CN112266741A - Solvent type low-elastic-modulus high-strength pressure-sensitive adhesive and preparation method thereof - Google Patents
Solvent type low-elastic-modulus high-strength pressure-sensitive adhesive and preparation method thereof Download PDFInfo
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- CN112266741A CN112266741A CN202011175091.4A CN202011175091A CN112266741A CN 112266741 A CN112266741 A CN 112266741A CN 202011175091 A CN202011175091 A CN 202011175091A CN 112266741 A CN112266741 A CN 112266741A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1818—C13or longer chain (meth)acrylate, e.g. stearyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
Abstract
A solvent type low-elasticity modulus high-strength pressure-sensitive adhesive and a preparation method thereof comprise an acrylate polymer and a PET release film, wherein the acrylate polymer comprises the following components in parts by mass: 6-8 parts of butyl acrylate, 0.05-0.15 part of hydroxyethyl acrylate, 6-8 parts of isooctyl acrylate, 10-16 parts of octadecyl acrylate, 3-4 parts of isodecyl acrylate, 2-4 parts of cyclohexyl methacrylate, 0.05-0.15 part of initiator, 60-70 parts of solvent and 0.1-0.3 part of TDI polymer.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of preparation of pressure-sensitive adhesives for electronic products, in particular to a solvent type pressure-sensitive adhesive with low elastic modulus and high strength and a preparation method thereof.
[ background of the invention ]
The lower the elastic modulus, the larger the elastic modulus deformation, the lower the rigidity, the better the flexibility of the material, and the deformation is easy to occur. In some cases, to increase the elastic deformation work, a material with a lower elastic modulus is used under constant stress, such as a flexible LED display.
According to the mechanics of materials, the bending radius of the material is calculated according to the following formula: and R is E multiplied by D/2P, wherein E is the elastic modulus, R is the bending radius, D is the material thickness, and P is the material strength.
The folding screen mobile phones in the current market are roughly two types, one type is a folding screen mobile phone formed by connecting two independent screens through a rotating shaft, and the folding screen mobile phone can perform multi-task cooperation after being unfolded; the other is to adopt a complete flexible display screen, the joint of the two bodies is bonded by pressure sensitive adhesive and flexible materials, but the contact seam is too wide, but the turning radius is too large when the mobile phone is used, so that the materials are difficult to be prevented from being damaged in the repeated bending process.
Therefore, the problem to be solved in the art is to provide a solvent-type pressure-sensitive adhesive with low elastic modulus and high strength.
[ summary of the invention ]
In order to solve the problems, the pressure-sensitive adhesive prepared from the polymerized solvent-type acrylate adhesive has the characteristics of low elastic modulus, high strength and the like, can be applied to a flexible display, and is large in screen, gorgeous in appearance and convenient to carry compared with a common mobile phone screen.
In order to solve the problems, the invention provides a solvent type low-elasticity modulus high-strength pressure-sensitive adhesive which comprises an acrylate polymer and a PET release film, wherein the acrylate polymer comprises the following components in parts by mass:
6-8 parts of butyl acrylate, 0.05-0.15 part of hydroxyethyl acrylate, 6-8 parts of isooctyl acrylate, 10-16 parts of octadecyl acrylate, 3-4 parts of isodecyl acrylate, 2-4 parts of cyclohexyl methacrylate, 0.05-0.15 part of initiator, 60-70 parts of solvent and 0.1-0.3 part of TDI polymer.
Further, the acrylate polymer comprises the following components in parts by mass: 7 parts of butyl acrylate, 0.105 part of hydroxyethyl acrylate, 7 parts of isooctyl acrylate, 14 parts of octadecyl acrylate, 3.5 parts of isodecyl acrylate, 3 parts of cyclohexyl methacrylate, 0.095 part of initiator, 65 parts of solvent and 0.2 part of TDI polymer.
Further, the initiator is benzoyl peroxide, and the solvent is ethyl acetate.
A preparation method of solvent type low elastic modulus high strength pressure sensitive adhesive applied to claim 1, the method comprises the steps of firstly adding monomers such as butyl acrylate, hydroxyethyl acrylate, isooctyl acrylate, octadecyl acrylate, isodecyl acrylate, cyclohexyl methacrylate and the like into a four-neck flask provided with a stirring, refluxing and dropping device, adding part of ethyl acetate and part of initiator after mixing uniformly, introducing high pure nitrogen at room temperature, controlling the external temperature through a water bath kettle to initiate polymerization reaction, then dropping the rest of initiator and part of ethyl acetate solvent, heating and preserving after dropping, adding the rest of ethyl acetate solvent after finishing heat preservation, controlling the viscosity and solid content of the polymer within the required range, cooling to room temperature to discharge, adding TDI polymer into discharged polyacrylate polymer, stirring uniformly, defoaming and coating on a PET release film substrate, and (4) drying, covering another layer of PET release film to finish the manufacture, and performing performance test after the manufacture is finished.
Further, the temperature of the water bath is controlled to be 80-85 ℃ in the process of controlling the external temperature of the water bath.
Further, the viscosity of the polymer is controlled at 3000-5000mpas, and the solid content is 35%.
Further, the temperature of the oven is kept at 120 ℃ in the drying process, and the drying time is kept for 5 min.
Further, the performance test comprises an initial adhesion test, a permanent adhesion test, a 180-degree peeling force test, a storage modulus, a loss modulus, a tangent angle test and a bending test.
Furthermore, the initial adhesion test adopts an inclined rolling ball method, and the initial adhesion of the sample is tested through the adhesion effect of the adhesive tape on the steel ball when the steel ball and the adhesive surface of the pressure-sensitive adhesive tape sample are temporarily contacted with each other under small pressure.
Further, the permanent adhesion test specifically includes that the test plate attached with the test sample is vertically hung on a test frame, a weight with a specified weight is hung at the lower end of the test plate, and the pulling-off resistance of the adhesive tape is measured by the displacement of the test sample after a certain time or the time required for the test sample to completely separate.
Moreover, the pressure-sensitive adhesive prepared from the polymerized solvent-type acrylate adhesive has the characteristics of low elastic modulus, high strength and the like, can be applied to a flexible display, and is large in screen, gorgeous in appearance and convenient to carry compared with a common mobile phone screen.
[ description of the drawings ]
FIG. 1 is a table of experimental data for the present invention.
[ detailed description ] embodiments
The directional terms of the present invention, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", etc., are only directions in the drawings, and are only used to explain and illustrate the present invention, but not to limit the scope of the present invention.
The solvent type low-elasticity modulus high-strength pressure-sensitive adhesive comprises an acrylate polymer and a PET release film, wherein the acrylate polymer comprises the following components in parts by mass:
6-8 parts of butyl acrylate, 0.05-0.15 part of hydroxyethyl acrylate, 6-8 parts of isooctyl acrylate, 10-16 parts of octadecyl acrylate, 3-4 parts of isodecyl acrylate, 2-4 parts of cyclohexyl methacrylate, 0.05-0.15 part of initiator, 60-70 parts of solvent and 0.1-0.3 part of TDI polymer.
The initiator is benzoyl peroxide, the solvent is ethyl acetate, the glass transition temperature of the cyclohexyl methacrylate is high, a certain strength can be provided for a polymer, the toughness of the polymer is greatly improved under the condition of not influencing the transparency, the flexible monomers such as butyl acrylate, isooctyl acrylate, octadecyl acrylate, isodecyl acrylate and the like endow the polymer with certain flexibility and extensibility, hydroxyethyl acrylate can be copolymerized with other acrylic monomers, an acrylic copolymer with active hydroxyl at a side chain can be prepared, the ethyl acetate is colorless and transparent, and has excellent solubility and quick drying, and the mixing of all components can be realized.
The preparation method of the solvent type low-elastic modulus high-strength pressure-sensitive adhesive comprises the following steps: firstly, adding monomers such as butyl acrylate, hydroxyethyl acrylate, isooctyl acrylate, octadecyl acrylate, isodecyl acrylate, cyclohexyl methacrylate and the like into a four-neck flask provided with a stirring, refluxing and dripping device, uniformly mixing, adding part of ethyl acetate and part of initiator, introducing high-purity nitrogen at room temperature, controlling the external temperature through a water bath kettle to initiate polymerization reaction, dripping the rest of initiator and part of ethyl acetate solvent, heating and storing after dripping, adding the rest of all ethyl acetate solvent after finishing heat preservation, controlling the viscosity and the solid content of the polymer within a required range, cooling to room temperature to discharge, adding TDI polymer into the discharged polyacrylate polymer, uniformly stirring, defoaming, coating on a PET release film substrate, drying, and covering another layer of PET release film to finish the preparation.
Example 1
The solvent type low-elasticity modulus high-strength pressure-sensitive adhesive comprises an acrylate polymer and a PET release film, wherein the acrylate polymer comprises the following components in parts by mass:
6 parts of butyl acrylate, 0.05 part of hydroxyethyl acrylate, 6 parts of isooctyl acrylate, 10 parts of octadecyl acrylate, 3 parts of isodecyl acrylate, 2 parts of cyclohexyl methacrylate, 0.05 part of an initiator, 60 parts of a solvent and 0.1 part of a TDI polymer.
The preparation method of the solvent type low-elastic modulus high-strength pressure-sensitive adhesive comprises the following steps:
the method comprises the following steps:
adding monomers such as butyl acrylate, hydroxyethyl acrylate, isooctyl acrylate, octadecyl acrylate, isodecyl acrylate, cyclohexyl methacrylate and the like into a four-neck flask provided with a stirring, refluxing and dripping device, and uniformly mixing.
Step two:
adding 30 parts of ethyl acetate solvent and 0.03 part of initiator, introducing high-purity nitrogen at room temperature, controlling the external temperature by a water bath kettle, and initiating polymerization reaction, wherein the reaction temperature is controlled to be 80-85 ℃.
Step three:
0.02 part of initiator and 10 parts of ethyl acetate solvent are dripped, the temperature is raised to 90 ℃ after the dripping is finished, the temperature is kept for 1H, the rest 20 parts of ethyl acetate solvent are added after the temperature is kept, the viscosity of the polymer is controlled at 3000-5000mpas, the solid content is controlled at 35 percent, and the mixture is discharged after being cooled to the room temperature.
Step four:
and adding 0.1 part of TDI polymer into the discharged acrylate polymer, uniformly stirring, defoaming, coating on a heavy PET release film substrate, drying in an oven at 120 ℃ for 5min, and coating a layer of PET release film.
Example 2
The solvent type low-elasticity modulus high-strength pressure-sensitive adhesive comprises an acrylate polymer and a PET release film, wherein the acrylate polymer comprises the following components in parts by mass:
7 parts of butyl acrylate, 0.105 part of hydroxyethyl acrylate, 7 parts of isooctyl acrylate, 14 parts of octadecyl acrylate, 3.5 parts of isodecyl acrylate, 3 parts of cyclohexyl methacrylate, 0.095 part of initiator, 65 parts of solvent and 0.2 part of TDI polymer.
The preparation method of the solvent type low-elastic modulus high-strength pressure-sensitive adhesive comprises the following steps:
the method comprises the following steps:
adding monomers such as butyl acrylate, hydroxyethyl acrylate, isooctyl acrylate, octadecyl acrylate, isodecyl acrylate, cyclohexyl methacrylate and the like into a four-neck flask provided with a stirring, refluxing and dripping device, and uniformly mixing.
Step two:
adding 35 parts of ethyl acetate solvent and 0.06 part of initiator, introducing high-purity nitrogen at room temperature, controlling the external temperature by a water bath kettle, and initiating polymerization reaction, wherein the reaction temperature is controlled to be 80-85 ℃.
Step three:
0.035 portion of initiator and 15 portions of ethyl acetate solvent are dripped, the temperature is raised to 90 ℃ after the dripping is finished, the temperature is kept for 1H, the remaining 15 portions of ethyl acetate solvent are added after the temperature is kept, the viscosity of the polymer is controlled at 3000-.
Step four:
and adding 0.2 part of TDI polymer into the discharged acrylate polymer, uniformly stirring, defoaming, coating on a heavy PET release film substrate, drying in an oven at 120 ℃ for 5min, and coating a layer of PET release film.
Example 3
The solvent type low-elasticity modulus high-strength pressure-sensitive adhesive comprises an acrylate polymer and a PET release film, wherein the acrylate polymer comprises the following components in parts by mass:
8 parts of butyl acrylate, 0.15 part of hydroxyethyl acrylate, 8 parts of isooctyl acrylate, 16 parts of octadecyl acrylate, 4 parts of isodecyl acrylate, 4 parts of cyclohexyl methacrylate, 0.15 part of initiator, 70 parts of solvent and 0.3 part of TDI polymer.
The preparation method of the solvent type low-elastic modulus high-strength pressure-sensitive adhesive comprises the following steps:
the method comprises the following steps:
adding monomers such as butyl acrylate, hydroxyethyl acrylate, isooctyl acrylate, octadecyl acrylate, isodecyl acrylate, cyclohexyl methacrylate and the like into a four-neck flask provided with a stirring, refluxing and dripping device, and uniformly mixing.
Step two:
adding 40 parts of ethyl acetate solvent and 0.1 part of initiator, introducing high-purity nitrogen at room temperature, controlling the external temperature by a water bath kettle, and initiating polymerization reaction, wherein the reaction temperature is controlled to be 80-85 ℃.
Step three:
0.05 part of initiator and 20 parts of ethyl acetate solvent are dripped, the temperature is raised to 90 ℃ after the dripping is finished, the temperature is kept for 1H, the rest 10 parts of ethyl acetate solvent are added after the temperature is kept, the viscosity of the polymer is controlled at 3000-5000mpas, the solid content is controlled at 35 percent, and the mixture is discharged after being cooled to the room temperature.
Step four:
and adding 0.3 part of TDI polymer into the discharged acrylate polymer, uniformly stirring, defoaming, coating on a heavy PET release film substrate, drying in an oven at 120 ℃ for 5min, and coating a layer of PET release film.
Experimental example:
the finished product obtained in example 2 is used as a test sample, an external sample is used as a reference, the initial adhesion of the finished product is measured according to the test principle of a GB/T4852 standard initial adhesion tester, the permanent adhesion test is carried out according to the permanent adhesion test experimental method of the pressure-sensitive adhesive tape in GB/T4851, the 180-degree peeling force test is carried out according to GB/T2792-2014, the storage modulus, the loss modulus and the tangent angle are measured by using a DHR series rotational rheometer of an American TA instrument, the bending test is carried out by using a flexible film bending life tester, and the experimental result is shown in FIG. 1.
The initial adhesion test adopts an inclined plane rolling ball method, and the initial adhesion of the sample is tested by the adhesion effect of the adhesive tape on the steel ball when the steel ball and the adhesive surface of the pressure sensitive adhesive tape sample are temporarily contacted with each other under small pressure.
The permanent viscous force test is that the experimental plate with the sample is vertically hung on an experimental frame, a weight with specified weight is hung at the lower end, and the pulling-off resistance of the adhesive tape is measured by the displacement of the sample after being stuck off or the time required for the sample to be completely separated after a certain time.
The pressure-sensitive adhesive prepared from the polymerized solvent-type acrylate adhesive has the characteristics of low elastic modulus, high strength and the like, can be applied to a flexible display, is large compared with a common mobile phone screen, and is gorgeous in appearance and convenient to carry.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (10)
1. The solvent type low-elasticity modulus high-strength pressure-sensitive adhesive is characterized by comprising an acrylate polymer and a PET release film, wherein the acrylate polymer comprises the following components in parts by mass:
6-8 parts of butyl acrylate, 0.05-0.15 part of hydroxyethyl acrylate, 6-8 parts of isooctyl acrylate, 10-16 parts of octadecyl acrylate, 3-4 parts of isodecyl acrylate, 2-4 parts of cyclohexyl methacrylate, 0.05-0.15 part of initiator, 60-70 parts of solvent and 0.1-0.3 part of TDI polymer.
2. The solvent-based low elastic modulus high strength pressure sensitive adhesive according to claim 1, wherein the acrylate polymer comprises the following components in parts by mass: 7 parts of butyl acrylate, 0.105 part of hydroxyethyl acrylate, 7 parts of isooctyl acrylate, 14 parts of octadecyl acrylate, 3.5 parts of isodecyl acrylate, 3 parts of cyclohexyl methacrylate, 0.095 part of initiator, 65 parts of solvent and 0.2 part of TDI polymer.
3. The solvent-based low elastic modulus high strength pressure sensitive adhesive according to claim 1, wherein the initiator is benzoyl peroxide and the solvent is ethyl acetate.
4. A preparation method of solvent type low elastic modulus high strength pressure sensitive adhesive applied to claim 1 is characterized in that monomers such as butyl acrylate, hydroxyethyl acrylate, isooctyl acrylate, octadecyl acrylate, isodecyl acrylate, cyclohexyl methacrylate and the like are firstly added into a four-mouth flask provided with a stirring, refluxing and dropping device, part of ethyl acetate and part of initiator are added after uniform mixing, high pure nitrogen is introduced at room temperature, external temperature is controlled by a water bath kettle to initiate polymerization reaction, then the rest of initiator and part of ethyl acetate solvent are dropped, heating and storing are carried out after dropping is finished, the rest of all ethyl acetate solvent is added after heat preservation is finished, after the viscosity and solid content of polymer are controlled within required ranges, cooling is carried out to room temperature for discharging, TDI polymer is added into discharged polyacrylate polymer and is uniformly stirred, coating the defoamed PET release film on a PET release film substrate, drying, covering another layer of PET release film to finish the manufacture, and performing performance test after the manufacture is finished.
5. The method for preparing the solvent-based low elastic modulus high strength pressure sensitive adhesive according to claim 4, wherein the temperature is controlled to be 80-85 ℃ during the external temperature control of the water bath kettle.
6. The method of claim 4, wherein the controlled polymer viscosity is 3000 mPas 5000 and the solid content is 35%.
7. The preparation method of the solvent-based low elastic modulus high strength pressure sensitive adhesive according to claim 4, wherein the drying temperature is kept at 120 ℃ for 5min during the drying process.
8. The method of making a solvent borne low elastic modulus high strength pressure sensitive adhesive according to claim 4 wherein said performance tests include tack test, permanent adhesion test, 180 degree peel test, storage modulus, loss modulus and tangent angle test, and bending test.
9. The method for preparing the solvent type pressure-sensitive adhesive with low elastic modulus and high strength as claimed in claim 8, wherein the initial adhesion test adopts an inclined rolling ball method, and the initial adhesion of the sample is tested by the adhesion effect of an adhesive tape on a steel ball when the steel ball and the adhesive surface of the pressure-sensitive adhesive tape sample are temporarily contacted with each other under slight pressure.
10. The method for preparing the solvent-type low-elastic-modulus high-strength pressure-sensitive adhesive according to claim 8, wherein the permanent adhesion test is carried out by vertically hanging a test plate with a sample attached thereon on a test frame, hanging a weight with a specified weight at the lower end, and measuring the pull-off resistance of the adhesive tape by using the displacement of the sample after a certain time or the time required for the sample to completely separate.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7108164B1 (en) | 2021-05-27 | 2022-07-28 | 東洋インキＳｃホールディングス株式会社 | Adhesives, Adhesive Sheets, Laminates, and Flexible Displays |
| JP2022181955A (en) * | 2021-05-27 | 2022-12-08 | 東洋インキＳｃホールディングス株式会社 | Adhesive, adhesive sheet, laminate, and flexible display |
| CN113817416A (en) * | 2021-08-25 | 2021-12-21 | 南京汇鑫光电材料有限公司 | High-reworkability acrylate pressure-sensitive adhesive tape and preparation method thereof |
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Application publication date: 20210126 |