超硬材料。在所述界面106的附近，存在扩散区112。所述扩散区在例如通过在高温和高压(HPHT)下的加工进行制造期间形成。在制造期间，在压力和温度下，所述基底102中的VIII族粘结剂金属渗入至超硬材料层104内，导致源自基底102的VIII族粘结剂金属移动进入所述超硬材料层104。这导致所述扩散区112富含VIII族粘结剂金属。与所述VIII族粘结剂金属的移动一起，也存在于所述基底的来自V族、VI族或VII族的金属从所述基底迁移至所述PcBN材料层内。在所述基底102和所述扩散区112中，所述V族、VI族或VII族金属作为与VIII族金属的合金存在。在PcBN材料110的本体(bulk)中，所述V族、VI族或VII族金属作为与铝的合金存在。
图2呈现了与线扫描202对照的材料立方氮化硼(cBN)和WC的横截面图201的对比组合200。切削元件的示例性实施方式的横截面的扫描电子显微镜或SEM显微图201显示了基底250、超硬材料层210、基底和超硬材料层的界面230、反应区220和消耗区。所述反应区220从所述层与基底250的界面230向着所述切削元件的工作面延伸入所述超硬材料层210内。
从图片的左侧210到图片的右侧250，显示了各种材料的浓度。最显著的变化发生在所述cBN层210和所述WC层250之间的界面230处。位于图片201下方的是一系列线扫描202，其呈现了包含在所述cBN层区、所述WC层区和其间的也被称为扩散区的界面区域内的铝260、钴270、钨280和铬290的量的图示。以每秒计数测量的所述线扫描202的强度是所显示的材料有多少的量度，在此情形中铝260、钴270、钨280和铬290呈现在所测试材料(在此情形中是cBN和WC层)上。所述线扫描202从左侧210进行到右侧250并直接对应于图片201，使得在所述图片的任何给定位置，直接位于图片201下方的对应线扫描202显示了所述材料的组成。
图2突出显示了包含在所述样品材料中的钴(Co)270。所述线扫描在强度上随着所述线扫描和所述样品的长度而变化，在位于或靠近界面275处具有最大的强度和波动，在界面275处所述cBN与所述WC相交于230。水平的白线240显示了用来收集显示于下图中的EDS线扫描的位置。所述工作面会在所述图像210左侧更远的位置。图2还突出显示了包含在所述样品材料中的铬(Cr)290。所述线扫描在强度上随着所述线扫描和所述样品的长度而变化，在位于或靠近界面295处具有最大的强度和波动。所述钴扫描线和所述铬扫描线两者在右侧的WC基底内彼此同步或一致地波动，显示了所述钴和所述镍在所述WC基底内合金化而在一起。类似的合金化也发生扩散层中靠近所述WC界面处。
图2还突出显示了包含在所述样品中的铝260和铬280。所述铝线扫描260的峰值最高点在线扫描265的最左侧，对应于所述样品的最左侧部分，其最远离所述cBN与WC界面230。所述铬290的峰值最高点也在所述线扫描293的最左侧，对应于所述样品的最左侧部分，其最远离所述cBN与WC界面230。这显示了所述铬和铝在所述cBN层210的本体中合金化而在一起。
铝水平在最接近于最远离所述界面的cBN层处达到峰值。第一实施方式在高浓度的cBN材料中进行了钴和铬的渗入。这包含含有基底、烧结至所述基底的cBN层的多晶烧结体，所述层包含在第一表面处的工作面，以及从所述基底的界面向着所述工作面延伸入所述cBN层内的扩散区。其中，所述cBN层由80-95体积％cBN；包含铝化钛、铝化镍和/或铝的铝源；以及与所述基底中的VIII族粘结剂金属混合的铬或其合金组成，其中所述铬在所述扩散层中与VIII族粘结剂金属合金化，且所述铬在远离所述界面的PcBN层的工作面处与铝合金化。铬的替代物是其它V族、VI族或VII族金属。
图3呈现了在2000x SEM尺寸310和10微米的比例尺320下反应区中的微结构的图像300。所述图像证明cBN浓度在WC/cBN界面350处低得多，这显示了钴和铬从所述硬质合金基底渗入了所述cBN层。该SEM图像显示了在顶部330处的pCBN层和在底部340处的WC基底。
图4呈现了在5000x SEM图像410和1微米的比例尺420下反应区中的微结构的图像400。较低部分显示了所述硬质WC基底，其中最亮的相440是WC且微暗的相430是Co和铬(430的放置在图中是错误的，在WC基底和cBN层两者中都可能包含430)。较高部分显示了所述多晶cBN材料。最暗区域是cBN颗粒。较浅的灰色是在界面450处从所述基底渗入的钴和铬。
在一个实施方式中，多晶烧结体由80-95体积％cBN；包含铝化钛、铝化镍和/或铝的铝源；以及在HPHT期间作为液相渗入所述cBN层的至少一种VIII族金属和至少一种V族、VI族或VII族金属组成。所述渗入金属可以作为金属盘(metal disk)或作为所述硬质合金基底中的组分(component)或作为两者的组合提供。
在另一个实施方式中，结合上述实施方式的元件的改善方案包含由80-95体积％cBN；包含铝化钛、铝化镍和/或铝的铝源组成的多晶烧结体，其中所述cBN层烧结至硬质合金基底并且铬在所述硬质合金的界面附近作为铬和钴的合金存在。此处，铬在工作面处作为铬和铝的合金存在。
性能测试证明了本发明的实施方式、实现以及新的和新颖的益处。使用以下条件在铸铁研磨中评价材料：
轴向和径向前角＝5度
导程角＝15度
Vc＝1000m/分钟
f＝0.1mm
Ap＝0.5mm
Ae＝52.37mm
常规材料(在HPHT期间只有钴渗入)在平均八次中由于崩刃而损坏。所述示例性材料(使用了与在常规材料中一致的粉末组合物。在HPHT期间的钴和铬的渗入伴随着在工作面处铝和铬的合金化)在平均十次中由于崩刃而损坏。该在工具寿命上的增加显示了本发明材料在断裂韧性上的增加。尽管本发明参照优选实施方式进行描述，但本领域技术人员将理解，在不背离本发明范围的情况下，可以做出各种改变并可以用等同物取代其要素。此外，可以做出许多修改以使特定的情形或材料适应于本发明的教导而不背离其基本范围。因此，意图是本发明不限于作为设想为进行本发明的最佳模式公开的特定实施方式，而是本发明将包括落入所附权利要求书范围内的所有实施方式。在此申请中，所有单位都是公制体系的并且所有的量和百分比均以重量计，除非另有明确说明。另外，本文提及的所有参考文献明确地通过引用并入本文。
Claims (20)
1.一种多晶烧结体(100)，包含：
80-95体积％cBN；
包含铝化钛、铝化镍、铝中至少一种的铝源；以及
至少一种VIII族金属和至少一种V族、VI族或VII族金属。
2.根据权利要求1所述的多晶烧结体(100)，其中所述VIII族金属是Fe、Co或Ni中的一种，且所述V族、VI族或VII族金属是V、Cr或Mn中的一种。
3.根据权利要求1所述的多晶烧结体(100)，其中所述VIII族金属是Co，且所述V族、VI族或VII族金属是Cr。
4.根据权利要求1所述的多晶烧结体(100)，其中在硬质合金基底中所述V族、VI族或VII族金属作为与VIII族金属的合金存在。
5.根据权利要求1所述的多晶烧结体(100)，其中在从硬质合金基底界面延伸入PcBN层(210)内的扩散层(230)中所述V族、VI族或VII族金属作为与VIII族金属的合金存在。
6.根据权利要求5所述的多晶烧结体(100)，其中在所述界面(230)处铬作为铬与钴的合金存在。
7.根据权利要求6所述的多晶烧结体(100)，其中在远离所述界面(230)的所述PcBN层(210)中所述V族、VI族或VII族金属作为与铝的合金存在。
8.根据权利要求1所述的多晶烧结体(100)，其中
所述金属包含来自Co、Cr、Mn、Fe、V和Ni的至少两种金属。
9.根据权利要求1所述的多晶烧结体(100)，其中所述至少两种金属渗入所述cBN层(210)。
10.根据权利要求1所述的多晶烧结体(100)，其中所述cBN层(210)渗入在液相中发生。
11.根据权利要求1所述的多晶烧结体(100)，其中所述在液相中的渗入在高温高压下发生。
12.根据权利要求1所述的多晶烧结体(100)，其中所述渗入金属作为至少一个金属盘提供。
13.根据权利要求1所述的多晶烧结体(100)，其中所述渗入金属作为在所述硬质合金基底中的组分提供。
14.根据权利要求1所述的多晶烧结体(100)，其中所述渗入金属作为金属盘且作为所述硬质合金基底中的组分提供。
15.根据权利要求6所述的多晶烧结体(100)，其中铬在所述硬质合金界面附近存在。
16.根据权利要求1所述的多晶烧结体(100)，其中所述cBN层(210)被烧结至硬质合金基底。
17.根据权利要求1所述的多晶烧结体(100)，其中铬在包含铬与铝的合金的工作面处存在。
18.一种多晶烧结体(100)，包含
80-95体积％cBN；
铝源；
硬质合金界面；以及
工作面。
19.一种多晶烧结体(100)，其中所述铝源还包含铝化钛、铝化镍和铝中的至少一种。
20.根据权利要求1所述的多晶烧结体(100)，其中所述铝源还包含铝化钛、铝化镍和铝中的至少一种。
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| PCT/US2018/039932 WO2020005247A1 (en) | 2018-06-28 | 2018-06-28 | Pcbn sintered compact |
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| EP (1) | EP3814041A1 (zh) |
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| WO2020005247A1 (en) | 2020-01-02 |
| JP7269967B2 (ja) | 2023-05-09 |
| KR20210025018A (ko) | 2021-03-08 |
| EP3814041A1 (en) | 2021-05-05 |
| US20210254197A1 (en) | 2021-08-19 |
| KR102472999B1 (ko) | 2022-11-30 |
| US11976345B2 (en) | 2024-05-07 |
| JP2021529720A (ja) | 2021-11-04 |
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