CN112349866A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN112349866A CN112349866A CN202011162440.9A CN202011162440A CN112349866A CN 112349866 A CN112349866 A CN 112349866A CN 202011162440 A CN202011162440 A CN 202011162440A CN 112349866 A CN112349866 A CN 112349866A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 88
- 230000004888 barrier function Effects 0.000 claims abstract description 56
- 238000002955 isolation Methods 0.000 claims abstract description 51
- 238000004806 packaging method and process Methods 0.000 claims abstract description 45
- 238000005538 encapsulation Methods 0.000 claims abstract description 31
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 14
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 135
- 239000010408 film Substances 0.000 description 106
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000011160 research Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a display panel, a manufacturing method thereof and a display device. The display panel has a through hole penetrating through the display panel, including: a substrate base having a display area and a through hole encapsulation area disposed around the through hole; the retaining wall is arranged on one side of the substrate base plate, is positioned in the through hole packaging area and is arranged around the through hole; the first isolation column is arranged on one side of the substrate base plate and is positioned on one side of the retaining wall close to the through hole; the packaging layer is arranged on one side of the substrate base plate, and comprises a first inorganic film layer, a barrier film layer, an organic film layer and a second inorganic film layer which are stacked and arranged in the direction away from the substrate base plate, wherein the orthographic projection of the barrier film layer on the substrate base plate is located in the through hole packaging area, and the orthographic projection of the barrier film layer on the substrate base plate and the orthographic projection of the organic film layer on the substrate base plate have an overlapping area. Therefore, when the organic film layer is formed by printing ink, the risk that the ink crosses the retaining wall can be effectively reduced by the film blocking layer, and the reliability of the display panel is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device.
Background
The display panel of the display device is generally manufactured by forming a thin film transistor layer, an OLED light emitting layer and a thin film encapsulation layer on a substrate. The existing display panel has an open pore structure in the middle of a display screen, namely an AA Hole product, and in order to meet the requirement that the thin film at the AA Hole position is effectively packaged and ensure the risk of no reliability, the film forming quality of an inorganic film layer and the stop position of an organic layer need to be controlled. In the AA hole product having the barrier pillar structure and the barrier wall structure, during the formation of the organic layer, ink (ink) runs the risk of crossing the barrier wall structure, which easily reduces the reliability of the display panel.
However, research on the display panel and the method for fabricating the same is still needed.
Disclosure of Invention
The present invention is based on the discovery and recognition by the inventors of the following facts and problems:
at present, an encapsulation layer of a display panel generally includes a first inorganic film layer, an organic film layer, and a second inorganic film layer stacked in sequence in a direction away from a substrate, after the first inorganic film layer is formed, the organic film layer is formed thereon by printing ink (ink), and when a through hole needs to be cut in the display panel, a dam is generally formed in advance on a side of the substrate where the encapsulation layer is formed, but the inventors found that the ink risks crossing the dam during the formation of the organic film layer, which may result in a reduction in reliability of the display panel. The inventors have found that a resist layer can be formed on the first inorganic film layer after the formation thereof, so that when the organic film layer is further formed, the resist layer can prevent the ink from crossing the dam wall, thereby avoiding the risk of confidence.
In view of the above, in one aspect of the present invention, the present invention provides a display panel having a through hole penetrating through the display panel, including: a substrate base having a display area and a through hole encapsulation area disposed around the through hole; the retaining wall is arranged on one side of the substrate base plate, is positioned in the through hole packaging area and is arranged around the through hole; the first isolation column is arranged on one side of the substrate base plate and is positioned on one side of the retaining wall close to the through hole; the packaging layer is arranged on one side of the substrate base plate and comprises a first inorganic film layer, a barrier film layer, an organic film layer and a second inorganic film layer which are arranged in a stacked mode in the direction far away from the substrate base plate, wherein orthographic projections of the first inorganic film layer and the second inorganic film layer on the substrate base plate cover the display area and the through hole packaging area; the orthographic projection of the organic film layer on the substrate covers partial areas of the display area and the through hole packaging area, the side face of the edge close to the through hole is positioned in the through hole packaging area, and the retaining wall is positioned on one side far away from the through hole; the orthographic projection of the barrier film layer on the substrate base plate is located in the through hole packaging area, and an overlapping area is formed between the orthographic projection of the barrier film layer and the orthographic projection of the organic film layer on the substrate base plate. Therefore, when the organic film layer is formed by printing ink, the risk that the ink crosses the retaining wall can be effectively reduced by the film blocking layer, and the reliability of the display panel is improved.
According to an embodiment of the present invention, the display panel further includes: and the second isolation column is arranged on one side of the substrate base plate, is positioned in the through hole packaging area and is positioned on one side of the retaining wall far away from the through hole.
According to the embodiment of the invention, the side end face of the barrier layer far away from the through hole is positioned on one side of the second isolation column close to or far away from the through hole.
According to the embodiment of the invention, the material of the barrier film layer is aluminum oxide, and the thickness of the barrier film layer is 10nm-200 nm.
According to the embodiment of the invention, the material of the barrier film layer is silicon nitride, and the thickness of the barrier film layer is 300nm-1000 nm.
According to the embodiment of the invention, the surface of the first inorganic film layer away from the substrate base plate is a rough surface.
According to an embodiment of the present invention, the thickness of the organic film layer is less than 10 micrometers.
In another aspect of the present invention, a method of fabricating a display panel is provided, the method including: providing a substrate base plate, wherein the substrate base plate is provided with a display area, a through hole area and a through hole packaging area positioned between the display area and the through hole area; forming a retaining wall and a first isolation column on one side of the substrate base plate, wherein the retaining wall is positioned in the through hole packaging area and arranged around the through hole area, and the first isolation column is positioned on one side of the retaining wall close to the through hole area; forming a packaging layer on one side of the substrate base plate, wherein the packaging layer comprises a first inorganic film layer, a barrier film layer, an organic film layer and a second inorganic film layer which are arranged in a stacking mode in the direction far away from the substrate base plate, and orthographic projections of the first inorganic film layer and the second inorganic film layer on the substrate base plate cover the display area and the through hole packaging area; the orthographic projection of the organic film layer on the substrate covers partial areas of the display area and the through hole packaging area, the side face of the edge close to the through hole area is positioned in the through hole packaging area, and the retaining wall is positioned on one side far away from the through hole area; the orthographic projection of the barrier film layer on the substrate base plate is positioned in the through hole packaging area, and an overlapping area is formed between the orthographic projection of the barrier film layer and the orthographic projection of the organic film layer on the substrate base plate; and cutting the through hole region to form a through hole. Therefore, the display panel prepared by the method has all the characteristics and advantages of the display panel, and the description is omitted. In general, the display panel manufactured by the method has high reliability, and the method is simple to operate and beneficial to industrial popularization.
According to an embodiment of the invention, the method further comprises: and forming at least one second isolation column on one side of the substrate base plate, wherein the second isolation column is positioned in the through hole packaging area and is positioned on one side of the retaining wall far away from the through hole.
According to the embodiment of the invention, the forming method of the barrier film layer is CVD or ALD.
In a further aspect of the invention, the invention proposes a display device comprising a display panel as described above, or a display panel produced by a method as described above.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a display panel according to another embodiment of the present invention;
FIG. 3 is a schematic diagram of a display panel according to another embodiment of the present invention;
FIG. 4 is a schematic diagram of a display panel according to another embodiment of the present invention;
FIG. 5 is a schematic diagram of a display panel according to another embodiment of the present invention;
FIG. 6 is a flow chart of a method of fabricating a display panel according to one embodiment of the invention;
FIG. 7 shows a schematic structural diagram of a substrate base plate according to one embodiment of the invention;
fig. 8 is a flowchart illustrating a method of fabricating a display panel according to another embodiment of the present invention.
Description of reference numerals:
1000: a display panel; 100: a substrate base plate; 110: a display area; 120: a through hole encapsulation area; 10: a through hole; 200: retaining walls; 300: a first isolation column; 400: a first inorganic film layer; 500: a barrier layer; 510: a side end face; 600: an organic film layer; 610: an edge side; 700: a second inorganic film layer; 800: a second isolation column; 11: a through hole region.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In one aspect of the present invention, a display panel is provided. As shown in fig. 1 and fig. 2 (wherein, fig. 2 is a cross-sectional view along BB' of fig. 1), the display panel 1000 has a through hole 10 penetrating through the display panel, the display panel 1000 includes a substrate 100, the substrate 100 has a display region 110 and a through hole encapsulation region 120 disposed around the through hole 10, the display panel 1000 further includes a retaining wall 200, the retaining wall 200 is disposed at one side of the substrate 100 and located at the through hole encapsulation region 120, and disposed around the through hole 10; a first isolation pillar 300, wherein the first isolation pillar 300 is disposed on one side of the substrate base plate 100 and is located on one side of the retaining wall 200 close to the through hole 10; the encapsulation layer is disposed on one side of the substrate base plate 100, and includes a first inorganic film layer 400, a barrier film layer 500, an organic film layer 600 and a second inorganic film layer 700 which are stacked in a direction away from the substrate base plate 100. Wherein, the orthographic projection of the first inorganic film layer 400 and the second inorganic film layer 700 on the substrate base plate 100 covers the display area 110 and the through hole packaging area 120; the orthographic projection of the organic film layer 600 on the substrate 100 covers partial areas of the display area 110 and the through hole encapsulation area 120, and the side surface 610 close to the edge of the through hole 10 is located in the through hole encapsulation area 120 and located on one side of the retaining wall 200 far away from the through hole 10; the orthographic projection of the barrier film layer 500 on the substrate base plate 100 is positioned in the through hole packaging area 120, and has an overlapping area with the orthographic projection of the organic film layer 600 on the substrate base plate 100. Therefore, the film blocking layer is formed on the surface of the first inorganic film layer of the packaging layer, which is far away from the substrate, so that the ink (ink) for forming the organic film layer 600 can be effectively prevented from crossing the blocking wall when being leveled, the trust risk is reduced, and the reliability of the display panel is improved.
As shown in fig. 2, the specific size of the width D of the overlapping region between the blocking layer 500 and the organic film 600 is not particularly required, and those skilled in the art can flexibly set the specific size, the thickness of the organic film, the height of the dam, etc. of the display panel according to different specific situations.
According to an embodiment of the present invention, the display panel may further include: at least one second isolation pillar 800, wherein the second isolation pillar 800 is disposed on one side of the substrate 100, located in the through hole encapsulation region 120, and located on one side of the retaining wall 200 away from the through hole 10. This improves the water and oxygen barrier ability of the encapsulating layer, and further improves the reliability of the display panel. In some embodiments, as shown in fig. 3, the display panel may include one second spacer 800; in other embodiments, as shown in fig. 4, the display panel may include two second spacers 800.
It should be noted that the retaining wall, the first isolation column and the second isolation column are all arranged around the through hole at intervals, and the retaining wall, the first isolation column and the second isolation column are all in an annular packaging structure. In addition, the number of the retaining wall, the first isolation column and the second isolation column is not particularly limited, and those skilled in the art can select the number according to actual requirements.
The specific structure of the substrate in the present invention is not particularly limited, and those skilled in the art can select the substrate according to actual needs. According to embodiments of the present invention, the display area of the substrate may include a thin film transistor layer, a light emitting device (EL device), and the like. The specific structure of the thin-film transistor layer, the specific structure of the light-emitting device, and the like are not particularly limited, and those skilled in the art can select the structure according to actual needs. In addition, as will be understood by those skilled in the art, the encapsulation layer covers the light emitting device so as to encapsulate the light emitting device and prevent water and oxygen from entering into the light emitting device and affecting the light emitting effect thereof.
According to an embodiment of the present invention, referring to fig. 3 or fig. 4, a side end surface 510 of the barrier layer 500 away from the through hole 10 is located at a side of the second separation column 800 close to or away from the through hole. This can further prevent the ink (ink) forming the organic film layer from crossing the dam when it is leveled. It should be noted that fig. 3 and fig. 4 only show two specific cases, and not limit the specific location of the barrier layer 500, in some embodiments, as shown in fig. 3, the display panel includes a second isolation pillar 800, and the side end surface 510 of the barrier layer 500 away from the through hole 10 is located on the side of the second isolation pillar 800 close to the through hole 10; in other embodiments, as shown in fig. 4, the display panel includes a plurality of second isolation pillars 800 (two second isolation pillars are taken as an example in fig. 4), and the side end surface 510 of the barrier layer 500 away from the through hole 10 is located on one side of all the second isolation pillars 800 away from the through hole 10; of course, in other embodiments, the side end surface 510 of the barrier layer 500 away from the through hole 10 may be located at any position between the second isolation pillars.
According to the embodiment of the present invention, the materials of the first inorganic film layer and the second inorganic film layer have no special requirement as long as the good encapsulation effect is obtained. In some embodiments, the materials of the first inorganic film layer and the second inorganic film layer may respectively include, but are not limited to, silicon nitride, silicon oxide, or silicon oxynitride.
According to the embodiment of the present invention, the material of the barrier layer 500 may be alumina, and the thickness of the barrier layer is 10nm to 200nm, for example, 10nm, 20nm, 30nm, 50nm, 60nm, 80nm, 100nm, 120nm, 140nm, 150nm, 160nm, 180nm, 190nm, 200nm, etc. Therefore, the barrier film is made of aluminum oxide, on one hand, the flatness of the aluminum oxide film layer is good, and the leveling of the printing ink can be hindered, on the other hand, the interface energy of the aluminum oxide is low, and the leveling of the printing ink is not facilitated, on the other hand, the aluminum oxide is an inorganic material, and the effective components of the printing ink forming the organic film layer are organic materials, different in polarity, and further not beneficial to the leveling of the printing ink; meanwhile, the film blocking layer has proper thickness, so that the ink (ink) forming the organic film layer can be effectively prevented from crossing the retaining wall when being leveled, and the obvious increase of the production cost can not be caused. If the thickness of the film blocking layer is too small, the ink (ink) forming the organic film layer cannot be effectively prevented from crossing the retaining wall when being leveled, and the packaging trust risk cannot be effectively reduced; if the thickness of the barrier film layer is too large, the production time is obviously increased, and the industrial popularization is not facilitated.
According to the embodiment of the invention, the material of the barrier film 500 may also be silicon nitride, and the thickness of the barrier film layer is 300nm-1000nm, for example, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm, 900nm, 1000 nm. Therefore, the barrier film has good water resistance and proper thickness, can effectively prevent the ink flow forming the organic film layer from crossing the retaining wall at ordinary times, and can not cause obvious increase of production cost. If the thickness of the film blocking layer is too small, the ink (ink) forming the organic film layer cannot be effectively prevented from crossing the retaining wall when being leveled, and the trust risk cannot be effectively reduced; if the thickness of the barrier film layer is too large, the production time is obviously increased, and the industrial popularization is not facilitated.
According to the embodiments of the present invention, as shown in fig. 2 to 4, the surface of the first inorganic film layer 400 away from the substrate base plate 100 may be a rough surface (the rough surface is not shown in the figures). Therefore, the rough surface can be more beneficial to leveling of the printing ink, and further is beneficial to reducing the thickness of the organic film layer, saving raw materials for forming the organic film layer and further reducing the cost. The specific size of the roughness of the rough surface has no special requirements, and the skilled person can flexibly set the roughness according to the actual situation, and in some embodiments, the roughness of the rough surface is in a micron order.
According to a drastic embodiment of the present invention, the thickness of the organic film layer 600 is less than 10 microns. Here, the thickness of the organic film layer refers to the thickness of the organic film layer covering most of the display area. Therefore, the organic film layer can be formed thinner, and the cost is reduced.
Through a series of researches and analyses, the inventors found that if the surface of the first inorganic film layer 400 away from the substrate 100 is a rough surface, the ink (ink) is more likely to cross the dam (as shown in fig. 5) during the process of fabricating the organic film layer, and thus the encapsulation fails, because the rough surface is more favorable for the leveling of the ink (ink). However, through further research, the inventor finds that, under the above circumstances, the arrangement of the blocking film layer of the present invention can still effectively prevent the ink flow from passing over the retaining wall at ordinary times, and further can reduce the thickness of the organic film layer and the production cost of the display panel while improving the packaging reliability of the display panel.
According to the embodiment of the present invention, the shape of the through hole has no special requirement, and those skilled in the art can flexibly design according to practical situations, for example, the shape of the through hole includes, but is not limited to, a circle, an ellipse, and a polygon such as a triangle, a pentagon, a hexagon, etc., and those skilled in the art can understand that the shape of the through hole refers to the shape of the cross section of the through hole.
In another aspect of the invention, a method of fabricating a display panel is provided. Referring to fig. 6 or 8, the method includes:
s100: a substrate 100 is provided, the substrate 100 having a display area 110, a via area 11 (as shown in fig. 7), and a via encapsulation area 120 located between the display area 110 and the via area 11.
Referring to fig. 8 (a), a substrate base plate 100 is provided. The substrate 100 has a display area 110, a via area 11, and a via encapsulation area 120 between the display area 110 and the via area 11, as shown in fig. 7. Note that, for ease of understanding, the substrate 100 in fig. 8 (a) does not show the display region, but only the via region 11, the via encapsulation region 120 between the display region and the via region. It is understood by those skilled in the art that the through hole region 11 may have a circular, oval, and polygonal shape such as triangular, pentagonal, hexagonal, etc. for forming the through hole.
S200: the dam 200 and the first isolation pillar 300 are formed at one side of the substrate base plate 100.
Referring to fig. 8 (b), a retaining wall 200 and a first isolation pillar 300 are formed on one side of the substrate 100, the retaining wall 200 is located in the through hole encapsulation region and is disposed around the through hole region 11, and the first isolation pillar 300 is located on one side of the retaining wall 200 close to the through hole region 11. The retaining wall is used for blocking water and oxygen and improving the water and oxygen blocking performance of the packaging layer; the arrangement of the first isolation column can also block water and oxygen, and the water and oxygen blocking performance of the packaging layer is improved.
It should be noted that the number of the retaining wall and the first isolation column is not particularly limited, and those skilled in the art can set the retaining wall and the first isolation column according to actual needs. In addition, the retaining wall and the first isolation column are both of annular structures, and the retaining wall and the first isolation column are arranged at intervals.
The order of forming the retaining wall and the first isolation column has no special requirement, and a person skilled in the art can flexibly design the flow of the manufacturing process according to the actual situation, that is, the retaining wall can be formed first and then the first isolation column is formed, or the retaining wall can be formed first and then the retaining wall can be formed, or the retaining wall and the first isolation column can be formed simultaneously, and at this time, the materials of the retaining wall and the first isolation column are the same. In addition, the specific method and material for forming the retaining wall and the first isolation column can be chosen by those skilled in the art according to the actual situation, and the requirement of limitation is not required here.
Referring to fig. 8 (b), the method further includes, according to an embodiment of the present invention: at least one second isolation pillar 800 is formed on one side of the substrate base plate 100, and the second isolation pillar 800 is located in the through hole encapsulation region and located on one side of the retaining wall 200 far away from the through hole region 11. Therefore, the arrangement of the second isolation columns can further improve the water and oxygen barrier performance of the packaging layer.
Furthermore, the second isolation column and the first isolation column can be formed in a synchronous step, so that the process steps are simplified, and the process flow and the process time are saved.
S300: an encapsulation layer is formed on one side of the base substrate 100.
Referring to fig. 8 (c), an encapsulation layer is formed on one side of the substrate base plate 100, and the encapsulation layer includes a first inorganic film layer 400, a barrier film layer 500, an organic film layer 600, and a second inorganic film layer 700, which are stacked in a direction away from the substrate base plate 100. Wherein, the orthographic projection of the first inorganic film layer 400 and the second inorganic film layer 700 on the substrate base plate 100 covers the display area and the through hole packaging area; the orthographic projection of the organic film layer 600 on the substrate 100 covers partial areas of the display area and the through hole packaging area, and the edge side 610 close to the through hole area 11 is positioned in the through hole packaging area and positioned on one side of the retaining wall 200 far away from the through hole area 11; the orthographic projection of the barrier film layer 500 on the substrate base plate 100 is positioned in the through hole packaging area, and an overlapping area is formed between the orthographic projection of the barrier film layer 500 and the orthographic projection of the organic film layer 600 on the substrate base plate 100.
It will be understood by those skilled in the art that when the display panel includes the second column spacers 800, the encapsulation layer covers the second column spacers 800.
According to an embodiment of the present invention, the barrier film layer is formed by Chemical Vapor Deposition (CVD) or Atomic Layer Deposition (ALD). When the material of the barrier film layer is alumina, the barrier film layer can be formed by adopting atomic layer deposition; when the material of the barrier film layer is silicon nitride, chemical vapor deposition can be adopted to form the barrier film layer. Therefore, the method has mature process, is convenient for industrial production, and is beneficial to reducing the cost.
In the embodiment of the present invention, the first inorganic film layer 400 and the second inorganic film layer 700 are formed by a method including, but not limited to, chemical vapor deposition, physical vapor deposition (such as magnetron sputtering), and the like; the organic film layer may be formed by a printing method.
S400: and cutting the through hole region to form the through hole.
After the formation of the encapsulation layer, referring to fig. 8 (d), the via region 11 is cut to form the via 10, which can be used for mounting a camera and other components. The through-hole 10 that is finally formed penetrates the substrate base plate 100 and the encapsulation layer, as understood by those skilled in the art. The specific method for forming the through holes by cutting has no special requirements, and people skilled in the art can flexibly select the method according to actual conditions, for example, laser cutting can be adopted to form the through holes.
Therefore, the method provided by the invention can effectively prevent the ink flow forming the organic film layer from crossing the retaining wall at ordinary times, and improve the reliability of the display panel.
In yet another aspect of the present invention, a display device is provided. The display device comprises the display panel or the display panel manufactured by the method. Therefore, the display panel has better reliability and better user experience. It will be understood by those skilled in the art that the display device has all the features and advantages of the display panel described above, and will not be described in detail herein. According to the embodiment of the invention, the display device can be any display device with a display function, such as a mobile phone, a computer, an iPad and the like.
In the description of the present invention, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention but do not require that the present invention must be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Reference throughout this specification to the description of "one embodiment," "another embodiment," "some embodiments," "other embodiments," or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction. In addition, it should be noted that the terms "first" and "second" in this specification are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (11)
1. A display panel having a through hole penetrating through the display panel, comprising:
a substrate base having a display area and a through hole encapsulation area disposed around the through hole;
the retaining wall is arranged on one side of the substrate base plate, is positioned in the through hole packaging area and is arranged around the through hole;
the first isolation column is arranged on one side of the substrate base plate and is positioned on one side of the retaining wall close to the through hole;
an encapsulation layer disposed on one side of the substrate base plate, the encapsulation layer including a first inorganic film layer, a barrier film layer, an organic film layer, and a second inorganic film layer, which are stacked in a direction away from the substrate base plate,
orthographic projections of the first inorganic film layer and the second inorganic film layer on the substrate cover the display area and the through hole packaging area; the orthographic projection of the organic film layer on the substrate covers partial areas of the display area and the through hole packaging area, the side face of the edge close to the through hole is positioned in the through hole packaging area, and the retaining wall is positioned on one side far away from the through hole; the orthographic projection of the barrier film layer on the substrate base plate is located in the through hole packaging area, and an overlapping area is formed between the orthographic projection of the barrier film layer and the orthographic projection of the organic film layer on the substrate base plate.
2. The display panel according to claim 1, further comprising: and the second isolation column is arranged on one side of the substrate base plate, is positioned in the through hole packaging area and is positioned on one side of the retaining wall far away from the through hole.
3. The display panel according to claim 2, wherein a side end surface of the barrier layer away from the through hole is located on a side of the second isolation pillar close to or away from the through hole.
4. The display panel according to any one of claims 1 to 3, wherein the material of the barrier film layer is aluminum oxide, and the thickness of the barrier film layer is 10nm to 200 nm.
5. The display panel according to any one of claims 1 to 3, wherein the material of the barrier film layer is silicon nitride, and the thickness of the barrier film layer is 300nm to 1000 nm.
6. The display panel according to any one of claims 1 to 3, wherein the surface of the first inorganic film layer away from the substrate base plate is a rough surface.
7. The display panel of claim 6, wherein the organic film layer has a thickness of less than 10 microns.
8. A method of making a display panel, comprising:
providing a substrate base plate, wherein the substrate base plate is provided with a display area, a through hole area and a through hole packaging area positioned between the display area and the through hole area;
forming a retaining wall and a first isolation column on one side of the substrate base plate, wherein the retaining wall is positioned in the through hole packaging area and arranged around the through hole area, and the first isolation column is positioned on one side of the retaining wall close to the through hole area;
forming an encapsulation layer on one side of the substrate base plate, wherein the encapsulation layer comprises a first inorganic film layer, a barrier film layer, an organic film layer and a second inorganic film layer which are arranged in a stacking way in the direction far away from the substrate base plate,
orthographic projections of the first inorganic film layer and the second inorganic film layer on the substrate cover the display area and the through hole packaging area; the orthographic projection of the organic film layer on the substrate covers partial areas of the display area and the through hole packaging area, the side face of the edge close to the through hole area is positioned in the through hole packaging area, and the retaining wall is positioned on one side far away from the through hole area; the orthographic projection of the barrier film layer on the substrate base plate is positioned in the through hole packaging area, and an overlapping area is formed between the orthographic projection of the barrier film layer and the orthographic projection of the organic film layer on the substrate base plate;
and cutting the through hole region to form a through hole.
9. The method of claim 8, further comprising:
and forming at least one second isolation column on one side of the substrate base plate, wherein the second isolation column is positioned in the through hole packaging area and is positioned on one side of the retaining wall far away from the through hole.
10. The method according to claim 8 or 9, wherein the formation method of the barrier film layer is CVD or ALD.
11. A display device comprising the display panel according to any one of claims 1 to 7 or the display panel manufactured by the method according to any one of claims 8 to 10.
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Application publication date: 20210209 |