CN112291640A - Orthogonal rack equipment and communication equipment - Google Patents
Orthogonal rack equipment and communication equipment Download PDFInfo
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- CN112291640A CN112291640A CN202011186369.8A CN202011186369A CN112291640A CN 112291640 A CN112291640 A CN 112291640A CN 202011186369 A CN202011186369 A CN 202011186369A CN 112291640 A CN112291640 A CN 112291640A
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
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- H04Q1/16—Wiring arrangements for selector switches or relays in frames
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
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Abstract
The application relates to orthogonal rack equipment and communication equipment, and belongs to the technical field of network communication. An orthogonal gantry apparatus, comprising: a single board assembly and a backplane assembly of orthogonal architecture; the single board assembly comprises a first processing board group and a switching board group, wherein the first processing board group is horizontally arranged, and the switching board group is vertically arranged; the back plate assembly is of an orthogonal structure and comprises a first back plate and a second back plate, the first back plate is horizontally arranged, the second back plate is vertically arranged, the first back plate is connected with the second back plate, the switching network plate group is connected with the first back plate, and the first processing plate group is connected with the second back plate. The backboard is split into a first backboard which is horizontally placed and a second backboard which is vertically placed, so that the area of the backboard is increased, the overcurrent capacity of the backboard is further improved, and the number of the slots of the exchange screen plate can be maximized; meanwhile, the position of the back plate is adjusted, so that the back plate is prevented from blocking a heat dissipation air duct of the system.
Description
Technical Field
The application belongs to the technical field of network communication, and particularly relates to orthogonal rack equipment and communication equipment.
Background
With the rapid development of the mobile internet industry, especially the development of 5G communication technology, higher requirements are put on the bandwidth of communication equipment. Under the requirement of high bandwidth, high-speed signals inside the device gradually develop from 1G to 10G, 25G, 56G and 112G; the volume of the equipment is gradually increased, and the trace length of the signal is also rapidly increased. To shorten the track length, a quadrature technique is introduced. In the communication device, the single board component using the orthogonal architecture greatly shortens the high-speed signal transmission distance between the Switch Fabric Unit (SFU) and the Line Processing Unit (LPU).
Fig. 1 is a schematic diagram of a current orthogonal architecture system, in which a plane of a backplane is perpendicular to planes of an LPU and an SFU, an LPU board is connected to the backplane (backplane) by a front-side horizontal insertion, and an SFU board is connected to the backplane by a rear-side vertical insertion. The inventor of the present application found in the course of studying the present application that: in the current orthogonal architecture system, when the number of LPU slots is increased (for example, more than 16), the high-speed signal routing of the SFU card is increased, which greatly improves the design difficulty and equipment cost of the whole machine; at the same time, the orthogonal structure can obstruct the heat dissipation air duct of the system.
Disclosure of Invention
In view of this, an object of the present invention is to provide an orthogonal rack device and a communication device, so as to solve the problem that the conventional orthogonal structure may obstruct a heat dissipation air duct of a system, and occupy a spatial position of an SFU board, so that the number of slots of the SFU board cannot be maximized.
The embodiment of the application is realized as follows:
in a first aspect, an embodiment of the present application provides an orthogonal rack apparatus, including: a single board assembly and a backplane assembly of orthogonal architecture; the single board assembly comprises a first processing board group and a switching board group, wherein the first processing board group is horizontally arranged, and the switching board group is vertically arranged; the back plate assembly comprises a first back plate and a second back plate, the first back plate is horizontally arranged, the second back plate is vertically arranged, the first back plate is connected with the second back plate, the switching network plate group is connected with the first back plate, and the first processing plate group is connected with the second back plate. In the embodiment of the application, the backboard is split into the first backboard which is horizontally arranged and the second backboard which is vertically arranged, so that the area of the backboard is increased, the overcurrent capacity of the backboard is further improved, and the number of the slots of the exchange screen plate can be maximized; meanwhile, the position of the back plate is adjusted, so that a heat dissipation air duct of the system is prevented from being obstructed.
With reference to one possible implementation manner of the embodiment of the first aspect, the backplane assembly further includes: the veneer component also comprises a second processing board group which is horizontally arranged; the third back plate is connected with the first back plate, and the second processing plate group is connected with the switching fabric plate group; the switching network board group is located between the second back board and the third back board, and the second processing board group is connected with the third back board. In the embodiment of the present application, a third backplane is further added to connect more processing boards, so that the number of slots of the processing boards is as large as possible.
With reference to one possible implementation manner of the embodiment of the first aspect, the second processing board group includes a plurality of processing boards, for each processing board, a first surface of the processing board is mounted with a power connector for connecting with the third backplane, a second surface of the processing board is mounted with a low-speed connector for connecting with the third backplane, and the first surface and the second surface are opposite surfaces; correspondingly, the third back plate is provided with a plurality of groups of power connectors and low-speed connectors which are the same as the number of the processing plates in the second processing plate group. In the embodiment of the application, each processing board in the second processing board group is provided with the low-speed connector and the power connector which are connected with the third back board, so that the processing boards can be connected with the third back board in a plugging and unplugging manner, the signal wiring length can be reduced, the design difficulty of the whole machine is simplified, and the equipment cost is reduced.
With reference to a possible implementation manner of the embodiment of the first aspect, the power connectors mounted on the processing board are located at the edge of the board, and the low-speed connectors mounted on the processing board are retracted towards the inner side of the board, so that the power connectors and the low-speed connectors are staggered. In the embodiment of the application, a specific setting mode is adopted, so that the power connector and the low-speed connector are staggered with each other, pin pins of the power connector and the low-speed connector are prevented from interfering with each other, and signal short circuit and interference between signals are avoided.
With reference to one possible implementation manner of the embodiment of the first aspect, the second backplane has the same structure as the third backplane. In the embodiment of the application, the second back plate and the third back plate with the same structure are adopted, so that the production and/or assembly complexity can be simplified.
With reference to a possible implementation manner of the embodiment of the first aspect, the switching network board set includes a plurality of switching network boards, for each switching network board, a first side of the switching network board is installed with a plurality of high-speed connectors that are the same as the number of processing boards in the first processing board set, a second side of the switching network board is installed with a plurality of high-speed connectors that are the same as the number of processing boards in the second processing board set, where the first side and the second side are opposite sides, and a side of the switching network board connected to the first backplane is installed with a power supply connection and a low-speed connector, and correspondingly, the first backplane is installed with a plurality of sets of power supply connectors and low-speed connectors that are the same as the number of switching network boards in the switching network board set. In the embodiment of the application, a plurality of high-speed connectors are respectively arranged on the first side surface and the second side surface of the exchange network board so as to connect more processing boards; meanwhile, the power supply connection and the low-speed connector are arranged to connect the first backboard, so that the exchange screen board, the first backboard and the processing board can be connected in a plugging mode, the signal wiring length can be reduced, the design difficulty of the whole machine is simplified, and the equipment cost is reduced.
With reference to one possible implementation manner of the embodiment of the first aspect, the number of the processing plates in the first processing plate group is the same as the number of the processing plates in the second processing plate group. In the embodiment of the application, the structure that the number of the processing plates in the first processing plate group is the same as that of the processing plates in the second processing plate group is adopted, so that the number of the processing plates connected with the first side surface and the second side surface of the exchange screen plate is the same, and a balance effect can be achieved.
With reference to one possible implementation manner of the embodiment of the first aspect, the first processing board group includes a plurality of processing boards, for each processing board, a first surface of the processing board is mounted with a power connector for connecting the second backplane, a second surface of the processing board is mounted with a low-speed connector for connecting the second backplane, and the first surface and the second surface are opposite surfaces; correspondingly, the second back plate is provided with a plurality of groups of power connectors and low-speed connectors which are the same as the number of the processing plates in the first processing plate group. In the embodiment of the application, each processing board in the first processing board group is provided with the low-speed connector and the power connector which are connected with the second back board, so that the processing boards can be connected with the second back board in a plugging mode, the signal wiring length can be reduced, the design difficulty of the whole machine is simplified, and the equipment cost is reduced.
With reference to a possible implementation manner of the embodiment of the first aspect, the power connectors mounted on the processing board are located at the edge of the board, and the low-speed connectors mounted on the processing board are retracted towards the inner side of the board, so that the power connectors and the low-speed connectors are staggered. In the embodiment of the application, a specific setting mode is adopted, so that the power connector and the low-speed connector are staggered with each other, pin pins of the power connector and the low-speed connector are prevented from interfering with each other, and signal short circuit and interference between signals are avoided.
In a second aspect, an embodiment of the present application further provides a communication device, including: a body and an orthogonal rack device as provided in the above-mentioned first aspect embodiment and/or in connection with any possible implementation of the first aspect embodiment, the orthogonal rack device being connected to the body.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the embodiments of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. The foregoing and other objects, features and advantages of the application will be apparent from the accompanying drawings. Like reference numerals refer to like parts throughout the drawings. The drawings are not intended to be to scale as practical, emphasis instead being placed upon illustrating the subject matter of the present application.
Fig. 1 is a schematic diagram of a conventional orthogonal architecture system.
Fig. 2 shows a schematic structural diagram of an orthogonal rack device provided in an embodiment of the present application.
Fig. 3 shows a schematic structural diagram of another orthogonal rack device provided in an embodiment of the present application.
Fig. 4 shows a schematic structural diagram of a first backplane provided in an embodiment of the present application.
Fig. 5 shows a schematic structural diagram of a processing plate in the first/second processing plate group provided in the embodiment of the present application.
Fig. 6 shows a schematic structural diagram of a second backplane provided in an embodiment of the present application.
Fig. 7 shows an assembly diagram of a processing board and a second backplane provided in the embodiment of the present application.
Fig. 8 shows a schematic structural diagram of a service network board provided in an embodiment of the present application.
Fig. 9 is a schematic diagram illustrating an assembly of a service network board and a first backplane provided in an embodiment of the present application.
Fig. 10 is a schematic diagram illustrating an assembly of a processing board and a service network board according to an embodiment of the present application.
Fig. 11 shows an assembly diagram of the second backplane, the third backplane, and the first backplane provided in the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, relational terms such as "first," "second," and the like may be used solely in the description herein to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally placed when products of the application are used, and are used only for convenience in describing the application and for simplicity in description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the application. Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Further, the term "and/or" in the present application is only one kind of association relationship describing the associated object, and means that three kinds of relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone.
In view of the defects of the conventional orthogonal architecture system (as shown in fig. 1), the embodiment of the present application provides an orthogonal rack device, in which the backplane is split into a first backplane horizontally disposed and a second backplane vertically disposed, so as to increase the number of slots of the processing board, and at the same time, the backplane area is increased, the backplane overcurrent capacity is improved, and the heat dissipation duct of the Switch Fabric Unit (SFU) is not blocked, so that the number of slots of the SFU is maximized. For ease of understanding, the following description will be made in conjunction with the orthogonal gantry apparatus shown in fig. 2. The orthogonal gantry apparatus includes: a single board assembly and a backplane assembly of orthogonal architecture.
The single board assembly comprises a first processing board assembly and a switching board assembly, wherein the first processing board assembly is horizontally arranged, the switching board assembly is vertically arranged, and the first processing board assembly is connected with the switching board assembly, for example, the first processing board assembly is connected with the switching board assembly in an inserting mode. The first Processing board set includes a plurality of Processing boards (e.g., Line Processing Units (LPUs), or Service Processing Units (SPUs)), and the number of the Processing boards may be set according to actual needs, so that the case shown in the figure that includes 4 LPUs cannot be understood as a limitation to the present application. The switching network board set comprises a plurality of switching network boards, the number of which can be set according to actual needs, so that the case that the figure comprises 3 SFUs is not to be understood as a limitation of the present application. For each processing board, high-speed connectors (such as an Examax series connector of amphenol or an Impulse series connector of Molex) for connecting the switching network board are arranged on the edge of the processing board, and the number of the high-speed connectors is consistent with that of the switching network board; correspondingly, for each switching network board, on the edge of the switching network board, there are provided high-speed connectors for connecting each processing board in the first set of processing boards, the number of which corresponds to the number of processing boards, such as 4, 6, 8 or 12. The high-speed signal routing length of the exchange network board can be greatly reduced through the connection of the high-speed connector.
The orthogonal-structure back board assembly comprises a first back board (such as BB-1) and a second back board (such as BB-2), wherein the first back board is horizontally arranged, the second back board is vertically arranged, the first back board is connected with the second back board, for example, the first back board is connected with the second back board in a plugging and unplugging mode, the switching network board group is connected with the first back board, for example, the switching network board group is connected with the first back board in a plugging and unplugging mode, and the first processing board group is connected with the second back board, for example, the first processing board group is connected with the second back board in a plugging and unplugging mode. It should be noted that the position of the first processing board group is not limited to the left side in the drawing, and may be located on the right side in the drawing, and accordingly, the position of the second back board may be not limited to the rear end in the drawing, and may be located at the front end in the drawing.
As an alternative embodiment, as shown in fig. 3, the back plate assembly further includes: a third vertically disposed back panel (e.g., BB-3), in which case the veneer assembly further comprises a second set of treatment panels disposed horizontally. The third backplane is connected with the first backplane, for example, the third backplane is connected with the first backplane by plugging. The second processing board group is connected with the switching board group, for example, the second processing board group is connected with the switching board group in an inserting manner. The switching network board group is located between the second back board and the third back board, and the second processing board group is connected with the third back board, for example, the second processing board group is connected with the third back board in an inserting manner.
Wherein, the first backplane is installed with a plurality of sets of power connectors and low-speed connectors, which are the same as the number of the switching network boards in the switching network board group, for example, if the number of the switching network boards is 4, the first backplane is installed with 4 sets of power connectors and low-speed connectors. Accordingly, for each switching net board, in addition to the plurality of high-speed connectors, the number of which is the same as the number of processing boards in the first processing board group, provided on the side connected to the first processing board group, a power supply connection and a low-speed connector for connecting the first backplane are installed on the side connected to the first backplane of the switching net board. In addition, a power connector and a low-speed connector for connecting the second backboard and the third backboard are also installed on the first backboard. In one embodiment, a schematic diagram of a power connector and a low-speed connector mounted on the first backplane is shown in fig. 4.
Optionally, a power connector for connecting the second backplane and a low-speed connector are mounted on the first surface of the processing board, a low-speed connector for connecting the second backplane is mounted on the second surface of the processing board, and the first surface and the second surface are opposite surfaces. Correspondingly, the second back plate is provided with a plurality of groups of power connectors and low-speed connectors which are the same as the number of the processing plates in the first processing plate group. Optionally, the power connector mounted on the processing board is located at the edge of the board, and the low-speed connector mounted on the processing board retracts toward the inner side of the board, so that the power connector and the low-speed connector are staggered from each other, and the pin of the low-speed connector on the second surface is prevented from interfering with the pin of the power connector on the first surface, so as to prevent signal short circuit and interference between signals. In one embodiment, the positional relationship of the high-speed connector, the low-speed connector, and the power connector mounted on the processing board is shown in fig. 5.
It should be noted that, the positional relationship between the power connector and the low-speed connector mounted on the processing board is not limited to that shown in fig. 5, and in an embodiment, the power connector and the low-speed connector may be located on the same side of the processing board, and the two connectors are staggered to facilitate the insertion with the second backplane. Further, the structures of the respective processing boards in the first processing board group may be different, for example, the power connectors and the low-speed connectors in the partial processing boards are arranged according to the first embodiment (the first surface of the processing board is provided with the power connectors for connecting the second backplane, the second surface of the processing board is provided with the low-speed connectors for connecting the second backplane, the first surface and the second surface are opposite surfaces), and the power connectors and the low-speed connectors in the partial processing boards are arranged according to the second embodiment (the power connectors and the low-speed connectors may be located on the same side of the processing board, and the power connectors and the low-speed connectors are staggered with each other).
And a plurality of groups of power connectors and low-speed connectors which are the same as the processing boards in the first processing board group in number are arranged on the second back board, the low-speed connectors are close to the edges of the boards, and the corresponding power connectors are properly retracted inwards the boards. In addition, a power connector and a low-speed connector for plugging the first backboard are also installed on one side (such as the lower edge in the figure) where the second backboard is connected with the first backboard. In one embodiment, a schematic structural diagram of the second back plate is shown in fig. 6.
The process of assembling the processing board and the second back board in the first processing board group is shown in fig. 7. A processing board, such as an LPU board, is interconnected to the second backplane by power connectors and low speed connectors.
Wherein, for each processing board in the second processing board group, in addition to the high-speed connector for connecting the switching network board (each high-speed connector is connected with the switching chip), a power connector for connecting the third backplane and a low-speed connector are also provided on the edge of the processing board, optionally, a power connector for connecting the third backplane is mounted on the first surface of the processing board, a low-speed connector for connecting the third backplane is mounted on the second surface of the processing board, and the first surface and the second surface are opposite surfaces. Correspondingly, the third back plate is provided with a plurality of groups of power connectors and low-speed connectors which are the same as the number of the processing plates in the second processing plate group. Optionally, the power connector mounted on the processing board is located at the edge of the board, and the low-speed connector mounted on the processing board retracts toward the inner side of the board, so that the power connector and the low-speed connector are staggered from each other, and the pin of the low-speed connector on the second surface is prevented from interfering with the pin of the power connector on the first surface, so as to prevent signal short circuit and interference between signals. Wherein the number of the processing plates in the second processing plate group may be the same as the number of the processing plates in the first processing plate group, and the structure of the processing plates in the second processing plate group is the same as the structure of the processing plates in the first processing plate group.
And a plurality of groups of power connectors and low-speed connectors which are the same as the processing boards in the second processing board group in number are arranged on the third back board, the low-speed connectors are close to the edges of the boards, and the corresponding power connectors are properly retracted inwards the boards. In addition, a power connector and a low-speed connector for plugging the first backboard are further installed on one side of the third backboard connected with the first backboard. Optionally, the structure of the third back plate is the same as the structure of the second back plate.
In the embodiment shown in fig. 3, each switching network board in the switching network board group has a first side surface on which a plurality of high-speed connectors are mounted, the number of which is the same as that of the processing boards in the first processing board group, and a second side surface on which a plurality of high-speed connectors are mounted, the number of which is the same as that of the processing boards in the second processing board group, and each high-speed connector is connected to a switching chip. Wherein the first side and the second side are opposite sides. In addition, the side of the exchange network board connected with the first back board is also provided with a power supply connection and a low-speed connector, and correspondingly, the first back board is provided with a plurality of groups of power supply connectors and low-speed connectors which are the same as the exchange network board in the exchange network board group in number. The structure of the exchange net board is shown in figure 8. It should be noted that the number of high speed connectors on the first side of the switch board and the number of high speed connectors on the second side of the switch board may be different, and therefore, the case that the number of high speed connectors on the first side of the switch board and the number of high speed connectors on the second side of the switch board shown in fig. 8 are the same is not to be construed as a limitation to the present application.
The assembly of the switching network board and the first backplane is schematically shown in fig. 9, the switching network board is perpendicular to the first backplane (BB-1), and the low-speed connector and the power connector at the lower edge of the switching network board are interconnected with the low-speed connector and the power connector in the middle of the first backplane.
Fig. 10 is a schematic view of the assembly of the processing plates and the exchange net plate in the first processing plate group and the second processing plate group. The high-speed connector of the LPU card on the left is interconnected with the high-speed connector on the left of the SFU card; the high-speed connector on the right side of the LPU card is interconnected with the high-speed connector on the right side of the SFU card.
Fig. 11 shows an assembly diagram of the second backplane, the third backplane, and the first backplane. BB-1 is horizontally arranged at the bottom of the equipment, and BB-2 and BB-3 are respectively arranged at BB-1; the low-speed connector and the power connector on the lower edge of the BB-2 are interconnected with the low-speed connector and the power connector on the front end of the BB-1; the low-speed connector and the power connector on the lower edge of the BB-3 are interconnected with the low-speed connector and the power connector on the rear end of the BB-1.
An embodiment of the present application further provides a communication device, including: the body and the orthogonal rack equipment, wherein the orthogonal rack equipment is connected with the body. The main body includes, but is not limited to, a machine frame, a Main Processing Unit (MPU), a power supply, and the like.
The implementation principle and the resulting technical effect of the orthogonal rack device provided by the communication device embodiment are the same as those of the orthogonal rack device embodiment described above, and for the sake of brief description, reference may be made to corresponding contents in the orthogonal rack device embodiment described above where no mention is made in part of the communication device embodiment.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. An orthogonal gantry apparatus, comprising:
the single board assembly comprises a first processing board group and a switching board group, wherein the first processing board group is horizontally arranged, the switching board group is vertically arranged, and the first processing board group is connected with the switching board group;
the back plate assembly is of an orthogonal structure and comprises a first back plate and a second back plate, the first back plate is horizontally arranged, the second back plate is vertically arranged, the first back plate is connected with the second back plate, the switching network plate group is connected with the first back plate, and the first processing plate group is connected with the second back plate.
2. The orthogonal rack apparatus of claim 1, wherein the backplane assembly further comprises: the veneer component also comprises a second processing board group which is horizontally arranged; the third back plate is connected with the first back plate, and the second processing plate group is connected with the switching fabric plate group; the switching network board group is located between the second back board and the third back board, and the second processing board group is connected with the third back board.
3. The orthogonal rack apparatus of claim 2, wherein the second processing board group comprises a plurality of processing boards, a first surface of which is mounted with a power connector for connecting the third backplane and a second surface of which is mounted with a low speed connector for connecting the third backplane for each processing board, the first surface and the second surface being opposite surfaces; accordingly, the number of the first and second electrodes,
and a plurality of groups of power connectors and low-speed connectors which are the same as the processing boards in the second processing board group in number are arranged on the third back board.
4. An orthogonal frame device as claimed in claim 3 wherein the power connectors mounted on the processing board are located at the edge of the board and the low speed connectors mounted on the processing board are recessed inwardly of the board so that the power connectors and low speed connectors are offset from each other.
5. The orthogonal rack apparatus of claim 2 or 3, wherein the structure of the second backplane is the same as the structure of the third backplane.
6. The orthogonal rack device according to claim 2, wherein the switching network board group comprises a plurality of switching network boards, a first side of each of which is mounted with a number of high-speed connectors equal to the number of processing boards in the first processing board group, and a second side of each of which is mounted with a number of high-speed connectors equal to the number of processing boards in the second processing board group, wherein the first side and the second side are opposite sides, and a side of each of which connected to the first backplane is mounted with a power supply connection and a low-speed connector, respectively,
and a plurality of groups of power connectors and low-speed connectors which are the same as the switching network boards in the switching network board group in number are arranged on the first back board.
7. The orthogonal rack apparatus of claim 2, wherein the number of processing plates in the first processing plate group and the number of processing plates in the second processing plate group are the same.
8. The orthogonal rack apparatus of claim 1, wherein the first processing board group comprises a plurality of processing boards, a first surface of which is mounted with a power connector for connecting the second backplane for each processing board, a second surface of which is mounted with a low speed connector for connecting the second backplane, the first surface and the second surface being opposite surfaces; accordingly, the number of the first and second electrodes,
and a plurality of groups of power connectors and low-speed connectors which are the same as the processing boards in the first processing board group in number are arranged on the second back board.
9. An orthogonal frame device as claimed in claim 8 wherein the power connectors mounted on the processing board are located at the edge of the board and the low speed connectors mounted on the processing board are recessed inwardly of the board so that the power connectors and the low speed connectors are offset from each other.
10. A communication device, comprising: a body and an orthogonal rack apparatus as claimed in any of claims 1-9, the orthogonal rack apparatus being connected to the body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011186369.8A CN112291640B (en) | 2020-10-30 | 2020-10-30 | Orthogonal rack equipment and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011186369.8A CN112291640B (en) | 2020-10-30 | 2020-10-30 | Orthogonal rack equipment and communication equipment |
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| Publication Number | Publication Date |
|---|---|
| CN112291640A true CN112291640A (en) | 2021-01-29 |
| CN112291640B CN112291640B (en) | 2022-02-22 |
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| CN202011186369.8A Active CN112291640B (en) | 2020-10-30 | 2020-10-30 | Orthogonal rack equipment and communication equipment |
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| CN112291640B (en) | 2022-02-22 |
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