CN112259511A - Fan-out type packaging structure with annular coaxial copper column ring and preparation method thereof - Google Patents

Fan-out type packaging structure with annular coaxial copper column ring and preparation method thereof Download PDF

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Publication number
CN112259511A
CN112259511A CN202011201833.6A CN202011201833A CN112259511A CN 112259511 A CN112259511 A CN 112259511A CN 202011201833 A CN202011201833 A CN 202011201833A CN 112259511 A CN112259511 A CN 112259511A
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copper
annular coaxial
layer
copper column
chip
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王新
蒋振雷
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Hangzhou Microsilicon Tech Co ltd
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Hangzhou Microsilicon Tech Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
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Abstract

The invention discloses a fan-out type packaging structure with an annular coaxial copper column ring, which comprises a chip which is plastically packaged in a plastic packaging layer, wherein the area of the plastic packaging layer, which is not provided with the plastic packaged chip, is provided with the annular coaxial copper column ring, one side of the plastic packaging layer, which corresponds to an exposed chip pin, is provided with a rewiring layer used for connecting the annular coaxial copper column ring and the corresponding pin of the chip, the rewiring layer is provided with a plurality of solder balls, the other side of the plastic packaging layer, which corresponds to the exposed chip pin, is provided with a protective layer, and a surface-mounted antenna which is arranged in the protective layer and corresponds to each contact. The invention also discloses a preparation method of the fan-out type packaging structure. By adopting the design scheme of the invention, the transmission loss of the radio-frequency signal transmitted and received by the surface-mounted antenna in a transmission path can be effectively reduced, and the overall performance of the antenna structure is improved.

Description

Fan-out type packaging structure with annular coaxial copper column ring and preparation method thereof
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a fan-out packaging structure with an annular coaxial copper column ring and a preparation method thereof.
Background
With the arrival of the 5G high-speed communication era, the communication frequency is continuously increased to the millimeter wave range, and the integrated integration and packaging of the radio frequency chip element and the millimeter wave antenna become the focus of attention and a great development trend of the industry. Meanwhile, as the integration of chip packaging is higher and higher, how to effectively improve the heat dissipation performance of the chip and the packaging body is also becoming more important.
Most of the different package structures or fan-out package methods currently used in the industry only focus on the design of the surface-mounted antenna (e.g., its three-dimensional shape, placement position, placement method, etc.) when integrating the rf signal transmission system on the package, and the transmission structure of the rf signal at the end portion of the antenna is not optimized too much, which limits the overall transmission performance of the rf signal on the transmission and reception path. Moreover, for the heat dissipation problem of the package, a heat sink or a heat sink is usually added outside the package, which would increase the volume of the package.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to solve the problems that the existing fan-out type packaging mode focuses on the design of an antenna, the transmission structure is not optimized, the overall transmission performance of radio frequency signals on a receiving, transmitting and transmitting path is not greatly improved, and the heat dissipation efficiency is poor.
The technical scheme is as follows: in order to solve the above problems, the present invention provides the following technical solutions:
a fan-out type packaging structure with an annular coaxial copper column ring comprises a chip which is plastically packaged in a plastic packaging layer, wherein at least one annular coaxial copper column ring is arranged in a region where the chip is not plastically packaged in the plastic packaging layer, a rewiring layer used for connecting the annular coaxial copper column ring and a corresponding pin of the chip is arranged on one side of the plastic packaging layer corresponding to the exposed pin of the chip, a plurality of solder balls are arranged on the rewiring layer, and a surface-mounted antenna corresponding to each contact of the annular coaxial copper column ring is arranged on the other side of the plastic packaging layer corresponding to the exposed pin of the chip.
The antenna pattern similar to a coaxial cable is adopted, so that the copper column positioned at the center of a circle or an ellipse center and corresponding to signal transmission and reception and the copper column positioned at the circumference or the ellipse circumference and corresponding to grounding jointly form a resonant cavity, the directivity of signal transmission can be improved on the one hand, and the reliability of signal reception is improved on the other hand, compared with the antenna design taking points as patterns, by adopting the novel antenna pattern in the form of a surface.
Furthermore, the plastic package layer is provided with a protective layer corresponding to the other side of the exposed chip pin and a surface-mounted antenna arranged in the protective layer and corresponding to each contact of the annular coaxial copper column ring.
Furthermore, each annular coaxial copper column ring comprises 11 copper columns, 10 first copper columns surrounding a circumference or an elliptical circumference and 1 second copper column located at the center of the circle or the center of the elliptical circle.
In a continuous experiment, the best signal sending and receiving performance can be found only under the matching of 10 circumference or ellipse circumference copper columns and 1 circle center or ellipse center copper column.
Furthermore, the second copper column of the annular coaxial copper column ring located at the circle center or the ellipse center is connected with the pin of the chip corresponding to the signal processing through the rewiring layer, and the first copper column of the annular coaxial copper column ring located at the circumference or the ellipse circumference is connected with the ground wire of the rewiring layer.
Furthermore, the second copper column of the annular coaxial copper column ring located at the circle center or the ellipse center is connected with the signal part of the surface-mounted antenna, and the first copper column of the annular coaxial copper column ring located at the circumference or the ellipse circumference is connected with the ground wire part of the surface-mounted antenna.
Further, when 10 copper pillars of the annular coaxial copper pillar ring are set to be elliptical, the eccentricity is less than 0.8.
A preparation method of a fan-out type packaging structure with an annular coaxial copper post ring specifically comprises the following steps:
1) preparing a temporary slide, and coating temporary bonding glue on the temporary slide;
2) depositing a thin copper seed layer on the temporary slide by using a plasma deposition method;
3) coating photosensitive dry films on the copper seed layer, and photoetching to form 11 groove combinations which are a group, 10 groove combinations which are a circumference or an elliptical circumference and a groove combination at the center of the circle or the center of the ellipse;
4) depositing metal copper in all grooves of the dry film by an electrochemical plating method to form copper columns one by one to form an annular coaxial copper column ring;
5) removing the dry film and a copper bell layer below the dry film by wet cleaning;
6) mounting the pin surface of the thinned chip to be packaged face down;
7) plastically packaging the chip and the annular coaxial copper column ring to form a plastic packaging body, and grinding and thinning the surface of the plastic packaging body to expose the upper surfaces of all the copper columns;
8) manufacturing a surface-mounted antenna on one side of the plastic package body, on which the pin is not exposed, by using a film technology of photoetching and electroplating, wherein a signal part of the surface-mounted antenna is electrically connected with a second copper column, positioned at the center of a circle or the center of an ellipse, of the annular coaxial copper column ring, and a ground wire part of the surface-mounted antenna is electrically connected with a first copper column, positioned at the circumference or the circumference of the ellipse, of the annular coaxial copper column ring;
9) removing the temporary bonding slide by adopting a laser or thermal stripping method, and removing the temporary bonding glue to expose the chip pin and one side of the copper column contact of the plastic package body;
10) manufacturing a rewiring layer on one side of the plastic package body, which is exposed out of the chip pins and the copper column contacts simultaneously, by using a film process;
11) implanting a solder ball on the metal pad of the rewiring layer, and then performing reflow soldering and curing;
12) and carrying out unit cutting on the manufactured fan-out type packaging body to form an independent packaging device.
Further, after the step 8), a layer of protective film for protecting the surface-mounted antenna is coated on the surface-mounted antenna, wherein the protective film is made of epoxy resin or polyimide organic materials and has a thickness of 10-80 um.
Further, the rewiring layer comprises a dielectric layer and a metal conducting layer, the dielectric layer is made of polyimide organic dielectric materials, the dielectric layer is manufactured through a spin coating method and is subjected to photoetching to form a required pattern, the metal conducting layer is made of copper of the titanium substrate through vacuum sputtering PVD and electrochemical ECD plating methods, and the required metal interconnection wiring pattern is subjected to photoetching.
Further, the step 10) is repeated to form a multilayer re-wiring layer.
Has the advantages that: compared with the prior art, the invention has the advantages that:
1) the annular coaxial copper column ring with a specific space structure can effectively reduce the transmission loss of radio-frequency signals transmitted and received by the surface-mounted antenna in a transmission path, and improve the overall performance of the antenna structure;
2) the annular coaxial copper column ring and the surface-mounted antenna are manufactured by adopting photoetching and electroplating processes, the structural size of the antenna has higher control precision, the reliability and the stability of the receiving and transmitting transmission model of the antenna structure can be obviously improved, and the antenna is very important for millimeter waves which are radio frequency signals with higher frequency;
3) the annular coaxial copper post ring is located inside the plastic package body and close to the chip, so that information interaction between the antenna and the chip can be realized only through the rewiring layer, and the heat dissipation performance of the chip and the package body can be improved and enhanced.
4) Unlike the heat sink fins or heat sink grooves on the peripheral surfaces of the package body, which are often used in other conventional package structures, the annular coaxial copper pillar ring with heat dissipation function of the present invention is located in the area inside the plastic package body that is not occupied by the chip, so that it is not necessary to occupy the volume of the package body additionally or increase the volume of the package body, thereby contributing to the miniaturization of the package.
Drawings
FIG. 1 is a schematic structural view of a product of the present invention;
FIG. 2 is a schematic structural view after completion of step 1 of the present invention;
FIG. 3 is a schematic structural view after step 2 of the present invention is completed;
FIG. 4 is a schematic structural view after step 3 of the present invention is completed;
FIG. 5 is a schematic structural view after completion of step 4 of the present invention;
FIG. 6 is a schematic structural view after completion of step 5 of the present invention;
FIG. 7 is a schematic top view of the present invention after step 5;
FIG. 8 is a schematic diagram of the present invention after completion of step 6;
FIG. 9 is a schematic diagram of the present invention after completion of step 7;
FIG. 10 is a schematic top view of the present invention after completion of step 7;
FIG. 11 is a schematic structural view after completion of step 9 of the present invention;
FIG. 12 is a schematic diagram of the present invention after step 10 is completed;
FIG. 13 is a schematic view of the structure of the present invention after step 11 is completed;
FIG. 14 is a schematic diagram of the structure of the present invention after step 12 is completed.
Detailed Description
The invention is further described below with reference to the figures and examples.
Example 1
As shown in fig. 1, a fan-out package structure with a ring-shaped coaxial copper pillar ring includes a chip 150 plastically packaged in a plastic package layer 160, at least one ring-shaped coaxial copper pillar ring 140 is disposed in an area of the plastic package layer 160 where the chip 150 is not plastically packaged, a redistribution layer 190 for connecting the ring-shaped coaxial copper pillar ring 140 and a corresponding pin of the chip 150 is disposed on one side of the plastic package layer 160 corresponding to an exposed chip pin, a plurality of solder balls 200 are disposed on the redistribution layer 190, and a surface-mounted antenna 170 corresponding to each contact of the ring-shaped coaxial copper pillar ring 140 is disposed on the other side of the plastic package layer 160 corresponding to the exposed chip pin.
The antenna pattern similar to a coaxial cable is adopted, so that the copper column positioned at the center of a circle or an ellipse center and corresponding to signal transmission and reception and the copper column positioned at the circumference or the ellipse circumference and corresponding to grounding jointly form a resonant cavity, the directivity of signal transmission can be improved on the one hand, and the reliability of signal reception is improved on the other hand, compared with the antenna design taking points as patterns, by adopting the novel antenna pattern in the form of a surface.
The plastic package layer 160 is provided with a protective layer 180 corresponding to the other side of the exposed chip pins and a surface-mounted antenna 170 arranged in the protective layer 180 corresponding to each contact of the annular coaxial copper pillar 140.
Each ring-shaped coaxial copper pillar ring 140 includes 11 copper pillars, 10 first copper pillars 1402 enclosing a circumference or an ellipse, and 1 second copper pillar 1401 located at a center or an ellipse center.
In a continuous experiment, the best signal sending and receiving performance can be found only under the matching of 10 circumference or ellipse circumference copper columns and 1 circle center or ellipse center copper column.
The second copper pillar 1401 of the annular coaxial copper pillar ring 140 located at the center of the circle or ellipse is connected with the pin of the chip 150 corresponding to the signal processing through the rewiring layer, and the first copper pillar 1402 of the annular coaxial copper pillar ring 140 located at the circumference or ellipse is connected with the ground wire of the rewiring layer 190.
The second copper column 1401 of the annular coaxial copper column ring 140 located at the center of the circle or ellipse is connected with the signal part 1701 of the surface-mounted antenna, and the first copper column 1402 of the annular coaxial copper column ring 140 located at the circumference or ellipse is connected with the ground part 1702 of the surface-mounted antenna 170.
When 10 copper pillars of the annular coaxial copper pillar ring 140 are set to be elliptical, the eccentricity is less than 0.8.
Example 2
As shown in fig. 2 to 14, the manufacturing process of the fan-out package structure with annular coaxial copper post ring includes the following steps:
1) a temporary carrier 100 is prepared, and a temporary bonding glue 110 is coated on the temporary carrier 100, wherein the temporary carrier can be made of silicon wafers, ceramics, glass, quartz and the like, as shown in FIG. 2.
2) The deposition of a thin copper seed layer 120 by plasma deposition is continued as shown in fig. 3.
3) Coating a photosensitive dry film 130 on the copper seed layer, and forming a groove by photoetching, as shown in fig. 4;
4) depositing copper metal in the grooves of the dry film by an electrochemical plating method to form copper pillars, as shown in fig. 5, 140 is the copper pillar deposited;
5) wet cleaning removes the dry film and the copper clock layer under the dry film, as shown in fig. 6. As shown in fig. 6, each annular coaxial copper pillar ring structure is composed of 11 copper pillars, the diameter d of each copper pillar is 100-250 um, the height is 150-450 um, and the copper pillars are 1 second copper pillar 1401 located at the center of the circle or the center of the ellipse and 10 first copper pillars 1402 located at the circumference or the circumference of the ellipse respectively; the 10 first copper pillars 1402 are respectively arranged at equal intervals on a circumference or an ellipse centered on the second copper pillar 1401 (if an ellipse, eccentricity is generally controlled to be < 0.8). The distance between the second copper column 1401 located at the center of the circle or the center of the ellipse and the first copper column 1402 located at the circumference or the circumference of the ellipse is D, and the distance D is 1-5 times of the diameter D of a single copper column; the second copper column 1401 located at the center of the circle or the center of the ellipse and the first copper column 1402 located at the circumference or the circumference of the ellipse together form the annular coaxial copper column ring 140, wherein the second copper column 1401 located at the center of the circle or the center of the ellipse is electrically connected with a signal port (SIG) of the surface-mounted antenna, and the first copper column 1402 located at the circumference or the circumference of the ellipse is electrically connected with the Ground (GND).
Fig. 7 is a plan top view of the structure shown to show the specific structure of these annular concentric copper pillars 140 made of copper pillars.
6) Next, the pin of the thinned chip to be packaged is mounted face down (face down), as shown in fig. 8; in the figure, 150 is a mounted chip, and the thickness of the chip 150 is slightly less than the height of the copper column by about 10-100 um; as an example, only one chip is shown in the drawing, and actually, one or more chips may be mounted as needed, and the present invention is not limited thereto.
7) The chip 150 and the annular coaxial copper pillar ring 140 are plastically packaged to form a plastic package body 160, and the surface of the plastic package body 160 is ground and thinned to expose the upper surfaces of all the copper pillars of the annular coaxial copper pillar ring 140, as shown in fig. 9. The upper surface of the plastic package body 160 is referred to as a first surface, and the surface of the plastic package body in contact with the temporary bonding glue layer is referred to as a second surface of the plastic package body.
Further, fig. 10 is a top plan view of the structure, and it can be seen that the annular coaxial copper pillar 140 and the chip 150 are both located inside the plastic package body 160. Because of the fan-out package, the area of the plastic package body 160 is larger than that of the chip 150, and the annular coaxial copper post ring is just located in the area of the plastic package body 160 not occupied by the chip 150, so that the internal space of the plastic package body is effectively utilized, and the requirement of miniaturization of the package is met. Only two annular coaxial copper pillar ring structures are shown in the figure, and actually, one or more annular coaxial copper pillar ring structures can be arranged in the plastic package according to specific practical requirements, and the invention is not limited.
8) Next, a surface-mounted antenna 170 is fabricated on the first surface of the plastic package body 160 by a photolithography and electroplating thin film process, as shown in fig. 11, "170" in the figure is a schematic diagram of a metal structure of the surface-mounted antenna, a signal portion 1701(SIG) of the surface-mounted antenna is electrically connected to a second copper pillar 1401 located at a center or an ellipse center of the annular coaxial copper pillar ring, and a ground portion (GND)1702 of the surface-mounted antenna is electrically connected to a first copper pillar 1402 located at a circumference or an ellipse circumference of the annular coaxial copper pillar ring 140.
9) Meanwhile, a layer of protective film 180 is coated on the surface-mounted antenna 170, and the protective film is made of epoxy resin or polyimide organic material, has a thickness of 10-80 um, and is used for protecting the surface-mounted antenna, as shown in fig. 12.
10) The temporary bonding slide 100 is removed by laser or thermal peeling, and the temporary bonding glue 110 is removed to expose the second surface of the plastic package body 160. At this time, the portion of the annular coaxial copper pillar 140 extending to the second surface of the plastic package body 160 and the leads of the chip 150 are also exposed from the second surface of the plastic package body 160. As shown in fig. 13.
11) A redistribution layer 190 is formed on the second surface of the plastic package 160 by a thin film process. The rewiring layer is composed of a dielectric layer 1901 and a metal conductive layer 1902. The pins of the chip 150 and the copper pillars of the ring of coaxial copper pillars are interconnected or routed through a rewiring layer 190. As shown in fig. 14.
The first copper pillar 1402 for grounding in the ring-shaped coaxial copper pillar ring is connected to the Ground (GND) in the redistribution layer, and the second copper pillar 1401 at the center of the circle or ellipse is connected to the corresponding signal processing line (SIG).
The dielectric layer 1901 selected by the invention is a polyimide organic dielectric material, and a dielectric layer film is manufactured by a spin coating method and is subjected to photoetching to form a required pattern; the metal conductive layer 1902 of the present invention is made of copper (a small amount of titanium is used as a copper substrate layer under the copper), and is made by vacuum sputtering PVD plating and electrochemical plating ECD plating, and a desired metal interconnection wiring pattern is formed by photolithography. The metal interconnect wiring layer 1902 may be one or more layers, which together with the dielectric layer 1901 form the redistribution layer structure 190, according to the actual wiring requirement.
12) Implanting a solder ball 200 on the metal pad of the rewiring layer, and then performing reflow soldering and curing; as shown in fig. 1. And finally, carrying out unit cutting on the manufactured fan-out type packaging body to form an independent packaging device.

Claims (10)

1. The utility model provides a fan-out type packaging structure with coaxial copper post ring of annular which characterized in that: the chip packaging structure comprises a chip packaged in a plastic packaging layer non-plastic packaging area, wherein one side of the plastic packaging layer corresponding to an exposed chip pin is provided with a rewiring layer used for connecting the annular coaxial copper pillar ring and the corresponding pin of the chip, the rewiring layer is provided with a plurality of solder balls, and the other side of the plastic packaging layer corresponding to the exposed chip pin is provided with a surface-mounted antenna corresponding to each contact of the annular coaxial copper pillar ring.
2. The fan-out package structure with annular coaxial copper collars of claim 1, wherein: the other side of the plastic packaging layer corresponding to the exposed chip pin is provided with a protective layer and a surface-mounted antenna which is arranged in the protective layer and corresponds to each contact of the annular coaxial copper column ring.
3. The fan-out package structure with annular coaxial copper collars of claim 1, wherein: each annular coaxial copper column ring comprises 11 copper columns, 10 first copper columns surrounding a circumference or an ellipse circumference and 1 second copper column located at the center of a circle or the center of an ellipse.
4. The fan-out package structure with annular coaxial copper collars of claim 1, wherein: the second copper column of the annular coaxial copper column ring, which is positioned at the circle center or the ellipse center, is connected with the pin of the chip corresponding to the signal processing through the rewiring layer, and the first copper column of the annular coaxial copper column ring, which is positioned at the circumference or the ellipse circumference, is connected with the ground wire of the rewiring layer.
5. The fan-out package structure with annular coaxial copper collars of claim 1, wherein: the second copper column of the annular coaxial copper column ring positioned at the circle center or the ellipse center is connected with the signal part of the surface-mounted antenna, and the first copper column of the annular coaxial copper column ring positioned at the circumference or the ellipse circumference is connected with the ground wire part of the surface-mounted antenna.
6. The fan-out package structure with annular coaxial copper collars of claim 3 wherein: when 10 copper columns of the annular coaxial copper column ring are set to be elliptical, the eccentricity is less than 0.8.
7. A method of making the fan-out package structure having annular coaxial copper collars of claim 1, wherein: the method specifically comprises the following steps:
1) preparing a temporary slide, and coating temporary bonding glue on the temporary slide;
2) depositing a thin copper seed layer on the temporary slide by using a plasma deposition method;
3) coating photosensitive dry films on the copper seed layer, and photoetching to form 11 groove combinations which are a group, 10 groove combinations which are a circumference or an elliptical circumference and a groove combination at the center of the circle or the center of the ellipse;
4) depositing metal copper in all grooves of the dry film by an electrochemical plating method to form copper columns one by one to form an annular coaxial copper column ring;
5) removing the dry film and a copper bell layer below the dry film by wet cleaning;
6) mounting the pin surface of the thinned chip to be packaged face down;
7) plastically packaging the chip and the annular coaxial copper column ring to form a plastic packaging body, and grinding and thinning the surface of the plastic packaging body to expose the upper surfaces of all the copper columns;
8) manufacturing a surface-mounted antenna on one side of the plastic package body, on which the pin is not exposed, by using a film technology of photoetching and electroplating, wherein a signal part of the surface-mounted antenna is electrically connected with a second copper column, positioned at the center of a circle or the center of an ellipse, of the annular coaxial copper column ring, and a ground wire part of the surface-mounted antenna is electrically connected with a first copper column, positioned at the circumference or the circumference of the ellipse, of the annular coaxial copper column ring;
9) removing the temporary bonding slide by adopting a laser or thermal stripping method, and removing the temporary bonding glue to expose the chip pin and one side of the copper column contact of the plastic package body;
10) manufacturing a rewiring layer on one side of the plastic package body, which is exposed out of the chip pins and the copper column contacts simultaneously, by using a film process;
11) implanting a solder ball on the metal pad of the rewiring layer, and then performing reflow soldering and curing;
12) and carrying out unit cutting on the manufactured fan-out type packaging body to form an independent packaging device.
8. The method of manufacturing a fan-out package structure having annular coaxial copper collars of claim 7, wherein: and 8), coating a protective film for protecting the surface-mounted antenna on the surface-mounted antenna, wherein the protective film is made of epoxy resin or polyimide organic materials and has the thickness of 10-80 um.
9. The method of manufacturing a fan-out package structure having annular coaxial copper collars of claim 7, wherein: the rewiring layer comprises a dielectric layer and a metal conducting layer, the dielectric layer is made of polyimide organic dielectric materials, the dielectric layer is manufactured by a spin coating method and is subjected to photoetching to form a required pattern, the metal conducting layer is made of copper of the titanium substrate by a vacuum sputtering PVD and electrochemical ECD plating method, and the required metal interconnection wiring pattern is formed by photoetching.
10. The method of manufacturing a fan-out package structure having annular coaxial copper collars of claim 7, wherein: repeating the step 10) to form a multilayer re-wiring layer.
CN202011201833.6A 2020-11-02 2020-11-02 Fan-out type packaging structure with annular coaxial copper column ring and preparation method thereof Pending CN112259511A (en)

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