CN112312703A

CN112312703A - Electronic device

Info

Publication number: CN112312703A
Application number: CN202011158464.7A
Authority: CN
Inventors: 胡贞
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-10-26
Filing date: 2020-10-26
Publication date: 2021-02-02

Abstract

The application discloses electronic equipment belongs to the electronic equipment field. The electronic device comprises a first circuit board and a second circuit board which are stacked, wherein the second circuit board is connected with the first circuit board through an intermediate layer, and a mounting cavity is formed between the second circuit board and the first circuit board; the functional device sets up in the installation intracavity, and the functional device is connected with first target plate body electricity, and elastic buffer sets up between functional device and second target plate body, and elastic buffer has the section of bending, and the section of bending can be deformed. Therefore, in the process that the electronic equipment is impacted, the elastic buffer part always pushes against the back of the second target plate body, a certain buffer space can be provided through the bending section, and then the impact stress of the functional device can be reduced.

Description

Electronic device

Technical Field

The application belongs to the technical field of communication, and particularly relates to an electronic device.

Background

With the application of 5G (5th generation mobile communication technology), the radio frequency and signal functions of 5G are implemented on electronic devices, and more components and devices need to be arranged on a main board of the electronic device to meet the requirements of the functions of the electronic device. In order to lay out more components and devices on a main board, many manufacturers use a 3D (three-dimensional) stacking technique to increase the layout area of the main board.

At present, the 3D stacking technology mainly includes welding a first shielding case on a circuit board, welding a second shielding case on a motherboard, setting functional devices such as a power management chip and a radio frequency device between the circuit board and the motherboard, setting devices such as a signal transmitting module and a signal receiving module between the first shielding case and the circuit board, and setting devices such as a processor and a memory between the second shielding case and the circuit board, so as to meet the requirement of laying out more components and devices on the motherboard.

However, in the process of implementing the present application, the inventors found that at least the following problems exist in the prior art: although the problem that the layout space of the mainboard of the electronic equipment is not enough is solved by the application of the 3D stacking technology, the functional devices such as the power management chip and the radio frequency device are packaged between the circuit board and the mainboard when being pasted, so that the mainboard is deformed once the electronic equipment falls, the functional devices such as the mainboard and the power management chip and the radio frequency device are pulled mutually, welding spots of the functional devices such as the power management chip and the radio frequency device are cracked, and the problem that the reliability of falling impact of the electronic equipment is not enough is caused.

Disclosure of Invention

The embodiment of the application aims to provide electronic equipment, and the problem that the reliability of falling impact of the electronic equipment is insufficient can be solved.

In order to solve the technical problem, the present application is implemented as follows:

an embodiment of the present application provides an electronic device, including:

a first circuit board;

the second circuit board is overlapped with the first circuit board, the second circuit board and the first circuit board are connected through an intermediate layer, and a mounting cavity is formed between the second circuit board and the first circuit board;

the functional device is arranged in the mounting cavity and is electrically connected with a first target board body, wherein the first target board body is one of the first circuit board and the second circuit board;

the elastic buffer piece is arranged between the functional device and the second target plate body, the elastic buffer piece is provided with a bending section, the bending section can be deformed, and the second target plate body is the first circuit board and the other one of the second circuit boards.

As can be seen from the above embodiments, in the embodiments of the present application, an electronic device includes a first circuit board and a second circuit board that are stacked, the second circuit board and the first circuit board are connected by an interposer, and a mounting cavity is formed between the second circuit board and the first circuit board; the functional device is arranged in the mounting cavity and electrically connected with the first target board body, wherein the first target board body is one of the first circuit board and the second circuit board; the elastic buffer piece is arranged between the functional device and the second target plate body, the elastic buffer piece is provided with a bending section, the bending section can be deformed, and the second target plate body is the other one of the first circuit board and the second circuit board. Therefore, in the process that the electronic equipment is impacted, the elastic buffer part always pushes against the back of the second target plate body, a certain buffer space can be provided through the bending section, and further the impact stress of the functional device can be reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic structural diagram of an electronic device provided herein;

fig. 2 is a schematic structural diagram of a first buffer provided in the present application;

FIG. 3 is a schematic cross-sectional view of a first buffer provided herein;

FIG. 4 is a schematic structural view of a second buffer provided in the present application;

fig. 5 is a schematic cross-sectional view of a second buffer provided herein.

Reference numerals:

1-a first circuit board; 2-a second circuit board; 3-a functional device; 4-an elastic buffer; 5-bottom filling glue; 6-a first shield; 7-a second shielding cage; 11-an intermediate layer; 8-a transmitting module; 9-a signal receiving module; 31-a management chip; 32-a radio frequency device; 41-bending section; 42-a connecting segment; 43-a resisting section; 44-a transition section; 411 — first inclined segment; 412-second inclined section.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof. Fig. 1 is a schematic structural diagram of an electronic device provided in the present application, and fig. 2 is a schematic structural diagram of an elastic buffer provided in the present application, as shown in fig. 1 and fig. 2, the electronic device includes a first circuit board 1 and a second circuit board 2, the second circuit board 2 is stacked on the first circuit board 1, the second circuit board 2 is connected to the first circuit board 1 through an interposer 11, and a mounting cavity is formed between the second circuit board 2 and the first circuit board 1; the functional device 3 is arranged in the mounting cavity and is electrically connected with the first target board body, wherein the first target board body is one of the first circuit board 1 and the second circuit board 2; elastic buffer member 4, elastic buffer member 4 sets up between functional device 3 and second target plate body, and elastic buffer member 4 has the section of bending 41, and the section of bending 41 is deformable, and wherein, second target plate body is another in first circuit board and the second circuit board.

The first circuit board 1 is a platform for hardware operation of an electronic device, the first circuit board 1 may include different types of slots, and exemplary slots may include a processor slot, a memory slot, and a PCI (Peripheral Component Interconnect) slot, where the processor slot is used to connect an interface of a processor, the memory slot is used to install a memory, and the PCI slot is used to connect expansion cards such as a video card, a sound card, a network card, a built-in card, a sound card, and a network card. It should be noted that the first circuit board 1 is a rectangular circuit board, and the front surface and the back surface of the first circuit board 1 may be connected to different electronic devices to implement different functions, such as: an electronic connector can be connected to the front surface of the first circuit board 1 to bridge two conductors on a loop, so that current or signals can flow from one conductor to the other conductor to realize interaction of electronic devices, and a power supply charger can be connected to the back surface of the first circuit board 1 to realize interaction of the electronic devices and external charging devices to realize charging of the electronic devices. Wherein, the back and the front of the first circuit board 1 are two opposite surfaces of the first circuit board 1.

The interposer 11 functions to electrically connect the second circuit board 2 and the first circuit board 1 while being supported between the second circuit board 2 and the first circuit board 1. Specifically, the back surface of the second circuit board 2 and the front surface of the first circuit board 1 are arranged in an opposed spaced-apart manner. The second circuit board 2 and the first circuit board 1 are each formed in a plate shape, and may be a multilayer substrate formed of a plurality of insulating material layers and a plurality of circuit layers, and may be an 8-layer or 10-layer substrate with respect to the circuit layers. The insulating material layer of the first circuit board 1 and the insulating material layer of the second circuit board 2 may be insulating layers composed of an insulating substance such as epoxy resin, polyimide resin, BT resin, liquid crystal polymer, or the like. The circuit layer is composed of a conductive substance such as a metal such as copper and is designed to have a specific pattern. The circuit layers may be formed on one or both surfaces of the insulating material layer, and the circuit layers of different layers may be electrically connected by a connection conductor penetrating the insulating material layer.

Under the action of the interposer 11, a mounting cavity is formed between the second circuit board 2 and the first circuit board 1, in which the functional device 3 is fixed. The functional device 3 may be a power management chip 31, a radio frequency device 32, or the like. It should be noted that the above embodiment is only one implementation of the present application, and the second circuit board 2 and the first circuit board 1 are spaced apart from each other to form a multi-layer structure, a stacked structure and a sandwich structure, so that the second circuit board 2 and the first circuit board 1 have a sufficient layout space, and thus the first circuit board 1 has a sufficient layout space. It should also be noted that the functional device 3 is electrically connected to a first target board, wherein the first target board is one of the first circuit board 1 and the second circuit board 2. Specifically, the functional device 3 may be electrically connected to the first circuit board 1, and may also be electrically connected to the second circuit board 2.

It should be noted that the functional device 3 includes a power management chip 31 and a radio frequency device 32. The power management chip 31 is a chip that functions to transform, distribute, detect and manage power in the electronic device, and the rf device 32 is a device for transmitting and receiving signals. Once the power management chip 31 and the radio frequency device 32 are damaged, the normal operation of the electronic device is directly affected, so that the power management chip 31 and the radio frequency device 32 need to be fully protected by the elastic buffer 4. In addition, after the functional devices 3 such as the power management chip 31 and the radio frequency device 32 are encapsulated between the second circuit board 2 and the first circuit board 1, once the electronic equipment falls, the first circuit board 1 is deformed, and then the functional devices 3 such as the first circuit board 1, the power management chip 31 and the radio frequency device 32 are pulled mutually, so that the pads of the functional devices 3 such as the power management chip 31 and the radio frequency device 32 are cracked, and the problem of insufficient reliability of falling impact of the electronic equipment is caused.

On this basis, an elastic buffer 4 may be provided between a second target board body, which is the other of the first circuit board 1 and the second circuit board 2, and the functional device 3. In particular, in a possible realisation, the functional device 3 is electrically connected to the first circuit board 1, the elastic buffer 4 being arranged between the second circuit board 2 and the functional device 3. In another possible implementation, the functional device 3 and the second circuit board 2 are electrically connected, and the elastic buffer 4 is arranged between the first circuit board 1 and the functional device 3.

It should be noted that the elastic buffer 4 has a bending section 41, and the bending section 41 is deformable. Specifically, the bending section 41 may be a frame structure formed by bending an elastic metal plate to form a buffer cavity. Like this, the one end of elastic buffer 4 can withstand the second target plate body, and the other end of elastic buffer 4 supports and presses on the functional device, absorbs the tolerance between second target plate body and the functional device 3 through the section 41 of bending, receives the in-process of assaulting at electronic equipment, and elastic buffer 4 supports the back at the second target plate body all the time, and because the section 41 of bending provides certain buffering space, can reduce the impact stress of functional device 3.

As can be seen from the above embodiments, in the embodiments of the present application, the electronic device includes a first circuit board 1 and a second circuit board 2 that are stacked, the second circuit board 2 and the first circuit board 1 are connected through an interposer 11, and a mounting cavity is formed between the second circuit board 2 and the first circuit board 1; the functional device 3 is arranged in the mounting cavity and is electrically connected with a first target board body, wherein the first target board body is one of the first circuit board 1 and the second circuit board 2; the elastic buffer member 4 is disposed between the functional device 3 and the second target board body, and the elastic buffer member 4 has a bending section 41, where the bending section 41 is deformable, and the second target board body is the other one of the first circuit board and the second circuit board. Therefore, in the process that the electronic equipment is impacted, the elastic buffer part 4 always pushes against the back of the second target plate body, a certain buffer space can be provided through the bending section, and further the impact stress of the functional device 3 can be reduced, so that in the process that the electronic equipment falls, even if the first circuit board 1 deforms towards the direction close to the second circuit board 2, the functional device 3 can be always fixed between the first circuit board 1 and the second circuit board 2 under the action of the elastic buffer part 4, and the impact reliability of the electronic equipment falling is improved.

Alternatively, as shown in fig. 2 to 5, the elastic buffer 4 includes: a connection section 42, the connection section 42 being connected to the second target board; the abutting section 43, the abutting section 43 abuts against the functional device, and the abutting section 43 and the connecting section 42 are arranged at intervals; the bending section 41 is connected between the connecting section 42 and the stopping section 43, and the bending section 41 is suspended.

It should be noted that the connecting section 42 may include two oppositely disposed elastic pieces or one elastic piece. Taking the example that the connecting section 42 includes two elastic pieces, the two elastic pieces are respectively connected with two ends of the connecting section 42. The end portions of the two elastic sheets are arranged at intervals, and the bending section 41 is connected between the connecting section 42 and the abutting section 43, so that a certain distance is formed between the two elastic sheets and the abutting section 43, when the connecting section 42 receives impact force, the connecting section can be bent towards the direction far away from the second target plate body and close to the abutting section 43, and then the bending end is subjected to angle change, and stress is absorbed. It should be further noted that the bending deformation of the bending section 41 arranged in the air can be bent toward one side of the extending direction of the connecting section 42 or bent toward one side away from the extending direction of the connecting section 42 due to the unhindered and unhindered bending deformation. Like this, because the unsettled setting of bending section 41 is between linkage segment 42 and ending section 43, when linkage segment 42 received the impact force for bending section 41 has sufficient space to take place to buckle and deform between linkage segment 42 and ending section 43, and then the unsettled bending section 41 that sets up can form buffer space.

Optionally, the bending segment 41 includes: a first inclined section 411, a first end of the first inclined section 411 being connected to the connecting section 42, a second end of the first inclined section 411 extending obliquely towards the functional device 3 and away from the connecting section 42; a second inclined section 412, a first end of the second inclined section 412 is connected with a second end of the first inclined section 411, a second end of the second inclined section 412 extends towards the functional device 3 and away from the first inclined section 411, and a second end of the second inclined section 412 is connected with the stopping section 43; the included angle between the first inclined section 411 and the second inclined section 412 is variable, so that the bending section 41 is deformable.

Specifically, as shown in fig. 3, bending section 41 may include a first inclined section 411 and a second inclined section 412. The first end of the first inclined section 411 is connected with the end of the connecting section 42, and a first included angle α exists between the plane of the first inclined section 411 and the plane of the connecting section 42. The second end of the first inclined section 411 is connected to the first end of the second inclined section 412, the second end of the second inclined section 412 is connected to the abutting section 43, a second included angle β exists between the plane of the second inclined section 412 and the plane of the abutting section 43, and the first included angle α and the second included angle β are equal to each other when the connecting section 42 is not pressed. The second segment of the first inclined segment 411 extends obliquely towards the functional device 3 and away from the connecting segment 42, the second end of the second inclined segment 412 extends obliquely towards the functional device 3 and away from the connecting first inclined segment 411, the inclination directions of the first inclined segment 411 and the second inclined segment 412 are opposite, and under the condition that the first included angle α and the second included angle β are equal, the inclination angle of the first inclined segment 411 and the inclination angle of the second inclined segment 412 are equal. The first included angle α, the second included angle β, the inclination angle of the first inclined section 411, and the inclination angle of the second inclined section 412 are all obtuse angles, and the connecting section 42 and the abutting section 43 are parallel under the condition of not being pressed. Like this, the buffer structure that first slope end and second slope section 412 formed can bulge in the one side of stopping section 43, when linkage segment 42 received the impact, can buckle towards the direction of stopping section 43, the impact force that receives can be followed linkage segment 42 and dispersed to buffer structure, because buffer structure bulge in the one side of stopping section 43, like this, when electronic equipment received the impact, linkage segment 42 pressurized back can make first contained angle alpha and second contained angle beta increase, make the power that linkage segment 42 received can disperse to one side of buffer structure, further strengthen elastic buffer member 4's the ability of receiving the impact. When the impact force on the connecting section 42 is large, the buffer structure formed by the bending section 41 can absorb a part of the impact force, and can be bent at the included angle between the first inclined end and the second inclined section 412, so that the whole bending section is deformed to a certain extent, and the impact force on the connecting section 42 is further absorbed. Meanwhile, the elastic buffer part 4 with the structure can increase the contact area between the abutting section 43 and the functional device 3, and avoid stress concentration.

Optionally, the second end of the first inclined section 411 and the first end of the second inclined section 412 are connected by a transition section 44, and the transition section 44 extends in the vertical direction.

It should be noted that the second end of the first inclined section 411 is connected to one end of the transition section 44, and the second end of the transition section 44 is connected to the first end of the second inclined section 412, so that the distance between the abutting section 43 and the connecting section 42 can be increased by connecting the first inclined section 411 and the second inclined section 412 through the transition section 44, so as to adapt to the distance between the functional device 3 and the second target board. Specifically, the spacing distance between the abutting section 43 and the connecting section 42 may be set based on the distance between the functional device 3 and the second target plate, and the extension length of the transition section 44 is further set, so that the pressure that the elastic buffer 4 can bear may be gradually increased along with the change of the pre-pressing distance. Under the condition that the contact area between the abutting section 43 and the functional device 3 is constant, the value of d/h can be designed, and under the condition that the distance for pressing the connecting section 42 in the direction close to the abutting section 43 is equal, when the value of d/h is larger, the pressure applied to the functional device 3 is smaller, and when the value of d/h is smaller, the pressure applied to the functional device 3 is larger. Where h denotes the distance between the abutment section 43 and the connecting section 42, and d denotes the distance between the end of the transition section 44 and the abutment section 43.

Optionally, the connecting section 42 extends along the horizontal direction, the connecting section 42 is connected to the second target plate by welding, the stopping section 43 extends along the horizontal direction, and the surface of the stopping section 43 is stopped against the functional device 3.

Specifically, the back surface of the second target board body may be provided with pads, the connection segment 42 is connected to the second target board body by pad welding, and the number of the pads is determined according to the number of the functional devices 3, which is not limited in this application. After the welding is completed, the surface of the abutting section 43 abuts against the functional device 3, so that the elastic buffer member 3 is always in a pressed state, and the elastic buffer member is always fixed between the second target plate body and the functional device.

Optionally, as shown in fig. 4 and 5, the connecting section 42 and the stopping section 43 are located on the same side of the bending section 41, and the extending length of the stopping section 43 is greater than the extending length of the bending section 41.

It should be noted that in the embodiment of the present application, the connecting section 42 may include only one elastic piece, and in this embodiment, the elastic piece and the abutting section 43 are located on the same side of the bending section 41. After the elastic sheet is pressed, an included angle between the first inclined section 411 and the second inclined section 412 is reduced, so that the elastic sheet can approach the abutting section 43, and the buffering effect of the elastic buffering member 4 can be realized. It should be further noted that the connection section 42 may be welded to the back surface of the second target board body through a spring plate pad, so that the elastic buffer 4 may be fixed to the second target board body as an integral structure, and the elastic buffer 4 is prevented from being separated from the second target board body after being pressed for multiple times, thereby further increasing the reliability of the buffer 4.

Optionally, as shown in fig. 2 and fig. 3, there are two elastic buffer members 4, the two elastic buffer members 4 are disposed oppositely, the connecting sections 42 of the two elastic buffer members 4 are disposed at intervals, and the abutting sections 43 of the two elastic buffer members 4 are integrally connected, or the abutting sections 43 of the two elastic buffer members 4 are disposed at intervals.

Specifically, the two elastic buffers 4 are symmetrically disposed along the middle line spaced at the middle of the connecting section 42, so that the first inclined sections 411 included in the two elastic buffers 4 on both sides are inclined in opposite directions, and the second inclined sections 412 included in the two elastic buffers 4 on both sides are inclined in opposite directions. The stopping sections 43 of the two elastic buffering members 4 are integrally connected, that is, there is no space between the stopping sections 43 of the two elastic buffering members 4, or the stopping sections 43 of the two elastic buffering members 4 are arranged at intervals. Thus, when the connecting sections 42 of the two elastic buffer members and the second target plate body are in abutting contact, the force received by the two connecting sections 42 is equal, and the two connecting sections 42 can be bent in the direction close to the abutting section 43 after being pressed, so that the force born by the two connecting sections 42 is larger.

Optionally, the elastic buffer 4 is an integrally formed elastic sheet metal part.

It should be noted that, the material of the elastic buffer member 4 may be a copper alloy, an aluminum alloy, or other sheet metal parts with a certain ductility, and after the sheet metal is formed, cracks can be prevented from being generated between the connection section 42, the abutting section 43, and the bending section 41 during connection, so that the service life of the elastic buffer member 4 can be prolonged.

Optionally, the elastic buffer member 4 is a white copper member, and the thickness of the elastic buffer member 4 is 0.1mm-0.25 mm.

Specifically, the ocean white copper buffer member can be any one of materials such as zinc white copper, nickel zinc white copper, because this type of material has certain ductility and fatigue resistance, consequently certain deformation can take place when receiving the impact force, and then makes elastic buffer member 4 can bear great impact force, and can resume original shape after the atress for elastic buffer member 4 can be fixed between second target plate body and functional device 3 all the time. In addition, the thickness of the elastic buffer 4 is 0.1mm-0.25mm, so that the elastic buffer 4 can have certain strength and toughness while maintaining elasticity.

Optionally, a underfill is further filled between the functional device 3 and the first target board.

It should be noted that, in order to fill the underfill 5 between the functional device 3 and the first target board by using capillary action, the underfill 5 may be fixed between the functional device 3 and the first target board after being cured, so as to avoid the direct contact between the functional device 3 and the first target board, and thus the functional device 3 has the following advantages after being fixed between the functional device 3 and the first target board: 1. the reliability, heat resistance and mechanical impact resistance are certain; 2. the viscosity is low, the flow is fast, and the first circuit board 1 does not need to be preheated; 3. the color is different before and after curing, so that the inspection is convenient; 4. the curing time of the underfill 5 is short, which is beneficial to the mass production of the first circuit board 1 and the functional device 3; 5. the repair of the functional device 3 and the first circuit board 1 in the later period is facilitated. It should be noted that there may be a plurality of positions for the underfill 5, and the underfill may be uniformly distributed between the functional device 3 and the first target board, so that the force applied to the first target board is more uniform. In addition, the main component of the underfill 5 may be epoxy resin, and since epoxy resin has certain elasticity, when the functional device 3 abuts against the first target board body, certain buffering may be provided, so that the impact force received by the first target board body is reduced.

Optionally, the electronic device further comprises a first shield 6; a first shield 6 is arranged on the surface of the first circuit board 1 remote from the functional component 3.

Specifically, the first shielding cover 6 is mainly used for shielding electronic signals generated by electronic devices mounted on the first circuit board 1, and on one hand, the first shielding cover 6 can reduce the influence of external electromagnetic waves on circuits inside the electronic devices mounted on the first circuit board 1, and on the other hand, the first shielding cover 6 can reduce the radiation intensity of the electromagnetic waves generated by the electronic devices mounted on the first circuit board 1 to the outside. The first shielding cover 6 may be a square housing or a circular housing, so that the first shielding cover 6 forms a certain inner cavity, and the first shielding cover 6 may cover the electronic device mounted on the first circuit board 1. In addition, the material of the first shielding case 6 may be cupronickel, tinplate, or the like, so that the first shielding case 6 may also play a role in assisting the heat dissipation of the electronic devices mounted on the first circuit board 1.

Optionally, a memory, a processor and a computer flash memory device are provided between the first shield 6 and the first circuit board 1.

Specifically, the electronic device arranged between the first shielding case 6 and the first circuit board 1 may include a memory, a processor and a computer flash memory device, and the device may generate more heat during operation, and if the device cannot be timely cooled, the device may be burned down, and the service life of the electronic device is reduced, so that the heat generated by the electronic device may be cooled through the first shielding case 6.

Optionally, the electronic device further comprises a second shielding can 7; a second shielding 7 covers the surface of the second circuit board 2 remote from the functional component 3.

It should be noted that the second shielding case 7 may be a square case or a circular case, so that the first shielding case 6 forms a certain inner cavity, and further, the first shielding case 6 may cover the electronic device disposed on the second circuit board 2. And then make second shield cover 7 can shield the electronic signal that the electron device installed on second circuit board 2 produced, can reduce the influence of external electromagnetic wave to the inside circuit of the electron device installed on second circuit board 2, can reduce the radiation intensity of the electromagnetic wave that the electron device installed on second circuit board 2 produced to the outside simultaneously. It should be noted that the material of the second shielding case 7 may be cupronickel, tinplate, or the like, so that the second shielding case 7 may also play a role in assisting the heat dissipation of the electronic devices mounted on the second circuit board 2.

Optionally, a signal transmitting module 8 and a signal receiving module 9 are disposed between the second shielding case 7 and the second circuit board 2.

Specifically, the electronic device disposed between the second shielding case 7 and the second circuit board 2 may include a signal transmitting module 8 and a signal receiving module 9, where the environment of signal transmission or signal reception is particularly important for the electronic device, and after the second shielding case 7 covers the signal transmitting module 8 and the signal receiving module 9, the electronic device may shield the electronic signals of the signal transmitting module 8 and the signal receiving module 9, and at the same time, the influence of the external electromagnetic waves on the circuits inside the signal transmitting module 8 and the signal receiving module 9 may be reduced.

It should be noted that, the electronic device provided in the embodiment of the present application may be: a cell phone, a tablet, an e-book reader, an MP3 player, an MP4 player, a laptop portable computer, a car computer, a desktop computer, a set-top box, a smart television, or a wearable device.

In addition, in the process of molding the elastic buffer 4, the distance between the connecting section 42 and the abutting section 43 may be set based on the distance between the functional device 3 and the second target board, so as to change the length of the connecting section 42, and the pressure that the elastic buffer 4 can bear may be gradually increased along with the change of the length of the connecting section 42. Under the condition that the contact area between the abutting section 43 and the functional device 3 is constant, the value of d/h can be designed, under the condition that the distance that the connecting section 42 presses down in the direction close to the abutting section 43 is equal, when the value of d/h is larger, the pressure applied to the functional device 3 is smaller, and when the value of d/h is smaller, the pressure applied to the functional device 3 is larger, so that the elastic buffer 4 can be arranged in electronic equipment with different specifications, and the application scene of the elastic buffer 4 is wider.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electronic device, comprising:

a first circuit board;

2. The electronic device of claim 1, wherein the elastomeric buffer comprises:

a connection section connected to the second target board;

the abutting section abuts against the functional device, and the abutting section and the connecting end are arranged at intervals;

the bending section is connected between the connecting section and the abutting section, and the bending section is arranged in a suspended mode.

3. The electronic device of claim 2, wherein the bend segment comprises:

a first inclined section, a first end of the first inclined section is connected with the connecting section, and a second end of the first inclined section extends towards the functional device and away from the connecting section in an inclined manner;

a second inclined section, wherein a first end of the second inclined section is connected with a second end of the first inclined section, a second end of the second inclined section faces the functional device and is far away from the first inclined section, the second end of the second inclined section extends in an inclined mode, and the second end of the second inclined section is connected with the abutting section;

and the included angle between the first inclined section and the second inclined section is variable, so that the bending section is deformable.

4. The electronic device of claim 3, wherein the second end of the first angled section and the first end of the second angled section are connected by a transition section, the transition section extending in a vertical direction.

5. The electronic device of claim 2, wherein the connecting section extends along a horizontal direction, the connecting section is connected with the second target board by welding, the abutting section extends along the horizontal direction, and a surface of the abutting section abuts against the functional device.

6. The electronic device of claim 2, wherein the connecting section and the abutting section are located on the same side of the bending section, and the extending length of the abutting section is greater than that of the connecting section.

7. The electronic device according to claim 2, wherein the number of the elastic buffer members is two, and the two elastic buffer members are disposed opposite to each other, wherein the connecting sections of the two elastic buffer members are disposed at an interval, and the abutting sections of the two elastic buffer members are integrally connected to each other, or the abutting sections of the two elastic buffer members are disposed at an interval.

8. The electronic device of any of claims 1-7, wherein the elastomeric buffer is an integrally formed elastomeric sheet metal part.

9. The electronic device of claim 8, wherein the elastomeric buffer is a cupronickel element, and the elastomeric buffer has a thickness of 0.1mm to 0.25 mm.

10. The electronic device according to claim 1, wherein an underfill is further filled between the functional device and the first target board body.