CN112285978B - Method for manufacturing liquid crystal display panel 2 - Google Patents
Method for manufacturing liquid crystal display panel 2 Download PDFInfo
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- CN112285978B CN112285978B CN202011430139.1A CN202011430139A CN112285978B CN 112285978 B CN112285978 B CN 112285978B CN 202011430139 A CN202011430139 A CN 202011430139A CN 112285978 B CN112285978 B CN 112285978B
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- annular sealing
- sealing member
- thin film
- film transistor
- transistor array
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
The invention discloses a manufacturing method of a liquid crystal display panel, which comprises the following steps: step A, placing an annular sealing component at the peripheral area of the thin film transistor array substrate, wherein a conductive particle accommodating part is arranged on the surface of the annular sealing component, which is back to the thin film transistor array substrate; step B, placing conductive particles in the conductive particle accommodating part; step C, liquid crystal is arranged in a space surrounded by the annular sealing member on the thin film transistor array substrate; step D, aligning the color film substrate and the thin film transistor array substrate and combining the color film substrate and the thin film transistor array substrate into a whole; e, curing the annular sealing member arranged between the color film substrate and the thin film transistor array substrate to enable the annular sealing member to seal the liquid crystal accommodating space between the thin film transistor array substrate and the color film substrate; the invention can improve the utilization rate of the conductive particles in the annular sealing member of the liquid crystal display panel.
Description
Technical Field
The invention relates to the field of liquid crystal display, in particular to a manufacturing method of a liquid crystal display panel.
Background
A sealing member is disposed between a thin film transistor array substrate and a color film substrate of a conventional liquid crystal display panel, and the sealing member is used for sealing a liquid crystal accommodating space between the thin film transistor array substrate and the color film substrate.
The sealing member is provided with conductive particles, which are typically gold balls (Au balls), and the conductive particles are used for conducting the thin film transistor array substrate and the color film substrate.
The conductive particles are mixed in a sealant material for forming the sealing member, and the sealant material is disposed at a position where the thin film transistor array substrate is provided with the conductive pad and a position where the thin film transistor array substrate is not provided with the conductive pad, so that the conductive particles in the sealant material disposed at the position where the thin film transistor array substrate is not provided with the conductive pad cannot play a role in conducting the thin film transistor array substrate and the color film substrate, that is, a part of the conductive particles is wasted.
Therefore, a new technical solution is needed to solve the above technical problems.
Disclosure of Invention
The invention aims to provide a manufacturing method of a liquid crystal display panel, which can improve the utilization rate of conductive particles in an annular sealing member of the liquid crystal display panel.
In order to solve the problems, the technical scheme of the invention is as follows:
a manufacturing method of a liquid crystal display panel comprises a thin film transistor array substrate, a color film substrate and liquid crystal arranged between the thin film transistor array substrate and the color film substrate, and comprises the following steps: step A, placing an annular sealing component at the peripheral area of the thin film transistor array substrate, wherein a conductive particle containing part is arranged on the surface of the annular sealing component, which faces away from the thin film transistor array substrate; step B, placing conductive particles in the conductive particle accommodating part; step C, arranging liquid crystal in a space surrounded by the annular sealing member on the thin film transistor array substrate; step D, aligning the color film substrate and the thin film transistor array substrate and combining the color film substrate and the thin film transistor array substrate into a whole; and E, curing the annular sealing member arranged between the color film substrate and the thin film transistor array substrate so as to enable the annular sealing member to seal the liquid crystal accommodating space between the thin film transistor array substrate and the color film substrate.
In the above method for manufacturing a liquid crystal display panel, before the step a, the method further includes the steps of: and F, forming the annular sealing component.
In the above method for manufacturing a liquid crystal display panel, the step F includes: f1, arranging the liquid sealant material in a mold with an annular groove; and f2, taking the annular sealing member out of the mold when the liquid sealant material is solidified into the solid annular sealing member.
In the above method for manufacturing a liquid crystal display panel, after step F1 and before step F2, step F further includes: step f3, imprinting the first surface of the liquid sealant material disposed in the annular groove to form the conductive particle accommodating portion.
In the above method for manufacturing a liquid crystal display panel, a protrusion is provided on a bottom surface of the annular groove, and the protrusion is used to form the conductive particle accommodating portion on the second surface of the annular groove.
In the above method of fabricating a liquid crystal display panel, a width of a bottom surface of the annular groove is smaller than or equal to a width of an opening of the annular groove.
In the above method of fabricating a liquid crystal display panel, a position of the conductive particle accommodating part in the annular sealing member corresponds to a position of the conductive pad in the peripheral region of the thin film transistor array substrate.
In the above method of manufacturing a liquid crystal display panel, a diameter of a minimum inscribed circle of the opening of the conductive particle containing part is larger than a diameter of a sphere corresponding to the conductive particle, and a depth of the conductive particle containing part is larger than or equal to the diameter of the sphere corresponding to the conductive particle.
In the method of manufacturing a liquid crystal display panel, the thickness of the annular sealing member is greater than or equal to the diameter of the spheres corresponding to the conductive particles in a direction perpendicular to the plane corresponding to the annular sealing member.
In the above method for manufacturing a liquid crystal display panel, the step a includes: a1, moving the annular sealing component to the upper part of the thin film transistor array substrate; a step of 2, aligning the annular sealing member with the peripheral region of the thin film transistor array substrate; step a3, placing the annular sealing member on the peripheral region from top to bottom.
In the invention, after the annular sealing member is arranged at the peripheral area of the thin film transistor array substrate, the conductive particles are arranged at the position of the annular sealing member corresponding to the conductive pad of the thin film transistor array substrate, so that the positions of the annular sealing member and the color film substrate where the thin film transistor array substrate and the color film substrate need to be conducted (conducted) are arranged on the conductive particles, the conductive particles are saved, the utilization rate of the conductive particles is improved, the conductive particles are prevented from being mixed into a frame adhesive material, and then the conductive particles are arranged at the positions where the thin film transistor array substrate and the color film substrate cannot be conducted, so that the conductive particles are wasted.
Drawings
FIG. 1 is a flow chart of a method for fabricating a liquid crystal display panel according to the present invention;
FIG. 2 is a flowchart illustrating a step of forming a ring-shaped sealing member in the method of fabricating the liquid crystal display panel shown in FIG. 1;
fig. 3 is a flowchart of a step of placing an annular sealing member at a peripheral region of a thin film transistor array substrate in the method of fabricating the liquid crystal display panel shown in fig. 1;
FIG. 4 is a top view of a mold used in the method for fabricating a liquid crystal display panel according to the present invention;
FIG. 5 is a top view of a TFT array substrate with an annular sealing member during the fabrication of a LCD panel according to the method of the present invention;
FIG. 6 is a side view of a liquid crystal display panel manufactured by the method of the present invention.
Detailed Description
The liquid crystal display panel comprises a display area and a peripheral area surrounding the display area, the liquid crystal display panel comprises a thin film transistor array substrate 501, a color film substrate 601 and liquid crystal arranged between the thin film transistor array substrate 501 and the color film substrate 601, an annular sealing member is arranged between the thin film transistor array substrate 501 and the color film substrate 601 and is located in the peripheral area of the liquid crystal display panel, a closed liquid crystal accommodating space is defined by the thin film transistor array substrate 501, the annular sealing member and the color film substrate 601, and the liquid crystal is arranged in the liquid crystal accommodating space.
A first conductive pad is disposed at a portion of the thin film transistor array substrate 501 corresponding to the peripheral region, a second conductive pad is disposed at a portion of the color filter substrate 601 corresponding to the first conductive pad, conductive particles 5021 are disposed in the annular sealing member, and the conductive particles 5021 are in contact with the first conductive pad and the second conductive pad. The conductive particles 5021 are one of spheres and cubes. The conductive particles 5021 comprise a magnetic conductive material, for example, the entirety of the conductive particles 5021 is made of a magnetic conductive material, or the conductive particles 5021 comprise an elongated elastic body and a magnetic conductive material layer covering the elastic body, and the elastic body can be made of rubber, for example. The magnetically conductive material may be iron, for example.
The second conductive pad is connected to a common electrode of the color filter substrate 601, and the first conductive pad is connected to a common line of the thin film transistor array substrate 501. The common line extends from the display region to the peripheral region. The portion of the common line located at the peripheral region is located near the edge of the thin film transistor array substrate 501.
The thin film transistor array substrate 501 includes at least two scan lines, at least two data lines, at least two thin film transistor switches, and at least two pixel electrodes, where the thin film transistor switches include a gate, a source, and a drain, the gate is connected to the scan lines, the source is connected to the data lines, and the drain is connected to the pixel electrodes.
The manufacturing method of the liquid crystal display panel provided by the invention comprises the following steps:
step a (step 102), placing an annular sealing member 502 at the peripheral region of the thin film transistor array substrate 501, wherein a conductive particle accommodating part is provided on the surface of the annular sealing member 502 facing away from the thin film transistor array substrate 501.
Step B (step 103) of placing conductive particles 5021 in the conductive particle holding part.
Step C (step 104) of disposing a liquid crystal in a space surrounded by the annular sealing member 502 on the thin film transistor array substrate 501.
And D, aligning the color film substrate 601 with the thin film transistor array substrate 501 and combining the color film substrate and the thin film transistor array substrate into a whole (step 105).
Step E (step 106), curing the annular sealing member 502 disposed between the color filter substrate 601 and the thin film transistor array substrate 501, so that the annular sealing member 502 seals the liquid crystal accommodating space between the thin film transistor array substrate 501 and the color filter substrate 601.
Before the step A, the manufacturing method further comprises the following steps:
step F (step 101), the annular seal member 502 is formed.
The step F comprises the following steps:
in step f1 (step 1011), the liquid sealant material is disposed in the mold 401 having the annular groove 4011.
Step f2 (step 1013) is to take out the annular sealing member 502 from the mold 401 when the liquid sealant material is solidified into the solid annular sealing member 502.
After the step F1, and before the step F2, the step F further comprises:
step f3 (step 1012), imprinting the first surface of the sealant material in liquid state disposed in the ring-shaped trench 4011 to form the conductive particle accommodating portion.
Alternatively, a bottom surface of the annular groove 4011 is provided with a protrusion 4012, and the protrusion 4012 is configured to form the conductive particle accommodating portion on the second surface of the annular groove 4011.
The width of the bottom surface of the annular trench 4011 is less than or equal to the width of the opening of the annular trench 4011.
The position of the conductive particle accommodating part in the annular sealing member 502 corresponds to the position of the conductive pad in the peripheral region of the thin film transistor array substrate 501.
The diameter of the smallest inscribed circle of the opening of the conductive particle containing part is larger than the diameter of the sphere corresponding to the conductive particles 5021, and the depth of the conductive particle containing part is larger than or equal to the diameter of the sphere corresponding to the conductive particles 5021.
In a direction perpendicular to a plane to which the annular sealing member 502 corresponds, a thickness of the annular sealing member 502 is greater than or equal to a diameter of a sphere to which the conductive particles 5021 correspond.
The step A comprises the following steps:
step a1 (step 1021), the ring-shaped sealing member 502 is moved to above the thin film transistor array substrate 501.
Step a2 (step 1022), aligning the annular sealing member 502 with the peripheral region of the thin film transistor array substrate 501.
Step a3 (step 1023), the annular sealing member 502 is placed on the peripheral region from top to bottom.
The annular groove 4011 comprises four segments of sub-grooves which are connected end to form an annular shape, the widths of any two positions of each segment of the sub-groove are equal, and the widths of the sub-grooves at any two ends are equal.
After the step F1, and before the step F2, the step F further comprises:
step f4, freezing the sealant material in liquid state disposed in the annular groove 4011, so that the sealant material in liquid state is solidified into the annular sealing member 502 in solid state. This can ensure that the width of any two positions of the annular sealing member 502 to be placed on the thin film transistor array substrate 501 is uniform (equal).
As a refinement, before the step F1, the step F further includes:
step f5, coating frame glue powder on the inner surface of the annular groove 4011. This facilitates separation of the annular seal member 502 from the annular groove 4011.
After step F, and before step a, the method further comprises:
step G, cleaning the annular sealing member 502 to remove the sealant powder attached to the surface of the annular sealing member 502.
The implementation environments of the steps F and G are different from the implementation environments of the steps a to E, so that it is ensured that the sealant powder does not affect the implementation environments of the steps a to E.
The step E comprises the following steps:
step e1, heating the annular sealing member 502 disposed between the color filter substrate 601 and the tft array substrate 501 to melt at least a portion of the annular sealing member 502 into a liquid state, which is beneficial to make the annular sealing member 502 tightly contact with the surface of the tft array substrate 501 and the surface of the color filter substrate 601.
Step e2, applying a squeezing force to the combination of the color filter substrate 601 and the thin film transistor array substrate 501 and the portion corresponding to the peripheral region, so that the conductive particles 5021 in the annular sealing member 502 contact both the color filter substrate 601 and the thin film transistor array substrate 501.
Step e3, irradiating the annular sealing member 502 in liquid state with ultraviolet light to cure the annular sealing member 502 in liquid state into a solid annular sealing member.
Prior to the step D, the method further comprises:
step H, heating the portion of the annular sealing member 502 to be in contact with the color filter substrate 601, so as to melt the portion of the annular sealing member 502 to be in contact with the surface of the color filter substrate 601, so that the annular sealing member 502 can be in close contact with the surface of the color filter substrate 601.
The step a1 includes:
the mold 401 is inverted so that the first surface of the annular sealing member 502 faces the thin film transistor array substrate 501.
The step a3 includes:
the annular sealing member 502 is released from the mold 401 such that the annular sealing member 502 is disposed on the peripheral region.
Before the step a3, the step a further includes:
step a4, heating the surface of the annular sealing member 502 to be in contact with the thin film transistor array substrate 501, so as to melt the surface of the annular sealing member 502 to be in contact with the thin film transistor array substrate 501. This makes it possible to bring the annular sealing member 502 into close contact with the thin film transistor array substrate 501 in a liquid state when placed on the thin film transistor array substrate 501, thereby preventing liquid crystal from leaking from a gap between the annular sealing member 502 and the thin film transistor array substrate 501.
After step B, and before step C, the method further comprises:
the sealant material in a liquid state is disposed in the conductive particle accommodating portion provided with the conductive particles 5021, so that the sealant material in a liquid state is used to fill the empty space of the conductive particle accommodating portion.
The annular sealing member 502 is provided with a light guiding column 5022, and the light guiding column 5022 is made of a transparent material.
After the step F1, and before the step F2, the step F further comprises:
step f6, mixing the light guide pillar 5022 into the liquid sealant material. Specifically, the light guiding column 5022 is inserted from the outside of the annular groove 4011 to the inside of the annular groove 4011 at the side of the annular groove 4011.
The length of the light guiding column 5022 is less than the width of the annular groove 4011. The first end of the light guiding column 5022 is flush with the outer side surface of the annular groove 4011, and the second end of the light guiding column 5022 is located in the frame sealant, that is, the first end of the light guiding column 5022 is located on the outer side surface of the annular sealing member 502. The diameter of the cross section of the light guiding column 5022 is less than or equal to the diameter of the sphere corresponding to the conductive particles 5021, and the light guiding column 5022 is used for guiding ultraviolet light outside the annular sealing member 502 into the annular sealing member 502 when the annular sealing member 502 is irradiated by the ultraviolet light, so that the inside of the annular sealing member 502 can also receive the irradiation of the ultraviolet light, and the curing of the inside of the annular sealing member 502 is accelerated. The surface of the second end of the light guide column 5022 and the side surface of the light guide column 5022 are uneven, and the surface of the second end of the light guide column 5022 and the side surface of the light guide column 5022 are used for diffusing ultraviolet light transmitted from the first end into the frame sealant material, so that the frame sealant material can be irradiated by the ultraviolet light.
The mold 401 is provided with a light guide column 5022 insertion hole corresponding to the outer side surface of the annular groove 4011.
The position of the light guiding column 5022 in the annular sealing member 502 is other than the position of the conductive particles 5021 in the annular sealing member 502.
Said step e3 includes:
the position where the light guide pillar 5022 is disposed and the position where the light guide pillar 5022 is not disposed on the outer side surface of the liquid annular sealing member 502 are irradiated with ultraviolet light, so that the liquid annular sealing member 502 is cured into a solid annular sealing member.
In the present invention, after the annular sealing member 502 is disposed at the peripheral region of the tft array substrate 501, the conductive particles 5021 are disposed at the position where the annular sealing member 502 corresponds to the conductive pad of the tft array substrate 501, so that the conductive particles 5021 are disposed at the position where the tft array substrate 501 and the color filter substrate 601 need to be conducted (electrically conductive), the conductive particles 5021 are saved, the utilization rate of the conductive particles 5021 is improved, and the situation that the conductive particles 5021 are wasted due to the fact that the conductive particles 5021 are disposed at the position where the tft array substrate 501 and the color filter substrate 601 cannot be conducted is avoided by mixing the conductive particles 5021 into the sealant 5021.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.
Claims (8)
1. The manufacturing method of the liquid crystal display panel is characterized in that the liquid crystal display panel comprises a thin film transistor array substrate, a color film substrate and liquid crystal arranged between the thin film transistor array substrate and the color film substrate, and the manufacturing method comprises the following steps:
step A, placing an annular sealing component at the peripheral area of the thin film transistor array substrate, wherein a conductive particle containing part is arranged on the surface of the annular sealing component, which faces away from the thin film transistor array substrate;
before the step A, the manufacturing method further comprises the following steps:
step F, forming the annular sealing component;
the step F comprises the following steps:
f1, arranging the liquid sealant material in a mold with an annular groove;
step f2, when the liquid sealant material is solidified into the solid annular sealing member, taking out the annular sealing member from the mold;
after the step F1, and before the step F2, the step F further comprises:
step f6, mixing a light guide column into the liquid frame glue material;
inserting the light guide column into the side surface of the annular groove from the outside of the annular groove to the inside of the annular groove, wherein the length of the light guide column is smaller than the width of the annular groove, the first tail end of the light guide column is flush with the outer side surface of the annular groove, the second tail end of the light guide column is positioned in the frame glue material, and the first tail end of the light guide column is positioned on the outer side surface of the annular sealing member;
step B, placing conductive particles in the conductive particle accommodating part;
step C, arranging liquid crystal in a space surrounded by the annular sealing member on the thin film transistor array substrate;
step D, aligning the color film substrate and the thin film transistor array substrate and combining the color film substrate and the thin film transistor array substrate into a whole;
step E, curing the annular sealing component arranged between the color film substrate and the thin film transistor array substrate so as to enable the annular sealing component to seal a liquid crystal accommodating space between the thin film transistor array substrate and the color film substrate;
the step E comprises the following steps:
step e1, heating the annular sealing member arranged between the color film substrate and the thin film transistor array substrate to melt at least a part of the annular sealing member into a liquid state, so that the annular sealing member is in close contact with the surface of the thin film transistor array substrate and the surface of the color film substrate;
step e2, applying an extrusion acting force to the combination of the color film substrate and the thin film transistor array substrate and the part corresponding to the peripheral area, so that the conductive particles in the annular sealing member are in contact with both the color film substrate and the thin film transistor array substrate;
and e3, irradiating the annular sealing member in the liquid state by using ultraviolet light to cure the annular sealing member in the liquid state into a solid annular sealing member.
2. The method for manufacturing a liquid crystal display panel according to claim 1, wherein after the step F1 and before the step F2, the step F further comprises:
step f3, imprinting the first surface of the liquid sealant material disposed in the annular groove to form the conductive particle accommodating portion.
3. The method of manufacturing a liquid crystal display panel according to claim 2, wherein a bottom surface of the annular groove is provided with a projection for forming the conductive particle housing portion on the second surface of the annular groove.
4. The method of claim 3, wherein a width of a bottom surface of the annular groove is less than or equal to a width of an opening of the annular groove.
5. The method of manufacturing a liquid crystal display panel according to claim 1, wherein a position of the conductive particle housing in the annular sealing member corresponds to a position of the conductive pad in the peripheral region of the thin film transistor array substrate.
6. The method of claim 1, wherein a diameter of a circle of least inscribed circle of the opening of the conductive particle containing part is larger than a diameter of a sphere corresponding to the conductive particle, and a depth of the conductive particle containing part is larger than or equal to the diameter of the sphere corresponding to the conductive particle.
7. The method of claim 1, wherein a thickness of the annular sealing member in a direction perpendicular to a plane to which the annular sealing member corresponds is greater than or equal to a diameter of a sphere to which the conductive particles correspond.
8. The method for manufacturing a liquid crystal display panel according to claim 1, wherein the step a comprises:
a1, moving the annular sealing component to the upper part of the thin film transistor array substrate;
a step of 2, aligning the annular sealing member with the peripheral region of the thin film transistor array substrate;
step a3, placing the annular sealing member on the peripheral region from top to bottom.
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| CN202011430139.1A CN112285978B (en) | 2020-12-09 | 2020-12-09 | Method for manufacturing liquid crystal display panel 2 |
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| CN202011430139.1A CN112285978B (en) | 2020-12-09 | 2020-12-09 | Method for manufacturing liquid crystal display panel 2 |
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| CN112285978B true CN112285978B (en) | 2021-06-18 |
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| CN101697043A (en) * | 2009-06-24 | 2010-04-21 | 深超光电（深圳）有限公司 | Liquid crystal display panel |
| TW201100932A (en) * | 2009-06-24 | 2011-01-01 | Century Display Shenzhen Co | Liquid crystal display and method for fabricating the same |
| CN102692763A (en) * | 2011-03-23 | 2012-09-26 | 黄继远 | Manufacturing method of flexible display panel |
| CN103135287A (en) * | 2011-11-22 | 2013-06-05 | 上海天马微电子有限公司 | Spacer and liquid crystal display panel |
| CN106681061A (en) * | 2017-03-17 | 2017-05-17 | 武汉华星光电技术有限公司 | Liquid crystal display panel, preparation method thereof and liquid crystal display device |
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