CN112345096B

CN112345096B - Movable temperature probe device

Info

Publication number: CN112345096B
Application number: CN202011101579.2A
Authority: CN
Inventors: 张凤雏; 顾益刚; 许文专; 朱君昌
Original assignee: Jiangyin Sfere Electric Co ltd
Current assignee: Jiangyin Sfere Electric Co ltd
Priority date: 2020-10-15
Filing date: 2020-10-15
Publication date: 2023-07-18
Anticipated expiration: 2040-10-15
Also published as: CN112345096A

Abstract

The invention discloses a movable temperature probe device, which comprises two identical temperature sensor shells, a rod-type temperature sensor and a spring, wherein the temperature sensor shells are made of high-temperature resistant materials, the two temperature sensor shells are assembled to form a shell, and a pipeline for installing the rod-type temperature sensor and a deformation cavity for installing the spring are formed in the shell; the movable temperature probe is installed, the rod-type temperature sensor is used for elastic compression movement, a chute installation structure is arranged in the middle of the outer layer of the temperature sensor shell, the movable temperature probe is installed in the guide groove structure through the chute installation structure, and the movable temperature probe slides in the guide groove structure to reach a specified measuring point.

Description

Movable temperature probe device

Technical Field

The invention relates to the technical field of temperature probes, in particular to an active temperature probe device.

Background

The power equipment and the circuit cable can generate heat in operation, potential safety hazards such as fire disaster can be caused when the temperature reaches a certain temperature, a temperature probe is needed to measure a place which possibly generates high-temperature potential hazards, the traditional probe needs to be in contact with the surface of a measurement target by means of an additional fixing means, the reliability and the accuracy are low, and the operation is not easy when the target position needs to be adjusted again.

Disclosure of Invention

The invention aims at the problems and the shortcomings of the prior art and provides an active temperature probe device which can reliably contact a target measured object and can move the position according to the planning.

The invention solves the technical problems by the following technical proposal:

the invention provides a movable temperature probe device which is characterized by comprising two identical temperature sensor shells, a rod-type temperature sensor and a spring, wherein the temperature sensor shells are made of high-temperature resistant materials, the two temperature sensor shells are assembled in a involution mode to form a shell, and a pipeline for installing the rod-type temperature sensor and a deformation cavity for installing the spring are formed in the shell; the movable temperature probe is installed, the rod-type temperature sensor is used for elastic compression movement, a chute installation structure is arranged in the middle of the outer layer of the temperature sensor shell, the movable temperature probe is installed in the guide groove structure through the chute installation structure, and the movable temperature probe slides in the guide groove structure to reach a specified measuring point.

Preferably, a pipeline structure is arranged in each temperature sensor shell, and a pipeline for the rod-type temperature sensor to move is formed after the two same temperature sensor shells are assembled in a involution mode; a deformation groove is formed in each temperature sensor shell, and a deformation cavity for installing a spring is formed after the two same temperature sensor shells are assembled in a involution mode; the side end of each temperature sensor shell is provided with a hasp structure for assembling and fixing two identical temperature sensor shells in a butt joint way.

Preferably, the rod-type temperature sensor is provided with a metal shell, the metal shell is in a hollow shape with an opening at the rear end, a baffle matched with the spring is arranged in the middle of the rear end of the rod-type temperature sensor, a fixed wire structure is arranged on the baffle, a thermosensitive element is arranged in the front end of the rod-type temperature sensor, and temperature data acquired by the thermosensitive element are transmitted to a measuring circuit through a rear end connecting wire.

On the basis of conforming to the common knowledge in the field, the above preferred conditions can be arbitrarily combined to obtain the preferred examples of the invention.

The invention has the positive progress effects that:

the rod-type temperature sensor can perform elastic compression movement, the thermosensitive element is positioned in the front end of the rod-type temperature sensor, and the front end of the rod-type temperature sensor is compressed and then contacts with the measuring surface so as to ensure the accuracy of sampling; the baffle of the rod type temperature sensor is provided with a fixed wire structure, so that the voltage can be measured or the working power supply can be taken while the charged target is measured; the middle part of the temperature sensor shell is provided with a chute mounting structure, the movable temperature probe can be mounted in a guide groove structure in a specific form, the movable temperature probe can slide in the guide groove structure to reach a designated measuring point, the movable temperature probe can be flexibly applied to various measuring occasions, only a matched mounting groove is manufactured, the application range is wide, and the movable temperature probe has a wide market prospect.

Drawings

FIG. 1 is a schematic illustration of the components of an active temperature probe device of the present invention;

FIG. 2 is a schematic diagram of an active temperature probe;

FIGS. 3 (a) - (b) are schematic views of a second housing structure;

FIGS. 4 (a) - (c) are schematic illustrations of assembly of an active temperature probe;

FIG. 5 is a schematic view of a particular form of channel structure;

FIG. 6 is a schematic illustration of the dimensions of an active temperature probe in cooperation with a particular form of channel structure;

FIGS. 7 (a) - (c) are schematic illustrations of a channel structure with an active temperature probe mounted in a particular form;

FIG. 8 is a schematic view showing the elastic compression movement of the surface of the measurement object after the movable temperature probe is mounted in the guide groove structure of a specific form;

FIG. 9 is a schematic diagram of a data acquisition mode after temperature measurement;

FIGS. 10 (a) - (d) are schematic diagrams of exemplary embodiments;

FIG. 11 is a schematic diagram showing the distribution of the active temperature probe after the assembly of the exemplary embodiment of FIG. 10;

FIG. 12 is a schematic view of the translational movement of the active temperature probe in zone A of FIG. 11;

FIGS. 13 (a) - (b) are schematic diagrams of exemplary case one measurement of different pitch targets;

FIGS. 14 (a) - (d) are schematic diagrams of exemplary case two;

fig. 15 (a) - (b) are three schematic diagrams of typical cases.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

An exploded view of an active temperature probe device is shown in fig. 1, and comprises two temperature sensor shells 1, a rod-type temperature sensor 2 and a spring 3, which are identical in structure.

As shown in fig. 2, a pipeline structure 1a is arranged inside each temperature sensor shell 1, and a pipeline for the rod-type temperature sensor 2 to move is formed after the two same temperature sensor shells 1 are assembled in a involution mode; a deformation groove 1b for installing a spring 3 is formed in each temperature sensor shell 1, and a deformation cavity for installing the spring 3 is formed after the two same temperature sensor shells 1 are assembled in a involution mode; the side end of each temperature sensor shell 1 is provided with a hasp structure 1c, and the hasp structure 1c is used for assembling and fixing two identical temperature sensor shells 1 in a butt joint mode.

As shown in fig. 3 (a) - (b), the rod-shaped temperature sensor 2 is provided with a metal shell 2a, the metal shell 2a is in a hollow shape with an opening at the rear end, a baffle plate 2b matched with the spring 3 is arranged in the middle of the rear end of the rod-shaped temperature sensor 2, a fixed lead structure 2d is arranged on the baffle plate 2b, a thermosensitive element 2e is arranged in the front end of the rod-shaped temperature sensor 2, and temperature data acquired by the thermosensitive element 2e are transmitted to a measuring circuit through a rear end connecting wire 2 c.

The installation process of the movable temperature probe device is shown in fig. 4 (a) - (c), the spring 3 is firstly assembled at the tail end of the rod-type temperature sensor 2 to the position of the baffle plate 2b as shown in fig. 4 (a), then the two same temperature sensor shells 1 are assembled and fixed in a butt joint manner as shown in fig. 4 (c), and the assembly of the movable temperature probe is completed.

As shown in fig. 5, which is a schematic view of a specific form of the guide groove structure, in combination with fig. 6, the dimension BCDE in the guide groove structure corresponds to the dimension BCDE on the movable temperature probe.

As shown in fig. 7 (a) - (c), a schematic view of a guide groove structure in which the movable temperature probe is mounted in a specific form is shown, the movable temperature probe 101 is first mounted in the guide groove structure 102 in the direction shown in fig. 7 (a), and then slid in the direction shown in fig. 7 (b) to move the movable temperature probe 101 to the designated position of the guide groove structure 102 as shown in fig. 7 (c).

Fig. 8 is a schematic diagram of elastic compression activity of the surface of a measurement target object after the movable temperature probe is mounted in a specific form of guide groove structure, as shown in the drawing, after the movable temperature probe 101 is mounted in the guide groove structure 102, the front end of the movable temperature probe 101 contacts the measurement target object 103, force n is applied to the guide groove structure 102 according to the direction of the drawing, the rod-shaped temperature sensor 2 in the movable temperature probe 101 is stressed and presses the spring 3 backwards, the spring 3 deforms to form a reaction force f so that the front end of the movable temperature probe 101 closely contacts the measurement target object 103, the measurement accuracy is improved, and the measurement is more reliable when voltage signal and working power supply are required.

As shown in fig. 9, after the active temperature probe 101 collects temperature data, the active temperature probe is electrically connected with the measurement circuit 104 through the data connection line 2C at the rear end of the rod-type temperature sensor 2 to transmit data.

As shown in fig. 10 (a) - (d), a schematic diagram of a typical case is shown, which has a housing 4 with 4 guide groove structures 4a, and 4 active temperature probes 101 are installed, the active temperature probes 101 collect temperature data and then electrically connect with a measurement circuit 104 through a data connection line 2C at the rear end of the rod-type temperature sensor 2 to transmit data, and a voltage signal and a working power supply are taken through a fixed wire structure 2 d.

Fig. 11 is a schematic diagram showing the distribution of the movable temperature probe 101 after the assembly of the exemplary case of fig. 10, and in combination with fig. 12, the movable temperature probe 101 moves within a certain range g.

As shown in fig. 13 (a) - (b), in conjunction with fig. 11 and 12, the case of fig. 10 can measure targets of different pitches c and d, such as bus bars of different current specifications, due to the movable nature of the movable temperature probe 101.

As shown in fig. 14 (a) - (d), the mounting groove 105 has a long and narrow guiding groove structure, and can sequentially mount a plurality of movable temperature probes 101, and can measure the test objects 106 on a plurality of paths.

As shown in fig. 15 (a) - (b), the mounting groove 107 has a cross-shaped channel structure, wherein a plurality of measurement target points 108 are distributed in the cross-shaped channel structure, and the movable temperature probe 101 can accurately reach the measurement target points 108 along the cross-shaped channel structure for temperature measurement.

10-15, the movable temperature probe 101 can be flexibly applied to various measurement occasions, and only a matched mounting groove is formed, so that the movable temperature probe has wide application range and wide market prospect.

While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that these are by way of example only, and the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the principles and spirit of the invention, but such changes and modifications fall within the scope of the invention.

Claims

1. The movable temperature probe device is characterized by comprising two identical temperature sensor shells, a rod-type temperature sensor and a spring, wherein the temperature sensor shells are made of high-temperature resistant materials, the two temperature sensor shells are assembled in a butt joint way to form a shell, and a pipeline for installing the rod-type temperature sensor and a deformation cavity for installing the spring are formed in the shell; the rod-type temperature sensor is used for elastic compression movement, a chute mounting structure is arranged in the middle of the outer layer of the temperature sensor shell, the movable temperature probe is mounted in the guide groove structure through the chute mounting structure, and the movable temperature probe slides in the guide groove structure to reach a designated measuring point;

a pipeline structure is arranged in each temperature sensor shell, and a pipeline for the rod-type temperature sensor to move is formed after the two same temperature sensor shells are assembled in a involution mode; a deformation groove is formed in each temperature sensor shell, and a deformation cavity for installing a spring is formed after the two same temperature sensor shells are assembled in a involution mode; the side end of each temperature sensor shell is provided with a hasp structure for assembling and fixing two identical temperature sensor shells in a involution way;

the rod type temperature sensor is provided with a metal shell, the metal shell is in a hollow shape with an opening at the rear end, a baffle matched with a spring is arranged in the middle of the rear end of the rod type temperature sensor, a fixed wire structure is arranged on the baffle, a thermosensitive element is arranged in the front end of the rod type temperature sensor, and temperature data acquired by the thermosensitive element are transmitted to a measuring circuit through a rear end connecting wire.