CN112312000A - Optical anti-shake realization method - Google Patents
Optical anti-shake realization method Download PDFInfo
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- CN112312000A CN112312000A CN201910694386.3A CN201910694386A CN112312000A CN 112312000 A CN112312000 A CN 112312000A CN 201910694386 A CN201910694386 A CN 201910694386A CN 112312000 A CN112312000 A CN 112312000A
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- image sensor
- sensor chip
- shake
- optical anti
- contact
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
- H04N23/682—Vibration or motion blur correction
- H04N23/685—Vibration or motion blur correction performed by mechanical compensation
- H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Adjustment Of Camera Lenses (AREA)
Abstract
The invention provides a method for realizing optical anti-shake, which comprises the following steps: the image sensor chip performs motion compensation, and the lens module does not perform motion compensation; the image sensor chip is electrically communicated with an external circuit through the contact part, the structure and the process are simple, the product yield is improved, the manufacturing cost is reduced, the reliability is improved, and the image quality is improved.
Description
Technical Field
The invention relates to an optical anti-shake realization method.
Background
The optical anti-shake depends on the motion compensation of a lens or a photosensitive element, so that the instability of images caused by shake in the use process of an operator is reduced to the maximum extent. The optical anti-shake technology is to detect a tiny movement by a gyroscope in a lens, transmit a signal to a microprocessor to immediately calculate a displacement amount to be compensated, and then compensate the movement amount according to a shake direction through a compensation lens group or a movable photosensitive element, thereby effectively overcoming image blur caused by vibration of a camera.
The existing optical anti-shake mainly adopts the following modes:
1. lens moving type optical anti-shake
Such optical anti-shake is mainly to compensate for camera shake by movement of the lens. The gyro sensor is installed in the anti-shake lens of Canon, it can accurately detect the hand vibration and convert it into electric signal, after the computer processing in the lens, control a group of correction optical components to move parallel to the film or CCD, CMOS plane, offset the imaging light shift caused by hand vibration. The system can effectively improve the effect of handheld shooting.
The lens can detect the shake of the camera through a pair of built-in gyroscope sensors, and the lens assembly is adjusted towards the shake direction to counteract the shake and prevent the picture from being blurred. If the shutter is half-pressed with the image stabilization function enabled, the lens will initiate camera shake compensation after 0.5 seconds. Such lenses can theoretically reduce two to three levels of shutter speed. Since the potential optical performance of the lens is optimized, a beautiful image can be captured.
2. Movable optical anti-shake of photosensitive element
Based on the considerations of lens-moving optical anti-shake in terms of production technology and cost, some manufacturers have developed a photosensitive-element-moving optical anti-shake (CCD or CMOS anti-shake) system. This technology has emerged with the advent of digital cameras because its principle has determined that film machines cannot be made anti-shake in this manner. The movable optical anti-shake (CCD or CMOS anti-shake) of the photosensitive element is to fix the photosensitive element (CCD/CMOS) of the digital camera on a platform which can slide in parallel through an electromagnetic effect, and when shooting is carried out, the platform can be fixed in a short time (CCD or CMOS anti-shake) by utilizing the electromagnetic hysteresis, so that the anti-shake purpose is achieved to a certain extent.
In the movable optical anti-shake of the photosensitive element, U.S. patent US9264,591B2, the title of the invention is: comb Drive And Leaf Spring Camera actor, it connects OIS Leaf-Spring Flexers 430 to AF Leaf-Spring Flexers 420 through the Flexible Link 450 set up around the chip of the Image sensor (Image sensor 490) And through the structure of Outline of Pre-Deflection Body410, when focusing, the above-mentioned structure can take place the elastic deformation, Drive the chip of the Image sensor to move, further realize the optical anti-shake. In addition to the above, U.S. patent application, application No.: 2015/0341534A1, title of the invention: electric Bar latch For Low Stiffness MEMS Actuator discloses a MEMS acutuator structure suitable For an image sensor module, which is connected to a movable platform311 through a flexible array 313, an image sensor chip is positioned on the movable platform311, and the movement of the image sensor chip in the focusing process is realized through the synergistic action of an inner frame and an outer frame, so that the optical anti-shake is further realized. The movable optical anti-shake method for the photosensitive element is complex in structure, needs a plurality of small precise mechanical structures in the image sensor module, and easily causes the problems of low product yield, high cost, high reliability risk and the like. In view of the above, a new method for preventing the optical shake of the movable photosensitive element is needed.
Disclosure of Invention
The invention aims to provide an optical anti-shake realization method, which has simple structure and process, improves the product yield, reduces the manufacturing cost, improves the reliability and improves the image quality.
Based on the above consideration, the invention provides an optical anti-shake realization method, which comprises the following steps: the image sensor chip performs motion compensation, and the lens module does not perform motion compensation; the image sensor chip is in electrical communication with an external circuit through a contact member.
Preferably, the magnetic member and the image sensor chip constitute an image sensor chip assembly, and the image sensor chip assembly is moved by an electromagnetic force generated by the external coil.
Preferably, the magnetic member generates an attractive force with the substrate under the image sensor chip to provide a contact force between the image sensor chip assembly and the contact member.
Preferably, the plurality of contact parts are provided with corresponding elastic parts to improve stability of electrical contact of the contact parts.
Preferably, a conductive lubricant is added on the contact component to improve the conductivity.
Preferably, the contact member is a conductive rolling member.
Preferably, the image sensor chip is electrically connected with the printed circuit board in a metal wire bonding mode; the printed circuit board is electrically connected with the rolling component through a welding disc positioned at the lower part.
Preferably, a limiting structure is arranged outside the rolling component to control the rolling component to move within the range of the limiting structure.
Preferably, the transverse distance of the limiting structure is more than 50 microns larger than the diameter of the rolling part, so that the contact between the rolling part and the two side areas of the limiting structure is reduced or avoided, and the friction force is reduced.
Preferably, the magnetic component is located on at least three sides of the image sensor chip assembly, and can realize the X-axis movement, the Y-axis movement and the plane rotation of the image sensor chip.
Preferably, the sensed position information is fed back through the hall sensing element, and the optical anti-shake process is controlled.
Preferably, a limiting device is arranged on the periphery of the image sensor chip assembly to control the image sensor chip assembly to move in a certain space.
The optical anti-shake realization method of the invention has the following optical anti-shake modes: the image sensor chip performs motion compensation, and the lens module does not perform motion compensation; the image sensor chip is electrically communicated with an external circuit through the contact part, the structure and the process are simple, the product yield is improved, the manufacturing cost is reduced, the reliability is improved, and the image quality is improved.
Drawings
Other features, objects and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments thereof, which proceeds with reference to the accompanying drawings.
Fig. 1 is a partial top view of a camera module using the optical anti-shake implementation method of the present invention;
fig. 2 is a partial bottom view of a camera module adopting the optical anti-shake implementation method of the present invention;
FIG. 3 is a cross-sectional view taken along line A-A of FIG. 1;
fig. 4 is a sectional view taken along line B-B in fig. 1.
In the drawings, like or similar reference numbers indicate like or similar devices (modules) or steps throughout the different views.
Detailed Description
In order to solve the above problems in the prior art, the present invention provides a method for implementing optical anti-shake, wherein the optical anti-shake method comprises: the image sensor chip performs motion compensation, and the lens module does not perform motion compensation; the image sensor chip is electrically communicated with an external circuit through the contact part, the structure and the process are simple, the product yield is improved, the manufacturing cost is reduced, the reliability is improved, and the image quality is improved.
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof. The accompanying drawings illustrate, by way of example, specific embodiments in which the invention may be practiced. The illustrated embodiments are not intended to be exhaustive of all embodiments according to the invention. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
Fig. 1 and fig. 2 are a partial top view and a partial bottom view of a camera module using the optical anti-shake implementation method of the present invention, respectively. The camera module includes a lens module (not shown), an image sensor chip 1, a magnetic member (e.g., magnet) 2, and a contact member 3. Preferably, the contact element 3 is an electrically conductive rolling element, such as a ball, a roller, and is shown here as an example of a ball implemented with a metallized ceramic material. The image sensor chip 1 performs motion compensation, and the lens module does not perform motion compensation. Specifically, the image sensor chip 1 is electrically connected to an external circuit through the balls 3, the magnetic member 2 and the image sensor chip 1 form an image sensor chip assembly, and an external coil (not shown) generates an electromagnetic force to push the image sensor chip assembly to move, so as to compensate according to a shaking direction and a displacement amount, thereby effectively overcoming image blur caused by vibration of a camera. The camera module adopting the method has simple structure and process, improves the product yield, reduces the manufacturing cost, improves the reliability and improves the image quality.
Fig. 3 and 4 are cross-sectional views taken along line a-a and line B-B of fig. 1, respectively. As shown in the figure, the image sensor chip 1 is electrically connected to the printed circuit board 4 disposed above the image sensor chip 1 by a metal wire (not shown) bonding manner; the printed circuit board 4 is electrically connected to the balls 3 through a pad 7 located at a lower portion, and the balls 3 are electrically connected to an external circuit through a substrate 5 disposed under the image sensor chip 1. Wherein, the magnetic component 2 and the substrate 5 generate an attractive force to provide a contact force between the image sensor chip assembly and the ball 3. The balls 3 are provided with corresponding elastic members (not shown) against which the balls 3 are pressed to improve the stability of the contact of the balls 3. And a conductive lubricant can be added on the ball 3 to improve the conductivity.
Preferably, the ball 3 is externally provided with a limiting structure (e.g. a groove) 8 to control the ball 3 to move in the range of the groove 8. The transverse distance d of the groove 8 is more than 50 microns larger than the diameter of the ball 3, so that the contact between the ball 3 and the two side areas of the groove 8 is reduced or avoided, and the friction force is reduced.
Preferably, a limiting device 6 is disposed at the periphery of the image sensor chip assembly to control the image sensor chip assembly to move in a certain space. The position limiting means 6 may be disposed in four corner regions of the periphery of the image sensor chip assembly, or surround the entire four-side regions as shown in fig. 1 and 2.
Preferably, the magnetic component 2 is located in at least three (four sides in the figure) areas of the image sensor chip assembly, and can realize the X-axis movement, the Y-axis movement and the planar rotation of the X-axis and the Y-axis of the image sensor chip 1 in the substrate 5.
Preferably, a hall sensor (not shown) is disposed near the magnetic component 2, and the hall sensor feeds back the sensed position information to determine the movement direction and displacement, so as to control the optical anti-shake process.
The optical anti-shake realization method of the invention has the following optical anti-shake modes: the image sensor chip performs motion compensation, and the lens module does not perform motion compensation; the image sensor chip is electrically communicated with an external circuit through the contact part, the structure and the process are simple, the product yield is improved, the manufacturing cost is reduced, the reliability is improved, and the image quality is improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. Furthermore, it will be obvious that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. Several elements recited in the apparatus claims may also be implemented by one element. The terms first, second, etc. are used to denote names, but not any particular order.
Claims (12)
1. An optical anti-shake realization method is characterized in that,
the optical anti-shake method comprises the following steps: the image sensor chip performs motion compensation, and the lens module does not perform motion compensation; the image sensor chip is in electrical communication with an external circuit through a contact member.
2. The method for realizing optical vibration prevention according to claim 1, wherein the magnetic member and the image sensor chip form an image sensor chip assembly, and the image sensor chip assembly is moved by an electromagnetic force generated by an external coil.
3. The method of claim 2, wherein the magnetic member generates an attractive force with the substrate under the image sensor chip to provide a contact force between the image sensor chip assembly and the contact member.
4. The method of claim 1, wherein the plurality of contact members are provided with corresponding elastic members to improve stability of electrical contact of the contact members.
5. The method for realizing optical vibration damping according to claim 1, wherein a conductive lubricant is added to the contact member to improve conductivity.
6. The method of claim 1, wherein the contact member is a conductive rolling member.
7. The method for realizing optical anti-shake according to claim 6, wherein the image sensor chip is electrically connected to the printed circuit board by means of metal wire bonding; the printed circuit board is electrically connected with the rolling component through a welding disc positioned at the lower part.
8. The method for realizing optical anti-shake according to claim 6, wherein a limit structure is arranged outside the rolling component to control the rolling component to move within the limit structure.
9. The method for realizing optical anti-shake according to claim 8, wherein the lateral distance of the limiting structure is more than 50 microns larger than the diameter of the rolling component, so as to reduce or avoid the contact between the rolling component and the two side areas of the limiting structure, and reduce the friction force.
10. The method for realizing optical anti-shake according to claim 3, wherein the magnetic component is located on at least three sides of the image sensor chip assembly, and can realize X-axis motion, Y-axis motion and plane rotation of the image sensor chip.
11. The method for realizing optical anti-shake according to claim 1, wherein the hall sensor element feeds back the sensed position information to control the optical anti-shake process.
12. The method for realizing optical anti-shake according to claim 2, wherein a position limiting device is arranged at the periphery of the image sensor chip assembly to control the image sensor chip assembly to move in a certain space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910694386.3A CN112312000B (en) | 2019-07-30 | 2019-07-30 | Optical anti-shake realization method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910694386.3A CN112312000B (en) | 2019-07-30 | 2019-07-30 | Optical anti-shake realization method |
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| CN112312000A true CN112312000A (en) | 2021-02-02 |
| CN112312000B CN112312000B (en) | 2023-01-06 |
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| CN201910694386.3A Active CN112312000B (en) | 2019-07-30 | 2019-07-30 | Optical anti-shake realization method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113489910A (en) * | 2021-08-03 | 2021-10-08 | Oppo广东移动通信有限公司 | Optical anti-shake method, system, computer-readable storage medium, and electronic device |
| WO2023040689A1 (en) * | 2021-09-18 | 2023-03-23 | 华为技术有限公司 | Three-axis optical image stabilization system, method and apparatus based on image sensor displacement |
| EP4191312A1 (en) * | 2021-12-02 | 2023-06-07 | Largan Precision Co. Ltd. | Photographing module and electronic device |
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| US20060203095A1 (en) * | 2005-02-10 | 2006-09-14 | Stmicroelectronics S.A. | Device comprising a camera module with automatic focusing and corresponding assembly method |
| CN105573014A (en) * | 2016-01-22 | 2016-05-11 | 南昌欧菲光电技术有限公司 | Camera module with focusing and anti-shaking functions |
| CN105789233A (en) * | 2016-04-15 | 2016-07-20 | 格科微电子（上海）有限公司 | Photosensitive element mobile type optical anti-shaking method of CMOS image sensor module |
| CN106791289A (en) * | 2015-11-20 | 2017-05-31 | 宁波舜宇光电信息有限公司 | Camera module and its optical anti-vibration element and anti-fluttering method |
| US20170371232A1 (en) * | 2010-10-22 | 2017-12-28 | Tdk Taiwan Corp. | Anti-shake compensation structure for auto-focus |
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2019
- 2019-07-30 CN CN201910694386.3A patent/CN112312000B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060203095A1 (en) * | 2005-02-10 | 2006-09-14 | Stmicroelectronics S.A. | Device comprising a camera module with automatic focusing and corresponding assembly method |
| US20170371232A1 (en) * | 2010-10-22 | 2017-12-28 | Tdk Taiwan Corp. | Anti-shake compensation structure for auto-focus |
| CN106791289A (en) * | 2015-11-20 | 2017-05-31 | 宁波舜宇光电信息有限公司 | Camera module and its optical anti-vibration element and anti-fluttering method |
| CN105573014A (en) * | 2016-01-22 | 2016-05-11 | 南昌欧菲光电技术有限公司 | Camera module with focusing and anti-shaking functions |
| CN105789233A (en) * | 2016-04-15 | 2016-07-20 | 格科微电子（上海）有限公司 | Photosensitive element mobile type optical anti-shaking method of CMOS image sensor module |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113489910A (en) * | 2021-08-03 | 2021-10-08 | Oppo广东移动通信有限公司 | Optical anti-shake method, system, computer-readable storage medium, and electronic device |
| CN113489910B (en) * | 2021-08-03 | 2023-01-24 | Oppo广东移动通信有限公司 | Optical anti-shake method, system, computer-readable storage medium, and electronic device |
| WO2023040689A1 (en) * | 2021-09-18 | 2023-03-23 | 华为技术有限公司 | Three-axis optical image stabilization system, method and apparatus based on image sensor displacement |
| EP4191312A1 (en) * | 2021-12-02 | 2023-06-07 | Largan Precision Co. Ltd. | Photographing module and electronic device |
| US11886106B2 (en) | 2021-12-02 | 2024-01-30 | Largan Precision Co., Ltd. | Photographing module and electronic device |
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| CN112312000B (en) | 2023-01-06 |
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