CN110459694B - Display panel, manufacturing method thereof and display device - Google Patents
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- CN110459694B CN110459694B CN201910693550.9A CN201910693550A CN110459694B CN 110459694 B CN110459694 B CN 110459694B CN 201910693550 A CN201910693550 A CN 201910693550A CN 110459694 B CN110459694 B CN 110459694B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 238000004806 packaging method and process Methods 0.000 claims abstract description 62
- 238000005538 encapsulation Methods 0.000 claims description 179
- 238000005530 etching Methods 0.000 claims description 27
- 238000002161 passivation Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 230000007423 decrease Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000012466 permeate Substances 0.000 abstract description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 16
- 229910052760 oxygen Inorganic materials 0.000 description 16
- 239000001301 oxygen Substances 0.000 description 16
- 238000010586 diagram Methods 0.000 description 13
- 238000003892 spreading Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 229910010272 inorganic material Inorganic materials 0.000 description 7
- 239000011147 inorganic material Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 238000001704 evaporation Methods 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
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- 239000000047 product Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The application discloses a display panel, a manufacturing method thereof and a display device, and relates to the technical field of display, wherein the display panel comprises a hole area, a first non-display area and a display area, and also comprises a substrate base plate, a light-emitting device layer and a packaging layer; the light emitting device layer is positioned on one side of the substrate and comprises an anode layer, a light emitting layer and a cathode layer; the packaging layer is positioned on one side of the light-emitting device layer, which is far away from the substrate and comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially arranged; the hole region at least penetrates through the organic packaging layer, the first inorganic packaging layer and the light-emitting device layer along the direction vertical to the substrate; the second inorganic packaging layer covers the organic packaging layer, the first inorganic packaging layer and the boundary of the light-emitting device layer in the hole region; and the orthographic projection of the second inorganic packaging layer on the substrate covers the hole region, so that the problem that the display panel fails due to the fact that water vapor in the air permeates from the boundary between the hole region and the first non-display region and spreads to the whole display panel can be effectively solved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device.
Background
In a conventional display device, such as a monitor, a television, a mobile phone, a tablet computer, etc., a display area of the display device is generally a regular rectangle, and a plurality of sub-pixels are disposed in the display area in an array.
In recent years, with the development of science and technology, the display device with the display panel has more and more extensive applications, so that the requirements of people on the display panel are more and more diversified, the requirements are not only met with the conventional performance indexes of the display panel, such as large size, high definition and the like, but also the requirements on the appearance of the display panel are more diversified, and meanwhile, the screen occupation ratio is higher.
The development trend of mobile phone screens is to remove borders and frame, and in order to further increase screen occupation ratio, the opening positions of devices such as cameras are usually set within a limited range of a display area. Generally, when a display panel is manufactured, the process of evaporating the luminescent material is to perform evaporation on the whole surface of a display area; after the basic manufacturing of the display panel is completed, when holes are dug in the limited range of the display area to form through holes for arranging devices such as cameras, the corresponding through holes can penetrate through the organic light-emitting material layer, so that the organic light-emitting material layer is exposed on the inner wall of the through holes, external moisture and oxygen can easily spread to the display area from the positions of the through holes, the moisture and the oxygen can possibly damage the normal functions of the organic light-emitting material layer, and the display abnormity can be caused to occur in the whole display panel.
Disclosure of Invention
In view of this, according to the display panel, the manufacturing method thereof and the display device provided by the present application, the second inorganic encapsulation layer covers the organic encapsulation layer, the first inorganic encapsulation layer, and the boundary between the light emitting device layer and the hole region, and at the same time, the second inorganic encapsulation layer covers the film layer exposed by the hole region, so that moisture in the air can be effectively prevented from permeating and spreading to the whole display panel from the boundary between the hole region and the first non-display region, and the problem of failure of the display panel is avoided.
The application has the following technical scheme:
in a first aspect, the present application provides a display panel including an aperture region, a first non-display region surrounding the aperture region, a display region surrounding the first non-display region, the display panel including a substrate, a light emitting device layer, and an encapsulation layer;
the light-emitting device layer is positioned on one side of the substrate and comprises an anode layer, a light-emitting layer and a cathode layer, the cathode layer is positioned on one side of the anode layer, which is far away from the substrate, and the light-emitting layer is positioned between the anode layer and the cathode layer;
the packaging layer is positioned on one side, far away from the substrate base plate, of the light-emitting device layer and comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially arranged, and the second inorganic packaging layer is positioned on one side, far away from the substrate base plate, of the first inorganic packaging layer;
the hole region penetrates through at least the organic encapsulation layer, the first inorganic encapsulation layer and the light-emitting device layer along a direction vertical to the substrate base plate, the radius of the hole region in the first inorganic encapsulation layer is R1, the radius of the hole region in the light-emitting device layer is R2, and R1 is not less than R2;
the second inorganic encapsulation layer covers the organic encapsulation layer, the first inorganic encapsulation layer and the boundary of the light-emitting device layer in the hole region; and an orthographic projection of the second inorganic encapsulation layer on the substrate base plate covers the hole area.
In a second aspect, the present application provides a method for manufacturing a display panel, the display panel including an aperture region, a first non-display region surrounding the aperture region, and a display region surrounding the first non-display region, the method including:
providing a substrate base plate;
manufacturing a light-emitting device layer on one side of the substrate base plate, wherein the manufacturing process comprises the following steps: manufacturing an anode layer on one side of the substrate, so that the orthographic projection of the anode layer on the substrate does not overlap with the hole area; manufacturing a light-emitting layer on one side of the anode layer far away from the substrate; arranging a first mask plate on one side of the light-emitting layer far away from the substrate, and then manufacturing a cathode layer, so that the orthographic projection of the cathode layer on the substrate is not overlapped with the hole region;
manufacturing a first inorganic packaging layer on one side of the cathode layer, which is far away from the substrate, so that the cathode layer is covered by the first inorganic packaging layer;
manufacturing an organic encapsulation layer on one side of the first inorganic encapsulation layer far away from the substrate base plate, wherein at least part of the first inorganic encapsulation layer is exposed in the hole area;
etching the first inorganic packaging layer in the hole area by taking the organic packaging layer as a mask to expose at least part of the light-emitting device layer; continuously etching the light-emitting device layer in a direction vertical to the substrate in the hole region to form a hole region penetrating at least the organic encapsulation layer, the first inorganic encapsulation layer and the light-emitting device layer, wherein the radius of the hole region in the first inorganic encapsulation layer is R1, the radius of the hole region in the light-emitting device layer is R2, and R1 is not more than R2;
and manufacturing a second inorganic packaging layer, wherein the second inorganic packaging layer covers the boundaries of the organic packaging layer, the first inorganic packaging layer and the light-emitting device layer in the hole region, and the orthographic projection of the second inorganic packaging layer on the substrate covers the hole region.
In a third aspect, the present application provides a display device, including a display panel, where the display panel is the display panel provided in the present application.
Compared with the prior art, the display panel, the manufacturing method thereof and the display device provided by the invention at least realize the following beneficial effects:
(1) the display panel, the manufacturing method thereof and the display device comprise a hole area which penetrates through an organic packaging layer, a first inorganic packaging layer and a light-emitting device layer in the direction vertical to a substrate base plate, the organic packaging layer, the first inorganic packaging layer and the light-emitting device layer are covered by a second inorganic packaging layer at the boundary of the hole area, and the hole area is covered by the orthographic projection of the second inorganic packaging layer on the substrate base plate, so that water vapor and oxygen in the air can be effectively prevented from spreading to the display panel from the boundary of the hole area and a first non-display area, and the problem of failure of the display panel is avoided.
(2) According to the display panel, the manufacturing method thereof and the display device, the radius R1 of the hole area on the first inorganic packaging layer is smaller than or equal to the radius R2 of the light-emitting device layer, so that the boundary of the light-emitting device layer on the hole area is flush with the boundary of the first inorganic packaging layer, or the boundary of the light-emitting device layer on the hole area is retracted towards the display area relative to the boundary of the first inorganic packaging layer.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a top view of a display panel provided in the prior art;
FIG. 2 is an AA' cross-sectional view of the display panel of FIG. 1;
fig. 3 is a top view of a display panel according to an embodiment of the present disclosure;
FIG. 4 is a BB' cross-sectional view of the display panel of the embodiment shown in FIG. 3;
FIG. 5 is another BB' cross-sectional view of the display panel of the embodiment shown in FIG. 3;
FIG. 6 is a cross-sectional view of the display panel of the embodiment shown in FIG. 3, taken along line CC';
FIG. 7 is a cross-sectional view of still another BB' of the display panel of the embodiment shown in FIG. 3;
fig. 8 is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure;
FIG. 9 is a schematic diagram of one configuration of layers of a light emitting device fabricated on a substrate;
fig. 10 is a schematic view of a first inorganic encapsulation layer formed on a cathode layer;
FIG. 11 is a schematic diagram of a structure for forming an organic encapsulation layer on a first inorganic encapsulation layer;
FIG. 12 is a schematic view of a structure for forming holes based on the structure of FIG. 11;
FIG. 13 is a schematic view of another configuration for forming holes in the substrate of FIG. 11;
fig. 14 is a schematic structural diagram of a second inorganic encapsulation layer fabricated on the basis of fig. 12;
fig. 15 is a schematic structural diagram of a second inorganic encapsulation layer fabricated on the basis of fig. 13;
fig. 16 is a schematic structural diagram of a bonding area in a display panel according to an embodiment of the present application;
fig. 17 is a schematic structural diagram of a display device according to an embodiment of the present disclosure.
Detailed Description
As used in the specification and in the claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, within which a person skilled in the art can solve the technical problem to substantially achieve the technical result. The description which follows is a preferred embodiment of the present application, but is made for the purpose of illustrating the general principles of the application and not for the purpose of limiting the scope of the application. The protection scope of the present application shall be subject to the definitions of the appended claims. The same parts between the embodiments are not described in detail.
Fig. 1 is a top view of a display panel 100 provided in the prior art, and fig. 2 is an AA' cross-sectional view of the display panel 100 corresponding to fig. 1. referring to fig. 1 and fig. 2, the display panel 100 includes a display area 110 and a through hole 120 located in the display area 110, and the display panel further includes a substrate 101, a light emitting device layer 102 and an encapsulation layer 103, which are sequentially disposed. In general, the light-emitting material in the light-emitting device layer 102 is deposited on the entire surface of the display panel by evaporation, and if a mask for shielding the through hole 120 is separately manufactured, the deposition accuracy of the mask is reduced at the through hole due to uneven stress. Since the light emitting device layer 102 is present on the entire surface of the display panel 100, after the display panel 100 is formed, a through hole 120 penetrating through the encapsulation layer 103 and the light emitting device layer 102 is formed by cutting the encapsulation layer 103 and the light emitting device layer 102, and after the through hole 120 is formed by cutting, the light emitting device layer 102 is exposed on the inner wall of the through hole 120, that is, at a position corresponding to the cutting line 104 in fig. 2; the light emitting device layer 102 extends from the cutting line 104 at the position of the through hole 120 to the display area 110, so that external moisture and oxygen easily enter the light emitting device layer 102 from the inner wall of the through hole 120 and spread to the display area 110, and damage to the light emitting device layer 102 in the display area 110 is easily caused, which affects normal display of the display panel 100.
In view of this, the display panel, the manufacturing method thereof and the display device provided in the present application include a hole region penetrating through the organic encapsulation layer, the first inorganic encapsulation layer and the light emitting device layer, and the second inorganic encapsulation layer covers the organic encapsulation layer, the first inorganic encapsulation layer and the boundary between the light emitting device layer and the hole region, and at the same time, the second inorganic encapsulation layer covers the hole region by orthogonal projection on the substrate, so that the moisture in the air can be effectively prevented from penetrating and spreading to the entire display panel from the boundary between the hole region and the first non-display region, thereby avoiding the problem of failure of the display panel.
The following detailed description is to be read in connection with the drawings and the detailed description.
Fig. 3 is a top view of a display panel according to an embodiment of the present invention, fig. 4 is a BB 'cross-sectional view of the display panel according to the embodiment of the present invention shown in fig. 3, fig. 5 is another BB' cross-sectional view of the display panel according to the embodiment of the present invention shown in fig. 3, referring to fig. 3-5, a display panel 200 according to an embodiment of the present invention includes a hole region 220, a first non-display region 230 surrounding the hole region 220, and a display region 210 surrounding the first non-display region 230, the display panel 200 includes a substrate 240, a light emitting device layer 270, and an encapsulation layer 280;
a light emitting device layer 270 on one side of the substrate 240, including an anode layer 271, a light emitting layer 272 and a cathode layer 273, wherein the cathode layer 273 is located on one side of the anode layer 271 away from the substrate 240, and the light emitting layer 272 is located between the anode layer 271 and the cathode layer 273;
the encapsulation layer 280 is positioned on one side of the light-emitting device layer 270 away from the substrate base plate 240 and comprises a first inorganic encapsulation layer 281, an organic encapsulation layer 282 and a second inorganic encapsulation layer 283 which are arranged in sequence, wherein the second inorganic encapsulation layer 283 is positioned on one side of the first inorganic encapsulation layer 281 away from the substrate base plate 240;
the hole region 220 penetrates at least the organic encapsulation layer 282, the first inorganic encapsulation layer 281 and the light-emitting device layer 270 along a direction perpendicular to the substrate 240, the radius of the hole region 220 in the first inorganic encapsulation layer 281 is R1, the radius of the light-emitting device layer 270 is R2, and R1 is not more than R2;
the second inorganic encapsulation layer 283 covers the organic encapsulation layer 282, the first inorganic encapsulation layer 281, and the light emitting device layer 270 at the boundary of the hole region 220; and an orthographic projection of the second inorganic encapsulation layer 283 on the substrate base 240 covers the aperture area 220.
Specifically, with continued reference to fig. 3-5, the display panel 200 provided in this embodiment includes an aperture area 220, a first non-display area 230 and a display area 210, wherein the aperture area 220 is surrounded by the first non-display area 230, and the first non-display area 230 is surrounded by the display area 210; the display panel 200 includes a substrate 240, a light emitting device layer 270 and an encapsulation layer 280, where, in the viewing angles shown in fig. 4 and 5, the light emitting device layer 270 includes an anode layer 271, a light emitting layer 272 and a cathode layer 273, which are sequentially arranged from bottom to top, and the encapsulation layer 280 includes a first inorganic encapsulation layer 281, an organic encapsulation layer 282 and a second inorganic encapsulation layer 283, which are sequentially arranged from bottom to top; in a direction perpendicular to the substrate base 240, the hole region 220 penetrates through the organic encapsulation layer 282, the first inorganic encapsulation layer 281, and the light-emitting device layer 270, the second inorganic encapsulation layer 283 covers the organic encapsulation layer 282, the first inorganic encapsulation layer 281, and the light-emitting device layer 270 at the boundary of the hole region 220, and the orthographic projection of the second inorganic encapsulation layer 283 on the substrate base 240 covers the hole region 220, that is, the second inorganic encapsulation layer 283 completely covers the cutting lines formed by the etching hole region 220 and the film layers exposed by the hole region 220. Alternatively, as shown in fig. 4, the radius R1 of the hole region 220 on the first inorganic encapsulation layer 281 is equal to the radius R2 of the light-emitting device layer 270, that is, in the hole region 220, the boundary of the light-emitting device layer 270 is flush with the boundary of the first inorganic encapsulation layer 281, and the boundary of the first inorganic encapsulation layer 281 and the light-emitting device layer 270 on the hole region 220 is covered by the second inorganic encapsulation layer 283, so as to prevent moisture and oxygen in air from penetrating and spreading from the boundary of the hole region 220 to the display panel 200, which causes the failure of the display panel 200, and the boundary of the light-emitting device layer 270 is flush with the boundary of the first inorganic encapsulation layer 281 on the hole region, which makes the etching process simpler and easier to implement; alternatively, as shown in fig. 5, the radius R1 of the hole region 220 on the first inorganic encapsulation layer 281 is set smaller than the radius R2 of the light emitting device layer 270, that is, at the hole region 220, the boundary of the light emitting device layer 270 is indented toward the display region with respect to the boundary of the first inorganic encapsulation layer 281, and thus, when the hole region 220 covers the second inorganic encapsulation layer 283, a structure in which the first inorganic encapsulation layer 281 and the second inorganic encapsulation layer 283 are stacked is formed at the boundary of the light emitting device layer 270 and the hole region 220, that is, stacking a plurality of inorganic layers at the boundary of the light emitting device layer 270 and the hole region 220 is more advantageous to prevent moisture and oxygen in the air from penetrating and spreading to the display panel 200 from the boundary of the hole region 220 and the first non-display region 230 to cause a failure of the display panel 200, compared to the case where the boundary of the light emitting device layer 270 and the first inorganic encapsulation layer 281 are flush.
It should be noted that fig. 3 only schematically illustrates a case where the display panel 200 includes one hole area 220, and in fact, in some other embodiments of the present application, the number of the hole areas 220 may be two or more, which is not specifically limited in this application, and the shape of the hole area 220 in the present application is also only schematically illustrated, and may be embodied in other forms besides using a circular through hole, and in addition, the position and size of the hole area 220 on the display panel 200 may also be flexibly adjusted, and the drawings of the present application are only schematically illustrated and do not represent actual positions, sizes and shapes. In addition, when the second inorganic encapsulation layer 283 is manufactured, a Chemical Vapor Deposition (CVD) method may be adopted, an atomic deposition process (ALD) or a sputtering process may also be adopted, which is not specifically limited in this application, and a different manufacturing process is adopted to obtain an interface where the second inorganic encapsulation layer 283 covers the luminescent material and the hole region 220, as shown in fig. 4 and 5.
Optionally, with continued reference to fig. 4 and 5, the display panel 200 further includes a planarization layer 260, the planarization layer 260 being located between the substrate base 240 and the light emitting device layer 270, and the second inorganic encapsulation layer 283 being in contact with the planarization layer 260 in the hole region 220. Specifically, the display panel 200 further includes a planarization layer 260, and the planarization layer 260 is located between the substrate 240 and the light emitting device layer 270, and in the view shown in fig. 4, the planarization layer 260 is located at the lower side of the light emitting device layer 270, and since the hole region 220 penetrates through the organic encapsulation layer 282, the first inorganic encapsulation layer 281 and the light emitting device layer 270, the planarization layer 260 located at the lower side of the light emitting device layer 270 is exposed by the hole region 220, and therefore, in the hole region 220, the second inorganic encapsulation layer 283 is in contact with the planarization layer 260, the planarization layer 260 is an organic material, moisture and oxygen in the air easily permeate through the organic material, and the second inorganic encapsulation layer 283 is an inorganic material, and since the inorganic material can better isolate moisture and oxygen, the planarization layer 260 exposed by the hole region 220 is covered by the second inorganic encapsulation layer 283, and the planarization layer 260 is prevented from contacting with the air, can prevent that steam and oxygen in the air from up permeating through the organic material layer below the light emitting device layer 270, simultaneously, because the second inorganic encapsulation layer 283 has covered the cutting line of hole region 220, consequently, cover the second inorganic encapsulation layer 283 that can completely cut off steam and oxygen at hole region 220, can prevent steam and oxygen infiltration and spread to display panel to can avoid causing the problem that display panel 200 became invalid.
Optionally, referring to fig. 6, fig. 6 is a CC' cross-sectional view of the display panel 200 of the embodiment shown in fig. 3, the display panel 200 further includes a passivation layer 250 and a planarization layer 260, the planarization layer 260 is located between the substrate base 240 and the light emitting device layer 270, the passivation layer 250 is located on a side of the planarization layer 260 close to the substrate base 240, the hole region 220 penetrates through the planarization layer 260, and the second inorganic encapsulation layer 283 is in contact with the passivation layer 250 in the hole region 220. Specifically, the display panel 200 further includes a passivation layer 250 and a planarization layer 260, and in the viewing angle shown in fig. 6, the planarization layer 260 is located at the lower side of the light emitting device layer 270, the passivation layer 250 is located at the lower side of the planarization layer 260, and on the basis that the hole region 220 penetrates through the organic encapsulation layer 282, the first inorganic encapsulation layer 281, and the light emitting device layer 270, the hole region 220 continues to penetrate through the planarization layer 260 downward, so that the passivation layer 250 is exposed by the hole region 220, and thus, in the hole region 220, the second inorganic encapsulation layer 283 contacts the passivation layer 250, and the passivation layer 250 is generally SIO, and the passivation layer 250 is in contact with the passivation layer 250X、SINXInorganic materials such as SION, and second inorganic encapsulation layer 283 also is inorganic material, compares in inorganic material layer and organic material layer contact, contacts between inorganic material layer and the inorganic material layer, and the stickability is better, consequently, when preventing steam infiltration, can also improve the fastness of pasting between the rete.
Alternatively, please refer to FIGS. 4-6, R1 is 2mm ≦ 3mm, R2 is 2mm ≦ 5 mm. Specifically, in this embodiment, the value range of R1 is set to be 2mm to 3mm, the value range of R2 is set to be 2mm to 5mm, when the boundaries of the first inorganic encapsulation layer 281 and the light emitting device layer 270 in the hole region 220 are flush, the values of R1 and R2 are the same, the value range of R2 is also 2mm to 3mm, when the boundary of the light emitting device layer 270 in the hole region 220 is retracted toward the display region relative to the first inorganic encapsulation layer 281, the value of R2 is greater than R1, and at this time, the value range of R2 is 3mm to 5 mm. It should be noted that 2mm to 3mm and 2mm to 5mm in this embodiment are merely exemplary illustrations, and in other embodiments, the value range of R1 and R2 may be set to other values according to actual needs, for example, the radius of the hole region may be set according to the size of a device that needs to be placed in the hole region, which is not specifically limited in this application.
Alternatively, referring to fig. 7, fig. 7 is a schematic cross-sectional view of still another BB' of the display panel 200 of the embodiment shown in fig. 3, in the first non-display area 230, a thickness of at least a portion of the organic encapsulation layer 282 gradually decreases along a direction of the display area 210 pointing to the hole area 220. Optionally, with continued reference to FIG. 7, the radius of the hole region 220 in the organic encapsulation layer 282 is R3, R3 ≧ R1. Specifically, in the first non-display region 230 surrounding the hole region 220, along the direction of the display region 210 toward the hole region 220, at least a portion of the thickness of the organic encapsulation layer 282 gradually decreases, the radius of the hole region 220 at the organic encapsulation layer 282 is R3, R3 ≧ R1, that is, similar to the light-emitting device layer 270, the boundary of the organic encapsulation layer 282 at the hole region 220 may be flush with the boundary of the first inorganic encapsulation layer 281, as shown in fig. 4, or may be set back toward the display region with respect to the boundary of the first inorganic encapsulation layer 281, as shown in fig. 7, when R3> R1 is taken, the edge of the organic encapsulation layer 282 near the hole region 220 is etched away, and in general, in the region where the thickness of the organic encapsulation layer 282 decreases, a stress concentration discontinuity tends to occur, and therefore, by etching away the boundary of the organic encapsulation layer 282 with the thinned hole region 220, it is advantageous to prevent the organic encapsulation layer 282 from being separated in a film layer in the region where the thickness of the organic encapsulation layer 282 is reduced in the first non-display region 230.
Alternatively, referring to fig. 3 and 6, the display panel 200 includes a second non-display region 290 surrounding the display region 210, and in the second non-display region 290, the second inorganic encapsulation layer 283 contacts the passivation layer 250 and covers the passivation layer 250. Specifically, in addition to the first non-display region 230, the display panel 200 further includes a second non-display region 290, the second non-display region 290 surrounds the display region 210, and in the second non-display region 290, the second inorganic encapsulation layer 283 is in direct contact with the passivation layer 250 and covers the passivation layer 250, so that the second inorganic encapsulation layer 283 forms a closed encapsulation at the edge position of the display panel 200, thereby preventing moisture and oxygen from penetrating and spreading from the edge region of the display panel 200 to the display panel 200, which causes a failure of the display panel 200.
Based on the same inventive concept, the present application further provides a manufacturing method of a display panel 200, as shown in fig. 8, which is a flowchart of the manufacturing method of the display panel 200 provided in the embodiments of the present application, and the structure of the display panel 200 is shown in fig. 3, where the display panel 200 includes a hole area 220, a first non-display area 230 surrounding the hole area 220, and a display area 210 surrounding the first non-display area 230, and the manufacturing method includes:
step 01: providing a substrate base plate 240;
step 02: referring to fig. 9, a light emitting device layer 270 is formed on one side of a substrate 240, and fig. 9 is a schematic structural diagram of the light emitting device layer 270 formed on the substrate 240, which includes: manufacturing an anode layer 271 on one side of the substrate 240, so that the orthographic projection of the anode layer 271 on the substrate 240 does not overlap with the hole region 220; fabricating a light emitting layer 272 on a side of the anode layer away from the substrate 240; arranging a first mask plate on one side of the light-emitting layer 272, which is far away from the substrate 240, and then manufacturing a cathode layer 273, so that the orthographic projection of the cathode layer 273 on the substrate 240 is not overlapped with the hole region 220;
step 03: referring to fig. 10, a first inorganic encapsulation layer 281 is formed on the cathode layer 273 at a side away from the substrate 240, where fig. 10 is a schematic structural diagram of forming the first inorganic encapsulation layer 281 on the cathode layer 273, so that the cathode layer 273 is covered by the first inorganic encapsulation layer 281;
step 04: referring to fig. 11, fig. 11 is a schematic structural diagram illustrating a structure of an organic encapsulation layer 282 formed on a first inorganic encapsulation layer 281, wherein the organic encapsulation layer 282 is formed on a side of the first inorganic encapsulation layer 281 away from the substrate 240, and at least a portion of the first inorganic encapsulation layer 281 is exposed in a hole region 220;
step 05: referring to fig. 12 and 13, fig. 12 is a schematic diagram illustrating a structure of forming a hole on the basis of fig. 11, and fig. 13 is a schematic diagram illustrating another structure of forming a hole on the basis of fig. 11, in which an organic encapsulation layer 282 is used as a mask, and the first inorganic encapsulation layer 281 of the hole region 220 is etched to expose at least a portion of the light emitting device layer 270; in the hole region 220, continuously etching the light-emitting device layer 270 along a direction vertical to the substrate base plate 240 to form a hole region 220 penetrating at least the organic encapsulation layer 282, the first inorganic encapsulation layer 281 and the light-emitting device layer 270, wherein the radius of the hole region 220 in the first inorganic encapsulation layer 281 is R1, the radius of the hole region 220 in the light-emitting device layer 270 is R2, and R1 is not more than R2;
step 06: referring to fig. 14 and 15, fig. 14 is a schematic structural view illustrating that the second inorganic encapsulation layer 283 is fabricated on the basis of fig. 12, fig. 15 is a schematic structural view illustrating that the second inorganic encapsulation layer 283 is fabricated on the basis of fig. 13, the second inorganic encapsulation layer 283 is fabricated, the second inorganic encapsulation layer 283 covers the organic encapsulation layer 282, the first inorganic encapsulation layer 281 and the light-emitting device layer 270 at the boundary of the hole region 220, and the forward projection of the second inorganic encapsulation layer 283 on the substrate 240 covers the hole region 220.
Specifically, referring to fig. 8 to 9, in the method for manufacturing the display panel 200 according to the embodiment of the present disclosure, firstly, a substrate 240 is provided, and a light emitting device layer 270 is manufactured on one side of the substrate 240, where the light emitting device layer 270 includes an anode layer 271, a light emitting layer 272 and a cathode layer 273, and since the anode layer 271 and the cathode layer 273 generally contain Ag, and Ag is difficult to be dry-etched, in order to avoid forming a material containing Ag in the hole region 220, when the light emitting device layer 270 is manufactured, an anode and a cathode are not formed in the hole region 220, and the anode layer 271 belongs to an array TFT process, so when the TFT panel is formed, the anode may not be formed in the hole region 220; when the cathode layer 273 is manufactured, a first mask plate is arranged in the hole area 220 on the light emitting layer 272 to shield the hole area 220, the first mask plate is made of metal, the first mask plate is fixed in the hole area 220 through a thin metal wire, and then the cathode layer is formed through evaporation, so that when the cathode layer 273 is formed through evaporation, the cathode is not formed in the hole area, namely, the orthographic projection of the cathode layer 273 on the substrate 240 is not overlapped with the hole area 220, and the problem that Ag contained in the light emitting device layer 270 cannot be removed in the process of forming the through hole through etching can be solved.
Referring to fig. 10 to 15, after the light emitting device layer 270 is manufactured, a first inorganic encapsulation layer 281 covering the entire surface of the cathode layer 273 on the side of the cathode layer 273 away from the substrate 240 is manufactured, and an organic encapsulation layer 282 is manufactured on the first inorganic encapsulation layer, in this embodiment, the organic encapsulation layer 282 is formed by an inkjet printing process, and the organic encapsulation layer 282 formed by inkjet printing exposes the first inorganic encapsulation layer 281 at least in the hole area 220, so that the organic encapsulation layer 282 is used as a mask to etch the first inorganic encapsulation layer 281, and the organic encapsulation layer 282 is used as a mask to etch the first inorganic encapsulation layer 281, which can save a step of setting a mask when patterning the first inorganic encapsulation layer 281 at one time, thereby saving manufacturing time and improving manufacturing efficiency. After exposing the light-emitting device layer 270 in the hole region 220, continuously etching the light-emitting device layer 270 in the hole region 220 in a direction perpendicular to the substrate 240, and forming a via hole at least penetrating through the organic encapsulation layer 282, the first inorganic encapsulation layer 281 and the light-emitting device layer 270 in the hole region 220, optionally, as shown in fig. 12, when the via hole is formed by etching, the radius of the first inorganic encapsulation layer 281 is smaller than or equal to the radius of the light-emitting device layer 270, that is, the boundary of the light-emitting device layer 270 in the hole region 220 is flush with the boundary of the first inorganic encapsulation layer 281 in the hole region 220, and the boundary of the first inorganic encapsulation layer 281 and the light-emitting device layer 270 in the hole region 220 is covered by the second inorganic encapsulation layer 283, so as to avoid the problem that moisture and oxygen in the air permeate from the boundary of the hole region 220 and spread to the display panel 200, which causes the display panel 200 to fail; alternatively, as shown in fig. 13, when the via hole is formed by etching, the radius R1 of the hole region 220 on the first inorganic encapsulation layer 281 is smaller than the radius R2 of the light-emitting device layer 270, that is, at the hole region 220, the boundary of the light-emitting device layer 270 at the hole region 220 is recessed from the boundary of the hole region 220 of the first inorganic encapsulation layer 281 at the hole region 220 toward the display region, as shown in fig. 13, so that when the hole region 220 covers the second inorganic encapsulation layer 283, the first inorganic encapsulation layer 281 and the second inorganic encapsulation layer 283 are stacked at the boundary of the light-emitting device layer 270 and the hole region 220, that is, the multiple inorganic layers 283 are stacked at the boundary of the hole region 220 and the hole region 220, and thus, it is possible to further prevent moisture and oxygen in the air from permeating from the boundary of the hole region 220 and the first non-display region 230 and spreading toward the display panel 200, causing a problem of failure of the display panel 200. The first inorganic encapsulation layer 281 and the light emitting device layer 270 are made of different materials, and when a hole region is formed by etching, the etching radius of the first inorganic encapsulation layer 281 can be smaller than the etching radius of the light emitting device layer 270 by adjusting an etching process, for example, controlling the etching time of the light emitting device layer 270 to be longer than the etching time of the first inorganic encapsulation layer 281, or controlling the etching speed of the light emitting device layer 270 to be longer than the etching speed of the first inorganic encapsulation layer 281, and the like, and the etching radius of the first inorganic encapsulation layer 281 can be equal to the etching radius of the light emitting device layer 270 by controlling the etching time and the etching speed.
Optionally, referring to fig. 16, fig. 16 is a schematic structural diagram of a binding region 291 in the display panel 200 according to the embodiment of the present application, where the display panel 200 further includes a second non-display region 290 surrounding the display region 210, and the binding region 291 located in the second non-display region 290, and the binding region 291 includes a binding pin 292; the first inorganic encapsulation layer 281 positioned in the second non-display region 290 is etched while the hole region 220 is etched using the organic encapsulation layer 282 as a mask, exposing the bonding pins 292. Specifically, the second non-display area 290 of the display panel 200 is provided with the bonding area 291, the bonding area 291 is provided with the bonding pins 292, since the first inorganic encapsulation layer 281 is formed on the whole surface without a patterning process, the bonding pins 292 located in the second non-display area 290 of the display panel 200 are covered by the first inorganic encapsulation layer 281, and in order to enable the display panel 200 to work normally, the bonding pins 292 located in the second non-display area 290 need to be exposed, therefore, while the via hole area 220 is etched to form the via hole, the first inorganic encapsulation layer 281 of the second non-display area 290 also needs to be etched to expose the bonding pins 292 covered by the first inorganic encapsulation layer 281, in this embodiment, the organic encapsulation layer 282 is used as a mask to etch the first inorganic encapsulation layer 281 of the second non-display area while etching the hole area, so that a process of setting a mask when the first inorganic encapsulation layer 281 is patterned can be saved, the manufacturing time is saved, and the manufacturing efficiency is improved; after the first inorganic encapsulation layer 281 is etched, in the second non-display region 290, the second inorganic encapsulation layer 283 is in contact with the passivation layer 250 and covers the passivation layer 250, so that the second inorganic encapsulation layer 283 forms a closed type package at the edge position of the display panel 200, thereby preventing water vapor and oxygen from penetrating from the edge area of the display panel 200 and spreading to the display panel 200, which causes the failure of the display panel 200.
Based on the same inventive concept, the present application further provides a display device 300, please refer to fig. 17, fig. 17 is a schematic structural diagram of the display device 300 according to the embodiment of the present application, the display device 300 includes a display panel 200, and the display panel 200 is any one of the display panels 200 according to the embodiments of the present application. For the embodiments of the display device 300 provided in the embodiments of the present application, reference may be made to the embodiments of the display panel 200, and repeated descriptions are omitted. The display device 300 provided by the present application may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
Optionally, at least one of a camera, an earpiece, a speaker, and an infrared sensor is disposed in the aperture area 220. By such an arrangement, the requirements of consumers on the display device 300 in social development are met, and the practicability of the display device 300 is improved. In addition, at least one device of the camera, the receiver, the loudspeaker and the infrared sensor is arranged in the hole area, so that the display effect of the whole screen is realized, and the high integration of the display device 300 is facilitated.
According to the embodiments, the application has the following beneficial effects:
(1) the display panel, the manufacturing method thereof and the display device comprise a hole area which penetrates through an organic packaging layer, a first inorganic packaging layer and a light-emitting device layer in the direction vertical to a substrate base plate, the organic packaging layer, the first inorganic packaging layer and the light-emitting device layer are covered by a second inorganic packaging layer at the boundary of the hole area, and the hole area is covered by the orthographic projection of the second inorganic packaging layer on the substrate base plate, so that water vapor and oxygen in the air can be effectively prevented from spreading to the display panel from the boundary of the hole area and a first non-display area, and the problem of failure of the display panel is avoided.
(2) According to the display panel, the manufacturing method thereof and the display device, the radius R1 of the hole area on the first inorganic packaging layer is smaller than or equal to the radius R2 of the light-emitting device layer, so that the boundary of the light-emitting device layer on the hole area is flush with the boundary of the first inorganic packaging layer, or the boundary of the light-emitting device layer on the hole area is retracted towards the display area relative to the boundary of the first inorganic packaging layer.
The foregoing description shows and describes several preferred embodiments of the present application, but as aforementioned, it is to be understood that the application is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the application, which is to be protected by the claims appended hereto.
Claims (10)
1. A display panel comprising an aperture region, a first non-display region surrounding the aperture region, a display region surrounding the first non-display region, the display panel comprising a base substrate, a light emitting device layer and an encapsulation layer;
the light-emitting device layer is positioned on one side of the substrate and comprises an anode layer, a light-emitting layer and a cathode layer, the cathode layer is positioned on one side of the anode layer, which is far away from the substrate, and the light-emitting layer is positioned between the anode layer and the cathode layer;
the packaging layer is positioned on one side, far away from the substrate base plate, of the light-emitting device layer and comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are sequentially arranged, and the second inorganic packaging layer is positioned on one side, far away from the substrate base plate, of the first inorganic packaging layer;
the hole region penetrates at least the organic encapsulation layer, the first inorganic encapsulation layer and the light emitting device layer in a direction perpendicular to the substrate base plate, and the hole region has a radius of R1 at the first inorganic encapsulation layer and a radius of R2 at the light emitting device layer, R1 < R2;
the second inorganic encapsulation layer covers the organic encapsulation layer, the first inorganic encapsulation layer and the boundary of the light-emitting device layer in the hole region; and an orthographic projection of the second inorganic encapsulation layer on the substrate base plate covers the hole area.
2. The display panel according to claim 1,
the display panel further includes a planarization layer between the substrate and the light emitting device layer, and the second inorganic encapsulation layer is in contact with the planarization layer in the hole region.
3. The display panel according to claim 1,
the display panel further comprises a passivation layer and a planarization layer, the planarization layer is located between the substrate base plate and the light-emitting device layer, the passivation layer is located on one side, close to the substrate base plate, of the planarization layer, the hole region penetrates through the planarization layer, and the second inorganic packaging layer is in contact with the passivation layer in the hole region.
4. The display panel of claim 1, wherein 2mm ≦ R1 ≦ 3mm, and 2mm ≦ R2 ≦ 5 mm.
5. The display panel of claim 1, wherein in the first non-display region, the thickness of at least a portion of the organic encapsulation layer gradually decreases in a direction from the display region to the aperture region, and the aperture region has a radius of R3 at the organic encapsulation layer, R3 ≧ R1.
6. The display panel according to claim 3, wherein the display panel comprises a second non-display region surrounding the display region, and wherein the second inorganic encapsulation layer is in contact with and covers the passivation layer in the second non-display region.
7. A method of manufacturing a display panel, the display panel including an aperture region, a first non-display region surrounding the aperture region, and a display region surrounding the first non-display region, the method comprising:
providing a substrate base plate;
manufacturing a light-emitting device layer on one side of the substrate base plate, wherein the manufacturing process comprises the following steps: manufacturing an anode layer on one side of the substrate, so that the orthographic projection of the anode layer on the substrate does not overlap with the hole area; manufacturing a light-emitting layer on one side of the anode layer far away from the substrate; arranging a first mask plate on one side of the light-emitting layer far away from the substrate, and then manufacturing a cathode layer, so that the orthographic projection of the cathode layer on the substrate is not overlapped with the hole region;
manufacturing a first inorganic packaging layer on one side of the cathode layer, which is far away from the substrate, so that the cathode layer is covered by the first inorganic packaging layer;
manufacturing an organic encapsulation layer on one side of the first inorganic encapsulation layer far away from the substrate base plate, wherein at least part of the first inorganic encapsulation layer is exposed in the hole area;
etching the first inorganic packaging layer in the hole area by taking the organic packaging layer as a mask to expose at least part of the light-emitting device layer; continuously etching the light-emitting device layer in a direction vertical to the substrate in the hole region to form a hole region penetrating at least the organic encapsulation layer, the first inorganic encapsulation layer and the light-emitting device layer, wherein the radius of the hole region in the first inorganic encapsulation layer is R1, the radius of the hole region in the light-emitting device layer is R2, and R1 is not more than R2;
and manufacturing a second inorganic packaging layer, wherein the second inorganic packaging layer covers the boundaries of the organic packaging layer, the first inorganic packaging layer and the light-emitting device layer in the hole region, and the orthographic projection of the second inorganic packaging layer on the substrate covers the hole region.
8. The method for manufacturing a display panel according to claim 7, wherein the display panel further comprises a second non-display area surrounding the display area, and a bonding area located in the second non-display area, the bonding area comprising bonding pins;
and etching the hole area by using the organic packaging layer as a mask, and etching the first inorganic packaging layer positioned in the second non-display area to expose the binding pins.
9. A display device comprising the display panel according to any one of claims 1 to 6.
10. The display device according to claim 9, wherein at least one of a camera, an earpiece, a speaker, and an infrared sensor is disposed in the aperture region.
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| CN113851598B (en) * | 2020-06-28 | 2024-06-11 | 北京小米移动软件有限公司 | Display module, manufacturing method thereof and terminal equipment |
| CN111640882B (en) * | 2020-06-30 | 2022-09-16 | 湖北长江新型显示产业创新中心有限公司 | Display panel, manufacturing method thereof and display device |
| CN112086579A (en) * | 2020-09-14 | 2020-12-15 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN112397675B (en) * | 2020-11-18 | 2022-07-22 | 合肥维信诺科技有限公司 | Display panel preparation method and display panel |
| CN112952017B (en) * | 2021-02-01 | 2022-09-27 | 厦门天马微电子有限公司 | Display panel, preparation method thereof and display device |
| CN114284318B (en) * | 2021-12-14 | 2024-08-02 | 深圳市华星光电半导体显示技术有限公司 | Display panel manufacturing method and display device |
| CN114267809B (en) * | 2021-12-15 | 2023-11-03 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
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