CN112347718A - Board level heating circuit, PCB board and computer of adjustable power - Google Patents
Board level heating circuit, PCB board and computer of adjustable power Download PDFInfo
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- CN112347718A CN112347718A CN202011168023.5A CN202011168023A CN112347718A CN 112347718 A CN112347718 A CN 112347718A CN 202011168023 A CN202011168023 A CN 202011168023A CN 112347718 A CN112347718 A CN 112347718A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
Abstract
The invention provides a power-adjustable plate-level heating circuit, which comprises: the control module, the output power control circuit and the heating element; the output power control circuit further comprises a voltage stabilizing module, the control module is connected with an enabling end of the voltage stabilizing module in the output power control circuit, an output end of the output power control circuit is connected with the heating element, and the control module is configured to output a PWM control signal to control the on or off of the output power control circuit so as to control the output power of the output power control circuit to the heating element. The invention realizes the arbitrary adjustment of the output power through the PWM control. In addition, the power-adjustable plate-level heating circuit provided by the invention has the characteristics of simple structure and low cost.
Description
Technical Field
The invention relates to the field of temperature control circuit design, in particular to a board-level heating circuit with adjustable power, a PCB and a computer.
Background
The low-temperature characteristic is an important performance index in the requirement of the reinforced computer on severe environment resistance, and the temperature of the reinforced computer in the low-temperature working environment is required to be as low as-40 ℃ or even-55 ℃ in some special occasions. Many chips or electronic devices cannot adapt to such a severe wide-temperature environment, cannot normally work in a low-temperature environment, and even cannot be started. Aiming at the chip or the device, omega-level heating resistance wires can be wound on the inner layer of the PCB nearby the chip or the device, and the resistance wires generate heat after being electrified to heat the chip or the device nearby, so that the low-temperature adaptability is improved.
The general heating circuit power supply adopts low-cost power, and output voltage is invariable, and once the heating coil is finished by winding design, the resistance value is fixed, thereby leading to the invariable unadjustable heating power.
Disclosure of Invention
To solve the technical problems mentioned in the background, in one aspect of the present invention, a power adjustable plate-level heating circuit is provided, which includes: the control module, the output power control circuit and the heating element; the output power control circuit further comprises a voltage stabilizing module, the control module is connected with an enabling end of the voltage stabilizing module in the output power control circuit, an output end of the output power control circuit is connected with the heating element, and the control module is configured to output a PWM control signal to control the output power of the output power control circuit to the heating element.
In one or more embodiments, the output power control circuit further comprises: a first voltage dividing resistor and a second voltage dividing resistor; the first voltage-dividing resistor and the second voltage-dividing resistor are connected in series and coupled between a switch end and a ground potential end of the voltage-stabilizing module, and a common end of the first voltage-dividing resistor and the second voltage-dividing resistor is connected with a feedback end of the voltage-stabilizing module.
In one or more embodiments, the second voltage divider resistor is a thermistor.
In one or more embodiments, an output inductor is further disposed between the switching terminal of the voltage stabilizing module and the first voltage dividing resistor.
In one or more embodiments, a common terminal of the output inductor and the first voltage-dividing resistor is configured as an output terminal of the output power control circuit, and an output capacitor is provided between the output terminal and the ground potential terminal.
In one or more embodiments, the control module includes a CPU, MCU, or CPLD.
In one or more embodiments, the heating element comprises: an electric heating wire or an electric heating sheet.
In another aspect of the present invention, a PCB board is further provided, wherein the PCB board is preset with the board-level heating circuit with adjustable power; the heating wire or the heating sheet is arranged on the outer surface of the PCB or embedded in the interlayer of the PCB.
In another aspect of the invention, the invention also provides a computer, and the computer is provided with the PCB board.
The beneficial effects of the invention include: the invention not only realizes the arbitrary adjustment of the output power through the PWM control, but also realizes the automatic fine adjustment of the output power under the condition of not changing the PWM signal through the addition of the thermistor, thereby keeping the environment temperature within the temperature range in which the integrated circuit can normally work. In addition, the power-adjustable plate-level heating circuit provided by the invention has the characteristics of simple structure and low cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
Fig. 1 is a schematic circuit diagram of a power-adjustable board-level heating circuit according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In order to realize the normal work of the integrated circuit at low temperature, the invention provides a board-level heating circuit with adjustable power, and particularly controls the output power of the heating circuit through a PWM control signal so as to control the heating temperature. Wherein, the PWM signal can be generated by one of a CPU, an MCU or a CPLD in the integrated circuit.
Fig. 1 is a schematic circuit diagram of a power-adjustable board-level heating circuit according to the present invention. In the embodiment shown in fig. 1, the adjustable power board level heating circuit comprises:
a control module 10, an output power control circuit 20, and a heating element 30; the output power control circuit 20 further includes a voltage stabilizing module, the control module 10 is connected to an enable terminal EN of a voltage stabilizing module UI in the output power control circuit 20, an output terminal VOUT of the output power control circuit 20 is connected to the heating element 30, and the control module 10 is configured to output a PWM control signal to control the output power control circuit 20 to turn on or off so as to control the output power of the output power control circuit to the heating element 30.
Specifically, the output power control circuit further includes: a first dividing resistor RA and a second dividing resistor RB; the first voltage-dividing resistor RA and the second voltage-dividing resistor RB are connected in series and coupled between a switch end SW of the voltage-stabilizing module UI and a ground potential end, and a common end of the first voltage-dividing resistor RA and the second voltage-dividing resistor RB is connected with a feedback end FB of the voltage-stabilizing module UI. An output inductor L is further disposed between the switch end SW of the voltage stabilizing module UI and the first voltage dividing resistor RA. And configuring a common end of the output inductor and the first voltage division resistor RA as an output end VOUT of the output power control circuit, and arranging an output capacitor COUT between the output end VOUT and the ground potential end. The output inductor L and the output capacitor COUT are used to form an energy storage and filter circuit to ensure the stability of the output current.
More specifically, the control module includes one of a CPU, an MCU, or a CPLD. In a preferred embodiment, a CPLD which is idle in an integrated circuit is used as a control module. The CPLD in the integrated circuit is generally used for power-on control and self-checking work during starting, the CPLD is used as a main control module to avoid occupying computing resources of a CPU or an MCU, and the CPLD can directly start to control and generate PWM work after the power-on and self-checking of the CPLD are finished, so that the interaction process of related signals is also avoided.
More specifically, the heating element comprises: an electric heating wire or an electric heating sheet. The heating wire or the heating sheet is arranged on the outer surface of the PCB or embedded in the interlayer of the PCB.
The adjustable output power is realized by the board-level heating circuit with adjustable power, however, in a further embodiment, the invention also provides a method for realizing automatic fine adjustment of power under the condition of not changing the duty ratio of the PWM control signal. Specifically, the second voltage-dividing resistor RB is configured as a positive temperature coefficient thermistor (with temperature rise, resistance value increase) to automatically adjust output power according to the ambient temperature, so as to maintain the ambient temperature within a temperature range suitable for the integrated circuit to work. The specific principle of the above embodiment is as follows:
the voltage stabilizing module UI is specifically a switching buck regulator, and includes pins such as an input terminal VIN, a switching terminal SW, a feedback terminal FB, and an enable terminal EN. In the working process, the common end of RA and RB is connected with the voltage stabilizer UI through the FB end, so that the divided voltage of RA and RB is compared with the reference voltage VREF inside the voltage stabilizer UI, and the adjustment of VOUT is realized according to the configuration proportion of the resistance values of RA and RB. The relationship between VOUT and RA and RB satisfies the following formula:
VOUT=(1+RA/RB)*VREF
initially, the heating element is energized to generate heat, so that the ambient temperature rises, and the change of the ambient temperature can be realized by the output power WOutput ofAnd power W corresponding to ambient heat lossDecrease in the thickness of the steelExpressed, the formula is as follows:
Woutput of-WDecrease in the thickness of the steel=C
C is a constant, and when C is larger than zero, the ambient temperature will rise, so that the resistance value of the positive temperature coefficient thermistor RB rises, VOUT falls, and C is reduced; when C decreases to 0, the ambient temperature no longer changes, and the resistance of the thermistor RB also no longer changes. Where the PWM control signal is used to control the nominal output power, which will ultimately determine the final ambient temperature.
At this time, when the ambient temperature changes, after the balance of C equal to 0 is broken, a new balance of C equal to 0 is reestablished, and the ambient temperature can be always kept within a certain temperature range by selecting a suitable thermistor.
Through the addition of the thermistor, the process of controlling the duty ratio of the PWM signal in real time according to environmental changes and further controlling the rated output power is simplified. The structure of the heating circuit of the invention can be simpler and the cost is lower.
In another alternative embodiment, the rated output power can be controlled without using the PWM control signal, and the automatic fine adjustment of the output power with the change of the ambient temperature can be realized only by setting the second voltage dividing resistor as the thermistor.
On the basis of the above embodiments, the present invention further provides a PCB board, wherein the PCB board is preset with the board-level heating circuit with adjustable power; the heating wire or the heating sheet is arranged on the outer surface of the PCB or embedded in the interlayer of the PCB.
On the basis of the above embodiments, the invention further provides a computer, and the computer is provided with the above PCB.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the disclosed embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.
The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, of embodiments of the invention is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (9)
1. A power adjustable board level heating circuit, comprising:
the control module, the output power control circuit and the heating element;
the output power control circuit further comprises a voltage stabilizing module, the control module is connected with an enabling end of the voltage stabilizing module in the output power control circuit, an output end of the output power control circuit is connected with the heating element, and the control module is configured to output a PWM control signal to control the output power of the output power control circuit to the heating element.
2. The power adjustable board level heating circuit of claim 1, wherein said output power control circuit further comprises:
a first voltage dividing resistor and a second voltage dividing resistor;
the first voltage-dividing resistor and the second voltage-dividing resistor are connected in series and coupled between a switch end and a ground potential end of the voltage-stabilizing module, and a common end of the first voltage-dividing resistor and the second voltage-dividing resistor is connected with a feedback end of the voltage-stabilizing module.
3. The power adjustable, board level heating circuit of claim 2, wherein said second voltage divider resistor is a thermistor.
4. A power regulated board level heating circuit according to claim 2 or 3, wherein an output inductor is further provided between the switching terminal of said voltage regulation module and said first voltage divider resistor.
5. The power adjustable board level heating circuit according to claim 4, wherein a common terminal of the output inductor and the first voltage dividing resistor is configured as an output terminal of the output power control circuit, and an output capacitor is provided between the output terminal and the ground potential terminal.
6. The adjustable power board level heating circuit of claim 1, wherein the control module comprises a CPU, MCU or CPLD.
7. The power adjustable, board level heating circuit of claim 1, wherein said heating element comprises: an electric heating wire or an electric heating sheet.
8. A PCB board, characterized in that the PCB board is preset with the adjustable power board level heating circuit of any one of claims 1 to 7;
the heating wire or the heating sheet is arranged on the outer surface of the PCB or embedded in the interlayer of the PCB.
9. A computer, characterized in that the computer is provided with a PCB board according to claim 8.
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CN202011168023.5A CN112347718A (en) | 2020-10-28 | 2020-10-28 | Board level heating circuit, PCB board and computer of adjustable power |
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CN202011168023.5A CN112347718A (en) | 2020-10-28 | 2020-10-28 | Board level heating circuit, PCB board and computer of adjustable power |
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US20110286138A1 (en) * | 2010-05-21 | 2011-11-24 | Junda Shi | Temperature Controller |
CN103702460A (en) * | 2013-12-20 | 2014-04-02 | 深圳英飞拓科技股份有限公司 | Simple small power controllable heating circuit |
CN204392088U (en) * | 2015-02-11 | 2015-06-10 | 深圳市施美森科技有限公司 | A kind of voltage stabilizing circuit of adjustable voltage |
CN107272771A (en) * | 2017-06-16 | 2017-10-20 | 深圳市共进电子股份有限公司 | The heater and method of main control chip |
CN206877177U (en) * | 2017-07-11 | 2018-01-12 | 北京数码视讯科技股份有限公司 | A kind of temperature control equipment and heater |
CN207557710U (en) * | 2017-11-02 | 2018-06-29 | 北京华亘安邦科技有限公司 | The temperature-adjusting circuit of heating chip based on itself thermometric |
US20190079337A1 (en) * | 2016-08-30 | 2019-03-14 | Boe Technology Group Co., Ltd. | Feedback circuit, heating circuit, display apparatus and display system |
CN109526069A (en) * | 2018-11-14 | 2019-03-26 | 深圳市国赛生物技术有限公司 | Overtemperature protection circuit and on-site rapid inspection instrument |
CN111464027A (en) * | 2020-06-04 | 2020-07-28 | 重庆邮电大学 | Programmable digital power supply system and method integrating switch power supply and linear power supply |
CN111831027A (en) * | 2019-04-23 | 2020-10-27 | 浙江宇视科技有限公司 | Outdoor electronic equipment and system circuit thereof |
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2020
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Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101187586A (en) * | 2006-11-15 | 2008-05-28 | 深圳迈瑞生物医疗电子股份有限公司 | Probe heating circuit of quick body temperature measuring device |
US20110286138A1 (en) * | 2010-05-21 | 2011-11-24 | Junda Shi | Temperature Controller |
CN103702460A (en) * | 2013-12-20 | 2014-04-02 | 深圳英飞拓科技股份有限公司 | Simple small power controllable heating circuit |
CN204392088U (en) * | 2015-02-11 | 2015-06-10 | 深圳市施美森科技有限公司 | A kind of voltage stabilizing circuit of adjustable voltage |
US20190079337A1 (en) * | 2016-08-30 | 2019-03-14 | Boe Technology Group Co., Ltd. | Feedback circuit, heating circuit, display apparatus and display system |
CN107272771A (en) * | 2017-06-16 | 2017-10-20 | 深圳市共进电子股份有限公司 | The heater and method of main control chip |
CN206877177U (en) * | 2017-07-11 | 2018-01-12 | 北京数码视讯科技股份有限公司 | A kind of temperature control equipment and heater |
CN207557710U (en) * | 2017-11-02 | 2018-06-29 | 北京华亘安邦科技有限公司 | The temperature-adjusting circuit of heating chip based on itself thermometric |
CN109526069A (en) * | 2018-11-14 | 2019-03-26 | 深圳市国赛生物技术有限公司 | Overtemperature protection circuit and on-site rapid inspection instrument |
CN111831027A (en) * | 2019-04-23 | 2020-10-27 | 浙江宇视科技有限公司 | Outdoor electronic equipment and system circuit thereof |
CN111464027A (en) * | 2020-06-04 | 2020-07-28 | 重庆邮电大学 | Programmable digital power supply system and method integrating switch power supply and linear power supply |
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