CN112318958A - Integrated recombination orthogonal bamboo board - Google Patents

Integrated recombination orthogonal bamboo board Download PDF

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Publication number
CN112318958A
CN112318958A CN202011324728.1A CN202011324728A CN112318958A CN 112318958 A CN112318958 A CN 112318958A CN 202011324728 A CN202011324728 A CN 202011324728A CN 112318958 A CN112318958 A CN 112318958A
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China
Prior art keywords
bamboo
recombined
board
integrated
chips
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Pending
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CN202011324728.1A
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Chinese (zh)
Inventor
苏毅
李乾
田嘉诚
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Nanjing Forestry University
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Nanjing Forestry University
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Priority to CN202011324728.1A priority Critical patent/CN112318958A/en
Publication of CN112318958A publication Critical patent/CN112318958A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27D—WORKING VENEER OR PLYWOOD
    • B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27D—WORKING VENEER OR PLYWOOD
    • B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
    • B27D1/10—Butting blanks of veneer; Joining same along edges; Preparatory processing of edges, e.g. cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/02—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising animal or vegetable substances, e.g. cork, bamboo, starch
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/06—Vegetal fibres
    • B32B2262/062—Cellulose fibres, e.g. cotton
    • B32B2262/065—Lignocellulosic fibres, e.g. jute, sisal, hemp, flax, bamboo
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/10—Properties of the layers or laminate having particular acoustical properties
    • B32B2307/102—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/712—Weather resistant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2419/00—Buildings or parts thereof

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

The invention discloses an integrated recombined orthogonal bamboo board which is formed by alternately and orthogonally placing unidirectional laminates consisting of integrated bamboo chips and recombined bamboo fibers. During preparation, the integrated bamboo chips are paved in the width direction, the grain direction of the same layer of bamboo chip material pavement is the same, recombined bamboo fibers are loaded between the adjacent bamboo chips, the directions of the bamboo fibers in the bamboo chips are consistent with the directions of the recombined bamboo fibers, and then prepressing is carried out to form a unidirectional laminate, so that the strength and the rigidity of the bamboo board are enhanced. The plurality of layers of unidirectional laminates are alternately and orthogonally placed and are hot-pressed and glued to form the board, so that the bidirectional bearing capacity is greatly improved. The method has the advantages that the integrated bamboo chips only need to be simply processed, and the working hours for processing the bamboo chips are saved. The bamboo fiber composite board has the advantages of retaining the structural advantages of bamboo materials, combining the advantages of small deformation of integrated bamboo chips, high strength, high rigidity and light weight and high strength of the recombined bamboo fibers, giving full play to the mechanical property of the bamboo to the greatest extent, having good dimensional stability, fire resistance and heat and sound insulation performance, and effectively improving the utilization rate of the materials.

Description

Integrated recombination orthogonal bamboo board
Technical Field
The invention belongs to the technical field of artificial boards, and particularly relates to an integrated recombined orthogonal bamboo board.
Background
Bamboo resources in China are rich, meanwhile, the bamboo has stable performance, high strength, good elasticity and small density, has super-strong tensile strength and excellent mechanical property, can be used as a building material together with reinforced concrete, and simultaneously has short growth cycle, less resource consumption and less environmental pollution.
The recombined bamboo is a novel material independently developed in China, and is a plate which is formed by processing traditional bamboo into long strip bamboo strips and bamboo filaments or grinding the bamboo strips into bamboo filament bundles, reorganizing the bamboo filament bundles and strengthening the bamboo filament bundles, and can be used for buildings. The tension damage of the recombined bamboo boards is mainly the fracture and splitting of the effective tension part, which shows that the stress is uniform and the stress distribution is uniform.
The existing recombined bamboo application technology is generally to process the recombined bamboo laminated board into recombined bamboo laminated boards with unidirectionally arranged fibers, glue multiple laminated boards, enable the arrangement direction of the fibers between an upper laminated board and a lower laminated board to be 90 degrees, and carry out normal-temperature negative pressure treatment after gluing to form an orthogonal glued bamboo material with more uniform bidirectional stress, wherein the higher the number of laminated layers is, the thicker the laminated board is, and the better the bending performance is. When the total thickness of the plate is the same, the number of the laminated plates is different, the number of the laminated plates is more, the proportion of the parallel grain laminated plates is larger, the limit bearing capacity is better, and the rigidity is larger. When the number of the laminated plates is the same, the larger the thickness of the laminated plate with the grain is, the higher the ultimate bearing capacity is, and the larger the rigidity is.
The utility model discloses a utility model patent that publication number is CN210361753U discloses a whole single-plate braider of bamboo bundle fibre, which comprises a frame, feeding mechanism, weaving mechanism, drive mechanism and the mechanical response trigger mechanism who is used for sensing bamboo bundle single-plate feeding back at every turn and triggers the drive mechanism action are installed to the higher authority of frame, carry out the whole processing of opening of veneer to the unit is restrainted to the bamboo of reorganization bamboo, and the elasticity adjustment of weaving of the whole single-plate of bamboo bundle is convenient simultaneously.
Disclosure of Invention
The invention aims to design an integrated recombined orthogonal bamboo board. A plurality of layers of unidirectional laminates along the length direction of the board and unidirectional laminates along the width direction of the board are alternately and orthogonally placed, so that the bidirectional bearing capacity is greatly improved, the mechanical property of bamboo is furthest exerted by the structural advantages of bamboo materials, the bamboo board has good dimensional stability, fire resistance and heat and sound insulation performance, and the utilization rate of the material is effectively improved.
The technical scheme of the invention is that the bamboo board is formed by alternately and orthogonally placing a plurality of layers of unidirectional laminates A along the length direction of the board and unidirectional laminates B along the width direction of the board and hot-pressing and gluing the laminates.
According to the integrated recombined orthogonal bamboo board, the unidirectional laminate A is composed of the bamboo chips A and the recombined bamboo fibers A which are tiled along the length direction of the board, the directions of the bamboo fibers in the bamboo chips A on the same layer are consistent with those of the recombined bamboo fibers A, the advantages of small deformation and high rigidity of the integrated bamboo chips and light weight and high strength of the recombined bamboo fibers are integrated, and the bearing capacity of the unidirectional laminate A is enhanced.
The integrated recombined orthogonal bamboo board is characterized in that the unidirectional laminate B is composed of bamboo chips B and recombined bamboo fibers B which are tiled along the board width direction, and the bamboo fibers in the bamboo chips B on the same layer are consistent with the recombined bamboo fibers B in direction.
The width of each bamboo chip A and each bamboo chip B of the integrated recombined orthogonal bamboo board is 18-30 mm, the length of each bamboo chip A and each bamboo chip B of the integrated recombined orthogonal bamboo board is 2000-2500 mm, and the thickness of each bamboo chip A and each bamboo chip B of the integrated recombined orthogonal bamboo board is 3-10 mm; the recombined bamboo fibers A and B are fiber bamboo bundle units with the width of 5-10 mm and the thickness of 3-10 mm, which are processed by raw bamboos through steps of rolling, washing, screening, boiling, grinding and the like.
The integrated recombined orthogonal bamboo board is characterized in that bamboo pieces A are flatly laid in material grooves of a single-board weaving machine in the corresponding size and are paved in the width direction, the grain directions of the bamboo pieces paved on the same layer are the same, the paving quantity is selected according to the required size, the staggered distance of adjacent bamboo pieces is 5-10 mm, recombined bamboo fibers A of the total weight are loaded through a feeding machine, fiber bamboo bundles are uniformly distributed through vibration, and then pre-pressing is carried out to form a preliminary board blank model.
The integrated recombined orthogonal bamboo board is characterized in that bamboo pieces B are flatly paved in a trough with a size corresponding to a single-board weaving machine in a width direction, the grain directions of the paving of the bamboo pieces on the same layer are the same, the paving quantity is selected according to the required size, the staggered distance of the adjacent bamboo pieces is 5-10 mm, recombined bamboo fibers B with the total weight are loaded through a feeding machine, fiber bamboo bundles are uniformly distributed through vibration, and then pre-pressing is carried out to form a preliminary board blank model.
The integrated recombined orthogonal bamboo board is formed by alternately and orthogonally placing the pre-pressed board blanks, gluing and hot-pressing, improves the bidirectional bearing capacity of the board and exerts the heat preservation and sound insulation performance of the bamboo board.
The integrated recombined orthogonal bamboo board provided by the invention has the beneficial effects that:
1. the integrated bamboo chips and the recombined bamboo fibers are compounded to form the unidirectional laminate, the direction of the fibers in the bamboo chips is consistent with that of the recombined bamboo fibers, the advantages of small deformation, high strength and rigidity, good shearing resistance and light weight and high strength of the recombined bamboo fibers of the integrated bamboo are integrated, and the formed unidirectional laminate is good in size stability and weather resistance.
2. The composite unidirectional laminates are alternately and orthogonally arranged to form the building board, so that the bidirectional bearing capacity and the heat-insulating performance of the board are greatly improved.
3. Bamboo belongs to green resources, and has the advantages of strong aesthetic property, excellent material property, excellent texture, beautiful grain color, convenient processing and sustainable supply.
Drawings
FIG. 1 is a side view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a view of a unidirectional ply A of the present invention in the long direction;
FIG. 4 is a view of a unidirectional ply B of the present invention in the widthwise direction;
FIG. 5 is a diagram illustrating an embodiment of the present invention.
1-single layer plate A; 2-unidirectional laminate B; 3-bamboo chips A; 4-recombinant bamboo fiber A; 5-bamboo chips B; 6-recombinant bamboo fiber B; 7-adhesive.
Detailed description of the preferred embodiments
The present invention will be described in detail with reference to the following detailed description and accompanying drawings.
The embodiment takes a bamboo chip and fiber composite board with a five-layer structure as an example, the main structure components comprise a unidirectional laminate A (1), a unidirectional laminate B (2), a bamboo chip A (3) along the length direction of the board, a recombined bamboo fiber A (4) along the length direction of the board, a bamboo chip B (5) along the width direction of the board and a recombined bamboo fiber B (6) along the width direction of the board, and the laminates are connected by an adhesive (7).
Processing raw bamboos into bamboo chips with the length of 2000-2500 mm, the width of 18-30 mm and the thickness of 3-10 mm, and carrying out steps of rolling, washing, screening, boiling, grinding and the like on the bamboo to form the recombined bamboo fibers with the width of 5-10 mm and the thickness of 3-10 mm.
Bamboo chips (3) are tiled in a material groove of a single board weaving machine, the material groove is paved in the width direction, the paving quantity is selected according to the required size, the staggering distance of adjacent bamboo chips is 5-10 mm, recombined bamboo fibers (4) of the total weight are loaded through a feeding machine, fiber bamboo bundles are uniformly distributed through vibration, and then prepressing is carried out to form a unidirectional laminate A (1).
Bamboo chips (5) are tiled in a material groove of a single board weaving machine, the material groove is paved in the width direction, the paving quantity is selected according to the required size, the staggered distance of the adjacent bamboo chips is 5-10 mm, recombined bamboo fibers (6) with the total weight are loaded through a feeding machine, fiber bamboo bundles are uniformly distributed through vibration, and then prepressing is carried out to form a unidirectional laminate B (2).
And (3) alternately and orthogonally placing the pre-pressed unidirectional laminates A (1) and the pre-pressed unidirectional laminates B (2), and performing hot-pressing gluing to form the board.
The novel plate provided by the invention has the advantages of strong stability, good bidirectional bearing capacity and strong heat insulation performance, integrates the advantages of the laminated material and the recombined material, can be prefabricated by using a mould, accelerates the construction speed and greatly improves the construction efficiency.

Claims (7)

1. An integrated recombined orthogonal bamboo board, comprising: the bamboo board is formed by alternately and orthogonally placing a plurality of layers of unidirectional laminates A (1) along the length direction of the board and unidirectional laminates B (2) along the width direction of the board and performing hot-pressing gluing.
2. The integrated, recombined, orthogonal bamboo panel of claim 1, wherein: the unidirectional laminate A is composed of bamboo chips A (3) and recombined bamboo fibers A (4) which are tiled along the length direction of the laminate, and the bamboo fibers in the bamboo chips A (3) on the same layer are consistent with the recombined bamboo fibers A (4) in direction.
3. The integrated, recombined, orthogonal bamboo panel of claim 1, wherein: the unidirectional laminate B is composed of bamboo chips B (5) and recombined bamboo fibers B (6) which are tiled along the width direction of the laminate, and the bamboo fibers in the bamboo chips B (5) on the same layer are consistent with the recombined bamboo fibers B (6) in direction.
4. The integrated, recombined, orthogonal bamboo panel of claim 1, wherein: the width of the bamboo chip A (3) and the width of the bamboo chip B (5) are 18-30 mm, the length of the bamboo chip A is 2000-2500 mm, and the thickness of the bamboo chip A is 3-10 mm; the recombined bamboo fibers A (4) and B (6) are fiber bamboo bundle units with the width of 5-10 mm and the thickness of 3-10 mm, which are processed by raw bamboos through steps of rolling, washing, screening, boiling, grinding and the like.
5. The integrated, recombined, orthogonal bamboo panel of claim 1, wherein: the method comprises the steps of paving bamboo chips A (3) in a trough with a size corresponding to a single-board weaving machine in a flatly-laid mode in the width direction, paving the bamboo chips on the same layer in the same grain direction, selecting the paving quantity according to the required size, enabling the staggered distance of the adjacent bamboo chips to be 5-10 mm, loading recombined bamboo fibers A (4) with the total weight through a feeder, vibrating to enable fiber bamboo bundles to be uniformly distributed, and then pre-pressing to form a preliminary plate blank model.
6. The integrated, recombined, orthogonal bamboo panel of claim 1, wherein: the method comprises the steps of paving bamboo chips B (5) in a trough with a size corresponding to a single-board weaving machine in a flatly-laid mode in the width direction, paving the bamboo chips on the same layer in the same grain direction, selecting the paving quantity of adjacent bamboo chips according to the required size, enabling the staggered distance of the adjacent bamboo chips to be 5-10 mm, loading recombined bamboo fibers B (6) with the total weight through a feeder, vibrating to enable fiber bamboo bundles to be distributed uniformly, and then pre-pressing to form a preliminary plate blank model.
7. The integrated, recombined, orthogonal bamboo panel of claim 1, wherein: and (3) alternately and orthogonally placing the pre-pressed plate blanks, gluing and hot-pressing to form the plate, wherein the hot-pressing temperature is 120-150 ℃.
CN202011324728.1A 2020-11-23 2020-11-23 Integrated recombination orthogonal bamboo board Pending CN112318958A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114833903A (en) * 2022-05-16 2022-08-02 上海市建筑科学研究院有限公司 Locally orthogonal recombined bamboo component and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114833903A (en) * 2022-05-16 2022-08-02 上海市建筑科学研究院有限公司 Locally orthogonal recombined bamboo component and preparation method thereof
CN114833903B (en) * 2022-05-16 2023-08-11 上海市建筑科学研究院有限公司 Local orthogonal recombined bamboo component and preparation method thereof

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