CN112289691B - Die assembly is used in production of digital analog conversion chip - Google Patents
Die assembly is used in production of digital analog conversion chip Download PDFInfo
- Publication number
- CN112289691B CN112289691B CN202011111629.5A CN202011111629A CN112289691B CN 112289691 B CN112289691 B CN 112289691B CN 202011111629 A CN202011111629 A CN 202011111629A CN 112289691 B CN112289691 B CN 112289691B
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- China
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- fixedly connected
- analog conversion
- conversion chip
- scraper blade
- digital
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 238000000748 compression moulding Methods 0.000 claims abstract description 12
- 238000004140 cleaning Methods 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 238000007790 scraping Methods 0.000 description 12
- 230000006835 compression Effects 0.000 description 8
- 238000007906 compression Methods 0.000 description 8
- 239000002994 raw material Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses a die assembly for digital-to-analog conversion chip production, and relates to the technical field of chip production. The digital-to-analog conversion chip production die assembly comprises a lower die block and an upper die block, wherein the left side of the upper die block is movably connected with a driving device, the bottom of the right side of the driving device is fixedly connected with the lower die block, and the right side of the upper die block is fixedly connected with a cross rod. This compression molding device is used in digital analog conversion chip production, when upward pressing the module to breaking away from and pushing down the module, first baffle can promote the second baffle and rise, and the locating lever breaks away from the jack, and the scraper blade pops out left automatically under drive spring's effect to the scraper blade can scrape last compression molding piece bottom, thereby makes and scrapes the compression molding piece bottom, makes the digital analog conversion chip raw and other materials of going up compression molding piece bottom scraped by the scraper blade, prevents the extravagant and the circumstances that the pollution appears in the digital analog conversion chip raw and other materials course of working of digital analog conversion chip, has improved the practicality of the device.
Description
Technical Field
The invention relates to the technical field of chip production, in particular to a die assembly for digital-to-analog conversion chip production.
Background
Integrated circuit english: integrated circuit, abbreviated IC; microcircuits (microcircuits), microchips, chips/dies (chips) are one way in electronics to miniaturize circuits (mainly including semiconductor devices, also including passive components, etc.) and are often manufactured on semiconductor wafer surfaces.
The digital-to-analog conversion chip needs to use the die assembly to die the raw materials in the production process, so that the raw materials of the digital-to-analog conversion chip are shaped, and the existing digital-to-analog conversion chip die assembly has certain limitation in the die assembly process because part of raw materials of the digital-to-analog conversion chip are adhered to the bottom of the upper die module and the raw materials of the digital-to-analog conversion chip are wasted.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a die assembly for producing a digital-to-analog conversion chip, which solves the problems in the prior art.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a digital analog conversion chip production is with die assembly, includes pushing down the module and going up the module, go up the module left side and drive arrangement swing joint, drive arrangement right side bottom and lower module fixed connection, go up the module right side fixedly connected with horizontal pole, horizontal pole bottom fixedly connected with montant, montant bottom left side fixedly connected with first baffle, first baffle top is provided with the second baffle, second baffle left side bottom fixedly connected with locating lever, the locating lever bottom is pegged graft with the jack, the jack is seted up at scraper blade center department top, scraper blade bottom and laminating of lower module top, scraper blade left side and laminating of last module, the scraper blade right side cup joints inside the fixed sleeve, fixed sleeve outer wall right side and cleaning device inner wall fixedly connected, cleaning device outer wall left side and lower module fixedly connected with, scraper blade right side fixedly connected with drive spring, drive spring right-hand member and fixed sleeve inner wall fixedly connected with, scraper blade bottom fixedly connected with rack, with drive gear top meshing, drive gear and right side fixedly connected with bevel gear, a bevel gear and a right side is connected with the handle, a bevel gear is connected with the right side, bevel gear is connected with the bevel gear fixedly connected with the right side, and is positive.
Preferably, the bottom of the second baffle is fixedly connected with a reset spring, and the bottom end of the reset spring is fixedly connected with the top of the fixed sleeve.
Preferably, the locating rod is sleeved inside the limiting sleeve, and the outer wall of the limiting sleeve is fixedly connected with the inner wall of the cleaning device.
Preferably, the right side of the front surface of the first bevel gear is meshed with the left side of the back surface of the second bevel gear.
Preferably, the handle is fixedly connected with the bearing inner ring, and the bearing outer ring is fixedly connected with the right side of the cleaning device.
Preferably, the pressing block in the upper pressing module is arranged inside the forming bin in the lower pressing module.
(III) beneficial effects
The invention provides a die assembly for digital-to-analog conversion chip production. The beneficial effects are as follows:
this compression molding device is used in digital analog conversion chip production, upward press the module to rise to break away from when pushing down the module, first baffle can promote the second baffle and rise, the locating lever breaks away from the jack, the scraper blade pops up left automatically under drive spring's effect, and the scraper blade can scrape last compression molding bottom, thereby make and go up compression molding bottom's digital analog conversion chip raw and other materials by the scraper blade scraping, prevent the extravagant and the circumstances that the pollution appears in the digital analog conversion chip course of working of digital analog conversion chip raw and other materials, the practicality of the device has been improved, also only need rotate the handle just can reset the scraper blade when resetting, in order to realize the reuse of the device, the practicality of the device has been further improved.
Drawings
FIG. 1 is a schematic diagram of the main structure of the present invention;
fig. 2 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.
In the figure: the cleaning device comprises a pressing module 1, a pressing module 2, a driving device 3, a cross rod 4, a vertical rod 5, a first baffle 6, a second baffle 7, a positioning rod 8, a 9-plug, a 10 scraping plate, a 11 fixing sleeve, a 12 cleaning device, a 13 rack, a 14 transmission gear, a 15 first conical gear, a 16 second conical gear, a 17 rotating shaft, a 18 handle, a 19 reset spring, a 20 limiting sleeve and a 21 driving spring.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-2, the present invention provides a technical solution: the compression molding device for digital-analog conversion chip production comprises a lower compression module 1 and an upper compression module 2, wherein the left side of the upper compression module 2 is movably connected with a driving device 3, the right side bottom of the driving device 3 is fixedly connected with the lower compression module 1, the right side of the upper compression module 2 is fixedly connected with a cross rod 4, the bottom of the cross rod 4 is fixedly connected with a vertical rod 5, the left side of the bottom end of the vertical rod 5 is fixedly connected with a first baffle 6, the top of the first baffle 6 is provided with a second baffle 7, the bottom of the left side of the second baffle 7 is fixedly connected with a positioning rod 8, the bottom of the positioning rod 8 is spliced with a jack 9, the jack 9 is arranged at the top of the center of a scraping plate 10, the bottom of the scraping plate 10 is attached to the top of the lower compression module 1, the left side of the scraping plate 10 is attached to the upper compression module 2, the right side of the scraping plate 10 is sleeved inside a fixed sleeve 11, the right side of the outer wall of the fixed sleeve 11 is fixedly connected with the inner wall of a cleaning device 12, the left side of the outer wall of the cleaning device 12 is fixedly connected with the lower compression module 1, the right side of the scraping plate 10 is fixedly connected with a driving spring 21, the right end of the driving spring 21 is fixedly connected with the inner wall of the fixed sleeve 11, the bottom of the scraping plate 10 is fixedly connected with a rack 13, the rack 13 is meshed with the top of a transmission gear 14, the transmission gear 14 is rotationally connected with the inner wall of the cleaning device 12, the front surface of the transmission gear 14 is fixedly connected with a first conical gear 15, the first conical gear 15 is meshed with a second conical gear 16, the right side of the second conical gear 16 is fixedly connected with a rotating shaft 17, the right end of the rotating shaft 17 is fixedly connected with a handle 18, the handle 18 is rotationally connected with the right side of the cleaning device 12, when an upper pressing module rises to be separated from a lower pressing module, a first baffle can push a second baffle to rise, a positioning rod is separated from an inserting hole, the scraping plate automatically pops left under the action of the driving spring, the bottom of the upper pressing module is scraped by the scraping plate, and the bottom of the upper pressing module is scraped, the digital-to-analog conversion chip raw material at the bottom of the upper pressing module is scraped by the scraping plate, the waste of the digital-to-analog conversion chip raw material and the pollution in the processing process of the digital-to-analog conversion chip are prevented, and the practicability of the device is improved.
Preferably, in this embodiment, a return spring 19 is fixedly connected to the bottom of the second baffle 7, and the bottom end of the return spring 19 is fixedly connected to the top of the fixing sleeve 11.
Preferably, in this embodiment, the positioning rod 8 is sleeved inside the stop collar 20, and the outer wall of the stop collar 20 is fixedly connected with the inner wall of the cleaning device 12.
Preferably, in this embodiment, the right side of the front face of the first bevel gear 15 is in engagement with the left side of the back face of the second bevel gear 16.
Preferably, in this embodiment, the handle 18 is fixedly connected to the bearing inner ring, the bearing outer ring is fixedly connected to the right side of the cleaning device 12, and the scraper can be reset only by rotating the handle during resetting, so that the device can be reused, and the practicability of the device is further improved.
Preferably, in the present embodiment, the press blocks in the upper press module 2 are disposed inside the molding bin in the lower press module 1.
This compression molding device is used in digital analog conversion chip production, upward press the module to rise to break away from when pushing down the module, first baffle can promote the second baffle and rise, the locating lever breaks away from the jack, the scraper blade pops up left automatically under drive spring's effect, and the scraper blade can scrape last compression molding bottom, thereby make and go up compression molding bottom's digital analog conversion chip raw and other materials by the scraper blade scraping, prevent the extravagant and the circumstances that the pollution appears in the digital analog conversion chip course of working of digital analog conversion chip raw and other materials, the practicality of the device has been improved, also only need rotate the handle just can reset the scraper blade when resetting, in order to realize the reuse of the device, the practicality of the device has been further improved.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a digital to analog conversion chip production is with die assembly, includes push down module (1) and last compression moulding piece (2), its characterized in that: the utility model discloses a cleaning device, including upper die piece (2), jack (9), scraper blade (10), upper die piece (2), jack (9), scraper blade (10) left side and upper die piece (2) laminating, scraper blade (10) right side cup joint inside fixed cover (11), fixed cover (11) outer wall right side and cleaning device (12) inner wall fixed connection, left side bottom of second baffle (7) is provided with second baffle (7), second baffle (7) left side bottom fixedly connected with locating lever (8), locating lever (8) bottom and jack (9) peg graft, jack (9) are seted up at scraper blade (10) center department top, scraper blade (10) bottom and lower die piece (1) top laminating, scraper blade (10) left side and upper die piece (2) laminating, scraper blade (10) right side cup joint inside fixed cover (11), fixed cover (11) outer wall right side and cleaning device (12) inner wall fixed connection, left side outer wall (12) and cleaning device (21) are connected with spring (21) fixed connection, scraper blade (10) right side fixed connection, scraper blade (21) fixed connection is fixed with bottom (13), the rack (13) is meshed with the top of the transmission gear (14), the transmission gear (14) is rotationally connected with the inner wall of the cleaning device (12), the front surface of the transmission gear (14) is fixedly connected with the first conical gear (15), the first conical gear (15) is meshed with the second conical gear (16), the right side of the second conical gear (16) is fixedly connected with a rotating shaft (17), the right end of the rotating shaft (17) is fixedly connected with a handle (18), and the handle (18) is rotationally connected with the right side of the cleaning device (12);
the bottom of the second baffle (7) is fixedly connected with a return spring (19), and the bottom end of the return spring (19) is fixedly connected with the top of the fixed sleeve (11).
2. The die assembly for digital-to-analog conversion chip production of claim 1, wherein: the locating rod (8) is sleeved inside the limiting sleeve (20), and the outer wall of the limiting sleeve (20) is fixedly connected with the inner wall of the cleaning device (12).
3. The die assembly for digital-to-analog conversion chip production of claim 1, wherein: the right side of the front face of the first bevel gear (15) is meshed with the back side of the left side of the second bevel gear (16).
4. The die assembly for digital-to-analog conversion chip production of claim 1, wherein: the handle (18) is fixedly connected with the bearing inner ring, and the bearing outer ring is fixedly connected with the right side of the cleaning device (12).
5. The die assembly for digital-to-analog conversion chip production of claim 1, wherein: the pressing block in the upper pressing module (2) is arranged in the forming bin in the lower pressing module (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011111629.5A CN112289691B (en) | 2020-10-16 | 2020-10-16 | Die assembly is used in production of digital analog conversion chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011111629.5A CN112289691B (en) | 2020-10-16 | 2020-10-16 | Die assembly is used in production of digital analog conversion chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112289691A CN112289691A (en) | 2021-01-29 |
| CN112289691B true CN112289691B (en) | 2024-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011111629.5A Active CN112289691B (en) | 2020-10-16 | 2020-10-16 | Die assembly is used in production of digital analog conversion chip |
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| Country | Link |
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| CN (1) | CN112289691B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114242618B (en) * | 2021-12-07 | 2024-10-11 | 江苏友润微电子有限公司 | Packaging device of three-dimensional integrated packaging structure of multi-chip flip chip paster |
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| CN108826999A (en) * | 2018-06-19 | 2018-11-16 | 余瑞钊 | A kind of metallurgical furnace feeding device based on accumulation of energy scraper |
| JP6535908B1 (en) * | 2018-05-04 | 2019-07-03 | 天台深藍智能科技有限公司 | Wall surface polishing equipment for interior |
| CN209829449U (en) * | 2019-05-07 | 2019-12-24 | 蚌埠市荣盛新型建材有限公司 | Rock wool area thermal protection composite panel production coating is with scraper mechanism of being convenient for adjust |
| CN210679400U (en) * | 2019-10-09 | 2020-06-05 | 常州邦泽精密机械有限公司 | Waste collecting mechanism of molding press |
| CN210787456U (en) * | 2019-07-21 | 2020-06-19 | 诸暨市粮工机械有限公司 | Rice scraping device of rubber roll rice huller |
| CN211640481U (en) * | 2019-12-25 | 2020-10-09 | 上海天晓环保工程有限公司 | Concrete waste material scraping device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110302984A (en) * | 2019-07-09 | 2019-10-08 | 佛山克情日用品有限公司 | A kind of public place handrail is antibacterial to remove stain system |
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2020
- 2020-10-16 CN CN202011111629.5A patent/CN112289691B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3067277U (en) * | 1999-09-08 | 2000-03-31 | 清旗 鍾 | Dice exchange system equipment |
| KR20120051352A (en) * | 2010-11-12 | 2012-05-22 | 김영철 | Squeegee lifting device for screen textile printing machine |
| JP6535908B1 (en) * | 2018-05-04 | 2019-07-03 | 天台深藍智能科技有限公司 | Wall surface polishing equipment for interior |
| CN108826999A (en) * | 2018-06-19 | 2018-11-16 | 余瑞钊 | A kind of metallurgical furnace feeding device based on accumulation of energy scraper |
| CN209829449U (en) * | 2019-05-07 | 2019-12-24 | 蚌埠市荣盛新型建材有限公司 | Rock wool area thermal protection composite panel production coating is with scraper mechanism of being convenient for adjust |
| CN210787456U (en) * | 2019-07-21 | 2020-06-19 | 诸暨市粮工机械有限公司 | Rice scraping device of rubber roll rice huller |
| CN210679400U (en) * | 2019-10-09 | 2020-06-05 | 常州邦泽精密机械有限公司 | Waste collecting mechanism of molding press |
| CN211640481U (en) * | 2019-12-25 | 2020-10-09 | 上海天晓环保工程有限公司 | Concrete waste material scraping device |
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| Publication number | Publication date |
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| CN112289691A (en) | 2021-01-29 |
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