CN112351623B - Semiconductor power device protection device - Google Patents
Semiconductor power device protection device Download PDFInfo
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- CN112351623B CN112351623B CN202011300400.6A CN202011300400A CN112351623B CN 112351623 B CN112351623 B CN 112351623B CN 202011300400 A CN202011300400 A CN 202011300400A CN 112351623 B CN112351623 B CN 112351623B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
Abstract
The invention discloses a semiconductor power device protection device, which comprises a bottom box, wherein the bottom box comprises a bottom plate, a door-shaped plate is welded on the upper surface of the bottom plate, a connecting plate is welded on the inner bottom of the door-shaped plate, a supporting column is welded on the inner top wall of the door-shaped plate, a spring is arranged on the outer wall of the supporting column, the lower end of the spring is welded with the connecting plate, a semiconductor power device body is arranged on the upper surface of the door-shaped plate, a pin is arranged on the right side wall of the semiconductor power device body, a pair of first stand columns are arranged on the front surface of the semiconductor power device body, a pair of second stand columns are arranged on the back surface of the semiconductor power device body, the pair of second stand columns and the pair of first stand columns are both welded on the upper surface of the door-shaped plate, an upper cover is arranged above the bottom box and comprises a convex plate, an indicating column is welded on the front surface of the convex plate, and the indicating column is matched with the upper cover, the semiconductor power device body can be prevented from being directly exposed in the air and damaged, and the deformation phenomenon of the pins can be prevented.
Description
Technical Field
The invention relates to the technical field of semiconductor power devices, in particular to a protection device for a semiconductor power device.
Background
The semiconductor power device is mainly used for high-power electronic devices in the aspects of electric energy conversion and control circuits of power equipment, the power device is almost used in all electronic manufacturing industries, including notebooks, PCs, servers, displays, various instruments, various control equipment and the like in the field of computers, the power device can play an effective energy-saving role besides ensuring the normal operation of the equipment, and the conventional semiconductor power device is easy to damage because no protective cover is directly exposed in the air during storage, and pins of the semiconductor power device are easy to deform, so that the normal operation of the semiconductor power device is influenced.
Disclosure of Invention
The invention provides a semiconductor power device protection device, which aims to solve the problems in the prior art.
In order to solve the problems, the invention adopts the following technical scheme:
a semiconductor power device protection device comprises a bottom box, a connecting plate, a supporting column, a semiconductor power device body and an upper cover.
The bottom box comprises a bottom plate, the upper surface of the bottom plate is welded with a door-shaped plate, the upper surface of the door-shaped plate is welded with a pair of second stand columns and a pair of first stand columns, the pair of first stand columns are located on the front side of the semiconductor power device body, the pair of second stand columns are located on the back side of the semiconductor power device body, the bottom box and the upper cover are conveniently connected together through the design of the pair of second stand columns and the pair of first stand columns, and dust is prevented from entering the surface of the semiconductor power device body.
Wherein, the connection plate is welded at the inner bottom of the door profile.
Wherein, the support column welding is in the interior roof of door template, be provided with the spring on the outer wall of support column, the lower extreme and the linking plate welding of spring are in the same place, utilize the spring to take place the characteristics that deformation removed external force can the automatic reconversion under the exogenic action, make the spring can play the effect of buffering to the semiconductor power device body when suffering the striking.
The semiconductor power device body is arranged on the upper surface of the door-shaped plate, and a pin is arranged on the right side wall of the semiconductor power device body.
As a preferred scheme of the present invention, the upper cover is located above the bottom case, the upper cover includes a convex plate, the upper cover and the bottom case are conveniently assembled and disassembled by designing the convex plate, the front of the convex plate is welded with the indication column, the front of the upper cover is quickly aligned by designing the indication column, and meanwhile, when the upper cover is opened, the upper cover and the bottom case can be conveniently separated by applying a vertical upward force to the indication column.
As a preferable aspect of the present invention, the bottom of the convex plate is provided with a placement groove, the placement groove and the semiconductor power device body are matched with each other, the bottom of the convex plate is provided with a pair of first mounting holes and a pair of second mounting holes, the pair of first mounting holes corresponds to the pair of first pillars one to one, the pair of first mounting holes is matched with the pair of first pillars, the pair of second mounting holes corresponds to the pair of second pillars one to one, and the pair of second mounting holes is matched with the pair of second pillars.
As a preferable scheme of the present invention, a first sliding groove is formed in an upper surface of the door-shaped plate, the first sliding groove is located on a front surface of the semiconductor power device body, a first sliding block is slidably connected in the first sliding groove, and a first positioning hole is formed in an upper surface of the first sliding block.
As a preferable scheme of the present invention, the bottom of the convex plate is provided with a first slot, the first slot is matched with the first chute and the first slider, the inner top of the first slot is welded with a first positioning column, and the first positioning column is matched with the first positioning hole.
As a preferable scheme of the present invention, the upper surface of the door plate is provided with a second sliding groove, the second sliding groove is located on the back surface of the semiconductor power device body, the second sliding groove is connected with a second sliding block in a sliding manner, the upper surface of the second sliding block is provided with a second positioning hole, and the back surface of the first sliding block and the front surface of the second sliding block are both provided with a first fastening column.
As a preferable scheme of the present invention, the bottom of the convex plate is provided with a second slot, the second slot is matched with the second chute and the second slider, the inner top of the second slot is welded with a second positioning column, the second positioning column is matched with the second positioning hole, the front surface and the back surface of the inner wall of the placement slot are both provided with first through holes, and the first through holes are matched with the first fastening columns.
As a preferable scheme of the present invention, the upper surface of the door plate is provided with a pair of third sliding grooves, the pair of third sliding grooves are slidably connected with a pair of third sliding blocks, the upper surfaces of the pair of third sliding blocks are provided with a pair of third positioning holes, the right side walls of the pair of third sliding blocks are welded with a pair of second fastening posts, the bottom of the convex plate is provided with a pair of third clamping grooves, the pair of third clamping grooves are matched with the pair of third sliding grooves and the pair of third sliding blocks, the inner tops of the pair of third clamping grooves are welded with a pair of third positioning posts, the pair of third positioning posts are matched with the pair of third positioning holes, the left side of the inner wall of the placing groove is provided with a pair of second through holes, and the pair of second through holes are matched with the pair of second fastening posts.
As a preferable aspect of the present invention, the upper surface of the door plate is provided with a pair of fourth sliding grooves, the pair of fourth sliding grooves are slidably connected with a pair of fourth sliding blocks, the upper surfaces of the pair of fourth sliding blocks are provided with a pair of fourth positioning holes, the bottom of the convex plate is provided with a pair of fourth clamping grooves, the pair of fourth clamping grooves are matched with the pair of fourth sliding grooves and the pair of fourth sliding blocks, the pair of fourth positioning columns are welded at the inner tops of the pair of fourth clamping grooves, the pair of fourth positioning columns are matched with the pair of fourth positioning holes, the right side of the inner wall of the placing groove is provided with a third through hole, and the third through hole is matched with the pins.
Compared with the prior art, the invention has the advantages that:
(1) aligning the pins with the third through holes, placing the semiconductor power device body in the placing groove, when the semiconductor power device body is placed in the placing groove, the first slide block is pushed to the direction of the semiconductor power device body on the first slide groove, the second slide block is pushed to the direction of the semiconductor power device body on the second slide groove, the first fastening column penetrates through the first through hole, and therefore the clamping effect is achieved on the front surface and the back surface of the semiconductor power device body, a pair of third sliding blocks are respectively pushed towards the direction of the semiconductor power device body on the pair of third sliding grooves until the pair of second fastening columns pass through the pair of second through holes, so that the left side wall of the semiconductor power device body is clamped, and a pair of fourth sliding blocks is pushed towards the direction of the semiconductor power device body through the pair of fourth sliding grooves, so that the right ends of the pins can be protected.
(2) Utilize mutual matching between standing groove and the semiconductor power device body, can place the semiconductor power device body in the standing groove, convenient storage through the cooperation each other between a pair of first mounting hole and a pair of first stand, between a pair of second mounting hole and a pair of second stand, can be in the same place upper cover and end box equipment, thereby prevent that the semiconductor power device body from directly exposing in the air and receiving the damage.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1 according to the present invention;
FIG. 3 is a schematic side view of the present invention;
FIG. 4 is a schematic diagram of an upper cover structure according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a bottom case according to an embodiment of the present invention;
fig. 6 is an enlarged view of the structure at B in fig. 5 according to the present invention.
The reference numbers in the figures illustrate:
1. a connector tile; 2. a support pillar; 3. a spring; 4. a semiconductor power device body; 5. a pin; 6. a bottom case; 61. a first chute; 62. a first slider; 63. a first positioning hole; 64. a first fastening post; 65. a second chute; 66. a second slider; 67. a second positioning hole; 68. a pair of first uprights; 69. a pair of second uprights; 610. a pair of third chutes; 611. a pair of third sliders; 612. a pair of third positioning holes; 613. a pair of second fastening posts; 614. a pair of fourth chutes; 615. a pair of fourth sliders; 616. a pair of fourth positioning holes; 617. a base plate; 618. a door profile; 7. an upper cover; 71. a placement groove; 72. a first through hole; 73. a pair of second through holes; 74. a third through hole; 75. a first card slot; 76. a first positioning post; 77. a second card slot; 78. a second positioning column; 79. a pair of third card slots; 710. a pair of third positioning columns; 711. a pair of fourth card slots; 712. a pair of fourth positioning columns; 713. an indicator column; 714. a pair of first mounting holes; 715. a pair of second mounting holes; 716. a convex plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b):
referring to fig. 1-6, a semiconductor power device protection apparatus comprises a bottom case 6, a connection board 1, a support pillar 2, a semiconductor power device body 4 and an upper cover 7.
The bottom box 6 comprises a bottom plate 617, a door-shaped plate 618 is welded on the upper surface of the bottom plate 617, a pair of second upright columns 69 and a pair of first upright columns 68 are welded on the upper surface of the door-shaped plate 618, the pair of first upright columns 68 are located on the front surface of the semiconductor power device body 4, the pair of second upright columns 69 are located on the back surface of the semiconductor power device body 4, the bottom box 6 and the upper cover 7 are conveniently connected together through the design of the pair of second upright columns 69 and the pair of first upright columns 68, and dust is prevented from entering the surface of the semiconductor power device body 4.
Wherein the connector tiles 1 are welded to the inner bottom of the door profile 618.
Wherein, support column 2 welds the interior roof of door template 618, is provided with spring 3 on the outer wall of support column 2, and the lower extreme of spring 3 is in the same place with linking up fishplate bar 1 welding, utilizes spring 3 to take place the characteristics that deformation removed external force can automatic recovery original state under the exogenic action, makes spring 3 can play the effect of buffering to the semiconductor power device body 4 when suffering the striking.
The semiconductor power device body 4 is disposed on the upper surface of the gate plate 618, and the right side wall of the semiconductor power device body 4 is provided with a pin 5.
Wherein, the upper cover 7 is located the top of end box 6, and the upper cover 7 includes convex plate 716, through the design to convex plate 716, makes things convenient for the equipment and the dismantlement of upper cover 7 and end box 6, and the front welding of convex plate 716 has indication post 713, and through the design to indication post 713, the front of finding upper cover 7 fast, simultaneously, when opening the upper cover 7, can be through applying a vertical ascending power to indication post 713, conveniently separate upper cover 7 and end box 6.
Specifically, the bottom of the convex plate 716 is provided with a placement groove 71, the placement groove 71 is matched with the semiconductor power device body 4, the bottom of the convex plate 716 is provided with a pair of first mounting holes 714 and a pair of second mounting holes 715, the pair of first mounting holes 714 is in one-to-one correspondence with the pair of first vertical columns 68, the pair of first mounting holes 714 is matched with the pair of first vertical columns 68, the pair of second mounting holes 715 is in one-to-one correspondence with the pair of second vertical columns 69, and the pair of second mounting holes 715 is matched with the pair of second vertical columns 69.
In a further embodiment, the semiconductor power device body 4 can be placed in the placement groove 71 for storage convenience by utilizing the mutual matching between the placement groove 71 and the semiconductor power device body 4, and the upper cover 7 and the bottom case 6 can be assembled together by the mutual matching between the pair of first mounting holes 714 and the pair of first vertical posts 68 and between the pair of second mounting holes 715 and the pair of second vertical posts 69, so that the semiconductor power device body 4 is prevented from being directly exposed in the air and damaged.
Specifically, the upper surface of the door-shaped plate 618 is provided with a first sliding groove 61, the first sliding groove 61 is located on the front surface of the semiconductor power device body 4, a first sliding block 62 is slidably connected in the first sliding groove 61, and the upper surface of the first sliding block 62 is provided with a first positioning hole 63.
In a further embodiment, the first sliding groove 61 and the first sliding block 62 are matched with each other, so that the front surface of the semiconductor power device body 4 can be clamped, and the semiconductor power device body 4 is prevented from shaking in the conveying process.
Specifically, the bottom of the convex plate 716 is provided with a first clamping groove 75, the first clamping groove 75 is matched with the first sliding groove 61 and the first sliding block 62, the inner top of the first clamping groove 75 is welded with a first positioning column 76, and the first positioning column 76 is matched with the first positioning hole 63.
In a further embodiment, the first clamping groove 75, the first sliding groove 61 and the first sliding block 62 are matched with each other, so that the first clamping groove 75, the first sliding groove 61 and the first sliding block 62 can be clamped together, and the first sliding block 62 can be fixed by matching the first positioning column 76 with the first positioning hole 63, so that the first sliding block 62 is prevented from sliding.
Specifically, the upper surface of the door-shaped plate 618 is provided with a second sliding groove 65, the second sliding groove 65 is located on the back surface of the semiconductor power device body 4, a second sliding block 66 is connected in the second sliding groove 65 in a sliding manner, the upper surface of the second sliding block 66 is provided with a second positioning hole 67, and the back surface of the first sliding block 62 and the front surface of the second sliding block 66 are both provided with first fastening columns 64.
In a further embodiment, the second sliding groove 65 and the second sliding block 66 cooperate with each other to clamp the back surface of the semiconductor power device body 4.
Specifically, the bottom of the convex plate 716 is provided with a second clamping groove 77, the second clamping groove 77 is matched with the second sliding groove 65 and the second sliding block 66, the second positioning column 78 is welded at the inner top of the second clamping groove 77, the second positioning column 78 is matched with the second positioning hole 67, the front surface and the back surface of the inner wall of the placing groove 71 are provided with a first through hole 72, and the first through hole 72 is matched with the first fastening column 64.
In a further embodiment, the second slot 77, the second sliding groove 65 and the second slider 66 can be clamped together by the mutual matching between the second slot 77, the second sliding groove 65 and the second slider 66, the second slider 66 can be fixed by the mutual matching between the second positioning column 78 and the second positioning hole 67, and the second slider 66 is prevented from sliding, when the semiconductor power device body 4 is placed in the placing groove 71, the first slider 62 is pushed in the direction of the semiconductor power device body 4 on the first sliding groove 61, the second slider 66 is pushed in the direction of the semiconductor power device body 4 on the second sliding groove 65, so that the first fastening column 64 penetrates through the first through hole 72, and the front surface and the back surface of the semiconductor power device body 4 are clamped.
Specifically, the upper surface of the door-shaped plate 618 is provided with a pair of third sliding grooves 610, the pair of third sliding grooves 610 is located on the left side of the semiconductor power device body 4, the pair of third sliding grooves 610 is connected with a pair of third sliding blocks 611 in a sliding manner, the pair of third sliding blocks 611 corresponds to the pair of third sliding grooves 610 one by one, the upper surface of the pair of third sliding blocks 611 is provided with a pair of third positioning holes 612, the pair of third positioning holes 612 corresponds to the pair of third sliding blocks 611 one by one, the right side walls of the pair of third sliding blocks 611 are welded with a pair of second fastening posts 613, and the pair of third sliding blocks 611 corresponds to the pair of second fastening posts 613 one by one.
In a further embodiment, the left side wall of the semiconductor power device body 4 can be clamped by the cooperation between the pair of third sliding grooves 610 and the pair of third sliding blocks 611.
Specifically, the bottom of the convex plate 716 is provided with a pair of third slots 79, the pair of third slots 79 are matched with the pair of third sliding grooves 610 and the pair of third sliding blocks 611, the pair of third positioning posts 710 are welded on the inner tops of the pair of third slots 79, the pair of third positioning posts 710 is matched with the pair of third positioning holes 612, the left side of the inner wall of the placement groove 71 is provided with a pair of second through holes 73, and the pair of second through holes 73 is matched with the pair of second fastening posts 613.
In a further embodiment, the pair of third locking grooves 79, the pair of third sliding grooves 610 and the pair of third sliding blocks 611 can be locked together by the mutual matching between the pair of third locking grooves 79, the pair of third sliding grooves 610 and the pair of third sliding blocks 611, the pair of third sliding blocks 611 can be fixed by the mutual matching between the pair of third positioning posts 710 and the pair of third positioning holes 612, the sliding phenomenon of the pair of third sliding blocks 611 is prevented, and when the semiconductor power device body 4 is placed in the placing groove 71, the pair of third sliding blocks 611 are respectively pushed towards the direction of the semiconductor power device body 4 on the pair of third sliding grooves 610 until the pair of second fastening posts 613 pass through the pair of second through holes 73.
Specifically, the upper surface of the door-shaped plate 618 is provided with a pair of fourth sliding grooves 614, the pair of fourth sliding grooves 614 is located on the right side of the semiconductor power device body 4, the pair of fourth sliding grooves 614 is connected with a pair of fourth sliding blocks 615 in a sliding manner, the pair of fourth sliding blocks 615 corresponds to the pair of fourth sliding grooves 614 one by one, the upper surface of the pair of fourth sliding blocks 615 is provided with a pair of fourth positioning holes 616, and the pair of fourth positioning holes 616 corresponds to the pair of fourth sliding blocks 615 one by one.
In a further embodiment, the right side wall of the semiconductor power device body 4 can be clamped by the mutual cooperation between the pair of fourth sliders 615 and the pair of fourth sliding grooves 614.
Specifically, a pair of fourth clamping grooves 711 are formed in the bottom of the convex plate 716, the pair of fourth clamping grooves 711 are matched with the pair of fourth sliding grooves 614 and the pair of fourth sliding blocks 615, a pair of fourth positioning columns 712 are welded to the inner tops of the pair of fourth clamping grooves 711, the pair of fourth positioning columns 712 is matched with the pair of fourth positioning holes 616, a third through hole 74 is formed in the right side of the inner wall of the placing groove 71, and the third through hole 74 is matched with the pins 5.
In a further embodiment, the pair of fourth card slots 711, the pair of fourth sliding grooves 614 and the pair of fourth sliding blocks 615 can be clamped together by the mutual matching between the pair of fourth card slots 711, the pair of fourth sliding grooves 614 and the pair of fourth sliding blocks 615, the pair of fourth sliding blocks 615 can be fixed by the mutual matching between the pair of fourth positioning columns 712 and the pair of fourth positioning holes 616, the sliding phenomenon of the pair of fourth sliding blocks 615 can be prevented, and the pins 5 are located in the third through holes 74 by the mutual matching between the third through holes 74 and the pins 5, so that the pins 5 can be prevented from being deformed, and the normal operation of the semiconductor power device can be influenced.
The working principle of the embodiment is as follows:
through the mutual matching between the third through holes 74 and the pins 5, the pins 5 are aligned with the third through holes 74, then the semiconductor power device body 4 is placed in the placement groove 71, when the semiconductor power device body 4 is placed in the placement groove 71, the first slider 62 is pushed in the direction of the semiconductor power device body 4 on the first sliding groove 61, the second slider 66 is pushed in the direction of the semiconductor power device body 4 on the second sliding groove 65, the first fastening column 64 passes through the first through hole 72, thereby playing a role in clamping the front and back of the semiconductor power device body 4, the pair of third sliders 611 are respectively pushed in the direction of the semiconductor power device body 4 on the pair of third sliding grooves 610, until the pair of second fastening columns 613 pass through the pair of second through holes 73, thereby playing a role in clamping the left side wall of the semiconductor power device body 4, the pair of fourth sliders 615 are pushed in the direction of the semiconductor power device body 4 on the pair of fourth sliding grooves 614, the right end of the pin 5 can be protected;
the first slider 62, the second slider 66, the pair of third sliders 611, and the pair of fourth sliders 615 can be fixed by the mutual matching between the first positioning post 76 and the first positioning hole 63, between the second positioning hole 67 and the second positioning post 78, between the pair of third positioning holes 612 and the pair of third positioning posts 710, and between the pair of fourth positioning holes 616 and the pair of fourth positioning posts 712, so as to prevent the first slider 62, the second slider 66, the pair of third sliders 611, and the pair of fourth sliders 615 from sliding, and the upper cover 7 and the bottom case 6 can be assembled together by the mutual matching between the pair of first mounting holes 714 and the pair of first posts 68, and between the pair of second mounting holes 715 and the pair of second posts 69, so as to prevent the semiconductor power device body 4 from being damaged by being directly exposed in the air.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to cover the technical scope of the present invention, the technical solutions and the modifications thereof according to the present invention within the technical scope of the present invention.
Claims (5)
1. A semiconductor power device protection device comprises a bottom box (6), and is characterized in that: the bottom box (6) comprises a bottom plate (617), a door-shaped plate (618) is welded on the upper surface of the bottom plate (617), a connecting plate (1) is welded on the inner bottom of the door-shaped plate (618), a supporting column (2) is welded on the inner top wall of the door-shaped plate (618), a spring (3) is arranged on the outer wall of the supporting column (2), the lower end of the spring (3) is welded with the connecting plate (1), a semiconductor power device body (4) is arranged on the upper surface of the door-shaped plate (618), a pin (5) is arranged on the right side wall of the semiconductor power device body (4), a pair of first upright posts (68) is arranged on the front surface of the semiconductor power device body (4), a pair of second upright posts (69) is arranged on the back surface of the semiconductor power device body (4), and the pair of second upright posts (69) and the pair of first upright posts (68) are welded on the upper surface of the door-shaped plate (618), an upper cover (7) is arranged above the bottom box (6), the upper cover (7) comprises a convex plate (716), and an indicating column (713) is welded on the front side of the convex plate (716);
a placing groove (71) is formed in the bottom of the convex plate (716), the placing groove (71) is matched with the semiconductor power device body (4), a pair of first mounting holes (714) and a pair of second mounting holes (715) are formed in the bottom of the convex plate (716), the pair of first mounting holes (714) is in one-to-one correspondence with the pair of first upright posts (68), the pair of first mounting holes (714) is matched with the pair of first upright posts (68), the pair of second mounting holes (715) is in one-to-one correspondence with the pair of second upright posts (69), and the pair of second mounting holes (715) is matched with the pair of second upright posts (69);
a first sliding groove (61) is formed in the upper surface of the door-shaped plate (618), the first sliding groove (61) is located on the front surface of the semiconductor power device body (4), a first sliding block (62) is connected in the first sliding groove (61) in a sliding mode, and a first positioning hole (63) is formed in the upper surface of the first sliding block (62);
first draw-in groove (75) have been opened to the bottom of convex plate (716), match each other between first draw-in groove (75) and first spout (61), first slider (62), the welding of the inside top of first draw-in groove (75) has first locating column (76), match each other between first locating column (76) and first locating hole (63).
2. A semiconductor power device protection arrangement according to claim 1, characterized by: the upper surface of door template (618) is provided with second spout (65), second spout (65) are located the back of semiconductor power device body (4), sliding connection has second slider (66) in second spout (65), the upper surface of second slider (66) is opened has second locating hole (67), the back of first slider (62) and the front of second slider (66) all are provided with first fastening post (64).
3. A semiconductor power device protection apparatus according to claim 2, wherein: the bottom of convex plate (716) is opened there is second draw-in groove (77), match each other between second draw-in groove (77) and second spout (65), second slider (66), the welding of the internal top of second draw-in groove (77) has second reference column (78), match each other between second reference column (78) and second locating hole (67), first through-hole (72) have all been opened with the back to the inner wall front of standing groove (71), match each other between first through-hole (72) and first fastening post (64).
4. A semiconductor power device protection arrangement according to claim 1, characterized by: a pair of third sliding grooves (610) are arranged on the upper surface of the door-shaped plate (618), a pair of third sliding blocks (611) are connected in the pair of third sliding grooves (610) in a sliding manner, a pair of third positioning holes (612) are formed on the upper surfaces of the pair of third sliding blocks (611), a pair of second fastening columns (613) are welded on the right side walls of the pair of third sliding blocks (611), the bottom of the convex plate (716) is provided with a pair of third clamping grooves (79), the pair of third clamping grooves (79) are matched with the pair of third sliding grooves (610) and the pair of third sliding blocks (611), a pair of third positioning columns (710) are welded at the inner tops of the pair of third clamping grooves (79), the pair of third positioning columns (710) and the pair of third positioning holes (612) are matched with each other, a pair of second through holes (73) are formed on the left side of the inner wall of the placing groove (71), the pair of second through holes (73) and the pair of second fastening posts (613) are matched with each other.
5. A semiconductor power device protection arrangement according to claim 1, characterized by: the upper surface of the door-shaped plate (618) is provided with a pair of fourth sliding grooves (614), the pair of fourth sliding grooves (614) is connected with a pair of fourth sliding blocks (615) in a sliding mode, the upper surfaces of the pair of fourth sliding blocks (615) are provided with a pair of fourth positioning holes (616), the bottom of the convex plate (716) is provided with a pair of fourth clamping grooves (711), the pair of fourth sliding grooves (614) and the pair of fourth sliding blocks (615) are matched with each other, the inner tops of the pair of fourth clamping grooves (711) are welded with a pair of fourth positioning columns (712), the pair of fourth positioning columns (712) and the pair of fourth positioning holes (616) are matched with each other, the right side of the inner wall of the placing groove (71) is provided with a third through hole (74), and the third through hole (74) and the pin (5) are matched with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011300400.6A CN112351623B (en) | 2020-11-19 | 2020-11-19 | Semiconductor power device protection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011300400.6A CN112351623B (en) | 2020-11-19 | 2020-11-19 | Semiconductor power device protection device |
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| Publication Number | Publication Date |
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| CN112351623A CN112351623A (en) | 2021-02-09 |
| CN112351623B true CN112351623B (en) | 2021-11-19 |
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| CN202011300400.6A Active CN112351623B (en) | 2020-11-19 | 2020-11-19 | Semiconductor power device protection device |
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