CN112318752B - Silicon rod cutting system - Google Patents
Silicon rod cutting system Download PDFInfo
- Publication number
- CN112318752B CN112318752B CN202011255257.3A CN202011255257A CN112318752B CN 112318752 B CN112318752 B CN 112318752B CN 202011255257 A CN202011255257 A CN 202011255257A CN 112318752 B CN112318752 B CN 112318752B
- Authority
- CN
- China
- Prior art keywords
- cutting
- cut
- polishing
- equipment
- silicon rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a silicon rod cutting system, relates to the technical field of solar silicon rod cutting, and provides a technical scheme for automatically counting information of each process in a silicon rod cutting process. The method comprises the following steps: a control platform, and a cutting apparatus, a squaring apparatus, and a polishing apparatus in communication with the control platform. The control platform is used for acquiring cutting material information sent by the cutting equipment, storing the cutting material information into a cutting material database, acquiring cutting material information sent by the cutting equipment, and storing the cutting material information into the cutting material database. The control platform is also used for adjusting the production specification of the polishing equipment to be matched with the material specification in the loading list of the polishing equipment when the material specification in the loading list of the polishing equipment is not matched with the current production specification of the polishing equipment. And acquiring polishing material information sent by polishing equipment, and storing the polishing material information into a polishing material database.
Description
Technical Field
The invention relates to the technical field of solar silicon rod cutting, in particular to a silicon rod cutting system.
Background
At present, information flow of each procedure of silicon rod cutting is mainly in a mode of manual document filling and data entry.
However, in the existing manual information statistics mode, a special material area is needed for material identification and information input, so that material accumulation and material circulation are not smooth. And the information feedback of each procedure is lagged, the information circulation is not smooth, the situations of equipment material waiting, faulty operation and the like are caused, and the utilization rate of the equipment cannot be effectively improved. The statistical mode of the manual information also causes that the information input is complicated, the flow is complex, the data error rate is high, and accurate data support service cannot be provided for production.
Disclosure of Invention
The invention aims to provide a silicon rod cutting system, and provides a technical scheme for automatically counting information of each process in a silicon rod cutting process.
The invention provides a silicon rod cutting system, which comprises the following components in the silicon rod cutting process: a control platform, and a cutting apparatus, a squaring apparatus, and a polishing apparatus in communication with the control platform. The control platform is used for controlling the cutting equipment to perform a cutting procedure on the silicon rods meeting the feeding list of the cutting equipment according to the feeding list of the cutting equipment to obtain cut materials; and cutting material information sent by the cutting equipment is obtained, and the cutting material information is stored in a cutting material database. The control platform is further used for controlling the cutting equipment to execute a cutting procedure on the cutting materials meeting the feeding list of the cutting equipment under the condition that the cutting material information meeting the feeding list of the cutting equipment exists in the cutting material database, and the cutting materials are obtained. And acquiring the cutting material information sent by the cutting equipment, and storing the cutting material information into a cutting material database. The control platform is also used for adjusting the production specification of the polishing equipment to be matched with the material specification in the loading list of the polishing equipment when the material specification in the loading list of the polishing equipment is not matched with the current production specification of the polishing equipment. And determining that the cutting material database has cutting material information meeting the feeding list of the polishing equipment, and controlling the polishing equipment to execute a cutting procedure on the cutting material meeting the feeding list of the polishing equipment to obtain the polishing material. And obtaining polishing material information sent by the polishing equipment, and storing the polishing material information into a polishing material database.
Under the condition of adopting the technical scheme, the control platform is communicated with the cutting equipment, the square cutting equipment and the polishing equipment. Based on this, the control platform can cut off equipment, squaring equipment and polishing equipment and carry out corresponding process to obtain cutting off material, squaring material and polishing material. And the cutting equipment is used for cutting off the material information sent to the control platform. And the cutting equipment is used for sending the cutting material information to the control platform. The polishing equipment is used for sending polishing material information to the control platform. Based on the method, compared with the mode that information flow of each procedure of silicon rod cutting in the prior art is mainly completed through manual document filling and data entry, corresponding equipment can automatically generate the procedure information after each procedure is completed, manual information entry is not needed, a special stacking area is not needed to be arranged for marking and information entry of materials, and material accumulation and unsmooth material flow are avoided. In addition, after each process is finished, corresponding equipment can automatically generate the process information, so that the technical problem of high data error rate caused by complicated manual information input and complex process can be solved, and accurate data support is provided for the production of silicon chips. The invention can improve the information transfer speed among all the working procedures, avoid the situations of equipment material waiting, faulty operation and the like, and improve the utilization rate of the equipment. And the control platform is used for controlling the cutting equipment to perform the cutting process on the silicon rods meeting the feeding list of the cutting equipment according to the feeding list of the cutting equipment, controlling the cutting equipment to perform the cutting process on the cut materials meeting the feeding list of the cutting equipment according to the feeding list of the cutting equipment, and controlling the polishing equipment to perform the polishing process on the cut materials meeting the feeding list of the polishing equipment according to the feeding list of the polishing equipment. Based on the method, the matching of the materials can be automatically completed according to the processing requirements of each device, the processing requirements of each device do not need to be manually determined, and the processing efficiency of each device is improved. And finally, the control platform is also used for adjusting the production specification of the polishing equipment to be matched with the material specification in the loading list of the polishing equipment when the material specification in the loading list of the polishing equipment is not matched with the current production specification of the polishing equipment. Based on this, control platform can adjust polishing equipment's current production specification according to the material specification in polishing equipment's the material loading list, effectively reduces the risk of cutting the overstock of material, and has promoted polishing equipment utilization ratio.
In one possible implementation, the material loading list of the cutting apparatus is determined by the material demand list of the cutting apparatus and the currently processed silicon rod identification information of the cutting apparatus.
Under the condition that the technical scheme is adopted, the requirement of the cutting equipment on the specification of the material is more detailed than the requirement of the cutting equipment on the specification of the material, and the material demand list of the cutting equipment and the identification information of the currently processed silicon rod of the cutting equipment are used for determining the material loading list of the cutting equipment, so that the cutting equipment can be continuously processed according to the current specification, the processing efficiency of the cutting equipment is improved, the specification of the cut material produced by the cutting equipment can meet the requirement of the cutting equipment on the cut material, and the waiting time of the cutting equipment is shortened.
In one possible implementation, the silicon rod cutting system further comprises a scanning device, a first handling apparatus and a second handling apparatus in communication with the control platform; the control platform is further used for receiving the silicon rod identification information of the silicon rod acquired by the first scanning device, storing the silicon rod identification information of the silicon rod into a silicon rod information database, and controlling the first carrying device to feed the silicon rod meeting the feeding list of the cutting device to the cutting device under the condition that the silicon rod information meeting the feeding list of the cutting device exists in the silicon rod information database; the control platform is further used for controlling the cutting equipment to carry out a cutting process on the silicon rods meeting the feeding list of the cutting equipment, and then controlling the second carrying equipment to convey the cut materials to the cutting and feeding area.
Under the condition of adopting the technical scheme, the silicon rod identification information of the silicon rod can be obtained by the scanning device, and the silicon rod identification information of the silicon rod is stored to the silicon rod information database by the control platform, so that the circulation speed of the information is further improved. The control platform is also used for controlling the first carrying equipment to feed the silicon rods meeting the feeding list of the cutting equipment to the cutting equipment, and controlling the second carrying equipment to convey the cut materials to the cutting and feeding area, so that the automation degree of the silicon rod cutting machine is improved.
In one possible implementation, the silicon rod cutting system further comprises a third handling device and a fourth handling device in communication with the control platform; the control platform is also used for controlling the third carrying equipment to carry the cut materials meeting the feeding list of the square cutting equipment to the square cutting equipment from the square cutting feeding area; the control platform is also used for controlling the fourth carrying equipment to convey the cut materials to the polishing feeding area after the cut materials are obtained.
Under the condition of adopting the technical scheme, the control platform is used for controlling the second carrying equipment to carry the cut materials meeting the feeding list of the cutting equipment to the cutting equipment from the cutting feeding area, and after the cut materials are obtained, the fourth carrying equipment is controlled to carry the cut materials to the polishing feeding area, so that the automation degree of the polishing device can be further improved.
In a possible implementation manner, the control platform is further configured to, when the material specification in the material loading list of the polishing device matches the current production specification of the polishing device, determine that the cut material database has cut material storage information meeting the material loading list of the polishing device, control the polishing device to perform a polishing process on the cut material meeting the material loading list of the polishing device to obtain a polishing material, obtain polishing material information sent by the polishing device, and store the polishing material information into the polishing material database.
Under the condition of adopting the technical scheme, the control platform is also used for controlling the polishing equipment to execute a polishing procedure on square materials to obtain the polishing materials when the material specification in the feeding list of the polishing equipment is matched with the current production specification of the polishing equipment. Based on the method, the device and the system, the material specification in the feeding list of the polishing equipment can be automatically judged to be matched with the current production specification of the polishing equipment, and the utilization rate of the equipment can be improved to a certain extent compared with a manual judgment mode.
In one possible implementation manner, the polishing device is further configured to send first polishing material information corresponding to the first polishing material to the control platform after the production specification is adjusted; the control platform is used for controlling the polishing equipment to produce the polishing materials under the condition that the first polishing materials are determined to be normal polishing materials according to the first polishing material information and the prestored polishing material standard information.
Under the condition of adopting the scheme, the invention utilizes the prestored standard information of the polishing materials to detect the first polishing material produced by the polishing equipment after the production specification is adjusted, thereby ensuring the quality of each produced polishing material. And the invention controls the polishing equipment to produce the polishing material under the condition of determining that the first polishing material is a normal polishing material, thereby ensuring the continuous operation mode of the polishing equipment and improving the circulation efficiency of the finished product material.
In one possible implementation, cutting off the material includes cutting off the material at the head, cutting off the material at the tail, and cutting off the material at the middle; wherein, the head cut-off material and the tail cut-off material are provided with silicon rod marks; the control platform is used for acquiring head cut-off material information, tail cut-off material information and middle cut-off material information generated by the cutting equipment, and storing the head cut-off material information, the tail cut-off material information and the middle cut-off material information to a cut-off material database; the head cut-off material information and the tail cut-off material information comprise corresponding silicon rod identification information; the control platform is further used for controlling the cutting equipment to cut off the material in the middle of the feeding list meeting the requirements of the cutting equipment to execute a cutting process, so that the cutting material is obtained, the cutting material information sent by the cutting equipment is obtained, and the cutting material information is stored in the cutting material database.
Under the condition of adopting the scheme, because the specifications of the head cut-off material and the tail cut-off material do not meet the requirements of the cutting equipment on the material specification, the control platform can control the cutting equipment to execute the cutting procedure on the middle cut-off material meeting the feeding list of the cutting equipment based on the middle cut-off material information after acquiring the head cut-off material information, the tail cut-off material information and the middle cut-off material information generated by the cutting equipment, so as to obtain the cut-off material. Based on this, the material that cuts off that carries out the butt process is the middle material that cuts off, has satisfied the requirement of butt equipment to the material specification, and above-mentioned information circulation process all goes on through control platform and cutting equipment, for the mode of artifical statistics, can improve the circulation efficiency of information.
In one possible implementation, the silicon rod cutting system further comprises an identification device in communication with the control platform; the control platform is also used for controlling the cutting equipment to perform a cutting process on the silicon rods meeting the feeding list of the cutting equipment, and after the cut materials are obtained, controlling the identification equipment to process the corresponding intermediate cut materials according to the silicon rod identifications of the silicon rods so as to obtain the intermediate cut materials with the silicon rod identifications; the silicon rod identification of each middle cut-off material is the same as the silicon rod identification on the corresponding head cut-off material and the corresponding tail cut-off material; the control platform is further used for receiving the silicon rod identification information of the middle cut-off material sent by the identification equipment and storing the silicon rod identification information of the middle cut-off material to the cut-off material database.
Under the condition of adopting the scheme, the intermediate cut-off materials are processed to obtain the intermediate cut-off materials with the silicon rod marks, and the silicon rod mark of each intermediate cut-off material is the same as the silicon rod marks on the corresponding head cut-off material and the corresponding tail cut-off material. Based on this, the control platform can determine that the head of the same silicon rod cuts off the material, the tail cuts off the material and the middle cuts off the material according to the silicon rod identification information, so that information statistics and subsequent other operations are facilitated.
In a possible implementation, the silicon rod cutting system further comprises a detection device in communication with the control platform, a fifth handling device and a first gripping device. The control platform is also used for controlling the fifth carrying device to cut off the materials at the head, cut off the materials at the tail and feed the polishing materials to the detection area. The detection equipment is also used for detecting the electrical property of the head cut-off material and the tail cut-off material and sending the detection results of the electrical property of the head cut-off material and the tail cut-off material to the control platform. The control platform is further used for controlling the first grabbing equipment to grab the unqualified polishing material to the area to be processed when the polishing material with the same silicon rod identification as the head cut-off material and the tail cut-off material is determined to be unqualified according to the electrical property detection result of the head cut-off material, the electrical property detection result of the tail cut-off material and electrical property detection standard information.
Under the condition of adopting the scheme, the electrical property of the head cut-off material and the tail cut-off material is detected, when the head cut-off material or the tail cut-off material is determined to be unqualified material by utilizing the electrical property detection result of the head cut-off material, the electrical property detection result of the tail cut-off material and the electrical property detection standard information, the polishing material obtained by the corresponding middle cut-off material is determined to be unqualified polishing material, and the first grabbing equipment is controlled to grab the unqualified polishing material to be processed. Based on the method, the polished material obtained by the corresponding middle cut material can be determined to be unqualified material only by detecting the electrical properties of the head cut material and the tail cut material, so that the detection scale is reduced, and the detection time is shortened.
In one possible implementation, the silicon rod cutting system further comprises a second gripping device in communication with the control platform. The control platform is used for controlling the second grabbing equipment to grab the qualified polishing materials to the polishing material storage when determining that the polishing materials with the same silicon rod identification as the head cut-off materials and the tail cut-off materials are the qualified polishing materials according to the electrical performance detection results of the head cut-off materials, the electrical performance detection results of the tail cut-off materials and electrical performance detection standard information.
Under the condition of adopting the scheme, the invention can determine that the polishing material obtained by the corresponding middle cutting material is qualified material only by detecting the electrical properties of the head cutting material and the tail cutting material, thereby reducing the detection scale and shortening the detection time.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a silicon rod cutting system provided by an embodiment of the invention;
fig. 2 is a schematic flow chart illustrating a silicon rod cutting process performed by a silicon rod cutting system according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a hardware configuration of a control platform in a silicon rod cutting system according to an embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
At present, information flow of each procedure of silicon rod cutting is mainly in a mode of manual document filling and data entry. However, in the conventional manual information statistics mode, a special material area is required for material identification and information input, so that material accumulation and material circulation are not smooth. And the information feedback of each procedure is lagged, the information circulation is not smooth, the situations of equipment material waiting, faulty operation and the like are caused, and the utilization rate of the equipment cannot be effectively improved. The statistical mode of the manual information also causes that the information input is complicated, the flow is complex, the data error rate is high, and accurate data support service cannot be provided for production.
Fig. 1 shows a silicon rod cutting system 100 according to an embodiment of the present disclosure. Referring to fig. 1, the silicon rod cutting system is applied to a silicon rod cutting process and comprises a control platform 101, a cutting device 102, a squaring device 103 and a polishing device 104, wherein the cutting device 102, the squaring device 103 and the polishing device 104 are communicated with the control platform 101.
The control platform is used for determining a feeding list of the cutting equipment according to the material demand list of the cutting equipment and the identification information of the currently processed silicon rod of the cutting equipment. Specifically, the material demand list of the cutting equipment comprises silicon rod identification information configured and processed by the cutting equipment and cutting and splicing material information. Because the requirement of the cutting equipment on the specification of the material is more detailed than the requirement of the cutting equipment on the specification of the material, the invention determines the feeding list of the cutting equipment by using the material requirement list of the cutting equipment comprising the silicon rod identification information configured and processed by the cutting equipment, the material splicing information of the cutting equipment and the identification information of the currently processed silicon rod of the cutting equipment, thereby not only enabling the cutting equipment to continue processing according to the current specification and improving the processing efficiency of the cutting equipment, but also enabling the specification of the cut material produced by the cutting equipment to meet the requirement of the cutting equipment on the cut material and reducing the waiting time of the cutting equipment.
In an embodiment, the silicon rod cutting system further comprises a scanning device, a first handling apparatus and a second handling apparatus in communication with the control platform. The control platform is further used for controlling the first carrying equipment to convey the silicon rods meeting the feeding list of the cutting equipment to the scanning area according to the feeding list of the cutting equipment before the cutting equipment performs the cutting process on the silicon rods, and controlling the first scanning equipment to acquire the silicon rod identification information of the silicon rods. The control platform is further used for receiving the silicon rod identification information of the silicon rod sent by the first scanning device and storing the silicon rod identification information of the silicon rod into the silicon rod information database. And then, the control platform is also used for controlling the first carrying equipment to feed the silicon rods meeting the feeding list of the cutting equipment to the cutting equipment. After the cutting equipment is used for feeding, the control platform is further used for controlling the cutting equipment to carry out a cutting process on the silicon rods meeting the feeding list of the cutting equipment, and then controlling the second carrying equipment to convey the cut materials to the cutting and feeding area. In practice, the control platform is further configured to control the cutting equipment to perform a cutting process on the silicon rods meeting the feeding list of the cutting equipment, control the second transporting equipment to transport the cut materials to the roller bed, and transport the cut materials to the cutting and feeding area by the roller bed.
For example, the scanning device may be a barcode scanning device, and in this case, a two-dimensional code or a barcode displaying the silicon rod representation information is attached to the silicon rod. The first carrying equipment and the second carrying equipment can be mechanical arms, four-axis robots or six-axis robots. The scanning apparatus, the first conveyance apparatus, and the second conveyance apparatus are not particularly limited in the present invention.
The control platform is further used for controlling the cutting equipment to execute a cutting procedure on the cutting materials meeting the feeding list of the cutting equipment according to the feeding request of the cutting equipment under the condition that the cutting material information meeting the feeding list of the cutting equipment exists in the cutting material database, and the cutting materials are obtained. The feeding list of the cutting equipment comprises processing specification information and splicing requirement information of the cutting equipment.
At this time, the silicon rod cutting system further comprises a third handling device and a fourth handling device in communication with the control platform. The control platform is used for controlling the third carrying equipment to carry the cut materials meeting the feeding list of the square cutting equipment to the square cutting equipment from the square cutting feeding area. And the cutting equipment is used for sending the generated cutting material information to the control platform after the cutting process is executed. The control platform is used for acquiring the cutting material information sent by the cutting equipment and storing the cutting material information into the cutting material database.
The control platform is further used for pushing a cutting blanking task to tools such as a mechanical arm/robot according to a cutting device finishing signal and combined with process requirements, blanking of the cutting device is completed, and the fourth carrying device is controlled to transfer the cutting materials to a polishing feeding area. The third carrying equipment and the fourth carrying equipment can be four-axis robots or six-axis robots.
Based on the above, the cutting procedure automatically completes the material matching function according to the production and processing requirements of the cutting equipment without manual intervention and information filling. Therefore, the feeding of the square cutting equipment is matched according to the requirements, so that the equipment wire breakage caused by the fact that the specification or the lengths of crystal bars are not required to be adjusted in a specific time by the single square cutting equipment is avoided, and the processing efficiency of the square cutting procedure is improved by more than 5%.
And the control platform is used for feeding the cut materials to the polishing equipment according to the feeding request and the processing specification requirement of the polishing equipment and the feeding list of the polishing materials to carry out the polishing procedure. The control platform is also used for automatically pushing information to the polishing equipment when the material specification in the feeding list of the polishing equipment is not matched with the current production specification of the polishing equipment, the specification matching and processing are automatically completed by the polishing equipment, the risk of material overstock can be effectively reduced, and the utilization rate of the polishing equipment is improved. And then, the control platform determines that the cutting material database has cutting material information meeting the feeding list of the polishing equipment according to the feeding list of the polishing equipment, and controls the polishing equipment to execute a cutting procedure on the cutting material meeting the feeding list of the polishing equipment to obtain the polishing material. And obtaining polishing material information sent by the polishing equipment, and storing the polishing material information into a polishing material database.
In another implementation, the polishing apparatus is further configured to send the first polishing material information corresponding to the first polishing material to the control platform after adjusting the production specification. The control platform is used for controlling the polishing equipment to produce the polishing materials under the condition that the first polishing materials are determined to be normal polishing materials according to the first polishing material information and the prestored polishing material standard information. Based on this, control platform utilizes the polishing material standard information of prestoring, detects the first polishing material that polishing equipment produced after adjusting production specification, has guaranteed the quality of every polishing material of production. And the invention controls the polishing equipment to produce the polishing material under the condition of determining that the first polishing material is a normal polishing material, thereby ensuring the continuous operation mode of the polishing equipment and improving the circulation efficiency of the finished product material.
And the control platform is also used for controlling the polishing equipment to carry out a polishing procedure on the cut materials meeting the feeding list of the polishing equipment under the condition that the cut material database has cut material storage information meeting the feeding list of the polishing equipment when the material specification in the feeding list of the polishing equipment is matched with the current production specification of the polishing equipment, so as to obtain the polishing materials, obtain polishing material information sent by the polishing equipment and store the polishing material information into the polishing material database.
And after the control platform acquires a finishing signal of the polishing equipment, the control platform controls the corresponding manipulator to transfer the polishing material to the roller line, the roller line conveys the polishing material to the corresponding wiping station, and the wiping procedure of the polishing material is manually completed. Naturally, the wiping station can also be equipped with a wiping device with which the polishing material wiping operation is carried out.
In yet another implementation, the silicon rod cutting system further comprises an identification device in communication with the control platform; the control platform is also used for controlling the cutting equipment to perform a cutting process on the silicon rods meeting the feeding list of the cutting equipment, and after the cut materials are obtained, controlling the identification equipment to process the corresponding intermediate cut materials according to the silicon rod identifications of the silicon rods so as to obtain the intermediate cut materials with the silicon rod identifications; the silicon rod identification of each middle cut-off material is the same as the silicon rod identification on the corresponding head cut-off material and the corresponding tail cut-off material; the control platform is further used for receiving the silicon rod identification information of the middle cut-off material sent by the identification equipment and storing the silicon rod identification information of the middle cut-off material to the cut-off material database.
According to the embodiment of the invention, the middle cut-off materials are processed to obtain the middle cut-off materials with silicon rod marks, and the silicon rod mark of each middle cut-off material is the same as the silicon rod marks on the corresponding head cut-off material and the corresponding tail cut-off material. Based on this, the control platform can determine that the head of the same silicon rod cuts off the material, the tail cuts off the material and the middle cuts off the material according to the silicon rod identification information, so that information statistics and subsequent other operations are facilitated.
In yet another implementation, referring to fig. 1, the silicon rod cutting system 100 further comprises a detection device 105, a fifth handling device and a first gripping device in communication with the control platform. The control platform 100 is further configured to control the fifth handling device to feed the head cut-off material, the tail cut-off material, and the polishing material to the detection area. The detection area and the wiping area may be the same area.
The detection equipment is used for detecting the electrical property of the head cut-off material and the tail cut-off material and sending the detection results of the electrical property of the head cut-off material and the tail cut-off material to the control platform.
The control platform is further used for controlling the first grabbing equipment to grab the unqualified polishing material to the area to be processed and push information to the terminal equipment of the abnormal processing personnel when the polishing material with the same silicon rod identification as the head cut-off material and the tail cut-off material is determined to be unqualified polishing material according to the electrical property detection result of the head cut-off material, the electrical property detection result of the tail cut-off material and electrical property detection standard information, and the abnormal processing personnel give processing suggestions. And when the polishing material is determined to be a qualified polishing material, controlling the second grabbing equipment to grab the qualified polishing material to the polishing material warehouse.
Based on the method, the polished material obtained by the corresponding middle cut material can be determined to be unqualified material only by detecting the electrical properties of the head cut material and the tail cut material, so that the detection scale is reduced, and the detection time is shortened. And links such as artifical participation material transport, material detection are effectively stopped, the risk of material backlog is reduced for material circulation efficiency promotes.
After the polishing flow is transferred to the polishing material warehouse, the control platform completes the actions of automatic splicing, automatic taking out and delivery and the like of the polishing materials according to the post-process or customer requirements, and the material carrying times, the document filling times and the like of staff are effectively reduced. The control platform is also used for completing material packaging information scanning and statistics work through the mobile terminal.
In order to guarantee that the detection information of the polishing equipment is accurate, the control platform automatically generates a first piece detection task according to the maintenance condition of the polishing equipment, the specification transformation condition of the equipment and the material processing condition of the equipment, and informs quality detection personnel to finish the first piece confirmation action of the material. When the first piece is unqualified, the control platform automatically pushes a message to the maintenance group to complete the calibration work of the polishing equipment. When the initial piece is qualified, the polishing equipment is automatically merged into a processing request generation queue.
In a specific embodiment, fig. 2 shows a schematic flow chart of a silicon rod slicing system for slicing a silicon rod provided by the embodiment. Referring to fig. 2, when a silicon rod cutting process is performed, the control platform first obtains a feeding requirement of the cutting-off device. The control platform is used for receiving the silicon rods according to the feeding requirements of the cutting equipment, placing the received silicon rods in the scanning area, and controlling the scanning equipment to scan the silicon rod marks of the silicon rods so as to obtain the corresponding silicon rod marks of the silicon rods. The control platform is also used for controlling the cutting equipment to complete the cutting process of the silicon rod, and obtaining a head cut material, a tail cut material and a middle cut material. And then, the control platform controls the detection equipment to detect the electrical properties of the head cut-off material and the tail cut-off material, and the electrical property detection results of the head cut-off material and the tail cut-off material are obtained.
Referring to fig. 2, the control platform is further used for controlling the cutting manipulator to convey the intermediate cut material to the cutting and feeding area, and controlling the identification device to operate on the intermediate cut material so as to form a silicon rod identification on the intermediate cut material. And then, the control platform is also used for controlling a square cutting equipment feeding manipulator to feed the square cutting equipment so as to carry out a square cutting process. After cutting off material loading to the butt equipment, the butt equipment still is used for carrying out material loading self-checking to whether the material of cutting off of material loading to butt equipment is normal material, when the material of cutting off of material loading to butt equipment is abnormal material, utilize corresponding arm to take out this abnormal material that cuts off, the equipment that cuts off at this moment generates bad examination report, and enter into the crystal bar and evaluate the flow. And when the cut materials fed to the square cutting equipment are normal materials, controlling the square cutting equipment to complete the square cutting procedure to obtain the square cutting materials.
Referring to fig. 2, the control platform is further used for controlling the polishing mechanical arm to feed the square cutting material to the polishing equipment, the polishing equipment is used for carrying out feeding self-checking, whether the square cutting material fed to the polishing equipment is a normal material is detected, when the square cutting material fed to the square cutting equipment is an abnormal material, the abnormal square cutting material is taken out by using the corresponding mechanical arm, and the abnormal square cutting material is fed to other polishing equipment, and after the feeding self-checking is carried out on other polishing equipment, when the square cutting material is judged to be a normal material, the control platform is further used for controlling the other polishing equipment to carry out a polishing process. And when the cut-off material fed to the polishing equipment is a normal material, controlling the polishing equipment to complete a square cutting procedure to obtain the polishing material. And detecting the first polishing material produced by the polishing equipment, and judging whether the first polishing material meets the parameter standard of the polishing material. And when the first polishing material meets the parameter standard of the polishing material, the control platform is used for controlling the polishing equipment to continue the polishing process. When the initial polishing material does not meet the parameter criteria for the polishing material, the polishing operation is complete.
Based on the technical scheme, the embodiment of the invention realizes the automatic matching of the requirements of the square cutting equipment and the cut-off material receiving, and avoids material overstock. The management of working hours and auxiliary materials is realized, the exception handling and the distribution of the auxiliary materials are completed according to the standard specified time, and the utilization rate of the square cutting equipment is improved by more than 5 percent.
According to the embodiment of the invention, through the electrical property detection head and tail cover, the electrical property detection operation mode of each short rod (also called as polishing material) is realized, the continuous operation mode of cutting, squaring, polishing and finished product warehousing links is realized, and the equipment efficiency is improved by more than 10%. The electrical property detection frequency of the polishing materials is reduced to 2 times/5, and the workload of workers is reduced by more than 20%.
According to the embodiment of the invention, through data acquisition of the polishing equipment, the first piece detection function (edge distance) and the appearance detection of the wiping station, the physical property detection operation mode of each short rod is realized, the continuous operation mode of polishing and finished product warehousing links is realized, and the material circulation efficiency of the finished product is improved by more than 5%.
According to the embodiment of the invention, automatic and efficient machining information, accurate data and 100% timeliness are realized through automation of cutting equipment, square cutting equipment, polishing equipment, detection equipment and material handling.
According to the embodiment of the invention, by adopting the working task management, the abnormal message promotion, the problem solution proposal and the like and combining the concept of a knowledge base, the abnormal solution efficiency in the silicon rod cutting process is improved by 40%, the material circulation efficiency of the working procedure is accelerated, and the material overstock on the site is effectively reduced.
According to the embodiment of the invention, aiming at the machining process of the silicon rod cutting machine, the requirements of square cutting scheduling, equipment data acquisition, the electrical performance attenuation rule of the crystal rod, material circulation automation and splicing rule are utilized, and the promotion of work task scheduling and problem solution is combined, so that the statistics of material information in the silicon rod cutting process is automatic, efficient, accurate and timely, the machining efficiency and the utilization rate of each module of equipment are improved, the field material circulation efficiency is further improved, and the labor intensity of staff and the field production cost are reduced.
Referring to fig. 3, the actions performed by the control platform described above may be stored as computer instructions in the memory 220 of the control platform, with the computer instructions stored in the memory 220 being executed by the processor.
The control platform 200 includes: a processor 210 and a communication interface 230, the communication interface 230 coupled to the processor 210, the processor 210 for executing computer programs or instructions. The control platform 200 may communicate with the drive components of the severing device, the squaring device, the polishing device, and the detection device via the communication interface 230.
As shown in fig. 3, the processor 210 may be a general-purpose Central Processing Unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more ics for controlling the execution of programs according to the present invention. The communication interface 230 may be one or more. Communication interface 230 may use any transceiver or the like for communicating with other devices or a communication network.
As shown in fig. 3, the control platform 200 may further include a communication line 240. The communication link 240 may include a path for transmitting information between the aforementioned components.
Optionally, as shown in fig. 3, the control platform 200 may further include a memory 220. The memory 220 is used to store computer instructions for performing aspects of the present invention and is controlled for execution by the processor 210. Processor 210 is operative to execute computer instructions stored in memory 220.
As shown in fig. 3, the memory 220 may be a read-only memory (ROM) or other types of static storage devices that can store static information and instructions, a Random Access Memory (RAM) or other types of dynamic storage devices that can store information and instructions, an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compact disc, laser disc, optical disc, digital versatile disc, blu-ray disc, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer, but is not limited to such. The memory 220 may be self-contained and coupled to the processor 210 via a communication link 240. The memory 220 may also be integrated with the processor 210.
Optionally, the computer instructions in the embodiment of the present invention may also be referred to as application program codes, which is not specifically limited in this embodiment of the present invention.
In particular implementations, as one embodiment, processor 210 may include one or more CPUs, such as CPU0 and CPU1 in fig. 3, as shown in fig. 3.
In one embodiment, as shown in fig. 3, control platform 200 may include a plurality of processors 210, such as processor 210 and processor 250 in fig. 3. Each of these processors may be a single-core processor or a multi-core processor.
The embodiment of the invention also provides a computer readable storage medium. The computer readable storage medium has stored therein instructions that, when executed, implement the functions performed by the control platform in the above embodiments.
In the above embodiments, all or part of the implementation may be realized by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer programs or instructions. The procedures or functions of the embodiments of the invention are performed in whole or in part when the computer program or instructions are loaded and executed on a computer. The computer may be a general purpose computer, special purpose computer, computer network, terminal, user equipment, or other programmable device. The computer program or instructions may be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another computer readable storage medium, for example, the computer program or instructions may be transmitted from one website site, computer, server, or data center to another website site, computer, server, or data center by wire or wirelessly. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that integrates one or more available media. The available media may be magnetic media, such as floppy disks, hard disks, magnetic tape; or an optical medium, such as a Digital Video Disc (DVD); it may also be a semiconductor medium, such as a Solid State Drive (SSD).
While the invention has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
While the invention has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.
Although the present invention has been described in connection with the specific features and embodiments thereof, it is apparent that various modifications and combinations can be made thereto without departing from the spirit and scope of the invention. Accordingly, the specification and figures are merely exemplary of the invention as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. A silicon rod cutting system, characterized in that, applied in a silicon rod cutting process, the silicon rod cutting system comprises: the cutting device, the square cutting device and the polishing device are communicated with the control platform;
the control platform is used for controlling the cutting equipment to perform a cutting procedure on the silicon rods meeting the feeding list of the cutting equipment according to the feeding list of the cutting equipment to obtain cut materials; cutting material information sent by the cutting equipment is obtained, and the cutting material information is stored in a cutting material database;
the control platform is further used for controlling the cutting equipment to execute a cutting procedure on the cut materials meeting the feeding list of the cutting equipment under the condition that the cut material information meeting the feeding list of the cutting equipment exists in the cut material database, so that the cut materials are obtained, the cut material information sent by the cutting equipment is obtained, and the cut material information is stored in the cut material database;
the control platform is further used for adjusting the production specification of the polishing equipment to be matched with the material specification in the feeding list of the polishing equipment when the material specification in the feeding list of the polishing equipment is not matched with the current production specification of the polishing equipment, determining that the cut material database has cut material information meeting the feeding list of the polishing equipment according to the feeding list of the polishing equipment, controlling the polishing equipment to perform a polishing process on the cut material meeting the feeding list of the polishing equipment to obtain a polishing material, obtaining polishing material information sent by the polishing equipment, and storing the polishing material information into the polishing material database;
the cutting off materials comprise head cutting off materials, tail cutting off materials and middle cutting off materials; silicon rod marks are arranged on the head cut-off material and the tail cut-off material;
the control platform is used for acquiring head cut-off material information, tail cut-off material information and middle cut-off material information generated by the cut-off equipment, and storing the head cut-off material information, the tail cut-off material information and the middle cut-off material information to a cut-off material database; the head cut-off material information and the tail cut-off material information comprise corresponding silicon rod identification information;
the control platform is further used for controlling the cutting equipment to execute a cutting procedure on the middle cut-off material meeting the feeding list of the cutting equipment, so that the cutting material is obtained, the cutting material information sent by the cutting equipment is obtained, and the cutting material information is stored in a cutting material database.
2. The silicon rod cutting system as recited in claim 1, wherein the loading list of the cut-off device is determined from a list of material requirements of the cut-off device and currently processed silicon rod identification information of the cut-off device.
3. The silicon rod cutting system of claim 1, further comprising a scanning device, a first handling apparatus and a second handling apparatus in communication with the control platform;
the control platform is further configured to receive silicon rod identification information of the silicon rod acquired by the scanning device, store the silicon rod identification information of the silicon rod in a silicon rod information database, and control the first carrying device to load the silicon rod meeting a loading list of the cutting device to the cutting device when it is determined that the silicon rod information meeting the loading list of the cutting device exists in the silicon rod information database;
the control platform is further used for controlling the cutting equipment to carry out a cutting process on the silicon rods meeting the feeding list of the cutting equipment, and then controlling the second carrying equipment to convey the cut materials to a cutting and feeding area.
4. The silicon rod cutting system as recited in claim 3 further comprising a third handling apparatus and a fourth handling apparatus in communication with the control platform;
the control platform is further used for controlling the third carrying equipment to carry the cut materials meeting the feeding list of the square cutting equipment from the square cutting feeding area to the square cutting equipment;
the control platform is also used for controlling the fourth carrying equipment to convey the cut materials to a polishing feeding area after the cut materials are obtained.
5. The silicon rod cutting system according to claim 1, wherein the control platform is further configured to, when the material specification in the material loading list of the polishing apparatus matches the current production specification of the polishing apparatus, determine that the cut material database meets cut material storage information of the material loading list of the polishing apparatus, control the polishing apparatus to perform a polishing process on the cut material meeting the material loading list of the polishing apparatus to obtain a polishing material, obtain polishing material information sent by the polishing apparatus, and store the polishing material information in a polishing material database.
6. The silicon rod cutting system according to claim 1, wherein the polishing apparatus is further configured to send first polishing material information corresponding to the first polishing material produced to the control platform after the production specification is adjusted;
and the control platform is used for controlling the polishing equipment to produce the polishing materials under the condition that the first polishing materials are determined to be normal polishing materials according to the first polishing material information and the prestored polishing material standard information.
7. The silicon rod cutting system as recited in claim 1 further comprising an identification device in communication with the control platform;
the control platform is further used for controlling the cutting equipment to perform a cutting process on the silicon rods meeting the feeding list of the cutting equipment, and after cut materials are obtained, controlling the identification equipment to process the corresponding intermediate cut materials according to the silicon rod identifications of the silicon rods so as to obtain intermediate cut materials with the silicon rod identifications;
the silicon rod identification of each intermediate cut-off material is the same as the silicon rod identification on the corresponding head cut-off material and the corresponding tail cut-off material;
the control platform is further used for receiving the silicon rod identification information of the middle cut-off material sent by the identification device and storing the silicon rod identification information of the middle cut-off material to a cut-off material database.
8. The silicon rod cutting system as recited in claim 7 further comprising a detection device, a fifth handling device and a first grasping device in communication with the control platform;
the control platform is further used for controlling the fifth carrying device to feed the head cut-off material, the tail cut-off material and the polishing material to a detection area;
the detection equipment is also used for detecting the electrical properties of the head cut-off material and the tail cut-off material and sending the electrical property detection results of the head cut-off material and the tail cut-off material to a control platform;
the control platform is further used for controlling the first grabbing equipment to grab the unqualified polishing material to a region to be processed when the polishing material with the same silicon rod identification as the head cut-off material and the tail cut-off material is determined to be unqualified according to the electrical property detection result of the head cut-off material, the electrical property detection result of the tail cut-off material and electrical property detection standard information.
9. The silicon rod cutting system as recited in claim 7 further comprising a second grasping device in communication with the control platform;
the control platform is used for controlling the second grabbing equipment to grab the qualified polishing materials to the polishing material storage when the polishing materials with the same silicon rod identification as the head cut-off materials and the tail cut-off materials are determined to be the qualified polishing materials according to the electrical performance detection results of the head cut-off materials, the electrical performance detection results of the tail cut-off materials and electrical performance detection standard information.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011255257.3A CN112318752B (en) | 2020-11-11 | 2020-11-11 | Silicon rod cutting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011255257.3A CN112318752B (en) | 2020-11-11 | 2020-11-11 | Silicon rod cutting system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112318752A CN112318752A (en) | 2021-02-05 |
| CN112318752B true CN112318752B (en) | 2022-09-06 |
Family
ID=74317632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011255257.3A Active CN112318752B (en) | 2020-11-11 | 2020-11-11 | Silicon rod cutting system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112318752B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114523409B (en) * | 2022-02-08 | 2023-05-30 | 隆基绿能科技股份有限公司 | Clamping centering method and silicon rod processing equipment |
| CN114589821B (en) * | 2022-03-10 | 2024-04-09 | 大连连城数控机器股份有限公司 | Cutting and grinding manufacturing island and cutting and grinding method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202336657U (en) * | 2011-10-21 | 2012-07-18 | 上海莱克气割机有限公司 | Robot sectional steel cutting system |
| JP2015161675A (en) * | 2014-02-28 | 2015-09-07 | 国立大学法人 千葉大学 | Scribe surface quality measuring and controlling device and scribe surface quality measuring and controlling method |
| CN205631056U (en) * | 2016-05-23 | 2016-10-12 | 上海日进机床有限公司 | Silicon rod clipper |
| CN109421178A (en) * | 2017-09-01 | 2019-03-05 | 隆基绿能科技股份有限公司 | Work pieces process production line |
| CN109784531A (en) * | 2018-12-12 | 2019-05-21 | 广州永霸信息科技股份有限公司 | A kind of production plan generates processing method, system, platform and storage medium |
| CN210116060U (en) * | 2019-03-21 | 2020-02-28 | 青岛高测科技股份有限公司 | Intelligent processing unit for crystalline silicon |
| CN111673929B (en) * | 2020-05-07 | 2021-11-09 | 宁夏隆基硅材料有限公司 | Multi-station feeding control method and system |
-
2020
- 2020-11-11 CN CN202011255257.3A patent/CN112318752B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112318752A (en) | 2021-02-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112318752B (en) | Silicon rod cutting system | |
| CN1725242B (en) | Method for solving transferred error in automatic material processing system | |
| US20150290762A1 (en) | Lens edging system, edging size management device, edging size management method and method of manufacturing spectacle lens | |
| CN110732906A (en) | Modular intelligent tool exchange method and management system | |
| CN110571170B (en) | MES system quick flow accounting method and device for LED packaging enterprise | |
| JP2009139979A (en) | Production management system and method for assigning order information | |
| US20210358784A1 (en) | Fault monitoring system and method for semiconductor manufacturing process | |
| CN112668961B (en) | Automatic feeding system, method and medium | |
| CN112486110B (en) | Silicon wafer production system | |
| CN113233163B (en) | Feeding and discharging system of slicing machine | |
| CN111144619A (en) | Task optimization scheduling method and device for automatic vending robot | |
| KR20160109432A (en) | Apparatus and method for remote management of part manufacturing using vision inspection | |
| CN112176416B (en) | Silicon rod splicing method, device and system, and computer storage medium | |
| CN114897118A (en) | Data transmission management system based on high-precision positioning equipment | |
| JP2010128907A (en) | Transportation management system and transportation management method | |
| CN111091326A (en) | Method and device for quickly replenishing goods in driver goods checking process | |
| CN112001677A (en) | Intelligent factory production control system | |
| JP2001236107A (en) | Automatic carrying device and its method | |
| CN114281045B (en) | Medium plate sample processing informationized centralized control system | |
| US20040177006A1 (en) | Parts kit production support system and program using associated parts identification data and shelf position identification data | |
| CN113780747B (en) | Automatic production line task dividing, grabbing and scheduling system and method | |
| CN115857453A (en) | Method, system and medium for scheduling wafer production materials | |
| CN114723376B (en) | Method and device for guiding delivery client to process waybill and waybill processing method | |
| CN117601288A (en) | Crystal bar processing control method and device | |
| CN114626786A (en) | Control method, management method and device of ex-warehouse system and ex-warehouse system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |