CN111048473A - Control chip mounting base of control system - Google Patents
Control chip mounting base of control system Download PDFInfo
- Publication number
- CN111048473A CN111048473A CN201911396025.7A CN201911396025A CN111048473A CN 111048473 A CN111048473 A CN 111048473A CN 201911396025 A CN201911396025 A CN 201911396025A CN 111048473 A CN111048473 A CN 111048473A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- chip
- plate
- control system
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000006835 compression Effects 0.000 claims abstract description 13
- 238000007906 compression Methods 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 6
- 239000012634 fragment Substances 0.000 description 11
- 238000001125 extrusion Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
Abstract
The invention relates to a control chip mounting seat of a control system, belonging to the field of chip mounting, which comprises a base and a mounting plate fixedly connected at the upper end of the base, wherein the mounting plate is chiseled inside with a mounting groove, the periphery of the mounting plate is chiseled with a plurality of uniformly distributed pin grooves, a cover plate is arranged above the base, four corners of the lower end of the cover plate are fixedly connected with positioning columns, four corners of the upper end of the mounting plate are chiseled with positioning grooves matched with the positioning columns, the positioning columns comprise two elastic sheets fixedly connected with the cover plate, the outer ends of the lower sides of the two elastic sheets are fixedly connected with bulges, one end of the two elastic sheets close to each other is fixedly connected with a compression spring, the upper ends of the left and the right of the base are fixedly connected with compression rods, the compression rods are positioned outside the, the chip is convenient to replace, and the damage to the chip in the replacement process is effectively reduced.
Description
Technical Field
The present disclosure relates to chip mounting seats, and particularly to a control chip mounting seat for a control system.
Background
Chips, also known as microcircuits, microchips, integrated circuits. Refers to a silicon chip containing integrated circuits, which has a small volume and is often a part of a computer or other electronic devices, and is a general term for semiconductor device products.
The existing electronic chip is directly fixed on the PCB board through glue, the chip is required to be replaced, the operation is troublesome, and the chip is easily damaged due to uneven stress when the chip is detached due to the fixing effect of the glue.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a control chip mounting seat of a control system.
In order to achieve the purpose, the invention adopts the technical scheme that:
a control chip mounting seat of a control system comprises a base and a mounting plate fixedly connected to the upper end of the base, wherein a mounting groove is formed in the mounting plate in a chiseled mode, a plurality of pin grooves which are uniformly distributed are formed in the periphery of the mounting plate, a cover plate is arranged above the base, positioning columns are fixedly connected to four corners of the lower end of the cover plate, positioning grooves matched with the positioning columns are formed in the four corners of the upper end of the mounting plate in a chiseled mode, the positioning columns comprise two elastic pieces fixedly connected with the cover plate, the outer ends of the lower sides of the two elastic pieces are fixedly connected with bulges, one ends, close to each other, of the two elastic pieces are fixedly connected with compression springs, compression rods are fixedly connected to the upper ends of the left and the right of the base and are positioned outside the mounting plate, pull rings are rotatably connected, effectively reduce the damage to the chip in the replacement process.
Furthermore, compression spring is spherical structure, and the shell fragment is vertical half-cylinder structure, and the reference column of being convenient for can not produce great friction when inserting and extracting the constant head tank in, the dismouting of the chip in this mount pad of being convenient for.
Furthermore, the shell fragment can also be set to the surface and be the columnar structure, and the section of shell fragment internal surface sets up for the inclined plane big end up down, effectively guarantees when inserting the reference column into the constant head tank, and two shell fragments receive the extrusion back, can have certain inside extruded space, are convenient for insert and extract.
Further, apron lower extreme fixedly connected with heat-conducting plate, it has a plurality of evenly distributed's louvre to cut on the apron, and the heat-conducting plate can in time be upwards guided the heat that the chip produced in the course of the work, and later upwards discharge through the louvre.
Further, bottom end fixedly connected with bottom plate in the mounting groove, the bottom plate is made for thermal-insulated material, can effectively restrain the heat transmission downwards that the chip produced in the course of the work through the bottom plate to effectively avoid the heat that the chip produced to influence the normal operating of chip place circuit.
Further, the distance between the upper surface of the base plate and the bottom end of the pin groove is smaller than the thickness of the chip, so that after the chip is installed in the installation groove, pins on the chip can be normally placed in the pin groove, the situation that the pins are loosened due to the fact that the pins are extruded by the bottom end of the pin groove is effectively avoided, and the service life of the chip is effectively guaranteed.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
(1) the scheme of the invention can realize the convenience for the installation and the disassembly of the chip and the replacement of the chip, and effectively reduce the damage to the chip in the replacement process;
(2) compression spring is spherical structure, and the shell fragment is vertical half-cylinder structure, and the reference column of being convenient for can not produce great friction when inserting and extracting the constant head tank in, the dismouting of the chip in this mount pad of being convenient for.
(3) The shell fragment can also be set to the surface and be the columnar structure, and the cross-section of shell fragment internal surface is big end up's inclined plane setting down, effectively guarantees when inserting the reference column in the constant head tank, and two shell fragments receive the extrusion back, can have certain inside extruded space, are convenient for insert and extract.
(4) The cover plate lower extreme fixedly connected with heat-conducting plate, the louvre of digging a plurality of evenly distributed on the apron, the heat-conducting plate can in time lead the heat that the chip produced in the course of the work to the top, and the back is upwards discharged through the louvre.
(5) Bottom end fixedly connected with bottom plate in the mounting groove, the bottom plate is made for thermal-insulated material, can effectively restrain the heat transmission downwards that the chip produced in the course of the work through the bottom plate to effectively avoid the heat that the chip produced to influence the normal operating of chip place circuit.
(6) The distance of bottom plate upper surface and pin inslot bottom is less than the thickness of chip for back in the mounting groove is installed to the chip, and the pin on the chip can normally be placed at the pin inslot, thereby effectively avoids pin inslot bottom to cause the extrusion to the pin and leads to the condition that the pin is loose, and then effectively guarantees the life of chip.
Drawings
The technical scheme of the invention is further explained by combining the accompanying drawings as follows:
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic structural view of a front view cross section of the present invention;
FIG. 3 is a schematic diagram of a portion of the present invention;
FIG. 4 is a schematic front view of the present invention;
fig. 5 is a schematic structural view of a positioning column in embodiment 2 of the present invention;
wherein: the heat-conducting plate comprises a base 1, a mounting groove 2, a pin groove 3, a cover plate 4, a heat-conducting plate 5, a positioning column 6, a spring plate 61, a bulge 62, a compression spring 63, a positioning groove 7, a bottom plate 8, a pull ring 9 and a compression bar 10.
Detailed Description
The invention is described in further detail below with reference to the figures and the embodiments.
Example 1:
the invention discloses a control chip mounting base of a control system as shown in attached figures 1-2, which comprises a base 1 and a mounting plate fixedly connected to the upper end of the base 1, wherein a mounting groove 2 is formed in the mounting plate, a plurality of uniformly distributed pin grooves 3 are formed in the periphery of the mounting plate, a cover plate 4 is arranged above the base 1, positioning columns 6 are fixedly connected to four corners of the lower end of the cover plate 4, positioning grooves 7 matched with the positioning columns 6 are formed in the four corners of the upper end of the mounting plate, a heat-conducting plate 5 is fixedly connected to the lower end of the cover plate 4, a plurality of uniformly distributed heat dissipation holes are formed in the cover plate 4, and the heat generated by a chip in the working process can be timely guided upwards by the heat-conducting plate 5 and then.
Referring to fig. 3, the positioning post 6 includes two elastic sheets 61 fixedly connected to the cover plate 4, the outer ends of the lower sides of the two elastic sheets 61 are fixedly connected to a protrusion 62, one end of the two elastic sheets 61 close to each other is fixedly connected to a compression spring 63, the compression spring 63 is of a spherical structure, and the elastic sheets 61 are of a vertical semi-cylindrical structure, so that when the positioning post 6 is inserted into and pulled out of the positioning slot 7, no large friction is generated, and the chip can be conveniently mounted and dismounted in the mounting seat, the bottom plate 8 is fixedly connected to the inner bottom end of the mounting groove 2, the bottom plate 8 is made of a heat insulation material, the heat generated in the chip during the working process can be effectively inhibited from being transferred downwards through the bottom plate 8, thereby effectively avoiding the heat generated by the chip from affecting the normal operation of the circuit where the chip is located, the distance between the upper surface of the bottom plate, the pin on the chip can normally be placed in pin groove 3 to effectively avoid 3 bottom ends in pin groove to cause the condition that the pin is loose to the pin extrusion, and then effectively guarantee the life of chip.
Like figure 4, the equal fixedly connected with depression bar 10 in base 1 left and right both ends upper end, depression bar 10 is located the mounting panel outside, apron 4 upper end rotates and is connected with pull ring 9, when dismantling the chip, at first the depression bar 10 is pushed down manually or through the frame of returning the shape, then the apron 4 is upwards pulled up through pull ring 9 to the rethread, make when upwards extracting apron 4, base 1 is difficult for the effect of production of power to the electronic component near its place circuit board, the electronic component near it is not fragile when effectively guaranteeing to dismantle the chip.
Example 2:
like figure 3, shell fragment 61 can also set to the surface and be the columnar structure, and the section of shell fragment 61 internal surface sets up for the inclined plane big end up down, effectively guarantees when inserting reference column 6 into constant head tank 7, and two shell fragments 61 receive the extrusion back, can have certain inside extruded space, are convenient for insert and extract.
When installing the chip, at first aim at pin groove 3 with the pin of chip, place the chip in mounting groove 2, then aim at constant head tank 7 with reference column 6 on the apron 4 and push down, make the chip fixed in mounting groove 2, when dismantling the chip, at first manual or push down depression bar 10 through the frame of returning the shape, then upwards draw apron 4 through pull ring 9, make apron 4 with the mounting panel separation can, can realize the installation and the dismantlement of the chip of being convenient for, thereby the change of the chip of being convenient for, effectively reduce the damage to the chip in the change process.
The above is only a specific application example of the present invention, and the protection scope of the present invention is not limited in any way. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (6)
1. The utility model provides a control system's control chip mount pad, includes base (1) and the mounting panel of fixed connection in base (1) upper end, its characterized in that: the mounting plate is internally provided with a mounting groove (2), a plurality of pin grooves (3) which are uniformly distributed are drilled on the periphery of the mounting plate, a cover plate (4) is arranged above the base (1), four corners of the lower end of the cover plate (4) are fixedly connected with positioning columns (6), the four corners of the upper end of the mounting plate are all provided with positioning grooves (7) matched with the positioning columns (6), the positioning column (6) comprises two elastic sheets (61) fixedly connected with the cover plate (4), the outer ends of the lower sides of the two elastic sheets (61) are fixedly connected with bulges (62), one ends of the two elastic sheets (61) close to each other are fixedly connected with compression springs (63), the base (1) is controlled equal fixedly connected with depression bar (10) in both ends upper end, depression bar (10) are located the mounting panel outside, apron (4) upper end is rotated and is connected with pull ring (9).
2. The control chip mount of a control system according to claim 1, wherein: the compression spring (63) is of a spherical structure, and the elastic sheet (61) is of a vertical semi-cylindrical structure.
3. The control chip mount of a control system according to claim 1, wherein: the outer surface of the elastic sheet (61) can be of a columnar structure, and the section of the inner surface of the elastic sheet (61) is an inclined plane with a small lower part and a large upper part.
4. The control chip mount of a control system according to claim 1, wherein: the heat dissipation device is characterized in that the lower end of the cover plate (4) is fixedly connected with a heat conduction plate (5), and a plurality of heat dissipation holes are uniformly distributed in the cover plate (4).
5. The control chip mount of a control system according to claim 1, wherein: bottom plate (8) are fixedly connected to the inner bottom end of mounting groove (2), bottom plate (8) are made for thermal-insulated material.
6. The control chip mount of a control system according to claim 5, wherein: the distance between the upper surface of the bottom plate (8) and the inner bottom end of the pin groove (3) is smaller than the thickness of the chip.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911396025.7A CN111048473A (en) | 2019-12-30 | 2019-12-30 | Control chip mounting base of control system |
| PCT/CN2020/107615 WO2021135230A1 (en) | 2019-12-30 | 2020-08-07 | Control chip mounting base of control system |
| DE202020106131.3U DE202020106131U1 (en) | 2019-12-30 | 2020-08-07 | A control chip socket for control systems |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911396025.7A CN111048473A (en) | 2019-12-30 | 2019-12-30 | Control chip mounting base of control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111048473A true CN111048473A (en) | 2020-04-21 |
Family
ID=70241812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911396025.7A Withdrawn CN111048473A (en) | 2019-12-30 | 2019-12-30 | Control chip mounting base of control system |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN111048473A (en) |
| DE (1) | DE202020106131U1 (en) |
| WO (1) | WO2021135230A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111642087A (en) * | 2020-05-28 | 2020-09-08 | 上海三达电子科技有限公司 | Double-spectrum fire alarm detector main control box |
| CN112351623A (en) * | 2020-11-19 | 2021-02-09 | 合肥高地创意科技有限公司 | Semiconductor power device protection device |
| WO2021135230A1 (en) * | 2019-12-30 | 2021-07-08 | 帕格曼科技(太仓)有限公司 | Control chip mounting base of control system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115904031B (en) * | 2023-02-22 | 2023-05-09 | 西安传显行风网络科技有限公司 | Computer motherboard fixing device for computer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009283828A (en) * | 2008-05-26 | 2009-12-03 | Nec Electronics Corp | Semiconductor device, and manufacturing method of semiconductor device |
| CN208722866U (en) * | 2018-09-24 | 2019-04-09 | 陕西理工大学 | A kind of electronic chip mounting base |
| CN209626204U (en) * | 2019-05-21 | 2019-11-12 | 深圳市卓盟科技有限公司 | A kind of adjustable fixed structure of integrated antenna package |
| CN209641996U (en) * | 2019-05-24 | 2019-11-15 | 北京万易行科技有限责任公司 | A kind of easy-to-dismount Combined insulating development board |
| CN111048473A (en) * | 2019-12-30 | 2020-04-21 | 帕格曼科技(太仓)有限公司 | Control chip mounting base of control system |
-
2019
- 2019-12-30 CN CN201911396025.7A patent/CN111048473A/en not_active Withdrawn
-
2020
- 2020-08-07 WO PCT/CN2020/107615 patent/WO2021135230A1/en active Application Filing
- 2020-08-07 DE DE202020106131.3U patent/DE202020106131U1/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021135230A1 (en) * | 2019-12-30 | 2021-07-08 | 帕格曼科技(太仓)有限公司 | Control chip mounting base of control system |
| CN111642087A (en) * | 2020-05-28 | 2020-09-08 | 上海三达电子科技有限公司 | Double-spectrum fire alarm detector main control box |
| CN111642087B (en) * | 2020-05-28 | 2021-09-07 | 上海黑拓科技发展有限公司 | Double-spectrum fire alarm detector main control box |
| CN112351623A (en) * | 2020-11-19 | 2021-02-09 | 合肥高地创意科技有限公司 | Semiconductor power device protection device |
| CN112351623B (en) * | 2020-11-19 | 2021-11-19 | 深圳市创业正强科技有限公司 | Semiconductor power device protection device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE202020106131U1 (en) | 2020-12-22 |
| WO2021135230A1 (en) | 2021-07-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200421 |