CN104745135B - Ultraviolet LED lamp encapsulating glue and preparation method thereof - Google Patents
Ultraviolet LED lamp encapsulating glue and preparation method thereof Download PDFInfo
- Publication number
- CN104745135B CN104745135B CN201510176622.4A CN201510176622A CN104745135B CN 104745135 B CN104745135 B CN 104745135B CN 201510176622 A CN201510176622 A CN 201510176622A CN 104745135 B CN104745135 B CN 104745135B
- Authority
- CN
- China
- Prior art keywords
- agent
- led lamp
- glue
- purple led
- percentage composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The invention discloses ultraviolet LED lamp encapsulating glue and a preparation method thereof. The ultraviolet LED lamp encapsulating glue is prepared from an agent A and an agent B in a mass ratio of 1: 1, wherein the agent A comprises one or more of 95-99% by weight of bisphenol A epoxy resin and cycloaliphatic epoxide resin, 1-3% by weight of an agent A additive, 0.01-1% by weight of an optical brightener, 0.01-1% by weight of a defoamer, 96-99% by weight of one of methylhexahydrophthalic anhydride and hexahydrophthalic anhydride, 0.1-2% by weight of an accelerant and 0.1-4% by weight of an agent B additive. According to the ultraviolet LED lamp encapsulating glue disclosed by the invention, the LED lamp is small in luminous decay, simple to prepare and low in manufacturing cost.
Description
Technical field
The present invention relates to biochemical material field, more particularly to a kind of purple LED lamp encapsulation glue and preparation method thereof.
Background technology
Ultraviolet leds possess that wavelength is short, are suitable to the characteristics such as trickle sensing, meet high color rendering, heating less, stability height
Light source requirements, are mainly used in special dimension, such as sterilizing use, raw doctor's specific use, hardening of resin, prevention semiconductor circuit
Burn into bill identification purposes (being applied to vending machine etc.), attraction insect (agricultural application etc.).
All there is light decay larger defect when lighting for a long time in the purple LED lamp of commercialization at present, this is purple light chip
Characteristic, especially when lighting for a long time, chip persistent fever, cause chip work at high temperature accelerated ageing decay.Also, industry
Some materials in glue in purple LED lamp easily make the illuminant colour skew of purple LED blue.
The content of the invention
Based on this, it is necessary to provide a kind of light decay for enabling to LED little and prepare the simple, purple LED of low cost
Lamp encapsulates glue.
A kind of purple LED lamp encapsulates glue, is made up of A agent, B agent, the A agent, B agent weight part ratio for (0.9~
1.1):(0.9~1.1);
Wherein, the A agent includes percentage composition in bisphenol A type epoxy resin, the cycloaliphatic epoxy resin of 95-99%
One or two, percentage composition for 1-3% A agent addition agents, percentage composition for 0.01-1% optics brightening agent, percentage composition
For the defoamer of 0.01%-1%;
The B agent including the methyl hexahydrophthalic anhydride, HHPA that percentage composition is 96%~99% one or two, hundred
Divide the accelerator that content is 0.1%-2%, percentage composition is the B agent addition agents of 0.1-4%.
Wherein in one embodiment, the A agent addition agents are polyglycols diglycidyl ether.
Wherein in one embodiment, the optics brightening agent is talan ester.
Wherein in one embodiment, the defoamer is the mixing of higher boiling virtue hydroxyl, ketone, ester and dimethyl silicone polymer
One or two in thing, or modified siloxane.
Wherein in one embodiment, the accelerator is BPP.
Wherein in one embodiment, the accelerator is the ethylene glycol solution of BPP.
Wherein in one embodiment, the B agent addition agents be ethylene glycol, 1,8- diazacyclos [5,4,0] hendecene -7,
One or more of modified siloxane.
Another object of the present invention is to provide the preparation method that a kind of purple LED lamp encapsulates glue.
A kind of purple LED lamp encapsulates the preparation method of glue, comprises the steps:
(1) weigh in bisphenol A type epoxy resin, cycloaliphatic epoxy resin one or two, be added thereto to A additions
Agent, optics brightening agent, defoamer are well mixed, and make A agent;
(2) accelerator is dissolved in B agent addition agents and makes intermediate, weigh one kind of methyl hexahydrophthalic anhydride, HHPA
Or two kinds, it is well mixed with obtained intermediate, make B agent;
(3) the B agent that the A agent that obtains step (1), step (2) are obtained is well mixed, and obtains final product.
Purple LED lamp according to the present invention encapsulates glue, and purple LED lamp according to the present invention encapsulates glue, by poly- two
Obtained by alcohol diglycidyl ether and BPP;It is and common for encapsulating the purple LED of different wave length for obtaining
The purple LED that the encapsulation of LED gluewater for packaging is obtained is compared, and when lighting for a long time, the light decay of purple LED has certain proportion to reduce.
Purple LED lamp according to the present invention encapsulates glue, it is determined that concrete proportioning between A agent, B agent, and enters one
Determine concrete bisphenol A type epoxy resin, cycloaliphatic epoxy resin and A agent addition agents, optics brightening agent, froth breaking in A agent to step
Proportion relation between agent, also further determines concrete methyl hexahydrophthalic anhydride, HHPA and accelerator, B agent in B agent and adds
Plus the proportion relation between agent.
Purple LED lamp according to the present invention encapsulates glue, because the additive for being used affects very little to transparency, so
There is no showing for form and aspect indigo plant partially using the luminaire of the purple LED obtained by the purple LED encapsulation glue obtained by the present patent application
As.
Purple LED lamp according to the present invention encapsulates glue, for ultraviolet leds lamp after, meet high color rendering, heating less,
The light source requirements of stability height, can be applicable to special dimension, such as sterilizing use, raw doctor's specific use, hardening of resin, prevention half
Conductor circuit burn into bill identification purposes (being applied to vending machine etc.), attraction insect (agricultural application etc.), and make
Use the cycle long, it is cost-effective, and work well.
Description of the drawings
LEDs of the Fig. 1 for embodiment of the present invention purple LED encapsulation glue with conventional glue in wavelength 370nm lights aging
Figure;
LEDs of the Fig. 2 for embodiment of the present invention purple LED encapsulation glue with conventional glue in wavelength 394nm lights aging
Figure;
Fig. 3 is that LED of the embodiment of the present invention purple LED encapsulation glue with conventional glue in wavelength 401.2nm is lighted always
Change figure.
Specific embodiment
A kind of purple LED lamp encapsulates glue, is made up of A agent, B agent, the A agent, B agent weight part ratio for (0.9~
1.1):(0.9~1.1);
Wherein, the A agent includes percentage composition in bisphenol A type epoxy resin, the cycloaliphatic epoxy resin of 95-99%
One or two, percentage composition for 1-3% A agent addition agents, percentage composition for 0.01-1% optics brightening agent, percentage composition
For the defoamer of 0.01%-1%;The A agent addition agents are polyglycols diglycidyl ether.The optics brightening agent is hexichol second
Alkene ester.The defoamer is the mixture of higher boiling virtue hydroxyl, ketone, ester and dimethyl silicone polymer, or in modified siloxane
One or two.
The B agent including the methyl hexahydrophthalic anhydride, HHPA that percentage composition is 96%~99% one or two, hundred
Divide the accelerator that content is 0.1%-2%, percentage composition is the B agent addition agents of 0.1-4%.The accelerator is benzyltriphenyl phosphonium
Phosphorus chloride, in the present embodiment, the accelerator is the ethylene glycol solution of BPP, also will benzyltriphenyl phosphonium
Phosphorus chloride is dissolved in ethylene glycol.The B agent addition agents are ethylene glycol, 1,8- diazacyclos [5,4,0] hendecene -7, modified silicon
One or more of oxygen alkane.
A kind of purple LED lamp that the present embodiment is related to encapsulates the preparation method of glue, comprises the steps:
(1) weigh in bisphenol A type epoxy resin, cycloaliphatic epoxy resin one or two, be added thereto to poly- second two
Alcohol epoxy resin, optics brightening agent, defoamer are well mixed, and make A agent;
(2) accelerator is dissolved in B agent addition agents and makes intermediate, weigh one kind of methyl hexahydrophthalic anhydride, HHPA
Or two kinds, it is well mixed with obtained intermediate, make B agent;
(3) the B agent that the A agent that obtains step (1), step (2) are obtained is well mixed, and obtains final product.
Embodiment 1
Present embodiments provide a kind of purple LED encapsulation glue (being labeled as glue 1)
Bisphenol A type epoxy resin 98.5g is weighed first, is added thereto to 0.4g optics brightening agent, 1g polyethylene glycol epoxies
Resin, 0.1g defoamers (higher boiling virtue hydroxyl, ketone, ester and dimethyl silicone polymer mixture wherein, higher boiling virtue hydroxyl, ketone, ester
This mixture is obtained final product from the composition of the BYK special products of BYK companies) it is well mixed, make A agent.By benzyltriphenyl phosphonium
Phosphorus chloride 1g is dissolved in 2g ethylene glycol and makes intermediate, and methyl hexahydrophthalic anhydride 97g is then weighed respectively, with obtained intermediate
It is well mixed, makes B agent.The A agent for obtaining, the B agent for obtaining are well mixed, are obtained final product and obtain purple LED gluewater for packaging 1.
Embodiment 2
Present embodiments provide a kind of purple LED encapsulation glue (being labeled as glue 2)
Bisphenol A type epoxy resin 95g is weighed first, 4g polyglycol type epoxy resins are added thereto to, and 0.8g optics increases gorgeous
Agent, 0.2g defoamers (good modest Elifom6800 is modified siloxane) are well mixed, and make A agent.By BPP
1g is dissolved in 2g ethylene glycol and makes intermediate, and HHPA 60g, methyl hexahydrophthalic anhydride 37g are then weighed respectively, and obtained
Intermediate is well mixed, and makes B agent.The A agent for obtaining, the B agent for obtaining are well mixed, are obtained final product and obtain purple LED encapsulation use
Glue 2.
Embodiment of the present invention purple LED encapsulate glue with conventional glue in wavelength 370nm, 394nm and 401.2nm when
LED to light aging numerical value as shown in the table, and referring to shown in Fig. 1-Fig. 3.
Note:Data above is under room temperature normal pressure, is persistently lighted using 20mA DC currents, is lighted and tested after certain hour
Its luminous flux gained.
Purple LED lamp according to the present invention encapsulates glue, and common for encapsulating the purple LED of the different wave length for obtaining
The purple LED that the encapsulation of LED gluewater for packaging is obtained is compared, and when lighting for a long time, the light decay of purple LED has certain proportion to reduce.
Purple LED lamp according to the present invention encapsulates glue, because the additive for being used affects very little to transparency, so
There is no showing for form and aspect indigo plant partially using the luminaire of the purple LED obtained by the purple LED encapsulation glue obtained by the present patent application
As.
Purple LED lamp according to the present invention encapsulates glue, for ultraviolet leds lamp after, meet high color rendering, heating less,
The light source requirements of stability height, can be applicable to special dimension, such as sterilizing use, raw doctor's specific use, hardening of resin, prevention half
Conductor circuit burn into bill identification purposes (being applied to vending machine etc.), attraction insect (agricultural application etc.), and make
Use the cycle long, it is cost-effective, and work well.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more concrete and detailed, but and
Therefore the restriction to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the guarantor of the present invention
Shield scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (5)
1. a kind of purple LED lamp encapsulates glue, it is characterised in that be made up of A agent, B agent, the A agent, the weight part ratio of B agent are
(0.9~1.1):(0.9~1.1);
Wherein, the A agent includes that percentage composition is in bisphenol A type epoxy resin, the cycloaliphatic epoxy resin of 95-98.5%
Plant or two kinds, percentage composition is the A agent addition agents of 1-3%, percentage composition is the optics brightening agent of 0.01-1%, and percentage composition is
The defoamer of 0.01%-1%;The A agent addition agents are polyglycols diglycidyl ether;
The B agent including the methyl hexahydrophthalic anhydride, HHPA that percentage composition is 96%~97% one or two, percentage contains
The accelerator for 1%-2% is measured, percentage composition is the B agent addition agents of 1-2%;The accelerator is BPP.
2. purple LED lamp according to claim 1 encapsulates glue, it is characterised in that the optics brightening agent is hexichol second
Alkene ester.
3. purple LED lamp according to claim 1 encapsulates glue, it is characterised in that the accelerator is benzyltriphenyl phosphonium
The ethylene glycol solution of phosphorus chloride.
4. purple LED lamp according to claim 1 encapsulates glue, it is characterised in that the B agent addition agents be ethylene glycol,
One or more of 1,8- diazacyclos [5,4,0] hendecene -7, modified siloxane.
5. the purple LED lamp described in a kind of any one of claim 1-4 encapsulates the preparation method of glue, it is characterised in that include
Following steps:
(1) weigh in bisphenol A type epoxy resin, cycloaliphatic epoxy resin one or two, be added thereto to A agent addition agents,
Optics brightening agent, defoamer are well mixed, and make A agent;
(2) accelerator is dissolved in B agent addition agents and makes intermediate, weigh methyl hexahydrophthalic anhydride, one kind of HHPA or two
Kind, it is well mixed with obtained intermediate, make B agent;
(3) the B agent that the A agent that obtains step (1), step (2) are obtained is well mixed, and obtains final product.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510176622.4A CN104745135B (en) | 2015-04-14 | 2015-04-14 | Ultraviolet LED lamp encapsulating glue and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510176622.4A CN104745135B (en) | 2015-04-14 | 2015-04-14 | Ultraviolet LED lamp encapsulating glue and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104745135A CN104745135A (en) | 2015-07-01 |
CN104745135B true CN104745135B (en) | 2017-05-03 |
Family
ID=53585410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510176622.4A Active CN104745135B (en) | 2015-04-14 | 2015-04-14 | Ultraviolet LED lamp encapsulating glue and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104745135B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105131898B (en) * | 2015-08-10 | 2017-10-20 | 苏州晶雷光电照明科技有限公司 | Preparation method for underwater LED lamp casting glue |
CN107903855A (en) * | 2017-11-29 | 2018-04-13 | 广州惠利电子材料有限公司 | One-pack-type display screen epoxy pouring sealant and preparation method thereof |
CN110746918A (en) * | 2019-10-30 | 2020-02-04 | 惠州市鑫惠利光电材料有限公司 | Low-light-attenuation LED epoxy packaging adhesive |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102070875A (en) * | 2010-12-17 | 2011-05-25 | 东莞市永固绝缘材料有限公司 | Epoxy resin glue for photoelectron attenuation-resistant packaging |
CN102181253A (en) * | 2011-03-22 | 2011-09-14 | 苏州市相城区开来化工有限公司 | Light emitting diode (LED) epoxy encapsulation adhesive |
CN103755937A (en) * | 2013-12-31 | 2014-04-30 | 上海东升新材料有限公司 | Method for preparing toluylene ester polymeric type fluorescence brightening and coloring agent |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0462941A (en) * | 1990-07-02 | 1992-02-27 | Toshiba Chem Corp | Compound semiconductor device |
CN101831014A (en) * | 2010-04-09 | 2010-09-15 | 濮阳市诚信钻采助剂有限公司 | Polymerizable emulsifier for inverse emulsion polymerization and preparation method thereof |
-
2015
- 2015-04-14 CN CN201510176622.4A patent/CN104745135B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102070875A (en) * | 2010-12-17 | 2011-05-25 | 东莞市永固绝缘材料有限公司 | Epoxy resin glue for photoelectron attenuation-resistant packaging |
CN102181253A (en) * | 2011-03-22 | 2011-09-14 | 苏州市相城区开来化工有限公司 | Light emitting diode (LED) epoxy encapsulation adhesive |
CN103755937A (en) * | 2013-12-31 | 2014-04-30 | 上海东升新材料有限公司 | Method for preparing toluylene ester polymeric type fluorescence brightening and coloring agent |
Also Published As
Publication number | Publication date |
---|---|
CN104745135A (en) | 2015-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100352858C (en) | Anti-ultraviolet epoxy composition and preparation method and application thereof | |
CN104745135B (en) | Ultraviolet LED lamp encapsulating glue and preparation method thereof | |
CN103289317B (en) | A kind of LED encapsulation material and its preparation method and application | |
WO2002019440A1 (en) | Encapsulants for solid state devices | |
CN104745132B (en) | A kind of outdoor paster lamp bead epoxide-resin glue and preparation method thereof | |
CN102634290A (en) | Double-component transparent epoxy resin LED (light emitting diode) patch packing adhesive | |
CN101831143A (en) | High-performance liquid epoxy resin composition for packaging LEDs | |
CN104004491A (en) | LED ultraviolet curable organosilicon encapsulation adhesive and preparation method thereof | |
KR20150047448A (en) | LED encapsulant | |
Yoon et al. | Highly improved reliability of amber light emitting diode with Ca–α–SiAlON phosphor in glass formed by gas pressure sintering for automotive applications | |
CN104788961A (en) | LED encapsulating material | |
JP2016088995A (en) | Resin composition for encapsulating photosemiconductor and photosemiconductor | |
CN106751877B (en) | A kind of modifying epoxy resin by organosilicon optical packaging material composition | |
CN107189734A (en) | A kind of transparent, low halogen, color inhibition epoxy pouring sealant and preparation method thereof | |
CN103579462A (en) | Light source of LED steering lamp of automobile | |
CN105111685A (en) | Maleic anhydride graft polyphenylene oxide modified epoxy resin composite material used for LED encapsulation and containing nano silicon nitride and preparation method thereof | |
CN112391034A (en) | Epoxy resin composite material and preparation method and application thereof | |
JP5584301B2 (en) | Epoxy resin composition | |
CN104371618A (en) | Dampness and heat resistant low light decay transparent epoxy LED encapsulating glue and preparation thereof | |
KR20070069669A (en) | Molding compound for light emitting diode | |
CN113140662A (en) | LED standard light source and LED light-emitting device | |
CN104610897B (en) | A kind of preparation method of the acrylic acid modified epoxy resin for LED encapsulation | |
CN102719212A (en) | Silane coupling agent modified cycloaliphatic epoxy resin surface mount device (SMD) packaging adhesive | |
Zhuang et al. | Effect of phosphor sedimentation on photochromic properties of a warm white light-emitting diode | |
CN105400211A (en) | LED packaging material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |