CN112297257B - Cutting unit position detection method and cutting device - Google Patents

Cutting unit position detection method and cutting device Download PDF

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Publication number
CN112297257B
CN112297257B CN202010708611.7A CN202010708611A CN112297257B CN 112297257 B CN112297257 B CN 112297257B CN 202010708611 A CN202010708611 A CN 202010708611A CN 112297257 B CN112297257 B CN 112297257B
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Prior art keywords
cutting
unit
cutting tool
height position
tool
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CN112297257A (en
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汤泽治信
佐藤雅史
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Disco Corp
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Disco Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B23Q17/0904—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool before or after machining
    • B23Q17/0919—Arrangements for measuring or adjusting cutting-tool geometry in presetting devices
    • B23Q17/0923—Tool length
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/002—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders
    • B23Q17/003—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring the holding action of work or tool holders by measuring a position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/10—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting speed or number of revolutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • B23Q17/2283—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work for adjusting the distance between coaxially rotating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/248—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves using special electromagnetic means or methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/026—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade carried by a movable arm, e.g. pivoted
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Provided are a cutting unit position detection method and a cutting device, and an installation process is properly performed. The cutting device comprises: a cutting unit; a cutting edge position detecting unit for detecting the height position of the lower end of the cutting edge of the cutting tool; and a control unit having a relation registering unit that registers a temporal change in a light receiving amount of light emitted from the light emitting unit and received by the light receiving unit, the detection method including: a relationship registration step of observing a light receiving amount that changes with time according to thermal expansion of the cutting tool, and registering a relationship between a time from the start of the observation and the change in the light receiving amount in a relationship registration section; and a height position detection step of obtaining a reference height position of the cutting unit when the height of the lower end of the cutting edge of the cutting tool after the workpiece is processed becomes a predetermined height position, wherein the height position detection step corrects the obtained reference height position of the cutting unit based on the relationship registered in the relationship registration unit by the relationship registration step.

Description

Cutting unit position detection method and cutting device
Technical Field
The present invention relates to a position detection method of a cutting unit and a cutting device, in which a height position of the cutting unit is detected when a lower end of a cutting edge of a cutting tool is positioned at a predetermined height position in a cutting device having the cutting unit mounted with the cutting tool for cutting a workpiece, and the cutting device is capable of performing the position detection method of the cutting unit.
Background
The device chip on which the semiconductor device is mounted is formed of a semiconductor wafer, a package substrate, a ceramic substrate, a glass substrate, or the like. A plurality of intersecting lines are set on the front surface of a semiconductor wafer or the like, and semiconductor devices are formed in regions defined by the lines, and then the semiconductor wafer or the like is divided along the lines, whereby individual device chips can be formed.
For dividing a semiconductor wafer or the like, for example, a cutting device having a cutting unit to which an annular cutting tool is attached is used. The cutting device rotates a cutting tool in a plane perpendicular to the front surface of a workpiece such as a semiconductor wafer, positions the lower end of the cutting edge of the rotating cutting tool at a predetermined height position, and performs machining feeding on the workpiece in a direction along a predetermined dividing line, thereby performing cutting machining on the workpiece.
When cutting of a workpiece is repeatedly performed in a cutting device, an annular cutting tool is gradually consumed, and the diameter of the cutting tool gradually decreases. Then, the height of the lower end of the cutting edge of the cutting tool gradually shifts from a predetermined height position, and the cutting depth changes. Therefore, a setting step of detecting the height position of the cutting unit when the lower end of the cutting edge of the cutting tool is positioned at a predetermined height is performed. In the setting step, a blade edge position detecting means is used (for example, refer to patent document 1).
The blade edge position detecting means has a groove-shaped cutter entry portion which opens upward and forward and backward in the main body. One side wall of the tool entrance part is provided with a light-emitting window of the light-emitting part, and the other side wall is provided with a light-receiving window of the light-receiving part. The light emitting window and the light receiving window are disposed at substantially the same height position.
In the setting step, the cutting means is lowered in a state in which light is emitted from the light emitting window of the light emitting section toward the light receiving window of the light receiving section, and the cutting edge of the cutting tool is brought into the tool entrance section. Then, a part of the light is shielded by the cutting tool, and therefore the light receiving amount of the light received by the light receiving portion is reduced. The height of the cutting unit is detected when the light receiving amount reaches a reference light receiving amount, that is, when the lower end of the cutting edge of the cutting tool is positioned at a predetermined height.
Patent document 1: japanese patent laid-open No. 2001-298001
When the cutting tool is rotated at a high speed, the diameter of the cutting tool slightly increases due to centrifugal force generated in association with the rotation. Therefore, in the setting step, for example, it is considered to rotate the cutting tool at the same speed as when the workpiece is cut. In this case, the setting step is performed in a state in which the same centrifugal force as in the cutting of the workpiece is applied to the cutting tool.
In cutting a workpiece, cutting water is sprayed to a cutting tool and the workpiece in order to remove processing heat and processing chips. Therefore, the temperature of the cutting tool for cutting the workpiece is kept constant. On the other hand, in the setting step, cutting water is not supplied to the cutting tool so as not to interfere with the detection of the edge of the cutting tool. In this case, during the installation process, the temperature of the cutting tool gradually increases due to frictional heat between the rotating cutting tool and the air, and thermal expansion of the cutting tool occurs.
In recent years, the rotational speed of the cutting tool has been increased to a rotational speed of about 80 to 100krpm in order to increase the cutting speed. In addition, it is also desirable to rotate the cutting tool at the same speed when the setting step is performed. However, when the rotational speed of the cutting tool is increased, frictional heat between the air and the cutting tool increases, and the temperature of the cutting tool is higher than before, so that thermal expansion of the cutting tool cannot be ignored. The thermal expansion amount is not constant, and the thermal expansion increases as the time required for the setting step increases.
In this way, the diameter of the cutting tool when the setting step is performed becomes larger than the diameter when the workpiece is cut due to the influence of thermal expansion. When the cutting tool is significantly thermally expanded during the setting process, the height position of the cutting unit detected during the setting process is not identical to the height position that should be detected. Therefore, when the cutting means is positioned at the cutting reference height based on the reference height detected in the setting step to cut the workpiece, the depth of penetration of the cutting tool becomes shallow, and the workpiece cannot be cut properly.
Disclosure of Invention
The present invention has been made in view of the above-described problems, and an object thereof is to provide a position detection method and a cutting device for a cutting unit capable of properly performing an installation process.
According to one embodiment of the present invention, there is provided a position detection method of a cutting unit, the method using a cutting device having: a chuck table for holding a workpiece by a holding surface; a cutting unit having a main shaft extending in a direction parallel to the holding surface and a cutting tool attached to a front end of the main shaft, the cutting unit cutting the workpiece with the cutting tool rotating around the main shaft while supplying cutting water to the workpiece and the cutting tool held by the chuck table; an plunge feeding unit for plunging the cutting unit in a plunge feeding direction perpendicular to the holding surface; a cutting edge position detection unit for detecting the height position of the lower end of the cutting edge of the cutting tool; and a control means for controlling each component, the cutting edge position detection means having a tool entrance portion into which the cutting tool enters, and a light emitting portion and a light receiving portion facing each other with the tool entrance portion interposed therebetween, the control means having a relationship registration portion capable of registering a change with time in the amount of light received by the light receiving portion from the light emitting portion, the position detection means comprising: a cutting tool positioning step of positioning the cutting tool at a height at which the light emitted from the light emitting section and received by the light receiving section is shielded by a predetermined amount by the cutter entry section of the cutting edge position detecting section by the infeed feeding section; a relationship registration step of observing the light receiving amount that changes with time according to thermal expansion of the rotating cutting tool in a state where the height of the cutting unit in the cutting feed direction is maintained after the cutting tool positioning step, and registering a relationship between a time from the start of the observation and the amount of change in the light receiving amount in the relationship registration section; and a height position detection step of, after the relation registration step, causing the cutting tool after the workpiece has been processed to enter the tool entry portion of the cutting edge position detection means while rotating about the main axis, positioning the cutting tool at a height at which the light emitted from the light emitting portion and received by the light receiving portion is shielded by the predetermined amount, and obtaining a height position of the cutting means when the height of the lower end of the cutting edge of the cutting tool becomes a predetermined height position, as a reference height position, and in the height position detection step, correcting the obtained reference height position of the cutting means based on the relation registered in the relation registration step.
Preferably, in the relation registration step, the cutting tool is rotated at a rotation speed corresponding to the rotation speed of the cutting tool in the height position detection step.
In addition, according to another aspect of the present invention, there is provided a cutting device including: a chuck table for holding a workpiece by a holding surface; a cutting unit having a main shaft extending in a direction parallel to the holding surface and a cutting tool attached to a front end of the main shaft, the cutting unit cutting the workpiece with the cutting tool rotating around the main shaft while supplying cutting water to the workpiece and the cutting tool held by the chuck table; an plunge feeding unit for plunging the cutting unit in a plunge feeding direction perpendicular to the holding surface; a cutting edge position detection unit for detecting a height position of the cutting unit when a lower end of the cutting edge of the cutting tool is at a predetermined height position as a reference height position; and a control unit for controlling each component, wherein the blade edge position detection unit comprises: a tool entry portion into which the cutting tool enters; a light emitting portion and a light receiving portion facing each other with the tool entrance portion interposed therebetween; and a photoelectric conversion unit that outputs an electric signal having a voltage value corresponding to the light receiving amount of the light received by the light receiving unit, wherein the control unit includes: a relationship registration unit capable of registering a temporal change in the amount of light received by the light receiving unit, which is emitted from the light emitting unit, as a temporal change in the voltage value of the electric signal output from the photoelectric conversion unit; a reference voltage value registration unit that registers, as a reference voltage value, a voltage value of an electrical signal output from the photoelectric conversion unit when light emitted from the light emitting unit is received by the light receiving unit when a lower end of a cutting edge of the cutting tool is positioned at the predetermined height position; a voltage value comparing unit that detects that the lower end of the cutting edge of the cutting tool is positioned at the predetermined height position when the voltage value of the electric signal output from the photoelectric conversion unit matches the reference voltage value registered in the reference voltage value registration unit; a cutting unit height detection unit connected to the voltage value comparison unit, the cutting unit height detection unit detecting a height of the cutting unit as the reference height position when the voltage value comparison unit detects that the lower end of the cutting edge of the cutting tool is positioned at the predetermined height position; and a correction unit that corrects the reference height position of the cutting tool detected by the cutting tool height detection unit, wherein a relationship between a voltage value of the electric signal output by the photoelectric conversion unit, which changes with time due to thermal expansion of the rotating cutting tool, and time is registered in the relationship registration unit, wherein the correction unit determines a correction amount of the reference height position of the cutting tool based on the relationship registered in the relationship registration unit, with reference to a time when the voltage value comparison unit detects that the lower end of the cutting edge of the cutting tool is positioned at the predetermined height position.
In the position detection method and the cutting device of the cutting unit according to one embodiment of the present invention, the trend of time variation of the light receiving amount of the light received by the light receiving portion of the cutting edge position detection unit according to the thermal expansion of the cutting tool is registered in the relation registration portion. More specifically, the relationship between time and the amount of change in the light receiving amount is registered in the relationship registration unit.
When the cutting edge position detection means obtains the height position of the cutting means when the lower end of the cutting edge of the cutting tool has reached the predetermined height position, the obtained reference height position of the cutting means is corrected using the relationship. More specifically, the reference height position of the cutting element obtained in a state in which the cutting tool thermally expands is corrected by a value corresponding to the expansion amount of the cutting tool, and the reference height position of the cutting element to be obtained is calculated.
The calculated reference height position of the cutting means to be obtained is the height position of the cutting means when the lower end of the cutting edge of the cutting tool becomes the predetermined height position without thermal expansion of the cutting tool. Further, by positioning the cutting means at the height calculated from the corrected reference height position, the workpiece can be cut appropriately.
Therefore, according to one embodiment of the present invention, a position detection method and a cutting device for a cutting unit capable of properly performing an installation process are provided.
Drawings
Fig. 1 is a perspective view schematically showing a cutting device.
Fig. 2 (a) is a perspective view schematically showing the edge position detecting means, and fig. 2 (B) is a structural view schematically showing the cutting means, the edge position detecting means, and the control means.
Fig. 3 (a) is a graph schematically showing a relationship between a voltage value of an electric signal corresponding to a light receiving amount of light, which varies due to the cutting tool whose diameter varies due to thermal expansion, and time when the cutting tool is caused to enter the tool entrance portion, and fig. 3 (B) is a graph schematically showing a relationship between a voltage value of an electric signal corresponding to a variation of the light receiving amount of light, which varies due to time.
Fig. 4 is a flowchart schematically showing the flow of each step of the position detection method of the cutting unit.
Description of the reference numerals
2: a cutting device; 4: a device base; 6: an X-axis movable workbench; 8: a chuck table; 8a: a holding surface; 10: a clamp; 12. 24, 30: a guide rail; 14. 28, 34: a ball screw; 16. 28a, 36: a pulse motor; 18: a cutting unit; 18a: a cutting tool; 18b: the lower end of the cutting tip; 18c: a main shaft; 18d: a cutting water supply nozzle; 20: a water drainage path; 22: a support structure; 26. 32: a moving plate; 38: a photographing unit (camera); 40: a blade edge position detection unit; 42: a control unit; 44: a main body; 46: a cutter entry portion; 48: a cover; 50: a light emitting section; 50a: a light source; 50b: a light emitting window; 52: a light receiving section; 52a: a photoelectric conversion section; 52b: a light receiving window; 54: a voltage value comparison unit; 56: a reference voltage value registration unit; 58: a cutting unit height detection section; 60: a correction unit; 62: a relationship registration unit; 64: a cutting unit height registration section; 66: time variation of the voltage value; 68: a reference voltage value; 70. 72: relationship.
Detailed Description
An embodiment of the present invention will be described with reference to the drawings. First, a cutting device for performing the position detection method of the cutting unit according to the present embodiment will be described with reference to fig. 1. Fig. 1 shows a cutting device 2 for cutting a workpiece such as a substantially disk-shaped substrate made of a material such as silicon, silicon carbide (SiC), gallium arsenide (GaAs), or other semiconductors, or a material such as sapphire, glass, or quartz.
A plurality of devices such as ICs (Integrated Circuit, integrated circuits) are formed on the front surface of the workpiece. Finally, the workpiece is divided for each device, thereby forming individual device chips. For example, the workpiece is cut in a state of being stuck to a belt stretched by an annular frame. When the workpiece is cut appropriately, the lower end of the cutting edge of the cutting tool described later reaches the belt.
As shown in fig. 1, the cutting device 2 includes a device base 4 for supporting each component. An X-axis moving table 6, an X-axis moving mechanism for moving the X-axis moving table 6 in the X-axis direction (machining feed direction), and a drain 20 covering the X-axis moving mechanism are provided at the upper center of the device base 4. The X-axis moving mechanism has a pair of X-axis guide rails 12 parallel to the X-axis direction, and the X-axis moving table 6 is slidably attached to the X-axis guide rails 12.
A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 6, and an X-axis ball screw 14 parallel to the X-axis guide rail 12 is screwed into the nut portion. An X-axis pulse motor 16 is connected to one end of the X-axis ball screw 14. When the X-axis ball screw 14 is rotated by the X-axis pulse motor 16, the X-axis moving table 6 moves along the X-axis guide rail 12 in the X-axis direction.
The X-axis moving table 6 is provided with a chuck table 8 for sucking and holding the workpiece. The chuck table 8 is coupled to a rotation driving source (not shown) such as a motor, and is rotatable about a rotation axis perpendicular to the upper surface of the chuck table 8. The chuck table 8 is fed in the X-axis direction by the X-axis moving mechanism.
The front surface (upper surface) of the chuck table 8 serves as a holding surface 8a for sucking and holding the workpiece. The holding surface 8a is connected to a suction source (not shown) via a flow path (not shown) formed in the chuck table 8. A jig 10 for fixing an annular frame holding the workpiece with a belt is disposed around the holding surface 8a.
A support structure 22 for supporting the two cutting units 18 for cutting the workpiece is disposed on the upper surface of the device base 4 so as to span the X-axis moving mechanism. An indexing unit that moves the two cutting units 18 in the Y-axis direction (indexing direction) and an plunge feeding unit that moves in the Z-axis direction (plunge feeding direction) are provided on the upper portion of the front surface of the support structure 22.
A pair of Y-axis guide rails 24 parallel to the Y-axis direction are provided on the front surface of the support structure 22. Two Y-axis moving plates 26 respectively corresponding to the cutting units 18 are slidably mounted on the Y-axis guide rail 24. A nut portion (not shown) is provided on the rear surface side (rear surface side) of each Y-axis moving plate 26, and a Y-axis ball screw 28 parallel to the Y-axis guide rail 24 is screwed into the nut portion.
A Y-axis pulse motor 28a is connected to one end of the Y-axis ball screw 28. When the Y-axis ball screw 28 is rotated by the Y-axis pulse motor 28a, the corresponding Y-axis moving plate 26 moves in the Y-axis direction along the Y-axis guide rail 24. That is, the Y-axis guide rail 24, the Y-axis moving plate 26, the Y-axis ball screw 28, and the Y-axis pulse motor 28a constitute an indexing unit.
Further, a pair of Z-axis guide rails 30 parallel to the Z-axis direction are provided on the front face (front face) of each Y-axis moving plate 26. The Z-axis moving plate 32 is slidably mounted on each Z-axis guide rail 30. A nut portion (not shown) is provided on the rear surface side (rear surface side) of the Z-axis moving plate 32, and a Z-axis ball screw 34 parallel to the Z-axis guide rail 30 is screwed into the nut portion. A Z-axis pulse motor 36 is connected to one end of the Z-axis ball screw 34.
When the Z-axis ball screw 34 is rotated by the Z-axis pulse motor 36, the Z-axis moving plate 32 moves along the Z-axis guide rail 30 in the Z-axis direction (in-feed direction). Namely, the Z-axis guide rail 30, the Z-axis moving plate 32, the Z-axis ball screw 34, and the Z-axis pulse motor 36 constitute an infeed unit.
A cutting unit 18 for machining a workpiece and a photographing unit (camera) 38 capable of photographing the workpiece held by the chuck table 8 are fixed to the lower portions of the two Z-axis moving plates 32. When the Y-axis moving plate 26 is moved in the Y-axis direction, the cutting unit 18 and the imaging unit 38 are moved in the Y-axis direction (index feed direction), and when the Z-axis moving plate 32 is moved in the Z-axis direction, the cutting unit 18 and the imaging unit 38 are moved in the Z-axis direction (cut feed direction).
The cutting unit 18 has a spindle 18c (see fig. 2B) along the Y-axis direction, which is a direction parallel to the holding surface 8a of the chuck table 8, and an annular cutting tool 18a (see fig. 2B) attached to the front end of the spindle 18 c. A rotary drive source (not shown) such as a motor is connected to the other end side of the spindle 18c, and when the spindle 18c is rotated by operating the rotary drive source, the cutting tool 18a rotates around the spindle 18 c.
The cutting tool 18a has, for example, a disk-shaped base. A substantially circular mounting hole penetrating the base is provided in the center of the base, and the tip of the spindle 18c passes through the mounting hole when the cutting tool 18a is mounted on the cutting unit 18. An annular blade edge for cutting into the workpiece held by the chuck table 8 is fixed to the outer peripheral portion of the base. The tip is also referred to as a sharpener section. The blade tip has abrasive grains such as diamond and a bonding material for dispersing and fixing the abrasive grains. The bonding material is formed of, for example, metal or resin.
When cutting the workpiece, the imaging unit 38 detects a device, a pattern, or the like formed on the front surface of the workpiece in advance, and recognizes the position of the line to be divided set on the front surface of the workpiece. The chuck table 8 is rotated so that the extending direction of the line to be divided coincides with the machining feed direction of the cutting device 2. The machining feed unit and the indexing feed unit are operated to position the cutting tool 18a above the extension line of the line to divide the workpiece.
The cutting unit 18 has a cutting water supply nozzle 18d for supplying cutting water such as pure water to the workpiece held by the chuck table 8 and the cutting tool 18 a. When the cutting tool 18a is rotated about the spindle 18c and the cutting edge of the cutting tool 18a is brought into contact with the workpiece, the workpiece is cut. At this time, frictional heat is generated between the workpiece and the edge of the cutting tool 18 a. In addition, chips are generated from the workpiece and the cutting tool 18 a. When cutting water is supplied to the workpiece and the cutting tool 18a during cutting of the workpiece, frictional heat and machining chips can be removed.
When cutting a workpiece with the cutting tool 18a to divide the workpiece, the height of the cutting unit 18 is adjusted so that the lower end 18B of the cutting edge of the cutting tool 18a (see fig. 2B) is positioned below the rear surface (lower surface) of the workpiece. The plunge feeding unit including the Z-axis pulse motor 36 further includes, for example, a position recognition unit (not shown) that recognizes the position of the cutting unit 18 in the plunge feeding direction. The cutting device 2 positions the cutting unit 18 at a predetermined height position using a position recognition unit including a scale or the like.
Then, the cutting tool 18a is rotated, the machining feed unit is operated, the chuck table 8 is moved in the machining feed direction to perform machining feed, and the cutting tool 18a is cut into the workpiece to cut the workpiece. After cutting the workpiece along one line, the indexing unit is operated to index the cutting unit 18, and the chuck table 8 is again subjected to machining feed to cut the workpiece along the other line. In this way, the cutting device 2 continuously cuts the workpiece.
The cutting device 2 also has a control unit 42. The control unit 42 has a function of controlling the respective components of the cutting device 2, such as the cutting unit 18, the chuck table 8, the respective moving mechanisms, the imaging unit 38, and the edge position detecting unit 40 (described later). The function of the control unit 42 is implemented as software of a device control computer, for example.
That is, the control unit 42 is constituted by a computer including a processing device such as a CPU and a storage device such as a flash memory. The control unit 42 functions as a specific unit that cooperates with the processing device (hardware resource) by operating the processing device in accordance with software such as a program stored in the storage device.
When cutting of the workpiece using the cutting tool 18a is repeated, the cutting edge of the cutting tool 18a is gradually consumed, and the diameter of the cutting tool 18a gradually decreases. In this case, the height position of the lower end 18b of the cutting edge of the cutting tool 18a gradually rises when the cutting unit 18 is positioned at a height position suitable for cutting. Further, the workpiece cannot be cut sufficiently.
Therefore, after the workpiece is cut by the cutting tool 18a so that the lower end 18b of the cutting edge of the cutting tool 18a is positioned at a height lower than the rear surface (lower surface) of the workpiece, the setting step is periodically performed. In the setting step, the height position of the cutting unit 18 is detected when the height of the lower end 18b of the cutting edge of the cutting tool 18a is positioned below the rear surface (lower surface) of the workpiece as the height position suitable for cutting.
A cutting edge position detecting unit 40 is disposed near the cutting unit 18 of the cutting device 2. When the edge position detecting means 40 is used, a setting step for positioning the lower end 18b of the edge of the cutting tool 18a at a height position lower than the rear surface (lower surface) of the workpiece at the time of cutting the workpiece can be performed. Fig. 2 (a) is a perspective view schematically showing the edge position detection unit 40, and fig. 2 (B) is a schematic view schematically showing the cutting unit 18, the edge position detection unit 40, and the control unit 42.
The main body 44 of the blade edge position detecting unit 40 is provided with a groove-shaped cutter entry portion 46 that opens upward. When the cutting edge position detecting means 40 is used, the cutting tool 18a is positioned above the tool entry portion 46, and the cutting tool 18a is lowered by operating the infeed means, so that the cutting tool 18a enters the tool entry portion 46.
A light emitting portion 50 is provided on one side wall of the tool entrance portion 46, and a light receiving portion 52 is provided on the other side wall of the tool entrance portion 46 at a position facing the light emitting portion 50. That is, the light emitting portion 50 and the light receiving portion 52 face each other with the tool entrance portion 46 interposed therebetween. The light emitting unit 50 includes a light emitting window 50b and a light source 50a connected to the light emitting window 50b via an optical fiber or the like, and emits light from the light emitting window 50b when the light source 50a is operated. A dimmer (not shown) having a function of adjusting the amount of light emitted is connected to the light source 50 a.
The light receiving unit 52 includes a light receiving window 52b and a photoelectric conversion unit 52a connected to the light receiving window 52b via an optical fiber or the like. The light reaching the light receiving window 52b is received by the photoelectric conversion unit 52a, and an electric signal having a voltage value corresponding to the amount of light received is output from the photoelectric conversion unit 52a. The photoelectric conversion portion 52a is electrically connected to the control unit 42, and transmits the electric signal to the control unit 42.
The light emission window 50b and the light receiving window 52b are provided at substantially the same predetermined height position. The edge position detecting means 40 is provided with an openable and closable cover 48, and the cover 48 protects the light emitting portion 50 and the light receiving portion 52 when the edge position detecting means 40 is not in use. When the blade edge position detecting means 40 is used, the cover 48 is opened in advance to expose the main body 44.
The main body 44 is also provided with a plurality of fluid ejection nozzles facing the light emission window 50b or the light receiving window 52 b. When a fluid such as air or water is discharged from the fluid discharge nozzle, contamination adhering to the light emission window 50b or the light receiving window 52b can be removed.
When the tip position detecting means 40 detects the lower end 18b of the tip of the cutting tool 18a, the light source 50a is operated to emit light from the light emitting window 50b, the light is irradiated to the light receiving window 52b of the light receiving unit 52, and the light is received by the photoelectric conversion unit 52a connected to the light receiving window 52 b. The photoelectric conversion unit 52a includes a light receiving element such as a CMOS sensor or a CCD sensor, converts the light into an electric signal having a voltage value corresponding to the amount of the received light, and transmits the electric signal to the control unit 42.
When the cutting tool 18a is lowered toward the tool entrance 46, the light emitted from the light emission window 50b is gradually blocked by the cutting tool 18a, reaches the light receiving window 52b, and the light receiving amount of the light received by the photoelectric conversion portion 52a gradually decreases. Accordingly, the control unit 42 analyzes the electric signal output from the photoelectric conversion unit 52a, and thereby can detect the height position of the lower end 18b of the cutting edge of the cutting tool 18 a.
The light receiving amount of the light received by the reference height position detection photoelectric conversion unit 52a is a height position of the cutting unit 18 at which the light receiving amount of the reference where the lower end 18b of the blade edge reaches the predetermined height position can be confirmed. Then, based on the detected reference height position of the cutting unit 18, a height position suitable for cutting, at which the cutting unit 18 should be positioned when cutting the workpiece, is calculated.
The graph shown in fig. 3 (a) is a graph schematically showing an example of a time change in the voltage value of the electric signal transmitted from the photoelectric conversion portion 52a to the control unit 42 when the cutting edge of the cutting tool 18a is brought into the tool entrance portion 46. In fig. 3 (a), the voltage value corresponding to the light receiving amount in the initial state before the light receiving amount is reduced is set to 5V. The time variation 66 of the voltage value is schematically shown in fig. 3 (a). However, the voltage value is not limited thereto.
When the cutting edge of the cutting tool 18a enters the tool entrance portion 46 and the light reaches the cutting tool 18a, the light receiving amount decreases, and the voltage value decreases. And, eventually, the light is completely shielded by the cutting tool 18 a. In the example shown in fig. 3 (a), the voltage value corresponding to the light receiving amount when the light does not reach the light receiving window 52b due to the cutting tool 18a is set to 0V. However, the voltage value is not limited thereto.
The reference voltage value 68 is preset in the voltage value of the electric signal output from the photoelectric conversion portion 52 a. In the example shown in fig. 3 (a), the reference voltage value 68 is set to 3V. However, the reference voltage value 68 is not limited thereto.
In the setting step, the cutting unit 18 is gradually lowered, and the height position of the cutting unit 18 when the voltage value becomes the reference voltage value 68 is detected as the reference height position. Then, from the reference height position, a height position of the cutting unit 18 suitable for cutting is detected.
More specifically, the height position (predetermined height position) of the lower end of the cutting tool 18a when the voltage value becomes the reference voltage value 68 is a height position lower than the holding surface 8a of the chuck table 8 by a predetermined distance. When detecting the height position of the cutting unit 18 at the time when the voltage value becomes the reference voltage value 68 as the reference height position, the height position higher than the reference height position by a predetermined distance or more is registered in the control unit 42 as a height position suitable for cutting of the cutting unit 18. When cutting a workpiece, the cutting unit 18 is positioned at the height position suitable for cutting by operating the infeed unit, and the workpiece is cut.
In addition, such a setting step is preferably performed while rotating the cutting tool 18a about the spindle 18 c. For example, the rotation speed of the cutting tool 18a may be equal to the rotation speed of the cutting tool 18a when cutting the workpiece. This is because, when the cutting tool 18a is rotated at a high speed, centrifugal force acts on the cutting tool 18a to increase the diameter of the cutting tool 18 a. When the rotation speed of the cutting tool 18a is made uniform in the setting step and the cutting of the workpiece, the influence of the centrifugal force can be canceled.
In order to remove machining chips and frictional heat when cutting an object to be machined, as described above, cutting water is supplied from the cutting water supply nozzle 18d or the like to the cutting tool 18a and the object to be machined. On the other hand, when the cutting edge position detecting unit 40 is used, cutting water is not supplied to the cutting tool 18 a. This is because, when cutting water is supplied to the cutting tool 18a, the cutting water affects light traveling from the light emission window 50b of the light emission portion 50 to the light receiving window 52b of the light receiving portion 52, preventing detection of the height position of the lower end 18b of the cutting edge of the cutting tool 18 a.
When the setting step is performed on the cutting unit 18 having the cutting tool 18a consumed for machining the workpiece, it is effective to make the cutting tool 18a rotated for cutting the workpiece enter the tool entrance 46 while maintaining the rotation speed thereof. That is, the continuous supply of cutting water to the rotating cutting tool 18a is stopped. When the supply of cutting water to the cutting tool 18a is stopped, the temperature of the cutting tool 18a gradually rises due to frictional heat generated by friction of the cutting tool 18a with air.
When the temperature of the cutting tool 18a increases, thermal expansion occurs, and the diameter of the cutting tool 18a increases. The higher the rotational speed of the cutting tool 18a, the more pronounced this tendency. Therefore, even if the height of the cutting unit 18 in the cutting feed direction is maintained after the tip of the cutting tool 18a is brought into the tool entrance 46, the height position of the lower end 18b of the tip changes with time.
Fig. 3 (B) is a graph showing a case of a change with time in the diameter of the cutting tool 18a due to thermal expansion. The graph shown in fig. 3 (B) is a graph schematically showing the relationship between the time from the start of observation when the light receiving amount of the light received by the light receiving unit 52 is observed so as to be equal to the voltage value of the electric signal outputted from the photoelectric conversion unit 52a and the voltage value variation corresponding to the light receiving amount variation.
Fig. 3 (B) schematically shows a relationship 70 between the amount of change in the voltage value and time when the rotation speed of the cutting tool 18a is relatively large, and a relationship 72 between the amount of change in the voltage value and time when the rotation speed is relatively small. When the supply of cutting water to the cutting tool 18a is stopped, the temperature of the rotating cutting tool 18a gradually increases, and the amount of thermal expansion of the cutting tool 18a also gradually increases.
In addition, the temperature rise of the cutting tool 18a due to frictional heat varies according to the rotational speed of the cutting tool 18a, and there is a tendency that: the greater the rotational speed of the cutting tool 18a, the more likely the temperature of the cutting tool 18a increases. In addition, the diameter of the cutting tool 18a may vary depending on the time required before the setup process is completed.
For example, when a 2-inch diameter cutting tool rotated at a rotation speed of 30 rpm is rotated at a rotation speed of 80 rpm, thermal expansion of the cutting tool 18a of about 6 μm to 7 μm is confirmed.
In addition, a trend of temperature rise was observed when the cutting tool was rotated at a rotation speed of 80krpm while supplying cutting water, and then the supply of cutting water was stopped. The result of the observation was that the temperature of the cutting tool at about 27 ℃ before stopping the cutting water was about 31 ℃ at 10 seconds after stopping, about 34 ℃ at 20 seconds after stopping, and about 35 ℃ at 30 seconds after stopping. Then, when the supply of cutting water was restarted, it was lowered to about 27 ℃ within 10 seconds.
Since the cutting water adhering to the cutting unit 18 may fall down to the tool inlet 46, the height of the cutting unit 18 may be repeatedly detected in the setting process in order to perform the setting process with high accuracy. Therefore, the execution time of the setting process is not constant. In the setting step, the temperature of the cutting tool 18a is increased at time, and the diameter of the cutting tool 18a is changed at time, so that it is not easy to perform the setting step using the edge position detecting means 40 with high accuracy and high reproducibility.
If the cutting tool 18a thermally expands during the setting process, the reference height position of the cutting unit 18 detected during the setting process does not coincide with the height position to be detected. Therefore, when the height position of the cutting unit 18 suitable for cutting is calculated from the detected reference height position, and the workpiece is cut by positioning the cutting unit 18 at the height position suitable for cutting, the depth of penetration of the cutting tool 18a becomes shallow, and the workpiece cannot be cut properly.
Therefore, in the cutting unit position detection method and the cutting device according to the present embodiment, the tendency of thermal expansion of the cutting tool 18a is measured in advance, and the reference height position of the cutting unit 18 detected in the setting step is corrected. The following describes a cutting device 2 capable of implementing the method for detecting the position of a cutting unit according to the present embodiment.
As shown in fig. 2 (B), the control unit 42 of the cutting device 2 includes, for example: a voltage value comparing section 54, a reference voltage value registering section 56, a cutting unit height detecting section 58, a correcting section 60, a relation registering section 62, and a cutting unit height registering section 64. The functions of each unit of the control unit 42 are realized by software stored in a storage device on a computer having a processing device such as a CPU and the storage device. The respective sections of the control unit 42 are explained below.
The voltage value comparing unit 54 is connected to the photoelectric conversion unit 52a of the light receiving unit 52, and receives an electric signal of a voltage value corresponding to the light receiving amount of the light received by the photoelectric conversion unit 52a from the photoelectric conversion unit 52 a. The voltage value comparison unit 54 records the following: in the setting step, the light is gradually blocked by the cutting tool 18a entering the tool entrance portion 46, the light receiving amount of the light is reduced, and the voltage value is reduced.
The voltage value comparing unit 54 detects that the lower end 18b, which is the edge of the cutting tool 18a, is positioned at a predetermined height position when the voltage value of the electric signal output from the photoelectric conversion unit 52a of the light receiving unit 52 matches the reference voltage value registered in the reference voltage value registration unit 56 described later. The voltage value comparing unit 54 sends information that the lower end 18b of the cutting edge of the cutting tool 18a is positioned at a predetermined height position when the voltage value of the electric signal matches the reference voltage value to a cutting unit height detecting unit 58 described later.
The voltage value of the electric signal output from the photoelectric conversion unit 52a when the light emitted from the light emitting unit 50 is received by the light receiving unit 52 when the lower end 18b of the cutting edge of the cutting tool 18a is positioned at a predetermined height position is registered in the reference voltage value registration unit 56 in advance as a reference voltage value. Here, the predetermined height position of the lower end 18b of the cutting edge of the cutting tool 18a is a height position lower than the holding surface 8a of the chuck table 8 by a predetermined distance.
The cutting unit height detection unit 58 is connected to the infeed unit including the Z-axis pulse motor 36 and the like, and the voltage value comparison unit 54. The cutting unit height detection unit 58 can acquire the height position of the cutting unit 18 in the feeding direction from the feeding unit. Then, the height position of the cutting unit 18 when the voltage value comparing unit 54 detects that the lower end 18b of the cutting edge of the cutting tool 18a is positioned at the predetermined height position is detected as the reference height position. Then, the height position of the cutting unit 18 suitable for cutting is calculated from the reference height position. The reference height position is corrected by a correction unit 60 described below.
The correction unit 60 corrects the reference height position of the cutting unit 18 detected by the cutting unit height detection unit 58. The correction unit 60 corrects the reference height position of the cutting unit 18 with reference to the time when the voltage value comparison unit 54 detects that the lower end 18b of the cutting edge of the cutting tool 18a is positioned at the predetermined height position. The correction unit 60 refers to this time to determine the amount of thermal expansion of the cutting tool 18a based on this time. The time change in the amount of thermal expansion of the cutting tool 18a is registered in a relationship registration section 62 described below.
The relationship registration unit 62 can register the time-dependent change in the amount of received light, which is emitted from the light source 50a of the light-emitting unit 50 and received by the photoelectric conversion unit 52a of the light-receiving unit 52, as the time-dependent change in the voltage value of the electrical signal output by the photoelectric conversion unit 52 a. The relationship registration unit 62 registers, for example, a relationship between the voltage value of the electric signal and time, which changes due to thermal expansion of the rotating cutting tool 18 a.
For example, when the cutting tool 18a is attached to the cutting device 2, the relationship is registered in the relationship registration unit 62 by observing thermal expansion of the cutting tool 18a due to frictional heat generated by rotation by the edge position detection unit 40. An example of the observation step will be described.
In order to match the situation of the setting process performed after cutting the workpiece, for example, cutting water is injected to the cutting tool 18a while rotating the cutting tool 18a at the same rotational speed as the rotational speed at the time of cutting the workpiece. Then, the injection of cutting water to the cutting tool 18a is stopped. When the injection of cutting water is stopped, thermal expansion of the cutting tool 18a starts.
The cutting edge of the rotating cutting tool 18a is brought into the tool entrance 46 of the edge position detecting unit 40. And, the cutting unit 18 is positioned at a height position suitable for observing the thermal expansion of the cutting tool 18 a.
In the edge position detecting means 40, light is irradiated from the light emitting section 50 to the light receiving section 52, and a change in the amount of received light by the light receiving section 52 is observed. Then, the control unit 42 obtains a relationship between the voltage value of the electric signal output from the photoelectric conversion unit 52a, which changes with time due to thermal expansion of the rotating cutting tool 18a, and registers the relationship in the relationship registration unit 62.
In addition, strictly speaking, since the thermal expansion of the cutting tool 18a starts from the time when the supply of cutting water to the cutting tool 18a is stopped, the thermal expansion proceeds to some extent at the time when the tip position detection unit 40 starts to observe. However, in the case where the step of setting the cutting tool 18a is performed after cutting the workpiece, the thermal expansion of the cutting tool 18a proceeds to the same extent after the supply of cutting water is stopped until the edge position detecting means 40 starts to observe.
Therefore, when the case of thermal expansion of the cutting tool 18a is acquired in advance by another step after the start of thermal expansion of the cutting tool 18a until the start of observation by the edge position detection unit 40, the correction portion 60 can correct the reference height position of the cutting unit 18 with higher accuracy. For example, the tip of the non-rotating cutting tool 18a is brought into the tool entrance 46 of the tip position detection unit 40, and then the rotation of the cutting tool 18a is started. Thus, the initial trend of thermal expansion of the cutting tool 18a can be observed.
In addition, a plurality of relationships between the voltage value of the electric signal and time may be registered in the relationship registration unit 62. The condition of thermal expansion of the cutting tool 18a varies according to the rotational speed of the cutting tool 18 a. Accordingly, the cutting tool 18a is rotated at a plurality of rotational speeds which can be set when cutting the workpiece, and the tendency of thermal expansion is measured by the edge position detecting means 40. When the correction unit 60 corrects the reference height position of the cutting unit 18, an appropriate relationship is selected based on the plurality of relationships registered in the relationship registration unit 62, and correction is performed.
Fig. 3 (B) shows an example of the relationship registered in the relationship registration unit 62. For example, the relationship between the amount of change in the amount of light received, which changes with time due to thermal expansion of the rotating cutting tool 18a, and the time from the start of observation is registered in the relationship registration unit 62 as a graph of the voltage value of the electric signal output from the photoelectric conversion unit 52 a.
The correction unit 60 refers to the time when the voltage value comparison unit 54 detects that the lower end 18b of the cutting edge of the cutting tool 18a is positioned at the predetermined height position, and determines the correction amount of the reference height position of the cutting unit 18 based on the relationship registered in the relationship registration unit 62. The correction amount corresponds to the thermal expansion amount of the cutting tool 18a in this time. The reference height position of the cutting unit 18 corrected by the correction amount is registered in the cutting unit height registration unit 64.
When the cutting unit 18 is positioned at a height position suitable for cutting calculated from the corrected reference height position, the workpiece can be cut appropriately by the cutting tool 18a by controlling the cutting feed unit at the time of cutting the workpiece. As described above, in the cutting device 2, the setting step is performed in consideration of the thermal expansion of the cutting tool 18a and the influence of the thermal expansion is eliminated. Accordingly, the reference height position of the cutting unit 18 desired to be obtained by the setting process is appropriately obtained.
Next, a method for detecting the height position of the cutting unit according to the present embodiment will be described. The height position detection method of the cutting unit is implemented by the cutting device 2, for example. Hereinafter, a case will be described in which the height position detection method of the cutting means is implemented in the cutting device 2. Fig. 4 is a flowchart showing a flow of steps of the height position detection method of the cutting unit.
In the height position detection method of the cutting unit, the cutting tool mounting step S10 may be initially performed. In the cutting tool mounting step S10, the cutting tool 18a is mounted on the tip of the spindle 18c of the cutting unit 18 included in the cutting device 2.
When the workpiece is cut by the cutting tool 18a, the tip is consumed, and therefore, a setting process is required. In order to perform the setting step in consideration of the thermal expansion of the cutting tool 18a, the tendency of the thermal expansion of the cutting tool 18a may be observed immediately after the cutting tool mounting step S10 is performed.
Next, a cutting tool positioning step S20 is performed. In the cutting tool positioning step S20, the cutting tool 18a is positioned at a height at which the light emitted from the light emitting portion 50 and received by the light receiving portion 52 is shielded by a predetermined amount by the cutting tool 18a being entered into the tool entrance portion 46 of the edge position detecting unit 40 by the infeed feeding unit.
At this time, the height at which the cutting tool 18a is positioned is a height suitable for observing the thermal expansion of the cutting tool 18 a. For example, in the setting step, the height of the cutting tool 18a positioned at the time of detecting the reference height position of the cutting unit 18 may be set. That is, the height of the cutting tool 18a may be set when the lower end 18b of the cutting edge of the cutting tool 18a is positioned at a predetermined height position.
After the cutting tool positioning step S20, a relation registration step S30 is performed. In the relation registration step S30, the cutting edge position detection means 40 is operated while maintaining the height of the cutting means 18 in the cutting feed direction, and the light receiving amount of the light received by the light receiving portion 52, which changes with time due to the thermal expansion of the rotating cutting tool 18a, is observed. Then, the relationship between the time from the start of observation and the amount of change in the voltage value corresponding to the amount of change in the light receiving amount is registered in the relationship registration unit 62 of the control unit 42.
In the cutting tool positioning step S20, the cutting tool 18a is rotated. At this time, the rotation speed of the cutting tool 18a matches the rotation speed of the cutting tool 18a at the time of cutting the workpiece. The rotation of the cutting tool 18a may be started before the tip of the cutting tool 18a is brought into the tool entrance 46 of the tip position detection means 40, or may be started after the tip is brought into the tool entrance 46.
For example, in order to create the same situation as in the process of setting the cutting tool 18a after cutting the workpiece, the cutting tool 18a may be rotated in advance. In this case, in the cutting tool positioning step S20, first, a cutting tool rotation start step and a cutting water supply step of supplying cutting water to the cutting tool 18a are performed. Then, a cutting water stopping step of stopping the supply of cutting water to the cutting tool 18a is performed, and then the cutting edge of the cutting tool 18a is brought into the tool entrance 46.
Alternatively, in the cutting tool positioning step S20, the rotation of the cutting tool 18a may be started after the tip of the cutting tool 18a is brought into the tool entrance 46 of the tip position detection unit 40. In this case, the rotation of the cutting tool 18a is started and the temperature of the cutting tool 18a gradually increases, so that the occurrence of thermal expansion of the cutting tool 18a can be observed by the edge position detection means 40 from the initial stage of thermal expansion.
When the relation registration step S30 is performed, a setting process in which thermal expansion of the cutting tool 18a is taken into consideration can be performed. After the relation registration step S30, a cutting step of cutting the workpiece with the cutting tool 18a may be performed. In the cutting step, the workpiece is held by the holding surface 8a of the chuck table 8, the cutting tool 18a is rotated, the cutting unit is positioned at a height position suitable for cutting, the chuck table 8 is subjected to machining feed, and the cutting tool 18a is cut into the workpiece.
In addition, since the cutting means 18 is positioned at a height suitable for the cutting in the cutting step, the setting step can be performed using the cutting edge position detecting means 40 after the cutting tool 18a is mounted on the spindle 18c and before the workpiece is machined. When the cutting unit 18 is positioned at a height position suitable for the cutting, the workpiece can be cut appropriately. When cutting of the workpiece is repeated, the edge of the cutting tool 18a is consumed, and the diameter is reduced, so that the setting process needs to be periodically performed.
Next, a step S40 of detecting the height position, which is performed as a loop of the setting step, will be described. In the height position detection step S40, the cutting tool 18a after the workpiece is machined is brought into the tool entrance 46 of the edge position detection means 40 while rotating about the spindle 18 c. The light emitted from the light emission window 50b of the light emission unit 50 is received by the photoelectric conversion unit 52a through the light receiving window 52b of the light receiving unit 52. The cutting tool 18a is positioned at a height that shields the light by a predetermined amount.
That is, when the voltage value of the electric signal output from the photoelectric conversion unit 52a matches the reference voltage value registered in the reference voltage value registration unit 56, the voltage value comparison unit 54 detects that the height of the lower end 18b of the edge of the cutting tool 18a is the predetermined height position. At this time, the height position of the cutting unit 18 is detected from the infeed unit by the cutting unit height detecting section 58 as a reference height position, and a height position suitable for cutting of the cutting unit 18 is calculated from the reference height position.
Here, in the height position detection step S40, in order to detect the reference height position of the cutting unit 18 with high accuracy, the lifting and lowering of the cutting tool 18a may be repeated in the tool entrance 46.
Cutting water supplied to the cutting tool 18a and the like may adhere to the cutting unit 18 when cutting the workpiece, and may fall down to the tool inlet 46 while the height position detection step S40 is performed. In addition, the cutting water may adhere to the edge of the cutting tool 18a rotating at a high speed, and may remain on the edge even when the supply of the cutting water is stopped. In these cases, the progress of light from the light emitting portion 50 to the light receiving portion 52 may be hindered by the cutting water.
Therefore, when the lifting and lowering of the cutting tool 18a with respect to the tool inlet 46 are repeated, the air flow around the cutting tool 18a changes, and the cutting water adhering to the cutting tool 18a is removed. In addition, when the number of measurements is increased by repeatedly raising and lowering the cutting tool 18a and repeatedly detecting the voltage value comparing unit 54 while operating the edge position detecting unit 40, the reference height position of the cutting unit 18 can be made highly accurate.
In the height position detection step S40, the reference height position of the cutting unit 18 obtained is corrected by the relationship registered in the relationship registration unit 62 in the relationship registration step S30. That is, in the correction section 60, the reference height position of the cutting unit 18 obtained by the cutting unit height detection section 58 is corrected using the relationship registered in the correction section 60.
In the height position detection step S40, the time required to detect that the lower end 18b of the tip of the cutting tool 18a is positioned at a prescribed height is not constant. Also, the longer the time required for detection, the greater the thermal expansion of the cutting tool 18 a. Therefore, when correcting the reference height position of the cutting unit 18, reference is made to the time when the lower end 18b of the cutting edge of the cutting tool 18a is detected to be positioned at the predetermined height position.
That is, based on the relationship registered in the relationship registration unit 62, the amount of change in the amount of light received by the thermal expansion of the cutting tool 18a during this time is calculated so as to be the amount of change in the voltage value of the electrical signal output by the photoelectric conversion unit 52 a. Then, the thermal expansion amount of the cutting tool 18a is calculated from the variation of the voltage value.
The reference height position of the cutting unit 18 detected by the cutting unit height detecting unit 58 is corrected by the thermal expansion amount of the cutting tool 18 a. More specifically, the reference height position of the cutting unit 18 before correction is a position higher than the reference height position to be detected by the thermal expansion amount. Therefore, the thermal expansion amount is subtracted from the reference height position of the cutting unit 18 before correction. The corrected reference height position is registered in the cutting unit height registration unit 64.
When cutting the workpiece with the cutting tool 18a again, the control unit 42 positions the height of the cutting unit 18 at a height position suitable for cutting calculated from the corrected reference height position. When cutting a workpiece, cutting water is supplied to the cutting tool 18a and the workpiece, so that thermal expansion of the cutting tool 18a can be suppressed. The lower end 18b of the cutting edge of the cutting tool 18a is positioned at a height lower than the lower surface of the workpiece, so that the workpiece is properly cut.
In the relation registration step S30, the cutting tool 18a may be rotated at a rotation speed corresponding to the rotation speed of the cutting tool 18a in the height position detection step S40. That is, the relation registration step S30 and the height position detection step S40 may be performed by rotating the cutting tool 18a at the rotation speed of the cutting tool 18a when cutting the workpiece with the cutting tool 18 a. When the rotational speeds of the cutting tools 18a are uniform, the influence of the centrifugal force applied to the cutting tools 18a can be eliminated.
As described above, according to the height detection method of the cutting means and the cutting device 2 of the present embodiment, the setting step is appropriately performed, and the cutting means 18 is positioned at a height suitable for cutting the workpiece.
In the above embodiment, the time change due to thermal expansion of the diameter of the cutting tool 18a is registered in the relation registering unit 62 as the voltage value of the electric signal outputted from the photoelectric conversion unit 52a, but the time change may be registered in the relation registering unit 62 in another way. The correction unit 60 corrects the reference height position of the cutting unit 18 with reference to the time change caused by the thermal expansion of the diameter of the cutting tool 18a registered in the form of the voltage value of the electric signal registered by the relation registration unit 62, but the correction of the reference height position may be performed by other methods.
For example, the thermal expansion amount itself of the cutting tool 18a that changes according to time may be registered in the relation registration unit 62. In this case, the correction unit 60 subtracts the thermal expansion amount from the detected reference height position of the cutting unit 18, thereby correcting the reference height position.
The relationship related to the time change in diameter due to thermal expansion of the cutting tool 18a registered in the relationship registration unit 62 may be obtained without using the cutting tool 18a attached to the cutting unit 18 at the time of the installation process. For example, in the case where the cutting device 2 repeatedly cuts the workpiece by replacing the same type of cutting tools 18a one by one over the lifetime, the relationship registered in the relationship registration unit 62 may be acquired by using the cutting tool 18a that was first mounted.
In this case, the reference height position of the cutting unit 18 to which the other cutting tools 18a of the same kind are attached may be corrected using the relationship registered in the relationship registration section 62. That is, even when the reference height position of the cutting unit 18 to which the cutting tool 18a other than the cutting tool 18a for acquiring the relation registered in the relation registration unit 62 is attached is corrected, the operation and effect of one embodiment of the present invention, in which the setting process is suitably performed, is produced.
In addition, the structure, method, and the like of the above embodiment can be modified and implemented as appropriate without departing from the scope of the object of the present invention.

Claims (3)

1. A method for detecting the position of a cutting unit, which uses a cutting device,
the cutting device comprises:
a chuck table for holding a workpiece by a holding surface;
a cutting unit having a main shaft extending in a direction parallel to the holding surface and a cutting tool attached to a front end of the main shaft, the cutting unit cutting the workpiece with the cutting tool rotating around the main shaft while supplying cutting water to the workpiece and the cutting tool held by the chuck table;
an plunge feeding unit for plunging the cutting unit in a plunge feeding direction perpendicular to the holding surface;
a cutting edge position detection unit for detecting the height position of the lower end of the cutting edge of the cutting tool; and
a control unit for controlling each component,
the cutting edge position detecting unit has a cutter entering portion for the cutting cutter to enter, a light emitting portion and a light receiving portion facing each other with the cutter entering portion interposed therebetween,
The control unit has a relation registering unit capable of registering a change with time in the light receiving amount of the light emitted from the light emitting unit and received by the light receiving unit,
it is characterized in that the method comprises the steps of,
the position detection method of the cutting unit comprises the following steps:
a cutting tool positioning step of positioning the cutting tool at a height at which the light emitted from the light emitting section and received by the light receiving section is shielded by a predetermined amount by the cutter entry section of the cutting edge position detecting section by the infeed feeding section;
a relationship registration step of observing the light receiving amount that changes with time according to thermal expansion of the rotating cutting tool in a state where the height of the cutting unit in the cutting feed direction is maintained after the cutting tool positioning step, and registering a relationship between a time from the start of the observation and the amount of change in the light receiving amount in the relationship registration section; and
a height position detection step of, after the relation registration step, causing the cutting tool after the workpiece has been processed to enter the tool entrance portion of the cutting edge position detection means while rotating about the main axis, positioning the cutting tool at a height at which the light emitted from the light emitting portion and received by the light receiving portion is shielded by the predetermined amount, obtaining a height position of the cutting means when the height of the lower end of the cutting edge of the cutting tool becomes a predetermined height position as a reference height position,
In the height position detection step, the reference height position of the cutting unit obtained is corrected based on the relationship registered in the relationship registration section by the relationship registration step.
2. The method for detecting the position of a cutting unit according to claim 1, wherein,
in the relation registering step, the cutting tool is rotated at a rotation speed corresponding to the rotation speed of the cutting tool in the height position detecting step.
3. A cutting device is characterized in that,
the cutting device comprises:
a chuck table for holding a workpiece by a holding surface;
a cutting unit having a main shaft extending in a direction parallel to the holding surface and a cutting tool attached to a front end of the main shaft, the cutting unit cutting the workpiece with the cutting tool rotating around the main shaft while supplying cutting water to the workpiece and the cutting tool held by the chuck table;
an plunge feeding unit for plunging the cutting unit in a plunge feeding direction perpendicular to the holding surface;
a cutting edge position detection unit for detecting a height position of the cutting unit when a lower end of the cutting edge of the cutting tool is at a predetermined height position as a reference height position; and
A control unit for controlling each component,
the blade edge position detection unit includes:
a tool entry portion into which the cutting tool enters;
a light emitting portion and a light receiving portion facing each other with the tool entrance portion interposed therebetween; and
a photoelectric conversion unit which outputs an electric signal having a voltage value corresponding to the light receiving amount of the light received by the light receiving unit,
the control unit has:
a relationship registration unit capable of registering a temporal change in the amount of light received by the light receiving unit, which is emitted from the light emitting unit, as a temporal change in the voltage value of the electric signal output from the photoelectric conversion unit;
a reference voltage value registration unit that registers, as a reference voltage value, a voltage value of an electrical signal output from the photoelectric conversion unit when light emitted from the light emitting unit is received by the light receiving unit when a lower end of a cutting edge of the cutting tool is positioned at the predetermined height position;
a voltage value comparing unit that detects that the lower end of the cutting edge of the cutting tool is positioned at the predetermined height position when the voltage value of the electric signal output from the photoelectric conversion unit matches the reference voltage value registered in the reference voltage value registration unit;
a cutting unit height detection unit connected to the voltage value comparison unit, the cutting unit height detection unit detecting a height of the cutting unit as the reference height position when the voltage value comparison unit detects that the lower end of the cutting edge of the cutting tool is positioned at the predetermined height position; and
A correction unit for correcting the reference height position of the cutting unit detected by the cutting unit height detection unit,
the relation registering unit registers a relation between a voltage value of the electric signal outputted from the photoelectric conversion unit and time, the relation being generated by thermal expansion of the rotating cutting tool and time-lapse,
the correction unit refers to the time when the voltage value comparison unit detects that the lower end of the cutting edge of the cutting tool is positioned at the predetermined height position, and determines the correction amount of the reference height position of the cutting unit based on the relationship registered in the relationship registration unit.
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