CN112309887B - Pre-dispatching method for wafer manufacturing, electronic device, computer equipment and system - Google Patents
Pre-dispatching method for wafer manufacturing, electronic device, computer equipment and system Download PDFInfo
- Publication number
- CN112309887B CN112309887B CN201910686400.5A CN201910686400A CN112309887B CN 112309887 B CN112309887 B CN 112309887B CN 201910686400 A CN201910686400 A CN 201910686400A CN 112309887 B CN112309887 B CN 112309887B
- Authority
- CN
- China
- Prior art keywords
- wafer
- wafers
- group
- carrier
- batch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Landscapes
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Factory Administration (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application provides a pre-dispatching method, an electronic device, computer equipment and a system for wafer manufacturing, which can determine an operable machine by acquiring the current operating condition of one or more machines; obtaining wafer storage information of a wafer group of wafers to be processed and wafer rated storage quantity of one or more wafer carriers of each operable machine table so as to calculate and obtain batch numbers corresponding to the wafer carriers, wherein each batch number corresponds to at least one wafer group; loading the wafers of the wafer group corresponding to each batch number into the wafer carrier of the corresponding batch number; the wafer carrier with the loaded wafers waits for processing by the operable machine. The method and the device can solve the problems that in the existing Batch operation, dispatching delay, manual experience inconsistency, repeated input and information depend on paper book recording and transmission, manual operation is frequent, misoperation and other difficulties and risks, the scientificity and effectiveness of a Batch production system of a factory are improved, and the humanized effect of the workflow of factory personnel is improved.
Description
Technical Field
The present application relates to the field of semiconductor manufacturing, and more particularly, to a method, an electronic device, a computer device, and a system for pre-dispatching wafer manufacturing.
Background
Semiconductor manufacturing is one of the most complex manufacturing processes today. The scheduling of a semiconductor production line is an important problem in the actual production of a semiconductor manufacturing system and is one of the difficulties in the theoretical research of the scheduling. The semiconductor production line has the characteristics of complex process flow, multiple processing flows, simultaneous processing of various products, mixed processing modes and the like. There may be multiple orders on a semiconductor manufacturing line and the types of products required may be different, thus making the process flow more complex.
At present, batch operation aiming at wafer processing in a factory basically stays in a manual and personal experience stage, for example, batch collection, manual account entry and paper book recording are carried out manually during wafer stock, and a large amount of repeated and dispersed operation exists. Due to inconsistent manual experience and the fact that information is recorded and transmitted by means of paper books, work dispatching delay, repeated input, low overall efficiency and high misoperation risk exist in batch operation aiming at wafer processing.
Disclosure of Invention
In view of the above, it is desirable to provide a method, an electronic device, a computer apparatus and a system for pre-dispatching in wafer manufacturing.
To achieve the above and other related objects, the present application provides a method for pre-dispatching in wafer manufacturing, the method comprising: acquiring the current operating condition of one or more machines of the current station to determine the operable machines; each operable machine table corresponds to at least one wafer carrier for loading wafers to be processed; and calculating and determining one or more wafer groups to which the number of wafers corresponding to the rated wafer storage amount of each wafer carrier belongs according to the number of wafers included in each wafer group output by the front station, and using the determined one or more wafer groups as the distribution batches of each wafer carrier and generating corresponding batch numbers.
In an embodiment of the present application, the determining the operable equipment includes: the current operating condition of the machine is idle; and/or the time for the machine platform to finish is less than or equal to the preset time.
In an embodiment of the application, the calculating and determining, according to the number of wafers included in each wafer group output by the front station, one or more wafer groups to which the number of wafers corresponding to the rated wafer storage amount of each wafer carrier belongs includes any one or more of the following combinations: 1) When the number of the wafers contained in one wafer group is larger than the rated wafer storage amount of the wafer carrier, the wafers in the wafer group are batched; 2) When the number of the wafers contained in one wafer group is equal to the rated wafer storage amount of the wafer carrier, each wafer in the wafer group is not processed; 3) And when the number of the wafers contained in one wafer group is smaller than the rated wafer storage amount of the wafer carrier, adding the wafers of the same type as the wafer group to the wafer group so as to meet the rated wafer storage amount of the wafer carrier.
In an embodiment of the present application, the lot number includes a name of a runnable machine, a name of a wafer lot, a name of a wafer carrier, a name of a wafer product, and a delivery date of the wafer product.
In an embodiment of the present application, the method further includes: and printing the batch number into a two-dimensional code, wherein the two-dimensional code can provide the stock information corresponding to the batch number after being scanned.
In an embodiment of the present application, the method further includes: loading the determined number of the wafers of one or more wafer groups for each wafer carrier at the front station according to the two-dimensional codes; and marking the two-dimensional code on the corresponding wafer carrier and sending the two-dimensional code to the current station so as to be used for checking and inputting the batch number corresponding to the wafer carrier by the current station.
In an embodiment of the present application, the method further includes: scanning the identification codes marked on the wafer carriers at the current station and extracting corresponding stock information; judging whether the quantity of the wafers corresponding to each wafer group on the wafer carrier is correct or not according to the stock information; if the wafer is correct, recording the corresponding batch number of the wafer; and if not, prompting that the quantity of the wafers corresponding to each wafer group on the wafer carrier is wrong.
To achieve the above and other related objects, the present application provides an electronic device, comprising: the acquisition module is used for acquiring the current operating condition of one or more machines at the current station so as to determine the operable machines; each runnable machine table corresponds to at least one wafer carrier for loading wafers to be processed; and the processing module is used for calculating and determining one or more wafer groups to which the number of wafers equivalent to the rated wafer storage amount of each wafer carrier belongs according to the number of wafers included in each wafer group output by the front station, and using the determined one or more wafer groups as the distribution batches of each wafer carrier and generating corresponding batch numbers.
To achieve the above and other related objects, the present application provides a computer apparatus, comprising: a memory, and a processor; the memory is to store computer instructions; the processor executes computer instructions to facilitate the implementation of the method as described above.
To achieve the above and other related objects, the present application provides a system for pre-dispatching in wafer manufacturing, the system comprising: the computer equipment, the current station formed by one or more machines and the front station formed by one or more machines; each machine table of the current station corresponds to at least one wafer carrier for loading wafers to be processed; the front station correspondingly outputs one or more groups of wafers.
To sum up, the method, the electronic device, the computer apparatus and the system for pre-dispatching in wafer manufacturing according to the present application determine an operable machine by obtaining a current operating status of one or more machines in a current station; each operable machine table corresponds to at least one wafer carrier for loading wafers to be processed; and calculating and determining one or more wafer groups to which the number of wafers corresponding to the rated wafer storage amount of each wafer carrier belongs according to the number of wafers included in each wafer group output by the front station, and using the determined one or more wafer groups as the distribution batches of each wafer carrier and generating corresponding batch numbers.
The pre-dispatching method realizes rapid batching of the wafer groups, the wafer groups correspond to the wafer carriers by virtue of batch numbers, automatic pre-dispatching is realized, the problems of delayed dispatching, inconsistent manual experience, repeated input, recording and transmitting of information by virtue of paper books, frequent and misoperation of manual operation and other difficulties and risks in the existing batch operation can be solved, the scientificity and effectiveness of a factory batch production system are improved, and the humanized effect of factory personnel workflow is improved.
Drawings
FIG. 1 is a schematic view of a pre-dispatching method for wafer fabrication according to an embodiment of the present invention.
FIG. 2 is a flow chart illustrating a method for pre-dispatching in wafer fabrication according to an embodiment of the present invention.
Fig. 3 is a block diagram of an electronic device according to an embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of a computer device according to an embodiment of the present application.
FIG. 5 is a block diagram illustrating a system of a pre-dispatching party for wafer fabrication according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present application is provided by way of specific examples, and other advantages and effects of the present application will be readily apparent to those skilled in the art from the disclosure herein. The application is capable of other and different embodiments and its several details are capable of modifications and various changes in detail without departing from the spirit of the application. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
Embodiments of the present application will be described in detail below with reference to the accompanying drawings so that those skilled in the art to which the present application pertains can easily carry out the present application. The present application may be embodied in many different forms and is not limited to the embodiments described herein.
In order to clearly explain the present application, components that are not related to the description are omitted, and the same reference numerals are given to the same or similar components throughout the specification.
Throughout the specification, when a component is referred to as being "connected" to another component, this includes not only the case of being "directly connected" but also the case of being "indirectly connected" with another element interposed therebetween. In addition, when a component is referred to as "including" a certain constituent element, unless otherwise stated, it means that the component may include other constituent elements, without excluding other constituent elements.
When an element is referred to as being "on" another element, it can be directly on the other element, or intervening elements may also be present. When a component is referred to as being "directly on" another component, there are no intervening components present.
Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first interface and the second interface, etc. are described. Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" include plural forms as long as the words do not expressly indicate a contrary meaning. The term "comprises/comprising" when used in this specification is taken to specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but does not exclude the presence or addition of other features, regions, integers, steps, operations, elements, and/or components.
Terms indicating "lower", "upper", and the like relative to space may be used to more easily describe a relationship of one component with respect to another component illustrated in the drawings. Such terms are intended to include not only the meanings indicated in the drawings, but also other meanings or operations of the device in use. For example, if the device in the figures is turned over, elements described as "below" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "under" and "beneath" all include above and below. The device may be rotated 90 or other angles and the terminology representing relative space is also to be interpreted accordingly.
Although not defined differently, including technical and scientific terms used herein, all terms have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Terms defined in commonly used dictionaries are to be additionally interpreted as having meanings consistent with those of related art documents and the contents of the present prompts, and must not be excessively interpreted as having ideal or very formulaic meanings unless defined.
The present application is currently primarily concerned with manufacturing industries where production integration and production flexibility are high, such as the semiconductor industry.
At present, batch processors are adopted as processing machines on a semiconductor production line. The smallest unit in a semiconductor manufacturing line is a wafer lot (1 ot), which typically contains tens of wafers. While a sequential processing machine has been used to process only one wafer lot at a time, a batch processor, which is commonly used today, can process a plurality of wafer lots at a time, but before processing, a wafer lot decision must be made as to how to group a plurality of wafer lots into a batch (batch).
As mentioned above, the existing batch operation aiming at wafer processing in the factory at present basically stays in the stage of manual operation and personal experience, and has the defects of delayed dispatching, inconsistent manual experience, repeated input, and high overall efficiency and misoperation risk due to the fact that information is recorded and transmitted by paper books. Therefore, the present application provides a method, an electronic device, a computer apparatus and a system for pre-dispatching in wafer manufacturing to solve the above-mentioned problems.
Fig. 1 is a schematic view of a pre-dispatching method for wafer fabrication according to an embodiment of the present invention. As shown, one or more stations are included in the scene, and before the stations process, the wafers to be processed are loaded to the wafer carriers in the stock areas corresponding to the stations to wait for processing.
The wafer carrier corresponding to each machine may be one or more, such as the wafer carrier a corresponding to the machine a in fig. 1, which may be specifically represented as one wafer carrier, or may be represented as multiple wafer carriers.
The stations and their corresponding wafer carriers in the stocker area may constitute the current station as shown in the figure, while the storage areas for the various wafer lots may constitute the previous station as shown in the figure, and the wafer lots after processing by the stations may constitute the next station as shown in the figure. It should be noted that the previous station, the current station, and the next station are only relative descriptions of one process link, and in the processing process of the entire wafer manufacturing system, the next station shown in the figure may be the previous station of the next process link, or the previous station shown in the figure may be the next station of the previous process link, and fig. 1 shows a scenario of the pre-dispatching method for wafer manufacturing according to the present application only in one process link.
It should be noted that the scenario embodiment of the pre-dispatch method of wafer fabrication shown in fig. 1 is merely illustrative and in no way implies any limitation to the present application, its application, or use.
The machine stations are used for carrying out processing, such as deposition, etching and other processes, on the wafers, wherein each machine station corresponds to one or more wafer carriers, common wafer carriers are wafer cassettes made of Teflon materials, and each wafer carrier can correspondingly place one or more groups of wafers.
The method includes the steps of firstly, determining one or more operable machines, then calculating a batch number corresponding to each wafer carrier according to wafer rated storage quantity of one or more wafer carriers corresponding to the operable machines and wafer storage information of a wafer group, and then loading the wafers to the carriers according to the batch numbers and sending the wafers to a spare area to wait for processing.
In addition, the batch number is uploaded to the system, so that an operator can load the wafers through a machine or manually in the whole wafer process treatment process, and the loaded wafers and wafer carriers can be tracked and recorded.
It should be noted that the wafer to be processed may be a blank silicon wafer without a device structure, or may be a silicon wafer with a device structure. However, the Batch operation (Form Batch operation) of the conventional wafer processing still remains in the stage of manual operation and personal experience, because the number of wafers in the wafer group and the rated wafer storage amount of the wafer carrier are not completely the same, and in addition, the delivery date and the product type of the product obtained by wafer manufacturing need to be considered, the wafers in the wafer group are manually recombined in batches according to experience so as to meet the rated wafer storage amount of the wafer carrier of each machine. In addition, the information involved is an artificial paper record. Due to inconsistent manual experience and the fact that information is recorded and transmitted by means of paper books, work dispatching delay, repeated input, low overall efficiency and high misoperation risk exist in batch operation aiming at wafer processing.
To solve at least one of the above problems, the present application provides a pre-dispatching method, an electronic device, a computer apparatus and a system for wafer manufacturing.
The method of pre-dispatching for wafer fabrication shown in fig. 1 is merely illustrative and is in no way meant to be any limitation on the present application, and applications or uses thereof.
Fig. 2 is a flow chart illustrating a pre-dispatching method for wafer fabrication according to an embodiment of the present invention. As shown, the method includes:
step S201: the current operating condition of one or more machines is obtained to determine the operable machines.
In this embodiment, a plurality of wafers of the same type may form a wafer lot, for example, the number of wafers in a wafer lot is 25, and each machine can process a plurality of wafer lots at a time. The machine corresponds to one or more wafer carriers, such as teflon cassettes, through which wafers are loaded and placed in the machine for processing.
In the embodiment, the operable equipment is determined according to the operation status corresponding to each equipment. Such as: whether the current operation state is a starting operation state or not, whether the current operation state is an idle state or not, the processing time (corresponding to different types of wafers) of the machine equipment, whether the machine equipment has faults or not and other relevant working condition parameters so as to know the current operation state.
In this embodiment, a station may correspond to multiple tools, or tools of multiple process types, and a corresponding tool may be selected according to the type of the process to be performed, and then whether the operation is possible is determined according to the operation status.
In the embodiment, the machines can be divided into operable machines and inoperable machines according to the current operating status of each machine. For example, a machine that has failed or is in a shutdown state is an inoperable machine. However, the method does not determine the machine which is not in fault or is in a halt state as the operable machine. It needs to satisfy the following conditions:
the machine with the current operation state being idle is an operable machine; and/or the obtained machine with the distance operation ending time less than or equal to the preset time is an operable machine.
Further, if the time measurement for restoring the machine in the shutdown or fault state to normal operation is digitized, i.e., the maintenance time can be determined in advance by experience to be an approximate time, the time measurement can also be used for pre-dispatching in advance, i.e., when the estimated maintenance time is less than the preset time, the machine can also be determined to be an operable machine.
In this embodiment, since the wafer loading process also requires time, the end time of the machining of the machine can be determined in advance, and the production efficiency can be further improved. For example, the preset time may be 10 minutes or 30 minutes, etc.
Step S202: and acquiring wafer storage information of a wafer group of wafers to be processed and the wafer rated storage quantity of one or more wafer carriers of each operable machine table so as to calculate and obtain batch numbers corresponding to the wafer carriers, wherein each batch number corresponds to at least one wafer group.
In this embodiment, in the whole process, because it is necessary to prevent the wafer from having a problem all the time, in the whole process chain, strict information entry (including quantity information) is required for the wafer or the wafer group that enters and exits in each process, and therefore, the wafer storage information of the wafer group of the wafer to be processed described in this application may be obtained through the entry information entered in the system or the manually recorded entry and exit record including the quantity information. For example, the wafer storage information of the wafer group of the wafers to be processed may be captured by an image capturing device, or manually checked to obtain the wafer storage information of the wafer group of the wafers to be processed.
Since the nominal wafer storage capacity of each machine corresponding to the wafer carrier is not necessarily equal to the number of wafers included in the wafer group, the allocation calculation is required. For example, if a number of wafer carriers corresponding to a machine station is 12, and the number of wafers in the 1 wafer group is 25, then the wafers in the wafer group need to be split during the distribution, which results in a batch. Therefore, it is necessary to calculate and determine one or more wafer groups to which the number of wafers corresponding to the rated wafer storage amount of each wafer carrier belongs, and use the determined one or more wafer groups as the distribution lot of each wafer carrier.
Specifically, the allocation calculation includes any one or more of the following:
1) And when the wafer storage amount of one wafer group is larger than the rated wafer storage amount of the wafer carrier, the wafers of the wafer group are batched, and each batch number corresponds to one wafer group.
For example, if the number of wafers required by the machine is 13 and the number of wafers in the wafer group is 25, a wafer group is divided into 13 wafers and 12 wafers, which form a master-slave batch.
2) When the wafer storage amount of one wafer group is equal to the rated wafer storage amount of the wafer carrier, the wafers of the wafer group are not batched, and each batch number corresponds to one wafer group.
This situation is the most ideal situation and no batching is required for the wafer lot.
3) When the wafer storage amount of one wafer group is smaller than the wafer rated storage amount of the wafer carrier, the wafers of the wafer group are not batched, and the wafers in a plurality of wafer groups need to be combined to meet the wafer rated storage amount of the wafer carrier, wherein each batch number corresponds to two or more wafer groups.
Specifically, corresponding to the situation of wafer group batching, on the contrary, the same type of wafers can be pieced together to form a batch.
For example, when the number of wafers included in a batched lot does not reach the number of wafers required by the operable machine, the batched lot needs to be supplemented with other lots of the same type to meet the rated wafer storage capacity of the wafer carrier, i.e., the batched lot needs to be completed.
It should be noted that the batches or lots need to strictly record the information of the wafer lot and the information of the wafers therein, and when the original wafer lot is split or formed into a new wafer lot, the information needs to be accurately recorded so as to trace back, and the batches or lots form corresponding batch information.
For example, 1) when the wafer storage amount of one of the wafer groups is larger than the rated wafer storage amount of the wafer carrier:
wafer lot number 001, which contains 25 wafers, assuming that the cassette number corresponding to the wafer carrier to be loaded is 1A, and the wafer carrier can load 20 wafers, the lot number corresponding to the wafer carrier is calculated as:
lot:001 20pcs Box number 1A.
2) When the wafer storage amount of one wafer group is equal to the wafer rated storage amount of the wafer carrier:
wafer lot number 002 wafer lot, which contains 25 wafers, assuming that the cassette number corresponding to the wafer carrier to be loaded is 1B, the wafer carrier can load 25 wafers, and then the lot number corresponding to the wafer carrier is calculated as:
lot:002 25pcs case number 1B.
3) When the wafer storage amount of one wafer group is smaller than the wafer rated storage amount of the wafer carrier:
a wafer group with wafer group number 003, which originally includes 25 wafers, and only 12 wafers remain after splitting, and a wafer group with wafer group number 004, which originally includes 25 wafers, and only 13 wafers remain after splitting, wherein the two groups of wafers need to be combined and placed in the same wafer carrier through calculation, and assuming that the cassette number corresponding to the wafer carrier to be loaded is 1C, the wafer carrier can be loaded with 25 wafers, the wafer group number corresponding to the wafer carrier batch number is calculated as:
lot:003 12pcs box number 1C;
lot:004 13pcs box No. 1C.
When calculating the wafer groups distributed by one or more wafer carriers corresponding to each machine station, forming corresponding batch numbers for each wafer carrier, wherein each batch number corresponds to at least one wafer group, so that workers can conveniently distribute the wafers, and meanwhile, the accurate record of the wafer processing process is also realized.
In an embodiment of the present application, the lot number may include a name of a runnable machine, a name of a wafer group, a name of a wafer carrier, a name of a wafer product, and a delivery date of the wafer product, in addition to the contents of the lot number in the above example. The wafer product name is the name of the semiconductor device manufactured on the wafer, and the delivery date of the wafer product is the last date when the semiconductor device is manufactured.
In short, the lot number can represent the corresponding relationship among the priorities of the corresponding machines, wafer carriers, wafer groups, wafer products and process sequences.
In an embodiment of the present application, the loading the wafers of the wafer group corresponding to each lot number into the wafer carrier of the corresponding lot number includes:
and printing the batch numbers into two-dimensional codes, and scanning the two-dimensional codes to load the wafers of the wafer group corresponding to each batch number into the wafer carriers corresponding to the batch numbers according to the batch numbers.
The batch number is firstly converted into an electronic two-dimensional code which can contain or be linked with the name of an operable machine, the name of a wafer group, the name of a wafer carrier, the name of a wafer product and the delivery date of the wafer product, and then the electronic two-dimensional code is printed into a paper two-dimensional code. The two-dimensional code can be an electronic version two-dimensional code or a paper version two-dimensional code, and the two-dimensional code can provide corresponding stock information after being scanned.
Preferably, if a damaged wafer is found in the process of loading the wafer of the wafer group corresponding to each lot number to the wafer carrier corresponding to the lot number according to each lot number, the wafer storage information of the wafer group of the wafer to be processed needs to be updated, and the lot number corresponding to each wafer carrier needs to be recalculated.
In an embodiment of the present application, after the wafers of the wafer group corresponding to each lot number are loaded into the wafer carriers of the corresponding lot numbers, before the wafer carriers loaded with the wafers wait for processing of the operable machine, the method includes:
and marking the two-dimensional code on the corresponding wafer carrier, so as to facilitate the tracking of the wafer carrier in the process flow.
For example, firstly, an electronic version two-dimensional code or a paper version two-dimensional code is distributed to a worker, the worker can acquire information such as a name of an operable machine, a name of a wafer group, a name of a wafer carrier, a name of a wafer product, a delivery date of the wafer product and the like corresponding to the two-dimensional code through scanning of a mobile phone or an industrial PAD, and the relationship among the information, and wafer storage information is included according to the information, so that the worker can quickly find the corresponding wafer and carry out distribution work; or, according to the two-dimensional code, the intelligent mechanical arm extracts information such as the name of an operable machine, the name of a wafer group, the name of a wafer carrier, the name of a wafer product and the like in the two-dimensional code, then automatically distributes wafers in each wafer group according to the information, and loads the wafers into the wafer carrier.
In an embodiment of the present application, the waiting of the wafer carrier loaded with the wafers for processing by the operable machine includes:
and placing the wafer carrier loaded with the wafers to a stock area of a corresponding operable machine according to the batch number, and waiting for processing of the operable machine.
In this embodiment, the names of the operable machines and the names of the wafer carriers included therein are obtained manually or by an intelligent robot according to the obtained batch numbers, and the wafer carriers loaded with the wafers can be placed in the stock areas corresponding to the operable machines to wait for the processing of the machines.
Preferably, in order to facilitate the platform and informatization of the wafer production process, the corresponding batch numbers are uploaded to the corresponding wafer production systems, and the corresponding distribution and delivery work is effectively checked, loaded, monitored in real time whether the stock preparation process is abnormal or not in each link, so that the production efficiency of the production systems is improved.
For example, the two-dimensional code corresponding to the lot number or the lot number uploaded or entered into the system can be used to detect whether the group number (type) of the wafer and the number of the wafers loaded on the corresponding wafer carrier are correct or not, so as to avoid errors caused by manual or mechanical loading; or, the wafer carrier can be guided to be placed at the designated position in the stocking area according to the two-dimensional code corresponding to the batch number or the batch number uploaded or recorded into the system.
In summary, the production dispatching is performed in a preposed mode to form pre-dispatching, production information two-dimensional coding platforms such as wafer carriers, tools and machines are matched, the complexity and the particularity of production batch operation are combined to form a complete set of complete intelligent batch scheme system, and the problems that in the existing batch operation, dispatching delay, manual experience is inconsistent, repeated input, information is recorded and transmitted by paper books, manual operation is frequent, misoperation is difficult and risks are caused are solved, the scientificity and the effectiveness of a factory batch production system are improved, and the humanized effect of factory worker workflow is improved.
Fig. 3 is a block diagram of an electronic device according to an embodiment of the present invention. As shown, the apparatus 300 includes:
an obtaining module 301, configured to obtain a current operating status of one or more machines to determine an operable machine; obtaining wafer storage information of a wafer group of wafers to be processed and wafer rated storage quantity of one or more wafer carriers of each operable machine table so as to calculate and obtain batch numbers corresponding to the wafer carriers, wherein each batch number corresponds to at least one wafer group;
a processing module 302, configured to load the wafers of the wafer group corresponding to each lot number into the wafer carrier of the corresponding lot number; the wafer carrier with the loaded wafers waits for processing by the operable machine.
It should be noted that, because the contents of information interaction, execution process, and the like between the modules/units of the apparatus are based on the same concept as the method embodiment described in the present application, the technical effect brought by the contents is the same as the method embodiment of the present application, and specific contents may refer to the description in the foregoing method embodiment of the present application, and are not described again here.
It should be further noted that the division of the modules of the above apparatus is only a logical division, and the actual implementation may be wholly or partially integrated into one physical entity, or may be physically separated. And these units can all be realized in the form of software invoked by a processing element; or can be implemented in the form of hardware; and part of the modules can be realized in the form of calling software by the processing element, and part of the modules can be realized in the form of hardware. For example, the processing module 302 may be a separate processing element, or may be integrated into a chip of the apparatus, or may be stored in a memory of the apparatus in the form of program code, and a processing element of the apparatus calls and executes the functions of the processing module 302. Other modules are implemented similarly. In addition, all or part of the modules can be integrated together or can be independently realized. The processing element described herein may be an integrated circuit having signal processing capabilities. In implementation, each step of the above method or each module above may be implemented by an integrated logic circuit of hardware in a processor element or an instruction in the form of software.
For example, the above modules may be one or more integrated circuits configured to implement the above methods, such as: one or more Application Specific Integrated Circuits (ASICs), or one or more microprocessors (DSPs), or one or more Field Programmable Gate Arrays (FPGAs), among others. For another example, when one of the above modules is implemented in the form of a Processing element scheduler code, the Processing element may be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. For another example, these modules may be integrated together and implemented in the form of a system-on-a-chip (SOC).
Fig. 4 is a schematic structural diagram of a computer device according to an embodiment of the present invention. As shown, the computer device 400 includes: a memory 401, a processor 402, and a communicator 403; the memory 401 is used for storing computer instructions; the processor 402 executes computer instructions to implement the method described in fig. 2. The communicator 403 communicates with an external device.
For example, the external device may be a server in the background of the system to store the calculated number; or, the mobile terminal is used manually, such as a mobile phone or an industrial PAD, to receive the two-dimensional code to execute batch or transportation work; or, for the smart robot, the batch or transport work is performed by receiving the two-dimensional code or the batch number.
In some embodiments, the number of the memories 401 in the computer device 400 may be one or more, the number of the processors 402 may be one or more, the number of the communicators 403 may be one or more, and fig. 4 is an example.
In an embodiment of the present application, the processor 402 in the computer device 400 loads one or more instructions corresponding to the processes of the application program into the memory 401 according to the steps described in fig. 2, and the processor 302 executes the application program stored in the memory 401, thereby facilitating the implementation of the method described in fig. 2.
The Memory 401 may include a Random Access Memory (RAM), and may also include a non-volatile Memory (non-volatile Memory), such as at least one disk Memory. The memory 401 stores an operating system and operating instructions, executable modules or data structures, or a subset thereof, or an expanded set thereof, wherein the operating instructions may include various operating instructions for implementing various operations. The operating system may include various system programs for implementing various basic services and for handling hardware-based tasks.
The Processor 402 may be a general-purpose Processor, and includes a Central Processing Unit (CPU), a Network Processor (NP), and the like; the Integrated Circuit may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, a discrete Gate or transistor logic device, or a discrete hardware component.
The communicator 403 is used to implement communication connection between the database access device and other devices (such as a client, a read-write library, and a read-only library). The communicator 303 may include one or more sets of modules for different communication modes, for example, a CAN communication module communicatively connected to a CAN bus. The communication connection may be one or more wired/wireless communication means and combinations thereof. The communication mode comprises the following steps: any one or more of the internet, CAN, intranet, wide Area Network (WAN), local Area Network (LAN), wireless network, digital Subscriber Line (DSL) network, frame relay network, asynchronous Transfer Mode (ATM) network, virtual Private Network (VPN), and/or any other suitable communication network. For example: any one or a plurality of combinations of WIFI, bluetooth, NFC, GPRS, GSM and Ethernet.
In some specific applications, the various components of the computer device 400 are coupled together by a bus system that may include a power bus, a control bus, a status signal bus, etc., in addition to a data bus. But for clarity of illustration the various buses have been referred to as a bus system in figure 4.
Fig. 5 is a schematic diagram of a pre-dispatcher system for wafer fabrication according to an embodiment of the present invention. As shown, the wafer fabrication pre-dispatcher 500 includes: as shown in fig. 4, the computer apparatus 510, one or more tools 520, each of which has at least one wafer carrier.
In some embodiments, the number of the tools 520 may be one or more, and is only one in fig. 5.
The computer 510 may be in communication connection with each of the machines 520 by one or more wired/wireless communication methods, or may be in electrical connection.
In particular, the computer device 510 is used to facilitate the implementation of the method as described in FIG. 2.
In summary, the method, the electronic device, the computer apparatus and the system for pre-dispatching in wafer manufacturing provided by the present application determine an operable machine by obtaining a current operating status of one or more machines; obtaining wafer storage information of a wafer group of wafers to be processed and wafer rated storage quantity of one or more wafer carriers of each operable machine table so as to calculate and obtain batch numbers corresponding to the wafer carriers, wherein each batch number corresponds to at least one wafer group; loading the wafers of the wafer group corresponding to each batch number into the wafer carrier of the corresponding batch number; the wafer carrier with the loaded wafers waits for processing by the operable machine.
The application effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the present invention. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present application.
Claims (9)
1. A method of pre-dispatching for wafer manufacturing, the method comprising:
acquiring the current operating condition of one or more machines to determine an operable machine;
acquiring wafer storage information of a wafer group of wafers to be processed and a wafer rated storage amount of one or more wafer carriers of each operable machine, so as to calculate a lot number corresponding to each wafer carrier, wherein each lot number corresponds to at least one wafer group and comprises any one or more of the following combinations: 1) When the wafer storage amount of one wafer group is larger than the rated wafer storage amount of the wafer carrier, the wafers of the wafer group are batched, and each batch number corresponds to one wafer group; 2) When the wafer storage amount of one wafer group is equal to the rated wafer storage amount of the wafer carrier, the wafers of the wafer group are not batched, and each batch number corresponds to one wafer group; 3) When the wafer storage amount of one wafer group is smaller than the wafer rated storage amount of the wafer carrier, the wafers of the wafer group are not batched, and the wafers in a plurality of wafer groups need to be combined to meet the wafer rated storage amount of the wafer carrier, wherein each batch number corresponds to two or more wafer groups;
loading the wafers of the wafer group corresponding to each batch number into the wafer carrier of the corresponding batch number;
the wafer carrier with the loaded wafers waits for processing by the operable machine.
2. The method of claim 1, wherein obtaining current operating conditions of one or more tools to determine operable tools comprises:
the machine with the current operation state being idle is an operable machine; and/or the obtained machine with the distance operation ending time less than or equal to the preset time is an operable machine.
3. The method of claim 1, wherein the lot number comprises a name of a runnable machine, a name of a wafer group, a name of a wafer carrier, a name of a wafer product, a date of delivery of the wafer product.
4. The method as claimed in claim 1 or 3, wherein the loading the wafers of the group of wafers corresponding to each lot number into the wafer carrier of the corresponding lot number comprises:
and printing the batch numbers into two-dimensional codes, and scanning the two-dimensional codes to load the wafers of the wafer group corresponding to each batch number into the wafer carriers corresponding to the batch numbers according to the batch numbers.
5. The method as claimed in claim 4, wherein after the wafers of the wafer group corresponding to each lot number are loaded into the wafer carriers of the corresponding lot numbers, before the wafer carriers with the loaded wafers wait for the processing of the operable machine, the method comprises:
and marking the two-dimensional code on the corresponding wafer carrier, so as to facilitate the tracking of the wafer carrier in the process flow.
6. A method as claimed in claim 1 or 3, wherein the wafer carrier with loaded wafers awaits processing by the operable tool, comprising: and placing the wafer carrier loaded with the wafers to a stock area of a corresponding operable machine according to the batch number, and waiting for processing of the operable machine.
7. An electronic device, the device comprising:
the system comprises an acquisition module, a processing module and a control module, wherein the acquisition module is used for acquiring the current operating condition of one or more machines to determine the operable machines; acquiring wafer storage information of a wafer group of wafers to be processed and wafer rated storage quantity of one or more wafer carriers of each operable machine table, so as to calculate and obtain a batch number corresponding to each wafer carrier, wherein each batch number corresponds to at least one wafer group, and the method comprises any one or more of the following combinations: 1) When the wafer storage amount of one wafer group is larger than the rated wafer storage amount of the wafer carrier, the wafers of the wafer group are batched, and each batch number corresponds to one wafer group; 2) When the wafer storage amount of one wafer group is equal to the rated wafer storage amount of the wafer carrier, the wafers of the wafer group are not batched, and each batch number corresponds to one wafer group; 3) When the wafer storage amount of one wafer group is smaller than the wafer rated storage amount of the wafer carrier, the wafers of the wafer group are not batched, and the wafers in a plurality of wafer groups need to be combined to meet the wafer rated storage amount of the wafer carrier, wherein each batch number corresponds to two or more wafer groups;
the processing module is used for loading the wafers of the wafer group corresponding to each batch number into the wafer carrier of the corresponding batch number; the wafer carrier with the loaded wafers waits for processing by the operable machine.
8. A computer device, characterized in that the device comprises: a memory, a processor, and a communicator; the memory is to store computer instructions; the processor executing computer instructions assists in implementing the method of any one of claims 1 to 6; the communicator is used for communicating with the outside.
9. A system for pre-dispatching for wafer manufacturing, the system comprising: the computer apparatus of claim 8, one or more stations; each machine table corresponds to at least one wafer carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910686400.5A CN112309887B (en) | 2019-07-29 | 2019-07-29 | Pre-dispatching method for wafer manufacturing, electronic device, computer equipment and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910686400.5A CN112309887B (en) | 2019-07-29 | 2019-07-29 | Pre-dispatching method for wafer manufacturing, electronic device, computer equipment and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112309887A CN112309887A (en) | 2021-02-02 |
| CN112309887B true CN112309887B (en) | 2023-03-21 |
Family
ID=74330011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910686400.5A Active CN112309887B (en) | 2019-07-29 | 2019-07-29 | Pre-dispatching method for wafer manufacturing, electronic device, computer equipment and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112309887B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109001961A (en) * | 2018-08-17 | 2018-12-14 | 上海哥瑞利软件有限公司 | A kind of developing apparatus and remodeling method of view-based access control model technological transformation |
| CN113762797B (en) * | 2021-09-14 | 2023-10-24 | 长鑫存储技术有限公司 | Wafer preparation control method and device |
| CN114843207B (en) * | 2022-04-14 | 2023-02-28 | 江苏京创先进电子科技有限公司 | Ring removing method, system and equipment |
| CN117917652B (en) * | 2024-03-20 | 2024-05-28 | 深圳市昇维旭技术有限公司 | Wafer cross-factory wafer flow method and device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196439A (en) * | 2000-01-13 | 2001-07-19 | Nec Corp | Method and system for manufacturing and managing of product |
| JP2008250826A (en) * | 2007-03-30 | 2008-10-16 | Mizuho Information & Research Institute Inc | Process management system, method, and program |
| CN104977903A (en) * | 2014-04-03 | 2015-10-14 | 中芯国际集成电路制造(上海)有限公司 | Real time dispatch system-based method and system for wafer batch dispatch under machine set |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3955116B2 (en) * | 1996-10-30 | 2007-08-08 | ユー・エム・シー・ジャパン株式会社 | Semiconductor manufacturing apparatus scheduling method |
| TW424259B (en) * | 1999-06-02 | 2001-03-01 | Taiwan Semiconductor Mfg | Dynamic dispatching method for solving problems of nonlinear delivery |
| US6584369B2 (en) * | 2000-02-02 | 2003-06-24 | Texas Instruments Incorporated | Method and system for dispatching semiconductor lots to manufacturing equipment for fabrication |
| JP3847568B2 (en) * | 2001-03-01 | 2006-11-22 | ファブソリューション株式会社 | Semiconductor device manufacturing method |
| US6580967B2 (en) * | 2001-06-26 | 2003-06-17 | Applied Materials, Inc. | Method for providing distributed material management and flow control in an integrated circuit factory |
| US6684123B2 (en) * | 2001-06-26 | 2004-01-27 | Applied Materials, Inc. | Method and apparatus for accessing a multiple chamber semiconductor wafer processing system |
| US7177716B2 (en) * | 2004-02-28 | 2007-02-13 | Applied Materials, Inc. | Methods and apparatus for material control system interface |
| US7206652B2 (en) * | 2004-08-20 | 2007-04-17 | International Business Machines Corporation | Method and system for intelligent automated reticle management |
| TW200638171A (en) * | 2005-04-26 | 2006-11-01 | Powerchip Semiconductor Corp | Real-time management systems and methods for manufacture management and yield rate analysis integration |
| CN101459098B (en) * | 2007-12-14 | 2012-07-04 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method and device for wafer optimized scheduling |
| US9748088B2 (en) * | 2013-12-09 | 2017-08-29 | Globalfoundries Inc. | Method, storage medium and system for controlling the processing of lots of workpieces |
| CN105097624B (en) * | 2014-05-22 | 2018-10-23 | 中芯国际集成电路制造(上海)有限公司 | The method and device of wafer automatic batching and transmission |
| CN105302078B (en) * | 2014-06-04 | 2018-11-16 | 中芯国际集成电路制造(上海)有限公司 | The control system and method for boiler tube board operation in a kind of semiconductor fabrication process |
| CN105447209A (en) * | 2014-06-04 | 2016-03-30 | 中芯国际集成电路制造(上海)有限公司 | Wafer batch flow card generation method and system |
| TWI506702B (en) * | 2014-07-28 | 2015-11-01 | Powerchip Technology Corp | Dispatch control method for furnace process |
| CN105446281B (en) * | 2014-09-01 | 2019-04-26 | 中芯国际集成电路制造(上海)有限公司 | Processing chamber sends pallet piling up method and system |
| CN107527077B (en) * | 2017-07-21 | 2020-09-01 | 华润微电子（重庆）有限公司 | Semiconductor auxiliary production method and system |
| CN109494178B (en) * | 2018-11-16 | 2022-04-12 | 上海华力微电子有限公司 | Dispatching method of detection machine |
-
2019
- 2019-07-29 CN CN201910686400.5A patent/CN112309887B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196439A (en) * | 2000-01-13 | 2001-07-19 | Nec Corp | Method and system for manufacturing and managing of product |
| JP2008250826A (en) * | 2007-03-30 | 2008-10-16 | Mizuho Information & Research Institute Inc | Process management system, method, and program |
| CN104977903A (en) * | 2014-04-03 | 2015-10-14 | 中芯国际集成电路制造(上海)有限公司 | Real time dispatch system-based method and system for wafer batch dispatch under machine set |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112309887A (en) | 2021-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112309887B (en) | Pre-dispatching method for wafer manufacturing, electronic device, computer equipment and system | |
| TWI301567B (en) | Method and system for automating issue resolution in manufacturing execution and material control systems | |
| EP0679972A1 (en) | An apparatus and method for controlling and scheduling processing machines | |
| US6434440B1 (en) | Production estimate management system | |
| US7151980B2 (en) | Transport management system and method thereof | |
| KR100303322B1 (en) | unity automatization system and method for the semi-conductor line management | |
| Wang et al. | Development of a capacity analysis and planning simulation model for semiconductor fabrication | |
| US20060095153A1 (en) | Wafer carrier transport management method and system thereof | |
| TW523800B (en) | Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control | |
| CN112185831B (en) | Sampling defect detection method, apparatus and system thereof | |
| US11042148B2 (en) | System and method for scheduling semiconductor lot to fabrication tool | |
| US20110218660A1 (en) | Method and apparatus for automated fab control | |
| CN116092961A (en) | Detection method and detection system for automatically detecting incoming wafers | |
| CN112185830B (en) | Sampling defect detection method, device, equipment and system | |
| US7613535B2 (en) | Independent, self-contained, risk isolated, sectional CIM design for extremely large scale factory operation | |
| CN110850819A (en) | Single-arm combination equipment scheduling method, system, mobile terminal and storage medium | |
| CN114548708B (en) | Empty wafer box management method and device, computer equipment and storage medium | |
| CN1920717A (en) | Method for sharing semiconductive machine and manufacture system using same | |
| CN116644219A (en) | Method and device for detecting and processing goods delivery abnormality | |
| CN112365181A (en) | Qtime WIP control method of dynamic process flow | |
| Kao et al. | Near optimal furnace tool allocation with batching and waiting time constraints | |
| US7426421B2 (en) | Methods and systems for transport system (TS) integration | |
| Lee et al. | Multi-objective production scheduling of probe process in semiconductor manufacturing | |
| TWI841084B (en) | Task scheduling method and semiconductor process equipment | |
| CN114300391B (en) | Wafer test method and device, electronic equipment and storage medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |