CN101737645A - LED (Liquid Emitting Diode) white light bulb and production method thereof - Google Patents
LED (Liquid Emitting Diode) white light bulb and production method thereof Download PDFInfo
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- CN101737645A CN101737645A CN200910156997A CN200910156997A CN101737645A CN 101737645 A CN101737645 A CN 101737645A CN 200910156997 A CN200910156997 A CN 200910156997A CN 200910156997 A CN200910156997 A CN 200910156997A CN 101737645 A CN101737645 A CN 101737645A
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Abstract
The invention provides an LED white light bulb, comprising a radiating base board, an LED chip, a glass shade, an insulating base and an electrode, wherein the LED chip is fixed on the radiating base board, the glass shade is bonded with the radiating base board, light emitted from the LED chip penetrates through the glass cover in which fluorescent powder is spread, the glass cover is filled with nitrogen or air, and the other surface of the radiating base board is connected with the insulating base connected with a lead electrode. The invention also provides a method for producing the LED white light bulb. The invention has the following advantages that the LED chip is directly fixed on the radiating base board, and heat generated during working of the chip is directly radiated by the radiating base board; the surface of the chip is not provided with a covering layer, and when the temperature of the chip is raised, stress releasing space is generated; glass materials can not be aged when the light passes through; and the spherical glass materials contribute to the reduction of total reflection.
Description
Technical field
The invention discloses a kind of LED white light bulb and preparation method thereof.Relate in particular to LED white light bulb of a kind of glass-encapsulated and preparation method thereof.
Background technology
The realization of semiconductor lighting at present comprises three kinds of modes: RGB three-color LED, ultraviolet LED+RGB fluorescent material (the i.e. ultraviolet excitation red, green, blue three-color phosphor of sending with ultraviolet LED, produce three kinds of light of red, green, blue, three kinds of light mix the back and realize white lights), blue-ray LED+yellow fluorescent powder (i.e. blue-light excited yellow fluorescent powder that sends with blue-ray LED, produce gold-tinted, by blue, green mixing, realize white light).For semiconductor lighting, having important problem is optical attenuation, and the mode that solves is that fluorescent material is coated on the led chip at present, with epoxy resin or silica gel led chip is encapsulated then, and its shortcoming is as follows:
Produce heat during (1) owing to led chip work, temperature raises, and the stress that encapsulating material and led chip thermal expansion coefficient difference produce tends to cause the led chip inefficacy.
(2) for solving heat dissipation problem, must be placed on the heat dissipation base after the led chip encapsulation, chip dispels the heat to heat dissipation base by support.
(3) light is by the encapsulating material outgoing, and photon and encapsulating material are had an effect, and makes encapsulating material aging, the light transmission variation.
In order to overcome the light transmission variation problem that organic encapsulating materials such as epoxy resin wear out and cause, application number is that 200710050164.5 patent proposes to adopt glass material to replace the encapsulating material of epoxy resin as led chip, utilize the glass material stable chemical property to solve the encapsulating material problem of aging, but high-power LED illumination tends to adopt many high-power chips, and this patent is difficult to solve the chip cooling problem.
Summary of the invention
The present invention is intended to solve the deficiencies in the prior art, and a kind of LED white light bulb that can effectively solve problems such as heat radiation, reliability, optical attenuation is provided.
The present invention simultaneously also proposes a kind of preparation method of LED white light bulb.
LED white light bulb, comprise: heat-radiating substrate, led chip, cloche, insulating base, electrode, described led chip is fixed on the heat-radiating substrate, described cloche and heat-radiating substrate bind, the luminous cloche that sees through of led chip, coating fluorescent material in the cloche, the another side of described heat-radiating substrate connects insulating base, and insulating base connects the lead-in wire electrode.
The preparation method of LED white light bulb comprises the steps:
(1) one side prepares the printed circuit that is used for the led chip line on heat-conducting substrate, and the part outside the printed circuit is made reflective surface, deposits reflective function material preferably on reflective surface, and the another side of heat-conducting substrate is made insulating base and lead-in wire electrode;
(2) led chip is solid brilliant on heat-conducting substrate by brazing metal, with lead-in wire led chip is coupled together then, and the led chip connected mode is the mixing of a plurality of chip series, parallel or series and parallel;
(3) cloche and the heat-conducting substrate with coated inner wall fluorescent material bonds together, and makes the luminous cloche that sees through of led chip, cloche the inside inflated with nitrogen or air.
Described cloche is hemispherical or circular arc.
Beneficial effect of the present invention is:
(1) led chip directly is fixed on the heat-radiating substrate, and the heat that produces during chip operation directly dispels the heat by heat sink;
(2) chip surface intectate, chip temperature have the stress release space when raising;
(3) glass material light by the time can not wear out;
(4) Qiu Xing glass material helps reducing total reflection.
Description of drawings
Fig. 1 is the heat-radiating substrate generalized section
Fig. 2 is the generalized section behind solid crystalline substance, the routing on the heat-radiating substrate
Fig. 3 is the glass case
Fig. 4 is the bulb generalized section after encapsulating
11. heat-conducting substrate, 12. insulating bases, 13. positive electrodes, 14. negative electrodes, 15. chips, 16. bonding wires, 21. hemispherical glass shells, 22. fluorescent material
The specific embodiment
Below with reference to Fig. 1, Fig. 2, Fig. 3, Fig. 4, do to specify with regard to embodiments of the present invention.LED white light bulb, comprise: heat-radiating substrate 11, led chip 15, cloche 21, insulating base 12, electrode 13,14, described led chip 15 is fixed on the heat-radiating substrate 11, described cloche 21 binds with heat-radiating substrate 11, the luminous cloche 21 that sees through of led chip 21, coating fluorescent material in the cloche 21, the another side of described heat-radiating substrate 11 connects insulating base 12, and insulating base connects lead-in wire electrode 13,14.
Described cloche 21 is a hemispherical.
A kind of LED white light method for dunking and making comprises:
(1) one side prepares the printed circuit that is used for the led chip line on heat-conducting substrate 11, part outside the printed circuit is made reflective surface, on reflective surface, deposit reflective function material preferably, such as argent, aluminium etc., perhaps on reflective surface, realize comprehensive distribution bragg (DBR) reflecting layer with multilayer silica, titanium dioxide; The another side of heat-conducting substrate 11 is made insulating base 12 and lead-in wire electrode 13,14, generalized section as shown in Figure 1;
(2) led chip 15 is solid brilliant on heat-conducting substrate 11 by brazing metal, 16 led chip 15 is coupled together with going between then, and led chip 15 connected modes are mixing of a plurality of chip series, parallel or series and parallel, generalized section as shown in Figure 2.
(3) cloche coated inner wall fluorescent material, coated technique is similar to the fluorescent powder coated technique of fluorescent tube or power saving fluorescent lamps, cloche 21 and heat-conducting substrate 11 are bonded together, make the luminous cloche that sees through of led chip, cloche the inside inflated with nitrogen or air are the generalized sections of LED white light bulb as Fig. 4.
Be to be understood that to be that the foregoing description is just to explanation of the present invention, rather than limitation of the present invention, anyly do not exceed the replacement of the unsubstantiality in the connotation scope of the present invention or the innovation and creation of modification all fall within the protection domain of the present invention.
Claims (7)
1.LED white light bulb, it is characterized in that comprising: heat-radiating substrate, led chip, cloche, insulating base, electrode, described led chip is fixed on the heat-radiating substrate, described cloche and heat-radiating substrate bind, the luminous cloche that sees through of led chip, coating fluorescent material in the cloche, cloche the inside inflated with nitrogen or air, the another side of described heat-radiating substrate connects insulating base, and insulating base connects the lead-in wire electrode.
2. LED white light bulb according to claim 1 is characterized in that described cloche is hemispherical or circular arc.
3. LED white light bulb according to claim 1 is characterized in that described led chip connected mode is the mixing of a plurality of chip series, parallel or series and parallel.
4.LED the preparation method of white light bulb is characterized in that comprising the steps:
(1) one side prepares the printed circuit that is used for the led chip line on heat-conducting substrate, and the part outside the printed circuit is made reflective surface, deposits reflective function material preferably on reflective surface, and the another side of heat-conducting substrate is made insulating base and lead-in wire electrode;
(2) led chip is solid brilliant on heat-conducting substrate by brazing metal, with lead-in wire led chip is coupled together then;
(3) cloche and the heat-conducting substrate with coated inner wall fluorescent material bonds together, and makes the luminous cloche that sees through of led chip, cloche the inside inflated with nitrogen or air.
5. as the preparation method of LED white light bulb as described in the claim 4, it is characterized in that depositing on the described reflective surface reflective function material preferably, be argent, aluminium, perhaps on reflective surface, realize reflecting layer, golden orientation distribution bragg (DBR) with multilayer silica, titanium dioxide.
6. as the preparation method of LED white light bulb as described in the claim 4, it is characterized in that the led chip connected mode is the mixing of a plurality of chip series, parallel or series and parallel.
7. as the preparation method of LED white light bulb as described in the claim 4, it is characterized in that described cloche is hemispherical or circular arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910156997A CN101737645A (en) | 2009-12-31 | 2009-12-31 | LED (Liquid Emitting Diode) white light bulb and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910156997A CN101737645A (en) | 2009-12-31 | 2009-12-31 | LED (Liquid Emitting Diode) white light bulb and production method thereof |
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| CN101737645A true CN101737645A (en) | 2010-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910156997A Pending CN101737645A (en) | 2009-12-31 | 2009-12-31 | LED (Liquid Emitting Diode) white light bulb and production method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101975340A (en) * | 2010-08-06 | 2011-02-16 | 敬俊 | Packaging structure of luminous semiconductor chip and packaging method thereof |
| CN102330892A (en) * | 2010-07-13 | 2012-01-25 | 富士迈半导体精密工业（上海）有限公司 | LED (Light-Emitting Diode) light source module |
| WO2012009921A1 (en) * | 2010-07-19 | 2012-01-26 | Huizhou Light Engine Ltd. | Phosphor coating films and lighting apparatuses using the same |
| WO2014146408A1 (en) * | 2013-03-19 | 2014-09-25 | 东南大学 | Spherical packaging structure for white light led |
| CN105221975A (en) * | 2014-06-17 | 2016-01-06 | 深圳市斯迈得光电子有限公司 | A kind of remote excitation technical pattern LED light source |
| CN105257991A (en) * | 2015-10-09 | 2016-01-20 | 东莞市北科电子科技有限公司 | Ultraviolet light-emitting diode (UV LED) system |
| CN105371123A (en) * | 2015-12-01 | 2016-03-02 | 袁志贤 | Large-power LED (light-emitting diode) module |
| CN106090650A (en) * | 2016-07-29 | 2016-11-09 | 广州依恩施节能科技有限公司 | A kind of LED fluorescent lamp and manufacture method thereof |
| CN107801275A (en) * | 2017-11-20 | 2018-03-13 | 中山驰马灯饰照明设计工程有限公司 | A kind of warm white anti-dazzling LED |
| CN108730939A (en) * | 2017-04-13 | 2018-11-02 | 光宝电子(广州)有限公司 | Light-emitting device |
| WO2023133762A1 (en) * | 2022-01-13 | 2023-07-20 | 厦门市芯颖显示科技有限公司 | Micro led display panel and fabricating method therefor |
-
2009
- 2009-12-31 CN CN200910156997A patent/CN101737645A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102330892A (en) * | 2010-07-13 | 2012-01-25 | 富士迈半导体精密工业（上海）有限公司 | LED (Light-Emitting Diode) light source module |
| WO2012009921A1 (en) * | 2010-07-19 | 2012-01-26 | Huizhou Light Engine Ltd. | Phosphor coating films and lighting apparatuses using the same |
| CN102338307A (en) * | 2010-07-19 | 2012-02-01 | 惠州元晖光电有限公司 | Phosphor coating films and lighting apparatuses using the same |
| CN101975340A (en) * | 2010-08-06 | 2011-02-16 | 敬俊 | Packaging structure of luminous semiconductor chip and packaging method thereof |
| WO2014146408A1 (en) * | 2013-03-19 | 2014-09-25 | 东南大学 | Spherical packaging structure for white light led |
| CN105221975A (en) * | 2014-06-17 | 2016-01-06 | 深圳市斯迈得光电子有限公司 | A kind of remote excitation technical pattern LED light source |
| CN105257991A (en) * | 2015-10-09 | 2016-01-20 | 东莞市北科电子科技有限公司 | Ultraviolet light-emitting diode (UV LED) system |
| CN105371123A (en) * | 2015-12-01 | 2016-03-02 | 袁志贤 | Large-power LED (light-emitting diode) module |
| CN106090650A (en) * | 2016-07-29 | 2016-11-09 | 广州依恩施节能科技有限公司 | A kind of LED fluorescent lamp and manufacture method thereof |
| CN108730939A (en) * | 2017-04-13 | 2018-11-02 | 光宝电子(广州)有限公司 | Light-emitting device |
| CN107801275A (en) * | 2017-11-20 | 2018-03-13 | 中山驰马灯饰照明设计工程有限公司 | A kind of warm white anti-dazzling LED |
| WO2023133762A1 (en) * | 2022-01-13 | 2023-07-20 | 厦门市芯颖显示科技有限公司 | Micro led display panel and fabricating method therefor |
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Open date: 20100616 |