CN112271246A - Novel LED lamp bead packaging method - Google Patents
Novel LED lamp bead packaging method Download PDFInfo
- Publication number
- CN112271246A CN112271246A CN202011156525.6A CN202011156525A CN112271246A CN 112271246 A CN112271246 A CN 112271246A CN 202011156525 A CN202011156525 A CN 202011156525A CN 112271246 A CN112271246 A CN 112271246A
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- Prior art keywords
- led
- lamp bead
- led lamp
- heat
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 239000011324 bead Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000005476 soldering Methods 0.000 claims abstract description 4
- 230000004907 flux Effects 0.000 abstract description 6
- 238000000605 extraction Methods 0.000 abstract description 4
- 239000012141 concentrate Substances 0.000 abstract 1
- 230000001737 promoting effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a novel LED lamp bead packaging method which is characterized by comprising the following steps: s1: fixing an LED chip on the upper surface of an LED bracket, wherein the upper surface of the LED bracket is coated with insulating glue in advance; s2, fixing the radiating fins in the radiating cavities of the LED brackets by using heat-conducting glue; s3: connecting the LED chip with the electrode through soldering tin; s4: after the LED support is coated with the heat dissipation glue, a light reflection block is arranged in the inner cavity of the LED support; s5: laying a fluorescent powder layer on the surface of the LED chip; s6: and packaging the fluorescent powder layer by using transparent resin to finish the packaging of the LED lamp beads. Through the convex transparent resin who is provided with the setting for the light that the LED chip gived off concentrates more, through the fin and the heat extraction passageway that are provided with, makes the heat of LED chip can discharge more fast, avoids the heat to pile up, and low LED's luminous flux obtains promoting.
Description
Technical Field
The invention relates to the field of LED lamp bead packaging, in particular to a novel LED lamp bead packaging mode method.
Background
In recent years, the LED illumination is rapidly advanced, and the types and styles of LED products are basically fixed. In the following, what LED application enterprises do is if the performance and quality of LED products are improved. The luminous efficiency of the LED product is an important parameter influencing the performance and quality of the LED product. Light emitting diodes, referred to as LEDs for short, radiate visible light when electrons and holes recombine, and thus can be used to make light emitting diodes. In circuits and instruments as indicator lights or to form text or numerical displays. Gallium arsenide diodes emit red light, gallium phosphide diodes emit green light, silicon carbide diodes emit yellow light, and gallium nitride diodes emit blue light. The organic light emitting diode OLED and the inorganic light emitting diode LED are classified into a semiconductor diode, which converts electric energy into light energy, due to their chemical properties.
The luminous efficiency of the LED is called light efficiency for short. It is the ratio of luminous flux emitted by electric light source and its electric power, and its unit is lumen/watt (lm/W), and is the most important technical parameter for evaluating electric efficiency of electric light source. Luminous flux refers to the amount of light radiation per unit time, expressed in lumens. The higher the luminous flux emitted by the unit electricity power of the light source, the higher the efficiency of converting electric energy into light energy, namely, the higher the luminous efficiency.
However, the existing packaging of the LED lamp bead often has a heat dissipation problem, which leads to the reduction of the luminous flux of the LED, and in addition, the inside of the LED lamp holder has light absorption, which leads to the poor lighting effect of the LED.
Disclosure of Invention
The invention aims to solve the technical problem of low axial resolution in a photoacoustic microscopic imaging system in the prior art, and provides a photoacoustic microscopic imaging method and system which can obtain high axial resolution and are matched by using a high-low frequency probe.
A novel LED lamp bead packaging method is characterized by comprising the following steps:
s1: fixing an LED chip on the upper surface of an LED bracket, wherein the upper surface of the LED bracket is coated with insulating glue in advance;
s2, fixing the radiating fins in the radiating cavities of the LED brackets by using heat-conducting glue;
s3: connecting the LED chip with the electrode through soldering tin;
s4: after the LED support is coated with the heat dissipation glue, a light reflection block is arranged in the inner cavity of the LED support;
s5: laying a fluorescent powder layer on the surface of the LED chip;
s6: and packaging the fluorescent powder layer by using transparent resin to finish the packaging of the LED lamp beads.
Further, the radiating fins are arranged on the upper surface of the radiating cavity at equal intervals.
Furthermore, the shape of the light reflecting block is matched with the inner cavity of the LED bracket, and the upper surface of the light reflecting block is horizontal.
Further, the fluorescent powder layer covers the LED chip and is flush with the upper surface of the light reflecting block.
Further, the transparent resin is arranged to be convex, and two ends of the transparent resin are flush with the LED support.
Further, an air inlet channel is formed in the lower surface of the LED support and penetrates through one side of the LED support to enter the heat dissipation cavity.
Further, the intake passage is provided in plurality.
Further, the LED support further comprises a heat exhaust channel, the heat exhaust channel is a tubular channel, the heat exhaust channel is arranged inside the LED support, one end of the heat exhaust channel is communicated with a heat dissipation cavity, and the other end of the heat exhaust channel penetrates through the upper surface of the LED support.
Furthermore, a through hole is formed in the upper surface of the heat dissipation cavity and is communicated with the heat dissipation cavity and the heat dissipation channel.
The invention has the advantages and beneficial effects that:
the LED lamp bead is mainly provided with the radiating fins, the heat exhaust channel and the air inlet channel, so that heat of the LED chip can be timely exhausted, the luminous flux of the LED lamp bead is improved, light emitted by the LED chip can be irradiated in a more concentrated mode through the arranged reflecting blocks and the transparent resin, light is concentrated, and the lighting effect is enhanced.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
In the figure: 1. an LED support; 2. a heat exhaust channel; 3. a light reflecting block; 4. a phosphor layer; 5. a transparent resin; 6. an LED chip; 7. a heat sink; 8. a heat dissipation cavity; 9. a connecting channel; 10. an intake passage.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
FIG. I is a schematic view of the present invention. A novel LED lamp bead packaging method comprises the following steps:
s1: fixing an LED chip on the upper surface of an LED bracket, wherein the upper surface of the LED bracket is coated with insulating glue in advance;
s2, fixing the radiating fins in radiating cavities of the LED bracket by using heat-conducting glue;
s3: connecting the LED chip with the electrode through soldering tin;
s4: after the LED support is coated with the heat dissipation glue, a light reflection block is arranged in the inner cavity of the LED support;
s5: laying a fluorescent powder layer on the surface of the LED chip;
s6: and packaging the fluorescent powder layer by using transparent resin to finish the packaging of the LED lamp beads.
Further, the radiating fins are arranged on the upper surface of the radiating cavity at equal intervals. The heat dissipation cavity can be well LED out of the heat of the LED chip through the arranged heat dissipation fins.
Furthermore, the shape of the light reflecting block is matched with the inner cavity of the LED bracket, and the upper surface of the light reflecting block is horizontal. Through the reflective block, the light emitted by the LED chip is gathered towards the middle, so that the light intensity is higher.
Further, the fluorescent powder layer covers the LED chip and is flush with the upper surface of the light reflecting block.
Further, the transparent resin is arranged to be convex, and two ends of the transparent resin are flush with the LED support.
Furthermore, an air inlet channel is formed in the lower surface of the LED support and penetrates through one side of the LED support to enter the heat dissipation cavity. Specifically, the intake passage is provided in plurality. The LED support further comprises a heat exhaust channel, the heat exhaust channel is a tubular channel and is arranged inside the LED support, one end of the heat exhaust channel is communicated with a heat dissipation cavity, and the other end of the heat exhaust channel penetrates through the upper surface of the LED support. Through the inlet channel who is provided with for inside cold air can get into the heat dissipation cavity along inlet channel, and because heat extraction channel's setting, make hot-air follow heat extraction channel and discharge, thereby form a heat extraction circulation, make the temperature of LED chip can be stabilized in a scope.
Specifically, the upper surface of the heat dissipation cavity is provided with a through hole which is communicated with the heat dissipation cavity and the heat dissipation channel. Through the through holes, hot air in the heat dissipation cavity can be well guided into the heat dissipation channel.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.
Claims (9)
1. A novel LED lamp bead packaging method is characterized by comprising the following steps:
s1: fixing an LED chip on the upper surface of an LED bracket, wherein the upper surface of the LED bracket is coated with insulating glue in advance;
s2, fixing the radiating fins in the radiating cavities of the LED brackets by using heat-conducting glue;
s3: connecting the LED chip with the electrode through soldering tin;
s4: after the LED support is coated with the heat dissipation glue, a light reflection block is arranged in the inner cavity of the LED support;
s5: laying a fluorescent powder layer on the surface of the LED chip;
s6: and packaging the fluorescent powder layer by using transparent resin to finish the packaging of the LED lamp beads.
2. The novel LED lamp bead packaging method according to claim 1, wherein a plurality of heat dissipation fins are arranged on the upper surface of the heat dissipation cavity at equal intervals.
3. The novel LED lamp bead packaging method according to claim 1, wherein the shape of the light reflecting block is matched with the inner cavity of the LED support, and the upper surface of the light reflecting block is horizontal.
4. The novel LED lamp bead packaging method according to claim 1, wherein the fluorescent powder layer covers the LED chip and is flush with the upper surface of the light reflecting block.
5. The novel LED lamp bead packaging method according to claim 1, wherein the transparent resin is convex and both ends of the transparent resin are flush with the LED support.
6. The novel LED lamp bead packaging method according to claim 1, wherein an air inlet channel is formed in the lower surface of the LED support, and the air inlet channel penetrates through one side of the LED support and enters the heat dissipation chamber.
7. The novel LED lamp bead packaging method according to claim 6, wherein a plurality of air inlet channels are provided.
8. The novel LED lamp bead packaging method according to claim 1, wherein the LED support further comprises a heat exhaust channel, the heat exhaust channel is a tubular channel, the heat exhaust channel is arranged inside the LED support, one end of the heat exhaust channel is communicated with a heat dissipation cavity, and the other end of the heat exhaust channel penetrates through the upper surface of the LED support.
9. The novel LED lamp bead packaging method according to claim 8, wherein a through hole is formed in an upper surface of the heat dissipation cavity, and the through hole is communicated with the heat dissipation cavity and the heat dissipation channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011156525.6A CN112271246A (en) | 2020-10-26 | 2020-10-26 | Novel LED lamp bead packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011156525.6A CN112271246A (en) | 2020-10-26 | 2020-10-26 | Novel LED lamp bead packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112271246A true CN112271246A (en) | 2021-01-26 |
Family
ID=74342178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011156525.6A Withdrawn CN112271246A (en) | 2020-10-26 | 2020-10-26 | Novel LED lamp bead packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112271246A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116404091A (en) * | 2023-04-18 | 2023-07-07 | 永林电子股份有限公司 | LED lamp bead capable of efficiently emitting light |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768500A (en) * | 2017-09-27 | 2018-03-06 | 广东晶科电子股份有限公司 | A kind of LED support and its luminescent device |
| CN110416384A (en) * | 2019-07-30 | 2019-11-05 | 深圳市两岸光电科技有限公司 | A kind of packaging method promoting LED lamp bead light efficiency |
-
2020
- 2020-10-26 CN CN202011156525.6A patent/CN112271246A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768500A (en) * | 2017-09-27 | 2018-03-06 | 广东晶科电子股份有限公司 | A kind of LED support and its luminescent device |
| CN110416384A (en) * | 2019-07-30 | 2019-11-05 | 深圳市两岸光电科技有限公司 | A kind of packaging method promoting LED lamp bead light efficiency |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116404091A (en) * | 2023-04-18 | 2023-07-07 | 永林电子股份有限公司 | LED lamp bead capable of efficiently emitting light |
| CN116404091B (en) * | 2023-04-18 | 2023-11-24 | 永林电子股份有限公司 | LED lamp bead capable of efficiently emitting light |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210126 |
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| WW01 | Invention patent application withdrawn after publication |