CN112345096A

CN112345096A - Movable temperature probe device

Info

Publication number: CN112345096A
Application number: CN202011101579.2A
Authority: CN
Inventors: 张凤雏; 顾益刚; 许文专; 朱君昌
Original assignee: Jiangyin Sfere Electric Co ltd
Current assignee: Jiangyin Sfere Electric Co ltd
Priority date: 2020-10-15
Filing date: 2020-10-15
Publication date: 2021-02-09
Anticipated expiration: 2040-10-15
Also published as: CN112345096B

Abstract

The invention discloses an active temperature probe device, which comprises two identical temperature sensor shells, a rod-shaped temperature sensor and a spring, wherein the temperature sensor shells are made of high-temperature-resistant materials, the two temperature sensor shells are oppositely mounted to form a shell, and a pipeline for mounting the rod-shaped temperature sensor and a deformation cavity for mounting the spring are formed in the shell; the temperature sensor comprises a rod-shaped temperature sensor, a sliding groove mounting structure is arranged in the middle of the outer layer of a shell of the temperature sensor, the movable temperature probe is mounted in a guide groove structure through the sliding groove mounting structure, and the movable temperature probe slides in the guide groove structure to reach a specified measuring point.

Description

Movable temperature probe device

Technical Field

The invention relates to the technical field of temperature probes, in particular to a movable temperature probe device.

Background

Power equipment and circuit cable all can produce the heat in service, reach the certain temperature and can arouse potential safety hazards such as conflagration, we need use temperature probe to go to measure the place that probably produces high temperature hidden danger, and traditional probe need contact with the help of extra fixed means and measures the target surface, and unreliable and accuracy are low, and difficult operation when needs adjust the target location once more.

Disclosure of Invention

The invention provides a movable temperature probe device which can reliably contact a target measuring object and move according to a planning position aiming at the problems and the defects of the prior art.

The invention solves the technical problems through the following technical scheme:

the invention provides a movable temperature probe device which is characterized by comprising two identical temperature sensor shells, a rod-shaped temperature sensor and a spring, wherein the temperature sensor shells are made of high-temperature-resistant materials, the two temperature sensor shells are oppositely mounted to form a shell, and a pipeline for mounting the rod-shaped temperature sensor and a deformation cavity for mounting the spring are formed in the shell; the temperature sensor comprises a rod-shaped temperature sensor, a sliding groove mounting structure is arranged in the middle of the outer layer of a shell of the temperature sensor, the movable temperature probe is mounted in a guide groove structure through the sliding groove mounting structure, and the movable temperature probe slides in the guide groove structure to reach a specified measuring point.

Preferably, a pipeline structure is arranged in each temperature sensor shell, and a pipeline for the rod-type temperature sensor to move is formed after two identical temperature sensor shells are assembled in a involutory manner; a variable groove is formed in each temperature sensor shell, and a variable cavity for mounting a spring is formed after two identical temperature sensor shells are assembled in a involutory manner; the side end of each temperature sensor shell is provided with a hasp structure for involutory assembly and fixation of two identical temperature sensor shells.

Preferably, the rod-shaped temperature sensor is provided with a metal shell, the metal shell is in a hollow shape with an opening at the rear end, a blocking piece matched with the spring is arranged in the middle of the rear end of the rod-shaped temperature sensor, a fixed lead structure is arranged on the blocking piece, a thermosensitive element is arranged inside the front end of the rod-shaped temperature sensor, and temperature data acquired by the thermosensitive element is transmitted to the measuring circuit through a rear end connecting wire.

On the basis of the common knowledge in the field, the above preferred conditions can be combined randomly to obtain the preferred embodiments of the invention.

The positive progress effects of the invention are as follows:

the rod-type temperature sensor can be elastically compressed, the thermosensitive element is positioned in the front end of the rod-type temperature sensor, and the front end of the rod-type temperature sensor is compressed and then contacts with the measuring surface, so that the sampling accuracy can be ensured; a fixed lead structure is arranged on a baffle of the rod-type temperature sensor, so that the voltage can be measured or a working power supply can be obtained while the charged target is measured; the middle part of the temperature sensor shell is provided with a sliding groove mounting structure, the movable temperature probe can be mounted in a guide groove structure in a specific form, the movable temperature probe can slide in the guide groove structure and reach a specified measuring point, the movable temperature probe can be flexibly applied to various measuring occasions, only the matched mounting groove is required to be manufactured, the application range is wide, and the market prospect is wide.

Drawings

FIG. 1 is a schematic view of the components of the active temperature probe apparatus of the present invention;

FIG. 2 is a schematic view of an active temperature probe;

FIGS. 3(a) - (b) are schematic views of a second housing structure;

FIGS. 4(a) - (c) are schematic diagrams of an active temperature probe assembly;

FIG. 5 is a view showing a structure of a guide groove in a specific form;

FIG. 6 is a schematic diagram showing the dimensions of a movable temperature probe in cooperation with a particular type of channel structure;

FIGS. 7(a) - (c) are schematic views showing the structure of a guide groove for mounting a movable temperature probe to a specific type;

FIG. 8 is a schematic view showing the elastic compression movement of the surface of the measurement target after the movable temperature probe is mounted in a specific type of guide groove structure;

FIG. 9 is a schematic diagram of a data acquisition mode after temperature measurement;

FIGS. 10(a) - (d) are schematic diagrams of an exemplary case;

FIG. 11 is a schematic view of the exemplary case-after-assembly active temperature probe distribution of FIG. 10;

FIG. 12 is a schematic view of the translation movement of the active temperature probe of zone A of FIG. 11;

FIGS. 13(a) - (b) are schematic diagrams of an exemplary case-measuring targets with different pitches;

FIGS. 14(a) - (d) are schematic diagrams of exemplary case two;

FIGS. 15(a) - (b) are schematic diagrams of exemplary case III.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

Fig. 1 shows an exploded view of the active temperature probe device, which comprises two temperature sensor shells 1 with the same structure, a rod-type temperature sensor 2 and a spring 3.

As shown in fig. 2, a pipeline structure 1a is arranged in each temperature sensor shell 1, and a pipeline for the movement of the rod-type temperature sensor 2 is formed after two identical temperature sensor shells 1 are assembled oppositely; a deformation groove 1b for mounting a spring 3 is formed in each temperature sensor shell 1, and a deformation cavity for mounting the spring 3 is formed after the two same temperature sensor shells 1 are oppositely assembled; the side end of each temperature sensor shell 1 is provided with a snap structure 1c, and the snap structures 1c are used for the involution assembly and fixation of two identical temperature sensor shells 1.

As shown in fig. 3(a) - (b), the rod-type temperature sensor 2 is provided with a metal shell 2a, the metal shell 2a is in a hollow shape with an opening at the rear end, a baffle plate 2b matched with the spring 3 is arranged in the middle of the rear end of the rod-type temperature sensor 2, a fixed lead structure 2d is arranged on the baffle plate 2b, a thermosensitive element 2e is arranged inside the front end of the rod-type temperature sensor 2, and temperature data collected by the thermosensitive element 2e is transmitted to the measuring circuit through a rear end connecting wire 2 c.

As shown in fig. 4(a) - (c), the process of installing the movable temperature probe device is shown, as shown in fig. 4(a), the spring 3 is firstly installed into the position from the tail end of the rod-type temperature sensor 2 to the position of the baffle 2b as shown in fig. 4(b), and then two identical temperature sensor shells 1 are assembled and fixed in a butting way as shown in fig. 4(c), and the movable temperature probe is assembled.

Referring to fig. 5, which is a schematic diagram of a particular type of channel configuration, and to fig. 6, the dimension BCDE of the channel configuration corresponds to the dimension BCDE of the active temperature probe, respectively.

Referring to fig. 7(a) - (c), which are schematic views of a specific type of guide groove structure for installing the movable temperature probe 101, the movable temperature probe 101 is first installed in the guide groove structure 102 in the direction shown in fig. 7(a), and then is slid in the direction shown in fig. 7(b) to move the movable temperature probe 101 to a designated position of the guide groove structure 102, as shown in fig. 7 (c).

Fig. 8 is a schematic diagram showing that the movable temperature probe is installed on the surface of a measurement target object in an elastic compression movement after the movable temperature probe is installed in a specific type of guide groove structure, as shown in the figure, after the movable temperature probe 101 is installed in the guide groove structure 102, the front end of the movable temperature probe 101 contacts with the measurement target object 103, n force is applied to the guide groove structure 102 according to the direction shown in the figure, the rod-type temperature sensor 2 in the movable temperature probe 101 is stressed to extrude the spring 3 backwards, the spring 3 deforms to form a reaction force f, so that the front end of the movable temperature probe 101 is in close contact with the measurement target object 103, the measurement precision is improved, and the movable temperature probe is.

As shown in fig. 9, the active temperature probe 101 collects temperature data and then is electrically connected to the measurement circuit 104 via a data connection 2C at the rear end of the rod-type temperature sensor 2 to transmit the data.

As shown in fig. 10(a) - (d), a typical case is schematically illustrated, which includes a housing 4 having 4 guiding

groove structures

4a, 4 active temperature probes 101 are installed, the active temperature probes 101 collect temperature data and then are electrically connected to a measuring circuit 104 through a data connecting line 2C at the rear end of the rod-type temperature sensor 2 to transmit data, and a fixed conducting wire structure 2d is used to obtain voltage signals and working power.

Fig. 11 is a schematic diagram showing the distribution of the movable temperature probe 101 after the assembly of the exemplary case of fig. 10, and in conjunction with fig. 12, the movable temperature probe 101 moves within a certain range g.

As shown in fig. 13(a) - (b), in conjunction with fig. 11 and 12, the case of fig. 10 can measure objects with different spacings c and d, such as bus bars with different current specifications, due to the movable nature of the movable temperature probe 101.

As shown in fig. 14(a) - (d) for a second exemplary embodiment, the mounting groove 105 has a long and narrow guiding groove structure, and can sequentially mount a plurality of active temperature probes 101 for measuring the test object 106 on a plurality of paths.

As shown in fig. 15(a) - (b) which are schematic diagrams of a typical case three, the installation slot 107 has a guide slot structure arranged in a cross, wherein a plurality of measurement target points 108 are distributed in the guide slot structure arranged in a cross, and the movable temperature probe 101 can accurately reach the measurement target points 108 along the guide slot structure arranged in a cross for temperature measurement.

With the combination of fig. 10-15, the movable temperature probe 101 can be flexibly applied to various measurement occasions, only needs to manufacture a matched mounting groove, has a wide application range and has a wide market prospect.

While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that these are by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.

Claims

1. The movable temperature probe device is characterized by comprising two identical temperature sensor shells, a rod-shaped temperature sensor and a spring, wherein the temperature sensor shells are made of high-temperature-resistant materials, the two temperature sensor shells are oppositely mounted to form a shell, and a pipeline for mounting the rod-shaped temperature sensor and a deformation cavity for mounting the spring are formed in the shell; the temperature sensor comprises a rod-shaped temperature sensor, a sliding groove mounting structure is arranged in the middle of the outer layer of a shell of the temperature sensor, the movable temperature probe is mounted in a guide groove structure through the sliding groove mounting structure, and the movable temperature probe slides in the guide groove structure to reach a specified measuring point.

2. The active temperature probe device according to claim 1, wherein a pipe structure is provided inside each temperature sensor housing, and a pipe for the rod type temperature sensor is formed after two identical temperature sensor housings are assembled in an involutory manner; a variable groove is formed in each temperature sensor shell, and a variable cavity for mounting a spring is formed after two identical temperature sensor shells are assembled in a involutory manner; the side end of each temperature sensor shell is provided with a hasp structure for involutory assembly and fixation of two identical temperature sensor shells.

3. The active temperature probe device according to claim 1, wherein the rod-type temperature sensor is provided with a metal shell, the metal shell is in a hollow shape with an opening at the rear end, a blocking piece matched with the spring is arranged in the middle of the rear end of the rod-type temperature sensor, a fixed lead structure is arranged on the blocking piece, a thermosensitive element is arranged inside the front end of the rod-type temperature sensor, and temperature data collected by the thermosensitive element is transmitted to the measuring circuit through a rear connecting wire.