CN111403355A - Packaging structure of complete plastic package antenna and preparation process thereof - Google Patents

Packaging structure of complete plastic package antenna and preparation process thereof Download PDF

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Publication number
CN111403355A
CN111403355A CN202010254867.5A CN202010254867A CN111403355A CN 111403355 A CN111403355 A CN 111403355A CN 202010254867 A CN202010254867 A CN 202010254867A CN 111403355 A CN111403355 A CN 111403355A
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CN
China
Prior art keywords
antenna
layer
rewiring layer
plastic
packaging
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Pending
Application number
CN202010254867.5A
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Chinese (zh)
Inventor
王新
蒋振雷
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Hangzhou Microsilicon Tech Co ltd
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Hangzhou Microsilicon Tech Co ltd
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Priority to CN202010254867.5A priority Critical patent/CN111403355A/en
Publication of CN111403355A publication Critical patent/CN111403355A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Aerials (AREA)

Abstract

The invention discloses a packaging structure of a completely plastic packaged antenna, which comprises a rewiring layer, a plastic packaging layer arranged on the surface of one side of the rewiring layer and solder balls arranged on the surface of the other side of the rewiring layer, wherein the plastic packaging layer is simultaneously and plastically packaged with an antenna and a device which are connected with contacts on the rewiring layer, and the antenna is completely and plastically packaged in the plastic packaging body. The invention also discloses a preparation process of the packaging structure of the complete plastic package antenna, firstly, a rewiring layer is manufactured on the temporary slide by using a film process, and then, the antenna structure is manufactured on the rewiring layer by using a dry film photoetching and electroplating method; then, the chip is also mounted on the rewiring layer and is encapsulated together with the antenna structure in a plastic package. By adopting the design scheme of the invention, the packaging body has smaller area, is more compact and has thinner thickness; the whole structure of the antenna is manufactured by using a photoetching method, so that the size of the antenna structure can be controlled very accurately, and the precision is higher.

Description

Packaging structure of complete plastic package antenna and preparation process thereof
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure of a completely plastic-packaged antenna and a preparation process thereof.
Background
With the advent of the 5G mobile communication era, the demand for heterogeneous integrated rf front-end modules is increasing, and in the evolution of antenna packaging technology, the integration of rf chip elements and antennas is a new trend, so that the aip (antenna in package) packaging technology gradually becomes the focus of attention in the advanced packaging industry.
In the existing fan-out antenna package, an antenna layer is formed on the surface of a plastic package body which is plastically packaged with a chip (including a passive element, a bare chip and the like), including the upper surface or the lower surface of the plastic package body, by using a manufacturing method of a Re-wiring layer (Re-Distribution L layer, namely RD L), or the antenna layer is respectively located on the surfaces of the plastic package body and a PCB package substrate.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to solve the problems that the existing fan-out type antenna package has the antenna arranged on the upper surface and the lower surface of a plastic package body, occupies more wiring area and increases the whole thickness of a PCB (printed circuit board).
The technical scheme is as follows: in order to solve the above problems, the present invention provides the following technical solutions:
a packaging structure of a complete plastic package antenna comprises at least one rewiring layer, a plastic package layer arranged on the surface of one side of the rewiring layer and solder balls arranged on the surface of the other side of the rewiring layer, wherein the plastic package layer is internally and simultaneously plastically packaged with an antenna and a device which are connected with metal contacts on the rewiring layer, and the antenna is completely and plastically packaged in the plastic package layer.
The conventional antenna structure is generally arranged on the upper surface and the lower surface of a plastic package body or a substrate, and the conventional antenna aims at electromagnetic waves with longer wavelengths, so that the size of the antenna is larger, and a larger area are needed to simulate the antenna structure.
Further, with the continuous progress of the technology, with the coming of the 5G era, the antenna can be set in other ways by adopting electromagnetic waves (millimeter waves) with shorter wavelengths, and the invention proposes that the antenna is completely plastically packaged on the premise of not influencing the function realization of the antenna, so that the wiring space on the surface or the basically lower surface of the plastic package is liberated, the whole packaging thickness can be reduced, and the integration level is further improved.
In the technical scheme of this application, the antenna can be by complete plastic envelope, if level with upper and lower surface, the antenna contact that exposes still can have the conflict with the line of walking on plastic-sealed body surface.
Further, the antenna comprises an antenna conductor and a grounding reflection conductor which are independent of each other, the grounding reflection conductor is arranged between the antenna conductor and the device, the antenna conductor is electrically connected with the signal metal contact on the rewiring layer, and the grounding reflection conductor is electrically connected with the grounding metal contact on the rewiring layer.
Furthermore, the grounding reflection conductor and the antenna conductor are made of metal copper, and the grounding reflection conductor is arranged between the antenna conductor and the chip, so that signal interference between an antenna signal and a device is prevented.
Further, the rewiring layer comprises a dielectric layer and a metal interconnection layer penetrating through the dielectric layer.
Further, the device includes a chip and a passive element.
Furthermore, the antenna conductor and the grounding reflection conductor are both spread on the rewiring layer and are completely plastically packaged by the plastic packaging layer to form the graphical antenna.
The antenna has a certain area or volume, so the prior art adopts the technical scheme of occupying more volume and occupies more area on the upper surface and the lower surface of the plastic package body through the plastic package body, and by adopting the technical scheme of the invention, the antenna is divided into an independent antenna conductor and a grounding reflection conductor, so that the antenna can be designed into a graphical antenna, and the realization of the functions of the antenna is kept.
A process for manufacturing a package structure of a fully plastic-encapsulated antenna as claimed in claim 1, comprising the steps of:
1) adhering a temporary bonding glue layer on the surface of the temporary bearing sheet;
2) manufacturing a rewiring layer on the surface of the temporary bonding glue layer by using a film process;
3) manufacturing an antenna on the rewiring layer by using a dry film photoetching and electroplating method;
4) then, continuously attaching the device to be packaged to the area, on the rewiring layer, where the antenna structure is not manufactured;
5) integrally plastic-packaging the antenna and the device on the rewiring layer to form a plastic packaging layer, so that the antenna structure and the chip are completely embedded in the plastic packaging body;
6) separating the temporary bearing sheet from the upper rewiring layer by adopting a laser or thermal stripping method, and removing the temporary bonding glue, so that the other side of the rewiring layer, which is opposite to the side where the plastic packaging layer is located, is exposed;
7) planting balls on the rewiring layer and completing the welding of the solder balls;
8) and carrying out unit cutting on the packaged device to obtain an individual packaging body unit.
Further, in the step 2), the upper and lower surfaces of the metal interconnection layer are at least flush with the upper and lower surfaces of the dielectric layer, and the end portion of the metal interconnection layer exposed outside is used as a metal contact.
Further, the device comprises a chip and a passive element, the device surface of the chip faces the rewiring layer during mounting, and the metal bumps of the device are connected with the corresponding metal contacts on the rewiring layer.
Has the advantages that: compared with the prior art, the invention has the advantages that:
the invention adopts the method of firstly making the rewiring layer and then manufacturing the plastic package layer by the plastic package element, can effectively improve the precision and the reliability of the rewiring layer, and the graphical antenna structure is wrapped in the plastic package body, so that the area of the upper surface or the lower surface of the plastic package body is not occupied, namely the wiring space of the rewiring layer positioned on the surface of the plastic package body is not occupied, thereby effectively reducing the area of the rewiring layer, further reducing the packaging volume, improving the integration level of a packaging device and increasing the design and the manufacturing flexibility of the rewiring layer.
Drawings
FIG. 1 is a schematic structural diagram of a product of example 1 of the present invention;
fig. 2 is a first exemplary patterned antenna according to embodiment 1 of the present invention;
fig. 3 is a second exemplary patterned antenna according to embodiment 1 of the present invention;
FIG. 4 is a schematic structural diagram of a product of example 2 of the present invention;
FIG. 5 is a schematic view of step 1) in example 3 of the present invention;
FIG. 6 is a schematic view of step 2) in example 3 of the present invention;
FIG. 7 is a schematic view of step 3) in example 3 of the present invention;
FIG. 8 is a schematic view of step 4) in example 3 of the present invention;
FIG. 9 is a schematic view of step 5) in example 3 of the present invention;
FIG. 10 is a schematic view of step 6) in example 3 of the present invention;
FIG. 11 is a schematic view of step 7) in example 3 of the present invention.
Detailed Description
The invention is further described below with reference to the figures and examples.
Example 1
As shown in fig. 1 to 3, a package structure of a fully plastic packaged antenna includes at least one redistribution layer 120, a plastic package layer 160 disposed on a surface of one side of the redistribution layer 120, and solder balls 170 disposed on a surface of the other side of the redistribution layer 120, wherein the plastic package layer 160 simultaneously encapsulates the antenna 130 and devices connected to metal contacts on the redistribution layer 120, and the antenna 130 is fully plastic packaged in the plastic package layer 160.
The conventional antenna structure is generally arranged on the upper surface and the lower surface of a plastic package body or a substrate, and the conventional antenna aims at electromagnetic waves with longer wavelengths, so that the size of the antenna is larger, and a larger area are needed to simulate the antenna structure. With the continuous progress of the technology, with the coming of the 5G era, we can consider to arrange the antenna in other ways by using electromagnetic waves (millimeter waves) with shorter wavelengths. The invention provides the method for completely plastically packaging the antenna on the premise of not influencing the function realization of the antenna, thereby freeing the wiring space on the surface or the basically lower surface of the plastic package, simultaneously reducing the whole packaging thickness and further improving the integration level.
In the technical scheme of this application, the antenna can be by complete plastic envelope, if level with upper and lower surface, the antenna contact that exposes still can have the conflict with the line of walking on plastic-sealed body surface.
The antenna 130 includes an antenna conductor 131 and a ground reflection conductor 132 which are independent of each other, and the ground reflection conductor 132 is provided between the antenna conductor 131 and the device, the antenna conductor 131 is electrically connected to the signal metal contact on the rewiring layer 120, and the ground reflection conductor 132 is electrically connected to the ground metal contact on the rewiring layer 120.
The grounding reflection conductor and the antenna conductor are made of metal copper, the antenna conductor is arranged close to the outside in the plastic package, and the grounding reflection conductor is arranged between the antenna conductor and the chip, so that the signal transmission performance of the antenna conductor is ensured, and the signal interference between the antenna signal and the chip is also prevented.
The rewiring layer 120 includes a dielectric layer 121, and a metal interconnection layer 122 penetrating the dielectric layer 121.
The device includes a chip 140 and a passive component 150.
The antenna conductor 131 and the ground reflection conductor 132 are spread out on the redistribution layer 120 and are completely encapsulated by the encapsulation layer 160, so as to form a patterned antenna.
The antenna has a certain area or volume, so the prior art adopts the technical scheme of occupying more volume and occupies more area on the upper surface and the lower surface of the plastic package body through the plastic package body, and by adopting the technical scheme of the invention, the antenna is divided into an independent antenna conductor and a grounding reflection conductor, so that the antenna can be designed into a graphical antenna, and the realization of the functions of the antenna is kept.
Example 2
As shown in fig. 4, based on embodiment 1, an embodiment 2 is proposed, in which a multi-layer package is performed on the basis of embodiment 1, that is, the multi-layer package includes more than two redistribution layers, and the two redistribution layers are, for example, a solder ball, a first redistribution layer, a first plastic package layer, a second redistribution layer, and a second plastic package layer in an overlapping order.
Because the first plastic package layer adopts the patterned antenna, the first rewiring layer and the second rewiring layer are only electrically connected through the metal interconnection columns 180, so that the second rewiring layer can be used for interconnecting more metal contacts through the metal interconnection columns 180 at the positions where the antenna is required to be led out originally, and the integration precision is improved.
Example 3
A manufacturing process of a packaging structure of a complete plastic package antenna comprises the following steps:
1) the temporary bonding paste 110 is applied to the temporary carrier 100, and the material of the temporary carrier may be silicon wafer, ceramic, glass, quartz, etc. As shown in fig. 5.
2) A rewiring layer 120 is formed on the slide sheet attached with the temporary bonding paste 110 by a thin film process. The rewiring layer is composed of a dielectric layer 121 and a metal interconnection layer 122.
The dielectric layer 121 is usually an inorganic dielectric material (silicon oxide, silicon nitride, etc.) or an organic dielectric material (polyimide, resin, etc.), preferably, the invention selects a polyimide organic dielectric material, manufactures a dielectric layer film by using a spin coating method, and performs photolithography on the polyimide dielectric layer to form a required pattern;
the metal interconnection layer 122 is usually made of copper, titanium, tin, etc., and the preferred metal conductive material selected in the present invention is copper (a small amount of titanium is used as a copper substrate layer under copper), which is made by vacuum sputtering PVD and electrochemical plating ECD, and the desired metal interconnection wiring pattern is photo-etched.
The metal interconnection layer 122 may be one or more layers, and forms the redistribution layer structure 120 together with the dielectric layer 121 according to the actual routing requirement. As shown in fig. 6.
3) Continuing to fabricate the antenna 130 on the rewiring layer; the antenna 130 includes an antenna conductor 131, and a grounded reflective conductor layer 132, as shown in fig. 7;
4) attaching devices to the area where the antenna structure is not formed on the rewiring layer, wherein the attached devices include a chip 140 (i.e., a bare chip with metal bumps, such as an RF chip) or a passive element 150; the metal bumps of the chip 140 or the passive component 150 correspond to the corresponding metal contact positions on the rewiring layer one by one, and the chip and the passive component form reliable circuit interconnection in a mode of adding solder paste and reflowing for reinforcement. As shown in fig. 8.
5) The antenna formed on the rewiring layer and the mounted device are subjected to plastic packaging to form a plastic packaging layer 160, as shown in fig. 9. The antenna and the device are embedded in the plastic packaging layer, wherein the height of the antenna is slightly larger than the thickness of the device, and the height difference between the antenna and the device is about 50-150 um.
6) Removing the temporary bonding slide 100 by adopting a laser or thermal stripping method, and removing the temporary bonding glue 110 to expose the metal contact on the other side surface of the rewiring layer opposite to the side where the plastic packaging layer is positioned; as shown in fig. 10;
7) planting solder balls 170 on the metal contacts of the rewiring layer, and then performing reflow soldering and curing; as shown in fig. 11.
And after the process steps are completed, unit cutting is carried out on the formed wafer-shaped fan-out type packaging body to form an independent packaging device.

Claims (8)

1. The utility model provides a packaging structure of complete plastic envelope antenna, includes at least one deck rewiring layer, sets up in the plastic envelope layer of rewiring layer one side surface to and set up in the tin ball of rewiring layer opposite side surface, its characterized in that: and the plastic packaging layer is internally and simultaneously plastically packaged with the antenna and the device which are connected with the metal contact on the rewiring layer, and the antenna is completely and plastically packaged in the plastic packaging layer.
2. The package structure of the complete plastic package antenna according to claim 1, wherein: the antenna comprises an antenna conductor and a grounding reflection conductor which are mutually independent, the grounding reflection conductor is arranged between the antenna conductor and the device, the antenna conductor is electrically connected with the signal metal contact on the rewiring layer, and the grounding reflection conductor is electrically connected with the grounding metal contact on the rewiring layer.
3. The package structure of the complete plastic package antenna according to claim 1, wherein: the rewiring layer comprises a dielectric layer and a metal interconnection layer penetrating through the dielectric layer.
4. The package structure of the complete plastic package antenna according to claim 1, wherein: the device comprises a chip and a passive element.
5. The package structure of the complete plastic package antenna according to claim 2, characterized in that: and the antenna conductor and the grounding reflection conductor are spread on the rewiring layer and are completely plastically packaged by the plastic packaging layer to form the graphical antenna.
6. A process for manufacturing a package structure of a fully plastic-encapsulated antenna as claimed in claim 1, characterized in that: the method comprises the following steps:
1) adhering a temporary bonding glue layer on the surface of the temporary bearing sheet;
2) manufacturing a rewiring layer on the surface of the temporary bonding glue layer by using a film process;
3) manufacturing an antenna on the rewiring layer by using a dry film photoetching and electroplating method;
4) then, continuously attaching the device to be packaged to the area, on the rewiring layer, where the antenna structure is not manufactured;
5) integrally plastic-packaging the antenna and the device on the rewiring layer to form a plastic packaging layer, so that the antenna structure and the chip are completely embedded in the plastic packaging body;
6) separating the temporary bearing sheet from the upper rewiring layer by adopting a laser or thermal stripping method, and removing the temporary bonding glue, so that the other side of the rewiring layer, which is opposite to the side where the plastic packaging layer is located, is exposed;
7) planting balls on the rewiring layer and completing the welding of the solder balls;
8) and carrying out unit cutting on the packaged device to obtain an individual packaging body unit.
7. The process for preparing the packaging structure of the complete plastic package antenna according to claim 6, wherein the process comprises the following steps: in the step 2), the upper and lower surfaces of the metal interconnection layer are at least flush with the upper and lower surfaces of the dielectric layer, and the end part of the exposed metal interconnection layer is used as a metal contact.
8. The process for preparing the packaging structure of the complete plastic package antenna according to claim 6, wherein the process comprises the following steps: the device comprises a chip and a passive element, the device surface of the chip faces the rewiring layer during mounting, and the metal bumps of the chip are connected with the corresponding metal contacts on the rewiring layer.
CN202010254867.5A 2020-04-02 2020-04-02 Packaging structure of complete plastic package antenna and preparation process thereof Pending CN111403355A (en)

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Application Number Priority Date Filing Date Title
CN202010254867.5A CN111403355A (en) 2020-04-02 2020-04-02 Packaging structure of complete plastic package antenna and preparation process thereof

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021112540A1 (en) 2021-02-26 2022-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. ANTENNA DEVICE AND METHOD

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102021112540A1 (en) 2021-02-26 2022-09-01 Taiwan Semiconductor Manufacturing Co., Ltd. ANTENNA DEVICE AND METHOD
DE102021112540B4 (en) 2021-02-26 2022-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. ANTENNA DEVICE AND METHOD
US11961809B2 (en) 2021-02-26 2024-04-16 Taiwan Semiconductor Manufacturing Co., Ltd. Antenna apparatus and method

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