CN112341755A - Yellowing-resistant transparent epoxy resin packaging material and preparation method and application thereof - Google Patents
Yellowing-resistant transparent epoxy resin packaging material and preparation method and application thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Abstract
The invention relates to the field of photoelectric device packaging materials, and discloses a yellowing-resistant transparent epoxy resin packaging material and a preparation method thereofA method and an application. The yellowing-resistant transparent epoxy resin packaging material is prepared from a composition containing epoxy resin, a diol modified anhydride curing agent, a curing accelerator, a release agent, a dispersing agent and a coloring agent. The epoxy resin is at least one of compounds shown in a formula (a), a formula (b), a formula (c) and a formula (d); the dihydric alcohol modified anhydride curing agent is a compound shown in a formula (g). The yellowing-resistant transparent epoxy resin packaging material prepared by the invention has good yellowing resistance and high light transmittance, and is suitable for the field of photoelectric device packaging.
Description
Technical Field
The invention relates to the field of photoelectric device packaging materials, in particular to a yellowing-resistant transparent epoxy resin packaging material and a preparation method and application thereof.
Background
In recent years, due to the popularization of the photoelectric device technology, the requirements on the reliability, aging resistance and light transmittance of the packaging material for the photoelectric device are higher and higher. The most widely used packaging materials in the market at present are mainly two types of packaging materials, namely organic silicon packaging materials and epoxy resin packaging materials. Among them, epoxy resin materials have been widely developed in the field of electronic device packaging due to their excellent chemical stability and adhesive properties.
The epoxy resin packaging material is generally a single-component or double-component combined packaging adhesive, but has poor aging resistance in the production process, is easy to have serious yellowing particularly in the high-temperature process, and is not suitable for application occasions with high aging resistance requirements. The ageing resistance of the polymer is generally improved by adding inorganic filler, but the light transmission performance of the polymer is reduced, so that the polymer cannot be used in application fields requiring both light transmission performance and ageing resistance.
Disclosure of Invention
The invention aims to overcome the defect that the yellowing resistance and the light transmittance of an epoxy resin packaging material in the prior art cannot be considered at the same time, and provides a yellowing-resistant transparent epoxy resin packaging material, and a preparation method and application thereof.
In order to achieve the above object, in a first aspect, the present invention provides a yellowing-resistant transparent epoxy resin encapsulating material, which is characterized in that the yellowing-resistant transparent epoxy resin encapsulating material is made of a composition containing an epoxy resin, a diol-modified acid anhydride curing agent, a curing accelerator, a release agent, a dispersant and a colorant;
wherein the composition comprises 30-45 wt% of epoxy resin, 51-68 wt% of dihydric alcohol modified anhydride curing agent, 43-50 wt% of anhydride curing agent, 0.25-0.7 wt% of curing accelerator, 0.3-0.9 wt% of release agent, 0.15-0.9 wt% of dispersing agent and 0.04-0.35 wt% of colorant based on the total weight of the composition;
wherein the epoxy resin is at least one of compounds shown in formula (a), formula (b), formula (c) and formula (d); the dibasic alcohol modified anhydride curing agent is a compound shown in a formula (g),
wherein R is a linear or branched chain alkylene of C1-C4, R 'is H or a linear or branched chain alkyl of C1-C3, R' is H or an alkyl of C1-C3, and n is 1-5.
Preferably, R is methyl or ethyl, R 'is H or C1-C3 linear alkyl, and R' is H or methyl.
Preferably, the colorant is one or more of ultramarine blue, phthalocyanine blue and fluorescent whitening agent, preferably ultramarine blue and/or phthalocyanine blue.
Preferably, the curing accelerator is an organic phosphorus and/or amine compound.
Preferably, the release agent is one or more of polyethylene wax, calcium stearate and zirconium stearate.
Preferably, the dispersant is one or more of 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltriethoxysilane and gamma- (2, 3-epoxypropoxy) propyltrimethoxysilane.
In a second aspect, the invention further provides a preparation method of the yellowing-resistant transparent solid epoxy resin packaging material, which comprises the following steps:
(1) reacting the dihydric alcohol shown in the formula (e) with the anhydride curing agent shown in the formula (f) to obtain a dihydric alcohol modified anhydride curing agent shown in the formula (g);
wherein R is a linear or branched chain alkylene of C1-C4, R 'is H or a linear or branched chain alkyl of C1-C3, R' is H or an alkyl of C1-C3, and n is 1-5; preferably, R is methyl or ethyl, R 'is H or a C1-C3 linear alkyl group, and R' is H or methyl.
(2) And reacting and curing the dihydric alcohol modified anhydride curing agent with epoxy resin, a curing accelerator, a release agent, a dispersing agent and a coloring agent to form a brittle solid, cooling, crushing, granulating and cake-making.
Preferably, in the step (1), the anhydride curing agent is one or more of methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, hexahydrophthalic anhydride and tetrahydrophthalic anhydride, and is preferably hexahydrophthalic anhydride and/or methyl hexahydrophthalic anhydride.
Preferably, the diol is one or more of ethylene glycol, 2-dimethyl-1, 3-propanediol, propylene glycol and butanediol, preferably ethylene glycol and/or 2, 2-dimethyl-1, 3-propanediol.
Preferably, in step (1), the reaction conditions include: the temperature is 100-130 ℃, preferably 100-105 ℃; the time is 15-40min, preferably 15-17 min.
Preferably, in step (2), the reaction conditions include: the temperature is 60-80 ℃, preferably 60-65 ℃; the time is 10-40min, preferably 10-15 min.
Preferably, in the step (2), the mixing conditions include: the temperature is 40-80 ℃, preferably 40-45 ℃; the time is 700-900min, preferably 750-800 min.
In a third aspect, the invention also provides an application of the yellowing-resistant transparent epoxy resin packaging material in the field of electronic device packaging or transparent LED supports.
The yellowing-resistant transparent epoxy resin packaging material provided by the invention also has a lower yellowing index at a temperature of more than 200 ℃, namely the material has better yellowing resistance, and simultaneously the material also has higher light transmittance, so that the epoxy resin packaging material prepared by the invention has better comprehensive performance and can be used in the field of electronic device packaging or transparent LED supports.
Detailed Description
The following describes in detail specific embodiments of the present invention. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
The endpoints of the ranges and any values disclosed herein are not limited to the precise range or value, and such ranges or values should be understood to encompass values close to those ranges or values. For ranges of values, between the endpoints of each of the ranges and the individual points, and between the individual points may be combined with each other to give one or more new ranges of values, and these ranges of values should be considered as specifically disclosed herein.
The invention provides a yellowing-resistant transparent epoxy resin packaging material which is characterized by being prepared from a composition containing epoxy resin, a diol modified anhydride curing agent, a curing accelerator, a release agent, a dispersing agent and a coloring agent.
The composition may contain 30 to 45 wt% of an epoxy resin, 51 to 68 wt% of a diol-modified acid anhydride curing agent, 43 to 50 wt% of an acid anhydride curing agent, 0.25 to 0.7 wt% of a curing accelerator, 0.3 to 0.9 wt% of a release agent, 0.15 to 0.9 wt% of a dispersant, and 0.04 to 0.35 wt% of a colorant, based on the total weight of the composition.
Preferably, the composition comprises 32 to 44 weight percent of epoxy resin, 53 to 66 weight percent of diol modified acid anhydride curing agent, 44 to 49 weight percent of acid anhydride curing agent, 0.3 to 0.65 weight percent of curing accelerator, 0.4 to 0.8 weight percent of release agent, 0.2 to 0.8 weight percent of dispersant and 0.05 to 0.3 weight percent of colorant based on the total weight of the composition.
More preferably, the composition contains 34 to 42 wt% of the epoxy resin, 56.8 to 64 wt% of the diol-modified acid anhydride curing agent, 46 to 48 wt% of the acid anhydride curing agent, 0.35 to 0.5 wt% of the curing accelerator, 0.53 to 0.7 wt% of the release agent, 0.25 to 0.55 wt% of the dispersant, and 0.07 to 0.25 wt% of the colorant, based on the total weight of the composition.
Wherein the epoxy resin is at least one of compounds shown in formula (a), formula (b), formula (c) and formula (d), preferably triglycidyl isocyanurate shown in formula (b) and/or cyclic organosilicon multifunctional epoxy resin shown in formula (d).
Wherein the dihydric alcohol modified anhydride curing agent is a compound shown as a formula (g);
wherein R is a linear or branched alkylene group of C1-C4, such as methyl, ethyl, propyl, isopropyl, butyl or isobutyl;
r' is H or a linear or branched alkyl group of C1-C3, which may be, for example, H, methyl, ethyl, isopropyl or propyl;
r' is H or C1-C3 alkyl, which may be, for example, H, methyl, ethyl or propyl;
n is 1 to 5 and may be, for example, 1, 2,3, 4 or 5.
In a preferred case, R is methyl or ethyl, R 'is H or a linear alkyl group of C1-C3, and R' is H or methyl.
The colorants may be of conventional choice in the art according to the present invention. In order to obtain the compromise effect, the colorant is preferably one or more of ultramarine blue, phthalocyanine blue and fluorescent brightener, preferably ultramarine blue and/or phthalocyanine blue. The addition of the coloring agent can effectively neutralize the yellow color of the resin to be white due to the yellow color of the resin after aging, thereby improving the aging degree of the resin.
According to the present invention, the curing accelerator may be a conventional choice in the art. In order to obtain the compatible effects, the curing accelerator is preferably an organic phosphorus and/or amine compound.
Wherein, the organic phosphorus compound can be triphenylphosphine and/or methyl tributyl phosphine dimethyl phosphate; the amine compound may be diazabicyclo and/or triethanolamine.
According to the present invention, the release agent may be a conventional choice in the art. In order to obtain the compatible effect, the release agent is preferably one or more of polyethylene wax, calcium stearate and zirconium stearate.
In a further preferred aspect, the release agent is calcium stearate and/or zirconium stearate.
According to the present invention, the dispersant may be a conventional choice in the art. In order to obtain the effect, the dispersant is preferably one or more of 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltriethoxysilane and gamma- (2, 3-epoxypropoxy) propyltrimethoxysilane.
In a further preferred case, the dispersant is gamma- (2, 3-glycidoxy) propyltrimethoxysilane and/or 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane.
The invention also provides a preparation method of the yellowing-resistant transparent epoxy resin packaging material, which comprises the following steps:
(1) reacting the dihydric alcohol shown in the formula (e) with the anhydride curing agent shown in the formula (f) to obtain a dihydric alcohol modified anhydride curing agent shown in the formula (g),
wherein R, R', R ", and n are as previously defined.
(2) And reacting and curing the dihydric alcohol modified anhydride curing agent with epoxy resin, a curing accelerator, a release agent, a dispersing agent and a coloring agent to form a brittle solid, cooling, crushing, granulating and cake-making.
In the method of the present invention, the anhydride curing agent may be a conventional choice in the art. In order to obtain the effect, the acid anhydride curing agent is preferably one or more of methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, hexahydrophthalic anhydride and tetrahydrophthalic anhydride, and is preferably hexahydrophthalic anhydride and/or methyl hexahydrophthalic anhydride.
The amount of the acid anhydride curing agent may be 45 to 50 wt%, preferably 45.5 to 49 wt%, and more preferably 46 to 48 wt% of the finally prepared yellowing-resistant transparent epoxy resin encapsulating material.
In the process of the present invention, the glycol may be a conventional choice in the art. In order to obtain the effect, the dihydric alcohol is preferably one or more of ethylene glycol, 2-dimethyl-1, 3-propanediol, propylene glycol and butanediol, and is preferably ethylene glycol and/or 2, 2-dimethyl-1, 3-propanediol.
The amount of the dihydric alcohol may be 5 to 20 wt%, preferably 9 to 17 wt%, and more preferably 10.8 to 16 wt% of the finally prepared yellowing-resistant transparent epoxy resin encapsulating material.
In the method of the present invention, in order to obtain the compatible effects, in step (1), the reaction conditions preferably include: the temperature is 100-130 ℃, preferably 100-105 ℃; the time is 15-40min, preferably 15-17 min. The specific reaction temperature and reaction time can be determined by those skilled in the art according to practical situations, which are well known to those skilled in the art and will not be described herein.
In the method of the present invention, in order to obtain the compatible effects, in step (2), the reaction conditions preferably include: the temperature is 60-80 ℃, preferably 60-65 ℃; the time is 10-40min, preferably 10-15 min. The specific reaction temperature and reaction time can be determined by those skilled in the art according to practical situations, which are well known to those skilled in the art and will not be described herein.
In order to achieve the above-mentioned effects, the method of the present invention preferably further comprises the step (2) of mixing the components under the following conditions: the temperature is 40-80 ℃, preferably 40-45 ℃; the time is 700-900min, preferably 750-800 min. The specific mixing temperature and mixing time can be determined by those skilled in the art according to practical situations, which are well known to those skilled in the art and will not be described herein.
The invention further provides application of the epoxy resin packaging material prepared by the method in the field of electronic device packaging or transparent LED supports. The epoxy resin packaging material provided by the invention has yellowing resistance and higher light transmittance, so that the epoxy resin packaging material can be well applied to the field of photoelectric device packaging.
The present invention will be described in detail by way of examples, but the scope of the present invention is not limited thereto.
In the following examples and comparative examples, the prepared materials were subjected to the following property test items:
1. and (3) light transmittance measurement:
(1) transferring and injecting the prepared material into a special mold by using a mold press under the process conditions that the mold temperature is 175 ℃ and the mold pressing time is 270s, and solidifying and molding the material into a sheet with the thickness of 1 mm;
(2) initial light transmittance: curing the obtained sheet for 3h after passing through a 150 ℃ oven, and testing light transmittance at wavelengths of 400nm, 420nm, 560nm and 680nm by using a spectrophotometer UV 2600;
(3) light transmittance after reflow soldering: and (3) performing three reflow soldering tests on the sheet in the testing step (2), wherein the four-stage temperature is tested at each time and is respectively 220 ℃, 205 ℃, 200 ℃ and 295 ℃, and after the three reflow soldering tests, a spectrophotometer UV2600 is used for testing the light transmittance at the wavelengths of 400nm, 420nm, 560nm and 680 nm.
2. And (3) measuring the yellowing index:
the Yellowing Index (YI) of the material is calculated by the following formula according to the light transmittance of the material,
YI＝100·(T680-T420)/T560
wherein, T420、T560And T680The material has light transmittance under the wavelengths of 420nm, 560nm and 680nm, and the higher the yellowing index is, the more obvious the yellowing phenomenon is.
In the examples and comparative examples, some materials and numbers are as follows:
TGIC: triglycidyl isocyanurate, the structure of which is shown as the formula (b) above, is a product sold by Nissan chemical company under the brand name TEPIC-S;
KR-470: a cyclic silicone multifunctional epoxy resin having a structure represented by the formula (d) above, which is a commercially available product of the japanese shiner chemical;
KH-560: gamma- (2, 3-epoxypropoxy) propyl trimethoxy silane, which is a commercial product with Dow Corning brand Z-6040;
methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride: is a general product in domestic market;
ultramarine blue: is a commercial product of the Haolide brand ultramarine blue 5008;
triphenylphosphine: is commercially available from Xinrunder chemical Co., Ltd.
Examples 1 to 4 and comparative examples 1 to 2
Weighing the components according to the proportion in the table 1, adding the anhydride curing agent and the dihydric alcohol modifier into a three-neck flask, and mechanically stirring and reacting for 15min under the condition of 100 ℃ oil bath until the inner process of the flask is colorless and transparent, thus obtaining the dihydric alcohol modified anhydride curing agent. Transferring the dihydric alcohol modified anhydride curing agent into a glass reaction kettle, adding epoxy resin, mechanically stirring and reacting for 10min under the condition of oil bath at 60 ℃, then sequentially adding a curing accelerator, a release agent, a dispersing agent and a coloring agent, and continuing to react for 5 min. And (3) putting the obtained product into a 50 ℃ oven, carrying out curing reaction for 750min, cooling the obtained product to room temperature, and carrying out granulation and cake forming to obtain the yellowing-resistant transparent epoxy resin packaging material. The performance was tested and the results are shown in table 1.
TABLE 1
As can be seen from the test results of examples 1-4 and comparative examples 1-2 in Table 1, the addition of the diol-modified anhydride curing agent, the curing accelerator, the release agent, the dispersant and the colorant has a great influence on the yellowing resistance of the epoxy resin material, and can better improve the light transmittance of the epoxy resin material and reduce the yellowing index of the composition, thereby improving the aging resistance of the transparent epoxy resin material, and being suitable for the field of electronic device packaging or transparent LED supports.
The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, many simple modifications can be made to the technical solution of the invention, including combinations of various technical features in any other suitable way, and these simple modifications and combinations should also be regarded as the disclosure of the invention, and all fall within the scope of the invention.
Claims (10)
1. The yellowing-resistant transparent epoxy resin packaging material is characterized by being prepared from a composition containing epoxy resin, a diol modified anhydride curing agent, a curing accelerator, a mold release agent, a dispersing agent and a coloring agent;
wherein the composition comprises 30-45 wt% of epoxy resin, 51-68 wt% of dihydric alcohol modified anhydride curing agent, 43-50 wt% of anhydride curing agent, 0.25-0.7 wt% of curing accelerator, 0.3-0.9 wt% of release agent, 0.15-0.9 wt% of dispersing agent and 0.04-0.35 wt% of colorant based on the total weight of the composition;
the epoxy resin is at least one of compounds shown in a formula (a), a formula (b), a formula (c) and a formula (d),
the dibasic alcohol modified anhydride curing agent is a compound shown in a formula (g),
wherein R is a linear or branched chain alkylene of C1-C4, R 'is H or a linear or branched chain alkyl of C1-C3, R' is H or an alkyl of C1-C3, and n is 1-5.
2. The yellowing-resistant transparent epoxy resin packaging material according to claim 1, wherein R is methyl or ethyl, R 'is H or a C1-C3 linear alkyl group, and R' is H or methyl.
3. The yellowing-resistant transparent epoxy resin encapsulating material according to claim 1, wherein the colorant is one or more of ultramarine blue, phthalocyanine blue and a fluorescent brightener, preferably ultramarine blue and/or phthalocyanine blue.
4. The yellowing-resistant transparent epoxy resin packaging material according to claim 1, wherein the curing accelerator is an organic phosphorus and/or amine compound;
preferably, the release agent is one or more of polyethylene wax, calcium stearate and zirconium stearate;
preferably, the dispersant is one or more of 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltriethoxysilane and gamma- (2, 3-epoxypropoxy) propyltrimethoxysilane.
5. A method for preparing the yellowing-resistant transparent epoxy resin packaging material of any one of claims 1 to 4, comprising the following steps:
(1) reacting a dihydric alcohol modifier shown in a formula (e) with an anhydride curing agent shown in a formula (f) to obtain a dihydric alcohol modified anhydride curing agent shown in a formula (g);
wherein R, R', R ", and n are as defined in claim 1;
(2) and reacting and curing the dihydric alcohol modified anhydride curing agent with epoxy resin, a curing accelerator, a release agent, a dispersing agent and a coloring agent to form a brittle solid, cooling, crushing, granulating and cake-making.
6. The method according to claim 5, wherein in step (1), the anhydride curing agent is one or more of methyl hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, hexahydrophthalic anhydride and tetrahydrophthalic anhydride, preferably hexahydrophthalic anhydride and/or methyl hexahydrophthalic anhydride.
7. The method of claim 5, wherein the glycol modifier is one or more of ethylene glycol, 2-dimethyl-1, 3-propanediol, propylene glycol, and butanediol, preferably ethylene glycol and/or 2, 2-dimethyl-1, 3-propanediol.
8. The method according to any one of claims 5 to 7, wherein in step (1), the reaction conditions comprise: the temperature is 100-130 ℃, preferably 100-105 ℃; the time is 15-40min, preferably 15-17 min.
9. The method according to any one of claims 5 to 7, wherein in step (2), the reaction conditions comprise: the temperature is 60-80 ℃, preferably 60-65 ℃; the time is 10-40min, preferably 10-15 min.
Preferably, in the step (2), the mixing conditions include: the temperature is 40-80 ℃, preferably 40-45 ℃; the time is 700-900min, preferably 750-800 min.
10. The use of the yellowing-resistant transparent epoxy resin encapsulating material of any one of claims 1 to 4 in the field of electronic device encapsulation or transparent LED supports.
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| CN116179127A (en) * | 2022-12-28 | 2023-05-30 | 烟台德邦科技股份有限公司 | Organosilicon modified epoxy resin adhesive |
Citations (9)
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| JP2004131553A (en) * | 2002-10-09 | 2004-04-30 | Yokohama Tlo Co Ltd | Epoxy resin composition |
| CN101657490A (en) * | 2007-04-17 | 2010-02-24 | 旭化成化学株式会社 | Epoxy silicone and manufacture method thereof and use curable resin composition of this epoxy silicone and uses thereof |
| CN105637008A (en) * | 2013-10-16 | 2016-06-01 | 日本化药株式会社 | Curable resin composition and cured product thereof |
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| CN116179127A (en) * | 2022-12-28 | 2023-05-30 | 烟台德邦科技股份有限公司 | Organosilicon modified epoxy resin adhesive |
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