CN112265235A - Injection mold temperature lifting system and heating and cooling method - Google Patents
Injection mold temperature lifting system and heating and cooling method Download PDFInfo
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- CN112265235A CN112265235A CN202011023545.6A CN202011023545A CN112265235A CN 112265235 A CN112265235 A CN 112265235A CN 202011023545 A CN202011023545 A CN 202011023545A CN 112265235 A CN112265235 A CN 112265235A
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- heat exchanger
- heat
- mold
- injection mold
- injection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
- B29C45/7331—Heat transfer elements, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses an injection mold temperature lifting system, which comprises: static molding; the die heat exchanger is arranged on the static die; the first heat exchanger is connected with the die heat exchanger, and a first liquid loop is formed between the first heat exchanger and the die heat exchanger; the first circulating pump is arranged on the first liquid loop; the heat circulation system is connected with the first heat exchanger and the second heat exchanger and used for heat exchange between the first heat exchanger and the second heat exchanger; the phase change heat accumulator is connected with the second heat exchanger, and a second liquid loop is formed between the phase change heat accumulator and the second heat exchanger; the second circulating pump is arranged on the second liquid loop; by applying the injection mold temperature lifting system, the injection molding production requirement can be met, and the injection molding energy consumption can be reduced; the invention also provides a heating and cooling method of the injection mold.
Description
Technical Field
The invention relates to the field of plastic product injection, in particular to an injection mold temperature lifting system, an injection mold temperature rising method and an injection mold temperature lowering method.
Background
In the injection molding process of the existing plastic product, because the temperature of an injection mold before injection molding is lower, liquid plastic is often condensed and solidified before filling a mold cavity of the mold, so that the injection mold cavity is blocked, and the injection molding failure is caused; on the other hand, after the completion of moulding plastics, in order to prevent that liquid plastics from splashing, cause the site work personnel to be injured, just can the die sinking take out the injection molding after need waiting for injection mold cooling, seriously restricted injection molding efficiency.
For this reason, the technical staff improves to the injection molding machine, has increased electrical heating module and fan module, before moulding plastics, utilizes electrical heating module to heat injection mold, utilizes the fan module to dispel the heat to the injection mold after the completion of moulding plastics, treats that the mould unloading is got after the injection mold temperature descends, no matter in the middle of injection mold intensification or the process of cooling, all need consume more electric energy, has caused the cost of moulding plastics and has fallen at a high level.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides an injection mold temperature lifting system which can meet the injection production requirement and simultaneously reduce the injection energy consumption.
The injection mold temperature elevating system of the first aspect of the invention comprises: static molding; the die heat exchanger is arranged on the static die; the first heat exchanger is connected with the die heat exchanger, and a first liquid loop is formed between the first heat exchanger and the die heat exchanger; the first circulating pump is arranged on the first liquid loop; the heat circulation system is connected with the first heat exchanger and the second heat exchanger and used for heat exchange between the first heat exchanger and the second heat exchanger; the phase change heat accumulator is connected with the second heat exchanger, and a second liquid loop is formed between the phase change heat accumulator and the second heat exchanger; and the second circulating pump is arranged on the second liquid loop.
According to some embodiments of the present invention, a thermal cycle system includes a semiconductor heat exchange module including a cold side and a hot side, the cold side being connected to a first heat exchanger, the hot side being connected to a second heat exchanger, and a dc power supply connected between the cold side and the hot side.
According to some embodiments of the invention, the first heat exchanger comprises a first heat exchange tank arranged in the first liquid circuit, inside which a plurality of cold ends are arranged in series one after the other.
According to some embodiments of the invention, the second heat exchanger comprises a second heat exchange tank located in the second liquid circuit, inside which a plurality of hot ends are arranged in series.
According to some embodiments of the invention, the stationary die is provided with a plurality of die heat exchangers, which are connected in series in sequence.
According to some embodiments of the invention, the first liquid circuit and the second liquid circuit are both filled with silicone oil.
The injection mold temperature raising method of the second aspect of the invention, which utilizes the injection mold temperature raising and lowering system, comprises the following steps: and starting the first circulating pump, the second circulating pump and the heat circulating system, so that heat passes through the second heat exchanger, the heat circulating system and the first heat exchanger from the phase change heat accumulator in sequence and then reaches the die heat exchanger, and the die heat exchanger heats the static die.
According to some embodiments of the invention, the injection mold temperature increasing method comprises the steps of: and starting the direct current power supply to enable the current to pass through the direct current power supply from the cold end to the hot end.
The injection mold cooling method of the third aspect of the invention, which utilizes the injection mold temperature elevating system, comprises the following steps: and starting the first circulating pump, the second circulating pump and the heat circulating system, so that heat passes through the first heat exchanger, the heat circulating system and the second heat exchanger from the mold heat exchanger in sequence, and reaches the phase change heat accumulator, so that the mold heat exchanger cools the static mold.
According to some embodiments of the invention, a method of cooling an injection mold comprises the steps of: and starting the direct current power supply to enable the current to pass through the direct current power supply from the hot end to the cold end.
By applying the injection mold temperature lifting system, before injection molding, the first circulating pump, the second circulating pump and the heat circulating system can be started, so that heat in the phase change heat accumulator sequentially passes through the second heat exchanger, the heat circulating system and the first heat exchanger to reach the mold heat exchanger, at the moment, the heat in the phase change heat accumulator can be used for heating a static mold, after injection molding, the first circulating pump, the second circulating pump and the heat circulating system can be started, so that the heat of the static mold sequentially enters the first heat exchanger, the heat circulating system and the second heat exchanger to reach the phase change heat accumulator through the mold heat exchanger, and the heat dissipated after the static mold is cooled is stored by the phase change heat accumulator for next injection molding; the heat that the mould gived off this moment can be used for the mould heating for the heat of mould is recycled, for adopting electric heater and fan to rise the method of heating or cooling for the mould, has effectively reduced the electric energy that consumes for the mould intensification or cooling, has reduced the required energy consumption of moulding plastics.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is an isometric view of an injection mold and mold heat exchanger in an embodiment of the invention;
FIG. 2 is a cross-sectional, isometric view of the die heat exchanger of FIG. 1;
FIG. 3 is a system diagram of an injection mold temperature ramping system according to an embodiment of the present invention;
fig. 4 is a cut-away isometric view of the first heat exchanger of fig. 3.
The above figures contain the following reference numerals.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and more than, less than, more than, etc. are understood as excluding the present number, and more than, less than, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1 and 3, the injection mold temperature elevating system of the present embodiment includes: a stationary mold 200; a mold heat exchanger 300 disposed on the stationary mold 200; a first heat exchanger 420 connected to the mold heat exchanger 300, a first liquid circuit being formed between the first heat exchanger 420 and the mold heat exchanger 300; a first circulation pump 410 disposed on the first liquid circuit; a heat cycle system and a second heat exchanger 510, the heat cycle system connecting the first heat exchanger 420 and the second heat exchanger 510, the heat cycle system being used for heat exchange between the first heat exchanger 420 and the second heat exchanger 510; the phase change heat accumulator 530 is connected with the second heat exchanger 510, and a second liquid loop is formed between the phase change heat accumulator 530 and the second heat exchanger 510; and a second circulation pump 520 provided on the second liquid circuit.
It is understood that the injection mold is generally composed of a stationary mold 200 and a movable mold 100.
By applying the injection mold temperature lifting system of the embodiment, before injection molding, the first circulating pump 410, the second circulating pump 520 and the heat circulation system can be started, so that heat in the phase change heat accumulator 530 sequentially passes through the second heat exchanger 510, the heat circulation system and the first heat exchanger 420 to reach the mold heat exchanger 300, at this time, the heat in the phase change heat accumulator 530 can be used for heating the static mold 200, after injection molding, the first circulating pump 410, the second circulating pump 520 and the heat circulation system can be started, so that the heat of the static mold 200 passes through the mold heat exchanger 300 and sequentially enters the first heat exchanger 420, the heat circulation system and the second heat exchanger 510 to reach the phase change heat accumulator 530, so that the heat dissipated after the static mold 200 is cooled is stored by the phase change heat accumulator 530 for next; the heat that the mould gived off this moment can be used for the mould heating for the heat of mould is recycled, for adopting electric heater and fan to rise the method of heating or cooling for the mould, has effectively reduced the electric energy that consumes for the mould intensification or cooling, has reduced the required energy consumption of moulding plastics.
Further, because the heat cycle system does not directly contact with the stationary mold 200 for heat exchange, the heat cycle system can be fixedly arranged on the injection molding equipment, and when the stationary molds 200 with different sizes are replaced, the first liquid loop can be formed by virtue of the flexible pipeline, so that the mold heat exchanger 300 can be conveniently arranged on the stationary molds 300 with different sizes without changing the position of the heat cycle system.
Wherein the heat cycle system may exchange heat between the first heat exchanger 420 and the second heat exchanger 510 in various ways, for example, referring to the related structure of the air-conditioning cooling and heating system in the prior art, such as CN111536586A, a heat pump system is used to exchange heat between the first heat exchanger 420 and the second heat exchanger 510, specifically, plate heat exchangers may be employed to serve as the first heat exchanger 420 and the second heat exchanger 510, and a compressor and a four-way valve are provided between the first heat exchanger 420 and the second heat exchanger 510, a whole independent refrigerant circuit is formed by the four-way valve, the compressor, the first heat exchanger 420 and the second heat exchanger 510, the operating state of the refrigerant circuit is switched by the four-way valve, so that heat is transferred from the first heat exchanger 420 to the second heat exchanger 510, or the second heat exchanger 510 is switched to the first heat exchanger 420.
Wherein the operating state of the four-way valve can be switched such that the first heat exchanger 420 functions as an evaporator and the second heat exchanger 510 functions as a condenser, and heat is transferred from the first heat exchanger 420 to the second heat exchanger 510; the four-way valve can be switched to another working state, the first heat exchanger 420 is used as a condenser, the second heat exchanger 510 is used as an evaporator, and heat is transferred from the second heat exchanger 510 to the first heat exchanger 420.
As shown in fig. 2, on the other hand, in order to simplify the piping arrangement, the thermal cycle system includes a semiconductor heat exchange module, the semiconductor heat exchange module includes a cold end 421 and a hot end 511, the cold end 421 is connected to the first heat exchanger 420, the hot end 511 is connected to the second heat exchanger 510, and a dc power supply 600 is connected between the cold end 421 and the hot end 511; at this time, the semiconductor heat exchange module can exchange heat between the cold end 421 and the hot end 511 through the peltier effect under the current action of the dc power supply 600, and a compressor and a refrigerant pipeline are not required to be arranged, wherein the semiconductor refrigeration element belongs to heat exchange elements commonly used in the prior art such as CN209801916U, and the flow direction of the heat depends on the current direction of the dc power supply 600.
As shown in fig. 4, in order to improve the heat exchange efficiency between the cold end 421 and the first liquid loop, the first heat exchanger 420 includes a first heat exchange box 422, the first heat exchange box 422 is disposed in the first liquid loop, and a plurality of cold ends 421 connected in series in sequence are disposed inside the first heat exchange box 422; wherein, the two ends of the first heat exchange box 422 are both provided with pipe joints for connecting the mold heat exchanger 300 and the first circulation pump 410.
Similar to the first heat exchanger 420, the second heat exchanger 510 includes a second heat exchange box, which is located in the second liquid loop and is provided with a plurality of hot ends 511 connected in series.
As shown in fig. 3, in order to prevent the deformation of the mold due to the excessive local temperature difference during the temperature rise and decrease of the mold, a plurality of mold heat exchangers 300 may be disposed on the stationary mold 200, and the plurality of mold heat exchangers 300 may be sequentially connected in series, and at this time, the plurality of mold heat exchangers 300 sequentially connected in series may be used as a whole heat exchange module to connect the first heat exchanger 420 and the first circulation pump 410.
As shown in fig. 2, the mold heat exchanger 300 may include a heat exchange box 320 and pipe connecting parts 310 provided at both ends of the heat exchange box 320, the heat exchange box 320 being provided on the stationary mold 200 to exchange heat with the stationary mold 200 when a liquid flows through the inside of the heat exchange box 320; for the convenience of heat exchange, the heat exchange box 320 may be made of materials with excellent heat conductivity, such as aluminum alloy or copper alloy.
As shown in FIG. 3, the temperature of the liquid plastic during injection molding can reach more than 200 ℃, and if water is used as the heat exchange liquid in the first liquid loop and the second liquid loop, the water is easily heated to boil, which causes the situation that the internal pressure of the liquid loop is too large and the equipment is damaged, therefore, silicone oil can be used as the heat exchange liquid in the two liquid loops, and since the silicone oil has good stability in a high temperature environment, the silicone oil can endure the high temperature of 180 plus 350 ℃, thereby effectively preventing the system pressure from being too large when the temperature is high.
Note that in the system diagram shown in fig. 3, the solid line indicates a fluid line, and the broken line indicates an electric circuit.
The embodiment further provides an injection mold temperature raising method, which includes the following steps of heating the stationary mold 200 by using the injection mold temperature raising and lowering system: the first circulation pump 410, the second circulation pump 520 and the heat circulation system are started, so that heat passes through the second heat exchanger 510, the heat circulation system and the first heat exchanger 420 from the phase change heat accumulator 530 in sequence and reaches the mold heat exchanger 300, and the mold heat exchanger 300 heats the static mold 200.
The injection mold heating method specifically comprises the following steps: turning on dc power supply 600 so that current flows from cold side 421 through dc power supply 600 to hot side 511; according to the relevant principle of the peltier effect, heat is transferred from the hot end 511 to the cold end 421, so that the heat stored in the phase change heat accumulator 530 can continuously heat the mold heat exchanger 300, and thus the static mold 200 is heated.
The embodiment also provides an injection mold cooling method, which utilizes the injection mold temperature lifting system to cool an injection mold, and comprises the following steps: the first circulation pump 410, the second circulation pump 520, and the heat circulation system are turned on, so that heat passes through the first heat exchanger 420, the heat circulation system, and the second heat exchanger 510 in order from the mold heat exchanger 300 to the phase change heat accumulator 530, so that the mold heat exchanger 300 cools the stationary mold 200.
Further, the injection mold cooling method specifically comprises the following steps: turning on dc power supply 600 so that current flows from hot terminal 511 through dc power supply 600 to cold terminal 421; according to the relevant principle of peltier effect, heat is transferred from the cold end 421 to the hot end 511 at this time, so that the mold heat exchanger 300 is continuously cooled, and then the static mold 200 is cooled, and meanwhile, the heat is transported to the phase change heat accumulator 530 to be stored for heating the static mold 200 next time.
It should be understood that the phase change heat accumulator 530 is a heat storage device widely used in the prior art such as CN111306973A for storing or releasing heat.
It is noted that the injection mold temperature elevating system in the embodiment can be used independently, and can also be used in cooperation with a fan assembly and an electric heating assembly in the prior art, and still can play a role in reducing energy consumption.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. Injection mold temperature operating system, its characterized in that includes:
a stationary mold (200);
a mold heat exchanger (300) disposed on the stationary mold (200);
a first heat exchanger (420) connected to the mold heat exchanger (300), the first heat exchanger (420) and the mold heat exchanger (300) forming a first liquid circuit therebetween;
a first circulation pump (410) disposed on the first liquid circuit;
a thermal cycle system and a second heat exchanger (510), the thermal cycle system connecting the first heat exchanger (420) and the second heat exchanger (510), the thermal cycle system for heat exchange between the first heat exchanger (420) and the second heat exchanger (510);
a phase change heat accumulator (530) connected with the second heat exchanger (510), wherein a second liquid loop is formed between the phase change heat accumulator (530) and the second heat exchanger (510);
a second circulation pump (520) disposed on the second liquid circuit.
2. An injection mold temperature ramping system according to claim 1, wherein the thermal cycle system comprises a semiconductor heat exchange module comprising a cold end (421) and a hot end (511), the cold end (421) being connected to the first heat exchanger (420), the hot end (511) being connected to the second heat exchanger (510), and a dc power supply (600) being connected between the cold end (421) and the hot end (511).
3. An injection mould temperature ramping system according to claim 2, wherein the first heat exchanger (420) comprises a first heat exchange tank (422), the first heat exchange tank (422) being arranged in the first liquid circuit, the first heat exchange tank (422) having a plurality of the cold ends (421) arranged in series one after the other arranged inside.
4. An injection mould temperature ramping system according to claim 2, wherein the second heat exchanger (510) comprises a second heat exchange tank located in the second liquid loop, inside which a plurality of the hot ends (511) are arranged in series one after the other.
5. An injection mold temperature ramping system according to claim 1, wherein a plurality of the mold heat exchangers (300) are provided on the stationary mold (200), the plurality of mold heat exchangers (300) being connected in series in sequence.
6. An injection mold temperature ramping system according to claim 1, wherein the first and second liquid circuits are both impregnated with silicone oil.
7. An injection mold temperature raising method using the injection mold temperature raising and lowering system according to claim 1, characterized by comprising the steps of:
and starting the first circulating pump (410), the second circulating pump (520) and the heat circulating system, so that heat passes through the second heat exchanger (510), the heat circulating system and the first heat exchanger (420) from the phase change heat accumulator (530) in sequence and then reaches the mold heat exchanger (300), and the mold heat exchanger (300) heats the static mold (200).
8. An injection mold temperature increasing method according to claim 7, characterized by comprising the steps of: the dc power supply (600) is turned on so that current flows from the cold side (421) through the dc power supply (600) to the hot side (511).
9. An injection mold cooling method using the injection mold temperature elevating system of claim 1, characterized by comprising the steps of:
and starting the first circulating pump (410), the second circulating pump (520) and the heat circulation system, so that heat passes through the first heat exchanger (420), the heat circulation system and the second heat exchanger (510) from the mold heat exchanger (300) in sequence to reach the phase change heat accumulator (530), and the mold heat exchanger (300) cools the static mold (200).
10. An injection mold cooling method as claimed in claim 9, comprising the steps of: the dc power supply (600) is turned on so that current flows from the hot side (511) through the dc power supply (600) to the cold side (421).
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| CN202011023545.6A CN112265235B (en) | 2020-09-25 | 2020-09-25 | Injection mold temperature lifting system and heating and cooling method |
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| CN202011023545.6A CN112265235B (en) | 2020-09-25 | 2020-09-25 | Injection mold temperature lifting system and heating and cooling method |
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| CN112265235A true CN112265235A (en) | 2021-01-26 |
| CN112265235B CN112265235B (en) | 2022-11-29 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101549546A (en) * | 2009-03-24 | 2009-10-07 | 大连理工大学 | Temperature changing unit of micro injection molding die |
| US20110162829A1 (en) * | 2009-09-17 | 2011-07-07 | Xiaodong Xiang | Systems and Methods of Thermal Transfer and/or Storage |
| CN106915050A (en) * | 2017-05-11 | 2017-07-04 | 遵义市贝康实业有限公司 | A kind of waste heat recycling device for vertical injection molding machine |
| CN108461617A (en) * | 2018-02-08 | 2018-08-28 | 南方科技大学 | Temperature regulation device and preparation method |
| CN108908804A (en) * | 2018-08-29 | 2018-11-30 | 福州大学 | It is a kind of using semiconductor cooler and the mold thermal shock device of phase-change material |
-
2020
- 2020-09-25 CN CN202011023545.6A patent/CN112265235B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101549546A (en) * | 2009-03-24 | 2009-10-07 | 大连理工大学 | Temperature changing unit of micro injection molding die |
| US20110162829A1 (en) * | 2009-09-17 | 2011-07-07 | Xiaodong Xiang | Systems and Methods of Thermal Transfer and/or Storage |
| CN106915050A (en) * | 2017-05-11 | 2017-07-04 | 遵义市贝康实业有限公司 | A kind of waste heat recycling device for vertical injection molding machine |
| CN108461617A (en) * | 2018-02-08 | 2018-08-28 | 南方科技大学 | Temperature regulation device and preparation method |
| CN108908804A (en) * | 2018-08-29 | 2018-11-30 | 福州大学 | It is a kind of using semiconductor cooler and the mold thermal shock device of phase-change material |
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| CN112265235B (en) | 2022-11-29 |
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