CN112289691A - Die assembly is used in production of digital-to-analog conversion chip - Google Patents
Die assembly is used in production of digital-to-analog conversion chip Download PDFInfo
- Publication number
- CN112289691A CN112289691A CN202011111629.5A CN202011111629A CN112289691A CN 112289691 A CN112289691 A CN 112289691A CN 202011111629 A CN202011111629 A CN 202011111629A CN 112289691 A CN112289691 A CN 112289691A
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- fixedly connected
- analog conversion
- conversion chip
- die assembly
- pressing module
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses a die assembly for producing a digital-to-analog conversion chip, and relates to the technical field of chip production. The die assembly for producing the digital-to-analog conversion chip comprises a pressing module and an upper pressing module, wherein the left side of the upper pressing module is movably connected with a driving device, the bottom of the right side of the driving device is fixedly connected with the pressing module, and the right side of the upper pressing module is fixedly connected with a cross rod. This die assembly is used in digital analog conversion chip production, it rises to when breaking away from the lower die block to go up the die block, first baffle can promote the second baffle and rise, the locating lever breaks away from the jack, the scraper blade pops out left automatically under drive spring's effect, and the scraper blade can scrape last die block bottom, thereby make last die block bottom scrape, make the digital analog conversion chip raw and other materials of last die block bottom scraped by the scraper blade, prevent the extravagant and digital analog conversion chip course of working in the circumstances that the pollution appears of digital analog conversion chip raw and other materials, the practicality of the device has been improved.
Description
Technical Field
The invention relates to the technical field of chip production, in particular to a die assembly for producing a digital-to-analog conversion chip.
Background
English integrated circuit: integrated circuit, abbreviated IC; or microcircuits (microcircuits), microchips (microchips), and chips/chips (chips) are one way to miniaturize circuits (including primarily semiconductor devices, including passive components, etc.) in electronics, and are often fabricated on the surface of semiconductor wafers.
The digital-to-analog conversion chip needs to use a die assembly to die raw materials in the production process, so that the raw materials of the digital-to-analog conversion chip are shaped, and the existing digital-to-analog conversion chip die assembly can have the phenomenon that part of the raw materials of the digital-to-analog conversion chip are adhered to the bottom of an upper die block in the die assembly process, so that the waste of the raw materials of the digital-to-analog conversion chip exists, and certain limitation is realized.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a die assembly for producing a digital-to-analog conversion chip, which solves the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a die assembly for producing a digital-to-analog conversion chip comprises a lower die block and an upper die block, wherein the left side of the upper die block is movably connected with a driving device, the bottom of the right side of the driving device is fixedly connected with the lower die block, the right side of the upper die block is fixedly connected with a cross rod, the bottom of the cross rod is fixedly connected with a vertical rod, the left side of the bottom of the vertical rod is fixedly connected with a first baffle, the top of the first baffle is provided with a second baffle, the bottom of the left side of the second baffle is fixedly connected with a positioning rod, the bottom of the positioning rod is spliced with an insertion hole, the insertion hole is formed in the top of the center of a scraper, the bottom of the scraper is jointed with the top of the lower die block, the left side of the scraper is jointed with the upper die block, the right side of the scraper is sleeved in, scraper blade right side fixedly connected with drive spring, drive spring right-hand member and fixed cover inner wall fixed connection, scraper blade bottom fixedly connected with rack, rack and drive gear top meshing, drive gear rotates with the cleaning device inner wall to be connected, drive gear openly and first conical gear fixed connection, first conical gear and second conical gear meshing, second conical gear right side fixedly connected with pivot, pivot right-hand member fixedly connected with handle, the handle rotates with the cleaning device right side to be connected.
Preferably, the bottom of the second baffle is fixedly connected with a return spring, and the bottom end of the return spring is fixedly connected with the top of the fixed sleeve.
Preferably, the positioning rod is sleeved inside the limiting sleeve, and the outer wall of the limiting sleeve is fixedly connected with the inner wall of the cleaning device.
Preferably, the front right side of the first bevel gear is meshed with the left back side of the second bevel gear.
Preferably, the handle is fixedly connected with the inner ring of the bearing, and the outer ring of the bearing is fixedly connected with the right side of the cleaning device.
Preferably, the pressing block in the upper pressing module is arranged inside the forming bin in the lower pressing module.
(III) advantageous effects
The invention provides a die assembly for producing a digital-to-analog conversion chip. The method has the following beneficial effects:
this die assembly is used in production of digital analog conversion chip, it rises to when breaking away from the lower die block to go up the moulding-die piece, first baffle can promote the second baffle and rise, the locating lever breaks away from the jack, the scraper blade pops out left automatically under drive spring's effect, and the scraper blade can scrape last moulding-die piece bottom, thereby make last moulding-die piece bottom scrape, make the digital analog conversion chip raw and other materials of last moulding-die piece bottom scraped by the scraper blade, prevent the extravagant condition that appears polluting in digital analog conversion chip raw and other materials and the digital analog conversion chip course of working, the practicality of the device has been improved, also only need to rotate the handle during resetting and just can reset the scraper blade, in order to realize the reuse of the device, the practicality of the device has further been improved.
Drawings
FIG. 1 is a schematic view of the main structure of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1 according to the present invention.
In the figure: the cleaning device comprises a 1 downward pressing module, a 2 upward pressing module, a 3 driving device, a 4 transverse rod, a 5 vertical rod, a 6 first baffle, a 7 second baffle, an 8 positioning rod, a 9 plug, a 10 scraping plate, a 11 fixing sleeve, a 12 cleaning device, a 13 rack, a 14 transmission gear, a 15 first bevel gear, a 16 second bevel gear, a 17 rotating shaft, a 18 handle, a 19 return spring, a 20 limiting sleeve and a 21 driving spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a die assembly for producing a digital-to-analog conversion chip comprises a lower die block 1 and an upper die block 2, the left side of the upper die block 2 is movably connected with a driving device 3, the bottom of the right side of the driving device 3 is fixedly connected with the lower die block 1, the right side of the upper die block 2 is fixedly connected with a cross rod 4, the bottom of the cross rod 4 is fixedly connected with a vertical rod 5, the left side of the bottom end of the vertical rod 5 is fixedly connected with a first baffle 6, the top of the first baffle 6 is provided with a second baffle 7, the bottom of the left side of the second baffle 7 is fixedly connected with a positioning rod 8, the bottom of the positioning rod 8 is inserted with an insertion hole 9, the insertion hole 9 is arranged at the top of the center of a scraper 10, the bottom of the scraper 10 is attached to the top of the lower die block 1, the left side of the scraper 10 is attached to the upper die block 2, the, the right side of the scraper 10 is fixedly connected with a driving spring 21, the right end of the driving spring 21 is fixedly connected with the inner wall of the fixed sleeve 11, the bottom of the scraper 10 is fixedly connected with a rack 13, the rack 13 is meshed with the top of a transmission gear 14, the transmission gear 14 is rotatably connected with the inner wall of the cleaning device 12, the front surface of the transmission gear 14 is fixedly connected with a first bevel gear 15, the first bevel gear 15 is meshed with a second bevel gear 16, the right side of the second bevel gear 16 is fixedly connected with a rotating shaft 17, the right end of the rotating shaft 17 is fixedly connected with a handle 18, the handle 18 is rotatably connected with the right side of the cleaning device 12, when the upper die block rises to be separated from the lower die block, the first baffle can push the second baffle to rise, the positioning rod is separated from the jack, the scraper automatically pops leftwards under the action of the driving spring, and the scraper can scrape the bottom of, the condition that the digital-to-analog conversion chip raw and other materials are wasted and the digital-to-analog conversion chip is polluted in the processing process is prevented, and the practicability of the device is improved.
Preferably, in this embodiment, a return spring 19 is fixedly connected to the bottom of the second baffle 7, and the bottom end of the return spring 19 is fixedly connected to the top of the fixing sleeve 11.
Preferably, in this embodiment, the positioning rod 8 is sleeved inside the limiting sleeve 20, and the outer wall of the limiting sleeve 20 is fixedly connected with the inner wall of the cleaning device 12.
Preferably, in the present embodiment, the front right side of the first bevel gear 15 is meshed with the left back side of the second bevel gear 16.
Preferably, in this embodiment, the handle 18 is fixedly connected to the inner ring of the bearing, and the outer ring of the bearing is fixedly connected to the right side of the cleaning device 12, so that the scraper can be reset only by rotating the handle during resetting, thereby realizing the recycling of the device and further improving the practicability of the device.
Preferably, in the present embodiment, the press block in the upper press block 2 is disposed inside the molding box in the lower press block 1.
This die assembly is used in production of digital analog conversion chip, it rises to when breaking away from the lower die block to go up the moulding-die piece, first baffle can promote the second baffle and rise, the locating lever breaks away from the jack, the scraper blade pops out left automatically under drive spring's effect, and the scraper blade can scrape last moulding-die piece bottom, thereby make last moulding-die piece bottom scrape, make the digital analog conversion chip raw and other materials of last moulding-die piece bottom scraped by the scraper blade, prevent the extravagant condition that appears polluting in digital analog conversion chip raw and other materials and the digital analog conversion chip course of working, the practicality of the device has been improved, also only need to rotate the handle during resetting and just can reset the scraper blade, in order to realize the reuse of the device, the practicality of the device has further been improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a die assembly is used in production of digital-to-analog conversion chip, includes pushes down module (1) and pushes up module (2), its characterized in that: the upper pressing module (2) is movably connected with the driving device (3) at the left side, the driving device (3) is fixedly connected with the lower pressing module (1) at the right side bottom, the upper pressing module (2) is fixedly connected with a transverse rod (4) at the right side, the transverse rod (4) is fixedly connected with a vertical rod (5) at the bottom, the vertical rod (5) is fixedly connected with a first baffle (6) at the bottom and the left side, a second baffle (7) is arranged at the top of the first baffle (6), a positioning rod (8) is fixedly connected with the bottom of the left side of the second baffle (7), the bottom of the positioning rod (8) is spliced with a jack (9), the jack (9) is arranged at the top of the center of the scraper (10), the bottom of the scraper (10) is spliced with the top of the lower pressing module (1), the left side of the scraper (10) is spliced with the upper pressing module (2), the right, fixed cover (11) outer wall right side and cleaning device (12) inner wall fixed connection, cleaning device (12) outer wall left side and push down module (1) fixed connection, scraper blade (10) right side fixedly connected with drive spring (21), drive spring (21) right-hand member and fixed cover (11) inner wall fixed connection, scraper blade (10) bottom fixedly connected with rack (13), rack (13) and drive gear (14) top meshing, drive gear (14) and cleaning device (12) inner wall rotate to be connected, drive gear (14) openly with first conical gear (15) fixed connection, first conical gear (15) and second conical gear (16) meshing, second conical gear (16) right side fixedly connected with pivot (17), pivot (17) right-hand member fixedly connected with handle (18), the handle (18) is rotatably connected with the right side of the cleaning device (12).
2. The die assembly according to claim 1, wherein: the bottom of the second baffle (7) is fixedly connected with a return spring (19), and the bottom end of the return spring (19) is fixedly connected with the top of the fixed sleeve (11).
3. The die assembly according to claim 1, wherein: the positioning rod (8) is sleeved inside the limiting sleeve (20), and the outer wall of the limiting sleeve (20) is fixedly connected with the inner wall of the cleaning device (12).
4. The die assembly according to claim 1, wherein: the right side of the front surface of the first bevel gear (15) is meshed with the back side of the left side of the second bevel gear (16).
5. The die assembly according to claim 1, wherein: the handle (18) is fixedly connected with the inner ring of the bearing, and the outer ring of the bearing is fixedly connected with the right side of the cleaning device (12).
6. The die assembly according to claim 1, wherein: and a pressing block in the upper pressing module (2) is arranged inside a forming bin in the lower pressing module (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011111629.5A CN112289691B (en) | 2020-10-16 | 2020-10-16 | Die assembly is used in production of digital analog conversion chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011111629.5A CN112289691B (en) | 2020-10-16 | 2020-10-16 | Die assembly is used in production of digital analog conversion chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112289691A true CN112289691A (en) | 2021-01-29 |
| CN112289691B CN112289691B (en) | 2024-01-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011111629.5A Active CN112289691B (en) | 2020-10-16 | 2020-10-16 | Die assembly is used in production of digital analog conversion chip |
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| Country | Link |
|---|---|
| CN (1) | CN112289691B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3067277U (en) * | 1999-09-08 | 2000-03-31 | 清旗 鍾 | Dice exchange system equipment |
| KR20120051352A (en) * | 2010-11-12 | 2012-05-22 | 김영철 | Squeegee lifting device for screen textile printing machine |
| CN108826999A (en) * | 2018-06-19 | 2018-11-16 | 余瑞钊 | A kind of metallurgical furnace feeding device based on accumulation of energy scraper |
| JP6535908B1 (en) * | 2018-05-04 | 2019-07-03 | 天台深藍智能科技有限公司 | Wall surface polishing equipment for interior |
| CN209829449U (en) * | 2019-05-07 | 2019-12-24 | 蚌埠市荣盛新型建材有限公司 | Rock wool area thermal protection composite panel production coating is with scraper mechanism of being convenient for adjust |
| US20200061675A1 (en) * | 2019-07-09 | 2020-02-27 | Dingfang Shuai | Bacteria-controlling and stain-removing system for handrails in public places |
| CN210679400U (en) * | 2019-10-09 | 2020-06-05 | 常州邦泽精密机械有限公司 | Waste collecting mechanism of molding press |
| CN210787456U (en) * | 2019-07-21 | 2020-06-19 | 诸暨市粮工机械有限公司 | Rice scraping device of rubber roll rice huller |
| CN211640481U (en) * | 2019-12-25 | 2020-10-09 | 上海天晓环保工程有限公司 | Concrete waste material scraping device |
-
2020
- 2020-10-16 CN CN202011111629.5A patent/CN112289691B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3067277U (en) * | 1999-09-08 | 2000-03-31 | 清旗 鍾 | Dice exchange system equipment |
| KR20120051352A (en) * | 2010-11-12 | 2012-05-22 | 김영철 | Squeegee lifting device for screen textile printing machine |
| JP6535908B1 (en) * | 2018-05-04 | 2019-07-03 | 天台深藍智能科技有限公司 | Wall surface polishing equipment for interior |
| CN108826999A (en) * | 2018-06-19 | 2018-11-16 | 余瑞钊 | A kind of metallurgical furnace feeding device based on accumulation of energy scraper |
| CN209829449U (en) * | 2019-05-07 | 2019-12-24 | 蚌埠市荣盛新型建材有限公司 | Rock wool area thermal protection composite panel production coating is with scraper mechanism of being convenient for adjust |
| US20200061675A1 (en) * | 2019-07-09 | 2020-02-27 | Dingfang Shuai | Bacteria-controlling and stain-removing system for handrails in public places |
| CN210787456U (en) * | 2019-07-21 | 2020-06-19 | 诸暨市粮工机械有限公司 | Rice scraping device of rubber roll rice huller |
| CN210679400U (en) * | 2019-10-09 | 2020-06-05 | 常州邦泽精密机械有限公司 | Waste collecting mechanism of molding press |
| CN211640481U (en) * | 2019-12-25 | 2020-10-09 | 上海天晓环保工程有限公司 | Concrete waste material scraping device |
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| Publication number | Publication date |
|---|---|
| CN112289691B (en) | 2024-01-26 |
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