CN112259667A - 一种led器件及其封装方法 - Google Patents
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Abstract
本发明公开了一种LED器件及其封装方法,其技术方案的要点是该LED器件包括有基板,在基板外围设有金属化线路层,在金属化线路层上设有光窗盖板,光窗盖板包括有金属件,在金属件上分别设有通光孔、盖住通光孔的光窗透镜,光窗盖板设于基板上方使光窗盖板与基板之间形成腔体,在腔体内设有LED芯片,LED芯片固定在基板上。光窗透镜采用熔焊或烧结工艺与金属件封装成光窗盖板,光窗盖板经相应工装治具组装到基板的金属化线路层上,最后通过电阻焊或熔焊工艺将光窗盖板与基板封接为一体。本发明基板、金属件、光窗透镜均采用无机材料,焊料、金属化线路层以及所有的镀层也采用无机材料,能够实现高气密性、高可靠性和无机封装。
Description
【技术领域】
本发明涉及LED封装领域,尤其是涉及一种LED器件及其封装方法。
【背景技术】
随着LED技术的日渐成熟,LED在各行各业得到了广泛应用。近年来5G技术的发展带动了万物互联、智能家居,赋予了光不同的含义,其中红外LED在安防、人脸识别、机器视觉、智能控制上起到了重要作用;年初新冠疫情,加深了人们对自身健康状况的关注,紫外线消毒杀菌产品首次进入公众视野,与生活息息相关的各种医用、家用紫外线LED消毒产品及方案层出不穷,LED已不仅仅只作为照明光源使用。伴随着应用场景的转变和多样化,对LED的可靠性提出了新的要求,尤其是在不可见光波段光源的理化特性易使硅胶或环氧树脂等有机材料老化、黄变,透氧透湿和透光特性发生变化导致器件失效或死灯,传统意义上的硅胶或环氧树脂封装形式已不能很好的满足产品的可靠性要求。
因此寻求一种可靠的气密性、无机封装技术显得较为迫切。
【发明内容】
本发明目的是克服了现有技术的不足,提供一种LED器件及其封装方法,其相较于传统LED光源具有高气密性、无机封装,主要应用于对气密要求高和不适宜有机材料封装的光源器件上。
本发明是通过以下技术方案实现的:
一种LED器件,其特征在于:包括有基板2,在所述基板2的外围设有金属化线路层4,在所述金属化线路层4上设有光窗盖板1,所述光窗盖板1包括有金属件101,在金属件101上分别设有通光孔、盖住所述通光孔的光窗透镜102,光窗盖板1为腔体结构,所述光窗盖板1设于所述基板2的上方使所述光窗盖板1与所述基板2之间形成腔体6,在所述腔体6内设有LED芯片3,所述LED芯片3固定在所述基板2上,所述基板2为平面结构。
如上所述的LED器件,其特征在于:所述光窗透镜102与所述金属件101之间设有将光窗透镜102、金属件101焊接连接的焊料5,所述焊料5呈环形,所述焊料5由无机材料制成。
如上所述的LED器件,其特征在于:所述基板2的材质为陶瓷、铝材、铜材、铝碳化硅基板中的一种。
如上所述的LED器件,其特征在于:所述光窗透镜102的材质为石英玻璃,所述光窗透镜102的形状为方形、圆形、椭球形、半球形中的一种。
如上所述的LED器件,其特征在于:所述金属件101的材质为科瓦合金或铜或铝,所述金属件101底部边沿部分设有延伸出的金属焊边,所述金属焊边与所述金属化线路层4焊接连接,所述金属焊边的宽度H1≧0.3毫米,所述金属化线路层4的厚度H2≧60微米,所述金属化线路层4表面设有镀层,所述镀层的材质为金或镍金。
如上所述的LED器件,其特征在于:所述金属件101表面设有镀镍层,所述腔体6的深度H3≧0.5毫米。
一种如上所述LED器件的封装方法,其特征在于包括有:
在所述基板2边沿设置有环形金属化线路层4,金属化线路层4线路层厚度不低于60微米,金属化线路层4表面镀金或镍金处理;
LED芯片3通过锡膏固晶或共晶工艺绑定在基板2上;
通过模具冲压制作所述金属件101,所述金属件101表面做镀镍处理;
切割与所述通光孔大小匹配的石英玻璃片制成光窗透镜102,对光窗透镜102边缘≦0.5毫米的环形区域做镀层处理,镀层厚度≧10微米,将光窗透镜102通过工装治具装入金属件101内,采用熔焊工艺将光窗透镜102与金属件101匹配接触部位进行熔接制成光窗盖板1,或者添加焊料5将光窗透镜102与金属件101烧结成光窗盖板1;
光窗盖板1经治具组装到基板2的金属化线路层4上,通过电阻焊工艺或熔焊工艺将光窗盖板1与基板2封接为一体,制成LED器件。
如上所述LED器件的封装方法,其特征在于:
所述电阻焊工艺为平行缝焊,所述熔焊工艺为激光焊。
如上所述LED器件的封装方法,其特征在于:所述焊料5的组分为TiCuBiZnMn,其中Ti占6.8%-25%、Cu占19.6%-34%、Bi占4.2%-7.3%、Zn占21%-37%、Mn占0.56%-1.2%。
如上所述LED器件的封装方法,其特征在于:所述光窗透镜102边缘的镀层组分为镍金或铜。
与现有技术相比,本发明有如下优点:
1、本发明基板、金属件、光窗透镜均采用无机材料,焊料、金属化线路层以及所有的镀层也采用无机材料,采用烧结工艺或熔焊工艺将光窗透镜与金属件封接为一体制成光窗盖板,采用电阻焊或熔焊工艺将光窗盖板与基板结合为一体制成LED器件,实现高气密性、无机封装。
2、本发明相较于传统LED光源,具有气密性好、无机封装、结构简单,主要应用于对气密性及可靠性要求高和不适宜有机材料封装的光源器件。尤其是UVC和大功率IR LED光源器件中,能较好的解决现有胶封和同类型无机封装方案中玻璃或石英光窗易掉透镜、器件光衰严重和气密性不足的问题。
【附图说明】
图1是本发明LED器件的基板结构示意图;
图2是本发明LED器件实施例一的结构剖视示意图,图中的光窗透镜与金属件烧结连接,光窗盖板为腔体结构,基板为平面结构,光窗透镜的形状为方形或圆形;
图3是本发明LED器件实施例二的结构剖视示意图,图中的光窗透镜与金属件烧结连接,光窗盖板为腔体结构,基板为平面结构,光窗透镜的形状为半球形或椭球形;
图4是本发明红LED器件实施例三的结构剖视示意图,图中的光窗透镜与金属件烧结连接,光窗盖板为平面结构,基板为腔体结构,光窗透镜的形状为半球形或椭球形;
图5是本发明红LED器件实施例四的结构剖视示意图,图中的光窗透镜与金属件熔焊连接,光窗盖板为平面结构,基板为腔体结构,光窗透镜的形状为方形或圆形;
图6是本发明LED器件实施例五的结构剖视示意图,图中的光窗透镜与金属件熔焊连接,光窗盖板为平面结构,基板为腔体结构,光窗透镜的形状为半球形或椭球形。
图中:1为光窗盖板;101为金属件;102为光窗透镜;2为基板;3为LED芯片;4为金属化线路层;5为焊料;6为腔体。
【具体实施方式】
下面结合附图对本发明技术特征作进一步详细说明以便于所述领域技术人员能够理解。
一种LED器件,包括有基板2,在所述基板2的外围设有金属化线路层4,在所述金属化线路层4上设有光窗盖板1,所述光窗盖板1包括有金属件101,在金属件101上分别设有通光孔、盖住所述通光孔的光窗透镜102,光窗盖板1的尺寸与基板2尺寸匹配,光窗盖板1带有腔体结构,所述光窗盖板1设于所述基板2的上方使所述光窗盖板1与所述基板2之间形成腔体6,在所述腔体6内设有LED芯片3,所述LED芯片3设有一个或多个,固定在所述基板2上。
进一步地,所述光窗透镜102通过焊料5、采用熔焊工艺与所述金属件101封装成光窗盖板1,所述光窗盖板1形状不限于方形、圆形、锥形等;所述焊料5呈环形,所述焊料5由无机材料制成。
如上所述的LED器件,所述腔体6的深度H3≧0.5毫米。
如上所述的LED器件,所述基板2优选采用平面结构,当然也可以是带腔体的结构,当基板2为平面结构时,对应的光窗盖板1为腔体结构;当基板2为带有台阶的腔体结构时,对应的光窗盖板1为平面结构,该台阶高度H4≧0.35毫米,便于匹配组装封接时不碰伤金线。
在基板2上设有电路图案,所述基板2的材质可以为陶瓷基板,也可以为金属基板如铝材、铜材等,还可以采用其它具有高导热和反光特性的复合材料,如铝碳化硅基板、涂有石墨烯的金属基板等。
进一步地,在陶瓷基板表面镀铝或采用高反射涂料材质,如PTFE,进一步提升不可见光波段特别是UVC波段器件的整体出光性能。
当光窗透镜102与金属件101烧结连接时,所述光窗透镜102与所述金属件101之间设有将光窗透镜102、金属件101焊接连接的焊料5,所述焊料5呈环形,所述焊料5由无机材料制成。所述焊料5的组分为TiCuBiZnMn,其中Ti占6.8%-25%、Cu占19.6%-34%、Bi占4.2%-7.3%、Zn占21%-37%、Mn占0.56%-1.2%。
所述光窗透镜102与所述金属件101也可以通过熔焊连接,则不需要焊料5。
如上所述的LED器件,所述光窗透镜102材质为石英玻璃,所述光窗透镜102的形状优选为方形、圆形、椭球形、半球形中的一种,当光窗透镜102形状不同时,为便于焊接,金属件101的形状也会作适应性变化。
如上所述的LED器件,所述金属件101的材质为科瓦合金或铜或铝,且金属件101表面需做镀镍,所述金属件101底部边沿部分有延伸出的金属焊边,所述金属焊边的宽度H1≧0.3毫米,所述金属焊边与所述金属化线路层4焊接连接,金属化线路层4的作用是通过电阻焊或熔焊工艺将光窗盖板1与基板2封接为一体;所述金属化线路层4也为环形,其厚度H2≧60微米,所述金属化线路层4表面设有镀层,所述镀层的材质为金或镍金。
本专利还请求保护一种如上所述LED器件的封装方法,具体如下:
在所述基板2边沿设置有环形金属化线路层4,金属化线路层4的厚度H2≧60微米,金属化线路层4表面镀金或镍金处理;
LED芯片3通过锡膏固晶或共晶工艺绑定在基板2上;
通过精密模具冲压制作所述金属件101,所述金属件101表面做镀镍处理;
切割与所述通光孔大小匹配的石英玻璃片制成光窗透镜102,对光窗透镜102边缘≦0.5毫米的环形区域做镀层处理,镀层组分为镍金或铜,镀层厚度≧10微米,将光窗透镜102通过工装治具装入金属件101内,采用熔焊工艺对石英玻璃边缘镀层区域与金属件匹配接触部位进行熔接制成光窗盖板1,该熔接过程需在高纯度氮气或氮气与氦气混合气氛中进行以达到较好的气密性效果。或者添加焊料5采用烧结工艺将光窗透镜102与金属件101封接成光窗盖板1。
光窗盖板1经治具组装到基板2的金属化线路层4上,通过电阻焊工艺或熔焊工艺将光窗盖板1与基板2封接为一体,制成LED器件。
进一步地,所述电阻焊工艺为平行缝焊,所述熔焊工艺为激光焊,所述焊料5采用金、锗、铟、锡、银、铜、硼、锑、铝中的两种或几种成分原材料按特定比例调制成粉末或膏状混合物,具体地,所述焊料5的组分为TiCuBiZnMn,其中Ti占6.8%-25%、Cu占19.6%-34%、Bi占4.2%-7.3%、Zn占21%-37%、Mn占0.56%-1.2%。
本发明基板2、金属件101、光窗透镜102均采用无机材料,焊料、金属化线路层以及所有的镀层也采用无机材料,采用烧结工艺或熔焊工艺将光窗透镜102与金属件101封接为一体制成光窗盖板,采用电阻焊或熔焊工艺将光窗盖板与基板2结合为一体制成LED器件,实现高气密性、无机封装。
本发明相较于传统LED光源,具有气密性好、无机封装、结构简单,主要应用于对气密性及可靠性要求高和不适宜有机材料封装的光源器件。尤其是UVC和大功率IR LED光源器件中,能较好的解决现有胶封和同类型无机封装方案中玻璃或石英光窗易掉透镜、器件光衰严重和气密性不足的问题。
本发明所述的实施例仅仅是对本发明的优选实施方式进行的描述,并非对发明构思和范围进行限定,在不脱离本发明设计思想的前提下,本领域中工程技术人员对本发明的技术方案作出的各种变型和改进,均应落入本发明的保护范围。
Claims (10)
1.一种LED器件,其特征在于:包括有基板(2),在所述基板(2)的外围设有金属化线路层(4),在所述金属化线路层(4)上设有光窗盖板(1),所述光窗盖板(1)包括有金属件(101),在金属件(101)上分别设有通光孔、盖住所述通光孔的光窗透镜(102),光窗盖板(1)为腔体结构,所述光窗盖板(1)设于所述基板(2)的上方使所述光窗盖板(1)与所述基板(2)之间形成腔体(6),在所述腔体(6)内设有LED芯片(3),所述LED芯片(3)固定在所述基板(2)上,所述基板(2)为平面结构。
2.根据权利要求1所述的LED器件,其特征在于:所述光窗透镜(102)与所述金属件(101)之间设有将光窗透镜(102)、金属件(101)焊接连接的焊料(5),所述焊料(5)呈环形,所述焊料(5)由无机材料制成。
3.根据权利要求1所述的LED器件,其特征在于:所述基板(2)的材质为陶瓷、铝材、铜材、铝碳化硅基板中的一种。
4.根据权利要求1所述的LED器件,其特征在于:所述光窗透镜(102)的材质为石英玻璃,所述光窗透镜(102)的形状为方形、圆形、椭球形、半球形中的一种。
5.根据权利要求1所述的LED器件,其特征在于:所述金属件(101)的材质为科瓦合金或铜或铝,所述金属件(101)底部边沿部分设有延伸出的金属焊边,所述金属焊边与所述金属化线路层(4)焊接连接,所述金属焊边的宽度H1≧0.3毫米,所述金属化线路层(4)的厚度H2≧60微米,所述金属化线路层(4)表面设有镀层,所述镀层的材质为金或镍金。
6.根据权利要求1所述的LED器件,其特征在于:所述金属件(101)表面设有镀镍层,所述腔体(6)的深度H3≧0.5毫米。
7.一种根据权利要求1-6任一项所述LED器件的封装方法,其特征在于包括有:
在所述基板(2)边沿设置有环形金属化线路层(4),金属化线路层(4)线路层厚度不低于60微米,金属化线路层(4)表面镀金或镍金处理;
LED芯片(3)通过锡膏固晶或共晶工艺绑定在基板(2)上;
通过模具冲压制作所述金属件(101),所述金属件(101)表面做镀镍处理;
切割与所述通光孔大小匹配的石英玻璃片制成光窗透镜(102),对光窗透镜(102)边缘≦0.5毫米的环形区域做镀层处理,镀层厚度≧10微米,将光窗透镜(102)通过工装治具装入金属件(101)内,采用熔焊工艺将光窗透镜(102)与金属件(101)匹配接触部位进行熔接制成光窗盖板(1),或者添加焊料(5)将光窗透镜(102)与金属件(101)烧结成光窗盖板(1);
光窗盖板(1)经治具组装到基板(2)的金属化线路层(4)上,通过电阻焊工艺或熔焊工艺将光窗盖板(1)与基板(2)封接为一体,制成LED器件。
8.根据权利要求7所述LED器件的封装方法,其特征在于:所述电阻焊工艺为平行缝焊,所述熔焊工艺为激光焊。
9.根据权利要求7所述LED器件的封装方法,其特征在于:所述焊料(5)的组分为TiCuBiZnMn,其中Ti占6.8%-25%、Cu占19.6%-34%、Bi占4.2%-7.3%、Zn占21%-37%、Mn占0.56%-1.2%。
10.根据权利要求7所述LED器件的封装方法,其特征在于:所述光窗透镜(102)边缘的镀层组分为镍金或铜。
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CN114203888B (zh) * | 2021-11-01 | 2024-02-20 | 佛山中科产业技术研究院 | 一种紫外led封装器件 |
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