CN112291941A - Printed circuit board and preparation method thereof - Google Patents
Printed circuit board and preparation method thereof Download PDFInfo
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- CN112291941A CN112291941A CN201910670194.9A CN201910670194A CN112291941A CN 112291941 A CN112291941 A CN 112291941A CN 201910670194 A CN201910670194 A CN 201910670194A CN 112291941 A CN112291941 A CN 112291941A
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- printed circuit
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Microelectronics & Electronic Packaging (AREA)
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a printed circuit board and a preparation method thereof. The preparation method of the printed circuit board comprises the following steps: providing a printed circuit board mother board, wherein the printed circuit board mother board comprises an element surface and a welding surface which are oppositely arranged along the thickness direction of the printed circuit board mother board, and at least one supporting hole which penetrates through the welding surface from the element surface is also arranged on the printed circuit board mother board; forming a photoresist layer on the component surface, and patterning the photoresist layer to form a tin-plated region and a non-tin-plated region, wherein the tin-plated region is arranged around the support hole; and forming a tin coating on the tin plating area by taking the patterned photoresist layer as a mask so as to finish the preparation of the printed circuit board. The preparation method of the printed circuit board can effectively ensure the tin plating amount of the tin plating area, thereby effectively fixing and supporting the components and improving the mounting performance when the printed circuit board is connected with other components.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board and a preparation method thereof.
Background
A Printed Circuit Board (hereinafter, referred to as PCB) is an important electronic component, and is generally used as a support for an electronic component and a carrier for electrical connection of the electronic component. When the PCB is connected with electronic components, such as three-dimensional electronic components like capacitors and electronic transformers, the PCB is light and cannot be fixed on the surface of the PCB, and sometimes through holes are formed in the PCB so that the electronic components can be inserted into the through holes to support the electronic components.
Currently, Surface Mount Technology (SMT) is generally used for assembling electronic components. Namely, solder paste is smeared on an area to be mounted on the PCB, and then the electronic component is soldered to the area to be mounted by adopting an SMT technology.
However, in the row PCB having through holes, solder paste is heated and easily flows out of the through holes during soldering, so that the solder paste in the area around the through holes is insufficient, thereby affecting the soldering quality of the electronic components.
Disclosure of Invention
The invention provides a printed circuit board and a preparation method thereof, which aim to overcome the defect that when the conventional printed circuit board is welded, solder paste is heated and easily flows out of a through hole, so that the insufficient solder paste is generated in the area around the through hole, and the welding quality of an electronic component is influenced.
In one aspect of the present invention, a method for manufacturing a printed circuit board is provided, which comprises the following steps:
providing a printed circuit board mother board, wherein the printed circuit board mother board comprises an element surface and a welding surface which are oppositely arranged along the thickness direction of the printed circuit board mother board, and at least one supporting hole which penetrates through the welding surface from the element surface is also arranged on the printed circuit board mother board;
forming a photoresist layer on the component surface, and patterning the photoresist layer to form a tin-plated region and a non-tin-plated region, wherein the tin-plated region is arranged around the support hole;
and forming a tin coating on the tin plating area by taking the patterned photoresist layer as a mask so as to finish the preparation of the printed circuit board.
Optionally, the photoresist in the photoresist layer is a positive photoresist, and the step of patterning the photoresist layer to form the tin-plated region and the non-tin-plated region specifically includes:
forming a mask plate on the surface of the photoresist layer, wherein the mask plate comprises a light transmitting area and a light shielding area, the light transmitting area corresponds to the tin-plated area, and the light shielding area corresponds to the non-tin-plated area;
and exposing and developing the photoresist layer to remove the photoresist layer at the tin-plated area and reserve the photoresist layer at the non-tin-plated area.
Optionally, the photoresist in the photoresist layer is a negative photoresist, and the step of patterning the photoresist layer to form the tin-plated region and the non-tin-plated region specifically includes:
forming a mask plate on the surface of the photoresist layer, wherein the mask plate comprises a light transmitting area and a light shielding area, the light transmitting area corresponds to the non-tinning area, and the light shielding area corresponds to the tinning area;
and exposing and developing the photoresist layer to reserve the photoresist layer at the non-tin-plated area and remove the photoresist layer at the tin-plated area.
Optionally, the preparation method further comprises, after developing the photoresist layer:
forming an injection groove with a preset first size in the area, corresponding to the supporting hole, of the developed photoresist layer, wherein the injection groove is recessed from one side, facing the element surface, of the photoresist layer to one side, away from the element surface;
the step of forming the tin plating layer on the tin plating area by taking the patterned photoresist layer as a mask specifically comprises the following steps:
depositing a tin plating material to the tin plating region using an electroplating process to form the tin plating layer, and, during the formation of the tin plating layer, passing part of the tin plating material through the support hole via the injection groove to form a predetermined second-sized tin ring on the soldering face.
Optionally, the predetermined first size is less than 3 mils, and the predetermined second size is less than 10 mils.
Optionally, the step of forming a tin plating layer on the tin plating region specifically includes:
electroplating area increasing parts are respectively arranged on two sides of the flying bar, and the printed circuit board mother board is fixed on the flying bar;
and forming a tin plating layer on the tin plating area by adopting an electroplating process.
Optionally, the preparation method further comprises the following steps performed after the providing of the motherboard of the printed circuit board and before the forming of the photoresist layer on the component surface:
and forming a protective layer on the surface of the motherboard of the printed circuit board.
Optionally, the step of forming a protective layer on the surface of the printed circuit board motherboard specifically includes:
depositing a nickel-gold material layer on the surface of the mother board of the printed circuit board in a mode of chemically depositing nickel and gold;
carrying out acid cleaning treatment on the nickel-gold material layer;
washing the nickel-gold material layer subjected to acid washing treatment with water;
and drying the nickel-gold material layer after the water washing treatment to form the protective layer.
Optionally, after forming the tin plating layer, the method further comprises:
washing the tin-plated layer with water;
and drying the washed tin-plated layer to finish the preparation of the printed circuit board.
In another aspect of the present invention, a printed circuit board is provided, which is manufactured by the above-mentioned manufacturing method.
The invention relates to a printed circuit board and a manufacturing method thereof, which comprises the steps of firstly providing a printed circuit board motherboard, wherein the printed circuit board motherboard comprises an element surface and a welding surface which are oppositely arranged along the thickness direction of the printed circuit board motherboard, and at least one supporting hole which penetrates through the welding surface from the element surface is also arranged on the printed circuit board motherboard. And then, forming a photoresist layer on the component surface, and patterning the photoresist layer to form a tin-plated area and a non-tin-plated area, wherein the tin-plated area is arranged around the support hole. And finally, forming a tin coating on the tin plating area by taking the patterned photoresist layer as a mask so as to finish the preparation of the printed circuit board. The tin plating amount of a tin plating area can be effectively ensured, so that when the device is connected with other devices, the device can be effectively fixedly supported, and the mounting performance is improved.
Drawings
The above and other objects, features and advantages of the embodiments of the present invention will become more readily understood by the following detailed description with reference to the accompanying drawings. Embodiments of the invention will now be described, by way of example and not limitation, in the accompanying drawings, in which:
FIG. 1 is a process flow diagram of a method of manufacturing a printed circuit board according to a first embodiment of the present invention;
fig. 2 a-2 i are process step diagrams of a method for manufacturing a printed circuit board according to a second embodiment of the invention.
Description of reference numerals:
110: a printed circuit board motherboard;
111: an element surface;
112: welding a surface;
113: a support hole;
120: a protective layer;
130: a photoresist layer;
131: a tinning area;
132: a non-tin plated region;
133: injecting into a groove;
140: a mask plate;
141: a light-transmitting region;
142: a light-shielding area;
150: plating a tin layer;
160: and (5) tin rings.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
As shown in fig. 1, a first aspect of the present invention provides a method for manufacturing a printed circuit board, including the following specific steps:
s110, providing a printed circuit board mother board, wherein the printed circuit board mother board comprises an element surface and a welding surface which are oppositely arranged along the thickness direction of the printed circuit board mother board, and at least one supporting hole which penetrates through the welding surface from the element surface is further arranged on the printed circuit board mother board.
Specifically, as shown in fig. 2a, in this step, a motherboard 110 of a printed circuit board is a provider of electrical connection of electronic components, and has been developed for over 100 years, and its design is mainly a layout design, and the main advantage of using a circuit board is that errors of wiring and assembly are greatly reduced, and the automation level and the production labor rate are improved. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. In this step, the specific structure of the printed circuit board motherboard 110 is not limited, for example, the printed circuit board motherboard 110 may be a single-sided board, or the printed circuit board motherboard 110 may also be a double-sided board, or the printed circuit board motherboard 110 may also be a four-layer board, or the printed circuit board motherboard 110 may also be a six-layer board, and the specific structure may be determined according to actual needs. The printed circuit board motherboard 110 includes a component surface 111 and a soldering surface 112 provided in the thickness direction thereof, and the printed circuit board motherboard 110 is further provided with two support holes 113 penetrating the thickness thereof. Of course, according to actual needs, the printed circuit board motherboard 110 may be further provided with a plurality of supporting holes 113, for example, three or more.
And S120, forming a protective layer on the surface of the printed circuit board motherboard.
Specifically, in this step, as shown in fig. 2a, a protection layer 120 may be formed on the surface of the printed circuit board motherboard 110 by deposition, sputtering, or the like, and the formed protection layer 120 may effectively protect a copper foil layer (not shown) structure on the printed circuit board motherboard 110. It should be noted that, in this step, specific materials of the protection layer 120 are not limited, for example, the protection layer 120 may be a nickel-gold material layer, and besides, the protection layer 120 may also be a protection layer made of other materials, which may be determined according to actual needs.
It should be noted that the step S120 is not an essential step, that is, in the actual process, it can be determined whether the protective layer 120 needs to be formed on the printed circuit board motherboard 110 according to specific needs, and if the protective layer 120 does not need to be formed, the step S120 can be completely omitted.
S130, forming a photoresist layer on the protective layer, and patterning the photoresist layer to form a tin-plated area and a non-tin-plated area, wherein the tin-plated area is arranged around the supporting hole.
Specifically, in this step, as shown in fig. 2b, a desired photoresist layer 130 may be formed on the protective layer 120 by deposition, sputtering, or the like, and then, as shown in fig. 2c and 2d, the photoresist layer 130 is patterned to form a tin-plated region 131 and a non-tin-plated region 132, the tin-plated region 131 being disposed around the support hole 113.
And S140, forming a tin plating layer on the tin plating area by taking the patterned photoresist layer as a mask so as to finish the preparation of the printed circuit board.
Specifically, in this step, as shown in fig. 2e, the photoresist layer 130 patterned in step S130 is used as a mask, so that the tin plating layer 150 can be formed in the tin plating region 131, but the tin plating layer 150 cannot be formed in the non-tin plating region 132 due to the existence of the photoresist layer, and then after the tin plating layer 150 is formed, the remaining photoresist layer 130 can be removed by an etching process, and the structure of the finally obtained printed circuit board is shown in fig. 2 f.
In the method for manufacturing a printed circuit board according to this embodiment, first, a motherboard of a printed circuit board is provided, the motherboard of the printed circuit board includes an element surface and a soldering surface that are oppositely disposed in a thickness direction of the motherboard, and at least one supporting hole that penetrates through the soldering surface from the element surface is further provided on the motherboard of the printed circuit board. And then, forming a protective layer on the surface of the motherboard of the printed circuit board, then, forming a photoresist layer on the protective layer, and patterning the photoresist layer to form a tin-plated area and a non-tin-plated area. And finally, forming a tin coating on the tin plating area by taking the patterned photoresist layer as a mask so as to finish the preparation of the printed circuit board. Therefore, the manufacturing method of the printed circuit board of the embodiment can effectively ensure the tin plating amount of the tin plating area, so that when the printed circuit board is connected with other components, the components can be effectively fixedly supported, and the mounting performance is improved.
The photoresist in the photoresist layer can adopt positive photoresist, and the positive photoresist is also called positive photoresist. Positive photoresist resins are a type of phenolic aldehyde called novolak, which provides adhesion, chemical resistance to the photoresist, and which dissolves in the developer in the absence of a dissolution inhibitor, which is a photosensitive compound, most commonly Diazonaphthoquinone (DNQ). Before exposure, DNQ is a strong dissolution inhibitor, reducing the dissolution rate of the resin. After uv exposure, DNQ chemically decomposes in the photoresist to become a solubility enhancer, greatly increasing the solubility factor in the developer to 100 or higher. This exposure reaction produces carboxylic acids in the DNQ which are highly soluble in the developer. The positive photoresist has good contrast, so the generated pattern has good resolution.
In addition, the photoresist in the photoresist layer may also be a negative photoresist, which is a photosensitive mixed liquid composed of three main components, namely, photosensitive resin, sensitizer (visible spectrum sensitizing dye) and solvent. Negative photoresists differ from positive photoresists mainly in the following differences:
(1) the exposure and development processes are different, positive photoresist is developed in an exposure area, and negative photoresist is opposite;
(2) the negative photoresist and the positive photoresist have different profiles formed by the boundary diffused light. The negative photoresist is reserved due to the exposure interval, and the image after development is an image with a wide top and a narrow bottom due to the diffusion formed outline; the positive photoresist is opposite and is an image with a wide bottom and a narrow top;
(3) the positive photoresist is dissolved in strong alkali, the developer adopts medium-sized alkali solution, and the negative photoresist mostly adopts organic solution, such as dimethylbenzene solution;
(4) the specific geometric figures obtained in the processing are different, an isolated single line can be easily obtained by using the negative photoresist, and isolated holes and grooves can be easily obtained by using the positive photoresist;
(5) negative photoresist is low in cost, and positive photoresist is expensive;
(6) the negative photoresist is treated by organic solution, which is unfavorable for ecological environment, while the positive photoresist is aqueous solution, which is popular with environmental protection people;
(7) negative photoresist has lower resolution than positive photoresist.
Therefore, according to the characteristics of the positive photoresist and the negative photoresist, when the positive photoresist is used as the photoresist, the step S130 specifically includes:
as shown in fig. 2b, a mask 140 is formed on the surface of the photoresist layer 130, the mask 140 includes a light-transmitting region 141 and a light-shielding region 142, the light-transmitting region 141 corresponds to the tin-plated region 131, and the light-shielding region 142 corresponds to the non-tin-plated region 132;
as shown in fig. 2c, the photoresist layer 130 is exposed and developed, so that the non-tin-plated region 132 covered by the light-shielding region 142 of the mask 140 is not irradiated with light, and the light-transmitting region 141 of the mask 140 is irradiated with light, and thus, the photoresist layer 130 at the irradiated tin-plated region 131 is removed, and the photoresist layer 140 at the non-irradiated tin-plated region 132 is remained, as shown in fig. 2 d.
On the contrary, when the photoresist is a negative photoresist, the step S130 specifically includes:
forming a mask plate on the surface of the photoresist layer, wherein the mask plate comprises a light transmitting area and a light shielding area, the light transmitting area corresponds to the non-tinning area, and the light shielding area corresponds to the tinning area;
the photoresist layer is exposed and developed, so that the non-tinning area covered by the shading area of the mask plate is not irradiated by light, and the light-transmitting area of the mask plate is irradiated by light, therefore, the photoresist layer at the tinning area which is irradiated by light can be reserved, and the photoresist layer at the non-tinning area which is not irradiated by light can be removed.
Preferably, an electroplating process may be used to form a tin-plated layer on the tin-plated region, where the electroplating is a process of plating a thin layer of other metal or alloy on the surface of some metal by using the principle of electrolysis, and the electroplating process is a process of attaching a metal film on the surface of a metal or other material product by using the action of electrolysis, so as to prevent metal oxidation (such as corrosion), improve wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate, etc.), and improve the appearance. The outer layer of many coins is also plated.
Specifically, when the electroplating process is performed, tin metal is used as an anode, the printed circuit board to be plated is used as a cathode, and cations of the tin metal are reduced on the surface of the printed circuit board to form a plating layer. In order to eliminate the interference of other cations and make the coating uniform and firm, a solution containing tin metal cations is used as an electroplating solution to keep the concentration of the tin cations of the coating constant.
The inventor of the invention finds that when the tin plating area is plated, the ratio of the electric tin area is very small, each surface of 1 printed circuit board is only 0.5 square, and in order to solve the problem, namely how to increase the plating area and prevent the printed circuit board from being burnt out by current, the inventor of the invention improves the flying bar, and the plating area increasing parts are respectively arranged on two sides of the flying bar, so that the printed circuit board is fixedly arranged on the improved flying bar before the tin plating layer is formed on the tin plating area by adopting the plating process, and the final parameter area input is according to the actual area (the printed circuit board and the plating area increasing part).
The specific structure of the plating area increasing portion is not limited, and the plating area increasing portion may be, for example, a bar, or may be another structure capable of increasing the plating area.
In order to further effectively increase the tin plating amount around the support hole, the above preparation method further comprises, after developing the photoresist layer:
as shown in fig. 2g, an implantation groove 133 with a predetermined first size is formed in a region of the developed photoresist layer 130 corresponding to the support hole 113, and the implantation groove 133 is recessed from a side of the photoresist layer 130 facing the device surface 111 to a side away from the device surface 111, such that the step S140 specifically includes:
as shown in fig. 2h, a plating process is used to deposit a tin plating material to the tin plating region 131 to form a tin plating layer 150, and, during the formation of the tin plating layer 150, a portion of the tin plating material passes through the support hole 113 via the injection groove 133 to form a tin ring 160 of a predetermined second size on the soldering surface 112, as shown in fig. 2 i.
It should be noted that, specific values of the preset first size and the preset second size are not limited specifically, and preferably, the preset first size may be smaller than 3 mils, and thus, the preset second size may be smaller than 10 mils. Of course, besides, those skilled in the art may select other values of the preset first size and the preset second size according to actual needs.
Specifically, the step of forming the protective layer on the surface of the motherboard of the printed circuit board specifically includes:
and depositing a nickel-gold material on the surface of the printed circuit board motherboard to form the protective layer.
In the embodiment, the nickel-gold material layer is deposited on the surface of the motherboard of the printed circuit board, so that the copper foil layer on the printed circuit board can be effectively protected, the copper foil layer can be prevented from being damaged in the subsequent preparation process, and the conductivity of the printed circuit board can be improved.
More specifically, the step of depositing a nickel-gold material layer on the surface of the printed circuit board motherboard to form the protective layer specifically includes:
depositing the nickel-gold material layer on the surface of the mother board of the printed circuit board in a mode of chemically depositing nickel-gold, carrying out acid cleaning treatment on the nickel-gold material layer, carrying out water washing treatment on the nickel-gold material layer after acid cleaning treatment, and carrying out drying treatment on the nickel-gold material layer after water washing treatment to form the protective layer.
In this embodiment, deposit through the mode that adopts chemical deposition nickel gold material layer, it is right the nickel gold material layer carries out the pickling, carries out the washing processing to the nickel gold material layer after the pickling, carries out drying process to the nickel gold material layer after the washing processing to can effectively get rid of dirt such as grease, water stain on printed circuit board surface, provide clean surface for follow-up pad pasting technology.
It should be noted that, besides the manner of depositing the nickel-gold material layer by using electroless nickel-gold deposition, the nickel-gold material layer may also be deposited by using other manners, which may be determined specifically according to actual needs.
In order to prevent oxidation of the tin plating layer at the tin plating region, the above method for producing a printed circuit board further comprises, after forming the tin plating layer:
washing the tin-plated layer with water;
and drying the washed tin-plated layer to finish the preparation of the printed circuit board.
Specifically, drying process to the tin coating can adopt drying device among the prior art to go on, drying device generally includes the stoving frame, be provided with backing roll and stoving pipeline in the stoving frame, stoving pipe connection has air pipe, air pipe connects an air heater, the air heater sets up in the stoving frame, and like this, through the drying device who sets up, can realize the fast drying to the tin coating after the washing, thereby can effectively prevent the oxidation of tin coating, improve printed circuit board's performance.
In another aspect of the present invention, a printed circuit board is provided, where the printed circuit board is manufactured by the manufacturing method described above, and the manufacturing method of the printed circuit board may specifically refer to the related descriptions above, and is not described herein again.
The printed circuit board of the embodiment, which is manufactured by the method for manufacturing a printed circuit board described above, can effectively ensure the tin plating amount in the tin plating area, so that when the printed circuit board is connected with other components, the components can be effectively fixed and supported, and the mounting performance is improved.
In the description of the present invention, it should be understood that, in the description above, reference to the description of the term "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The preparation method of the printed circuit board is characterized by comprising the following specific steps of:
providing a printed circuit board mother board, wherein the printed circuit board mother board comprises an element surface and a welding surface which are oppositely arranged along the thickness direction of the printed circuit board mother board, and at least one supporting hole which penetrates through the welding surface from the element surface is also arranged on the printed circuit board mother board;
forming a photoresist layer on the component surface, and patterning the photoresist layer to form a tin-plated region and a non-tin-plated region, wherein the tin-plated region is arranged around the support hole;
and forming a tin coating on the tin plating area by taking the patterned photoresist layer as a mask so as to finish the preparation of the printed circuit board.
2. The method for manufacturing a printed circuit board according to claim 1, wherein the photoresist in the photoresist layer is a positive photoresist, and the step of patterning the photoresist layer to form the tin-plated region and the non-tin-plated region specifically comprises:
forming a mask plate on the surface of the photoresist layer, wherein the mask plate comprises a light transmitting area and a light shielding area, the light transmitting area corresponds to the tin-plated area, and the light shielding area corresponds to the non-tin-plated area;
and exposing and developing the photoresist layer to remove the photoresist layer at the tin-plated area and reserve the photoresist layer at the non-tin-plated area.
3. The method for manufacturing a printed circuit board according to claim 1, wherein the photoresist in the photoresist layer is a negative photoresist, and the step of patterning the photoresist layer to form the tin-plated region and the non-tin-plated region specifically comprises:
forming a mask plate on the surface of the photoresist layer, wherein the mask plate comprises a light transmitting area and a light shielding area, the light transmitting area corresponds to the non-tinning area, and the light shielding area corresponds to the tinning area;
and exposing and developing the photoresist layer to reserve the photoresist layer at the non-tin-plated area and remove the photoresist layer at the tin-plated area.
4. The method for manufacturing a printed circuit board according to claim 2 or 3, further comprising, after developing the photoresist layer:
forming an injection groove with a preset first size in the area, corresponding to the supporting hole, of the developed photoresist layer, wherein the injection groove is recessed from one side, facing the element surface, of the photoresist layer to one side, away from the element surface;
the step of forming the tin plating layer on the tin plating area by taking the patterned photoresist layer as a mask specifically comprises the following steps:
depositing a tin plating material to the tin plating region using an electroplating process to form the tin plating layer, and, during the formation of the tin plating layer, passing part of the tin plating material through the support hole via the injection groove to form a predetermined second-sized tin ring on the soldering face.
5. The method of claim 4, wherein the predetermined first dimension is less than 3 mils and the predetermined second dimension is less than 10 mils.
6. The method for manufacturing a printed circuit board according to any one of claims 1 to 3, wherein the step of forming a tin plating layer on the tin plating region specifically comprises:
electroplating area increasing parts are respectively arranged on two sides of the flying bar, and the printed circuit board mother board is fixed on the flying bar;
and forming a tin plating layer on the tin plating area by adopting an electroplating process.
7. A method for manufacturing a printed circuit board according to any one of claims 1 to 3, further comprising the following steps performed after said providing of the mother board of the printed circuit board and before said forming of the photoresist layer on the component side:
and forming a protective layer on the surface of the motherboard of the printed circuit board.
8. The method for manufacturing a printed circuit board according to claim 7, wherein the step of forming a protective layer on the surface of the motherboard of the printed circuit board specifically comprises:
depositing a nickel-gold material layer on the surface of the mother board of the printed circuit board in a mode of chemically depositing nickel and gold;
carrying out acid cleaning treatment on the nickel-gold material layer;
washing the nickel-gold material layer subjected to acid washing treatment with water;
and drying the nickel-gold material layer after the water washing treatment to form the protective layer.
9. The method for manufacturing a printed circuit board according to any one of claims 1 to 3, further comprising, after forming the tin-plated layer:
washing the tin-plated layer with water;
and drying the washed tin-plated layer to finish the preparation of the printed circuit board.
10. A printed circuit board formed by the manufacturing method according to any one of claims 1 to 9.
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| CN201910670194.9A CN112291941B (en) | 2019-07-24 | 2019-07-24 | Printed circuit board and preparation method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1409737A (en) * | 1972-09-29 | 1975-10-15 | Exacta Circuits Ltd | Through-hole plated printed circuits |
| JP2009155703A (en) * | 2007-12-27 | 2009-07-16 | Ishihara Chem Co Ltd | Process for inhibiting tin whisker through electroless plating |
| KR20110015991A (en) * | 2009-08-10 | 2011-02-17 | 삼성전기주식회사 | Printed circuit board and method of manufacturing the same |
| CN103607841A (en) * | 2013-12-04 | 2014-02-26 | 江苏长电科技股份有限公司 | SMT subtraction high-density packaged multilayer circuit board structure and manufacturing method thereof |
| CN208501129U (en) * | 2018-05-17 | 2019-02-15 | 北大方正集团有限公司 | Electroplating device |
| CN109788635A (en) * | 2019-03-15 | 2019-05-21 | 深圳市满坤电子有限公司 | A kind of novel processing method of printed circuit board |
-
2019
- 2019-07-24 CN CN201910670194.9A patent/CN112291941B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1409737A (en) * | 1972-09-29 | 1975-10-15 | Exacta Circuits Ltd | Through-hole plated printed circuits |
| JP2009155703A (en) * | 2007-12-27 | 2009-07-16 | Ishihara Chem Co Ltd | Process for inhibiting tin whisker through electroless plating |
| KR20110015991A (en) * | 2009-08-10 | 2011-02-17 | 삼성전기주식회사 | Printed circuit board and method of manufacturing the same |
| CN103607841A (en) * | 2013-12-04 | 2014-02-26 | 江苏长电科技股份有限公司 | SMT subtraction high-density packaged multilayer circuit board structure and manufacturing method thereof |
| CN208501129U (en) * | 2018-05-17 | 2019-02-15 | 北大方正集团有限公司 | Electroplating device |
| CN109788635A (en) * | 2019-03-15 | 2019-05-21 | 深圳市满坤电子有限公司 | A kind of novel processing method of printed circuit board |
Also Published As
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|---|---|
| CN112291941B (en) | 2022-02-18 |
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