CN112259010B

CN112259010B - Display screen assembly and electronic equipment

Info

Publication number: CN112259010B
Application number: CN202011125656.8A
Authority: CN
Inventors: 刘泰洋; 何晓克
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-10-20
Filing date: 2020-10-20
Publication date: 2022-08-05
Anticipated expiration: 2040-10-20
Also published as: CN112259010A

Abstract

The embodiment of the application provides a display screen assembly and electronic equipment, wherein the display screen assembly can be applied to the electronic equipment and comprises a middle frame, a display module and a buffer structure, wherein the middle frame is provided with an accommodating groove, the display module is arranged in the accommodating groove, and the display module comprises a substrate, a packaging plate and a first glue structure for connecting the substrate and the packaging plate; the buffer structure is arranged between the display module and the middle frame, a first hollowed-out area is formed between the periphery of the buffer structure and the middle frame, and the first hollowed-out area and the first glue structure are oppositely arranged in the direction perpendicular to the display plane. This application embodiment can reduce the effort that buffer structure transmitted for first glued structure when the display screen subassembly received external impact, avoids first glued structure atress too big and fracture to improve the shock resistance of display screen subassembly.

Description

Display screen assembly and electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to a display screen assembly and electronic equipment.

Background

Generally, electronic devices such as smart phones are provided with a display screen. The electronic equipment displays a picture through the display screen so as to be used by a user. However, when the electronic device is dropped, the display screen is easy to break after being impacted.

Disclosure of Invention

The embodiment of the application provides a display screen assembly and electronic equipment, and the impact resistance of the display screen assembly can be improved.

The embodiment of the application provides a display screen subassembly, includes:

a middle frame provided with a storage groove;

the display module is arranged in the accommodating groove and comprises a substrate, a packaging plate and a first glue structure for connecting the substrate and the packaging plate; and

the buffer structure is arranged between the display module and the middle frame, a first hollowed-out area is formed between the periphery of the buffer structure and the middle frame, and the first hollowed-out area and the first glue structure are oppositely arranged in the direction perpendicular to the display plane.

The embodiment of the application further provides an electronic device, which comprises the display screen assembly and the shell, wherein the shell is provided with a storage space, and the display screen assembly is contained in the storage space.

This application embodiment sets up first fretwork region through setting up at buffer structure, and first fretwork region sets up with first glued structure relatively for the display screen subassembly reduces buffer structure and transmits the effort for first glued structure when receiving external shock, avoids first glued structure atress too big and break, thereby improves the shock resistance of display screen subassembly.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a display screen assembly in the electronic device shown in fig. 1.

Fig. 3 is a schematic structural diagram of a middle frame of the display screen assembly shown in fig. 2.

FIG. 4 is a schematic structural diagram of the first glue structure and the buffer structure in the display panel assembly shown in FIG. 2.

Fig. 5 is a second structural diagram of a display module in the display screen assembly shown in fig. 2.

Fig. 6 is a schematic view of a third structure of a display module in the display assembly shown in fig. 2.

Fig. 7 is a schematic diagram illustrating a fourth structure of a display module in the display assembly shown in fig. 2.

Fig. 8 is a flow chart illustrating the fabrication of the package plate, the substrate and the first glue structure of the display panel assembly shown in fig. 2.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 20 may be a computing device such as a laptop computer, a computer monitor containing an embedded computer, a tablet computer, a cellular telephone, a media player, or other handheld or portable electronic devices, smaller devices (such as a wristwatch device, a hanging device, a headset or earpiece device, a device embedded in eyeglasses, or other device worn on the head of a user, or other wearable or miniature devices), a television, a computer display not containing an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which an electronic device with a display is installed in a kiosk or automobile), a device that implements the functionality of two or more of these devices, or other electronic devices. In the exemplary configuration of fig. 1, the electronic device 20 is a portable device, such as a cellular telephone, media player, tablet, or other portable computing device. Other configurations may be used for the electronic device 20, if desired. The example of fig. 1 is merely exemplary.

As shown in fig. 1, the electronic device 20 may include a housing 200 and a display screen assembly 400, wherein the housing 200 is used for forming an outer contour of the electronic device 20, the display screen assembly 400 is used for displaying a picture, and the housing 200 is provided with a receiving space in which the display screen assembly is received.

As shown in fig. 2, fig. 2 is a schematic structural diagram of a display screen assembly in the electronic device shown in fig. 1. The display screen assembly 400 may include a middle frame such as the middle frame 410. The middle frame 410 may have a thin plate-like or sheet-like structure, or may have a hollow frame structure. The middle frame 410 is used for providing a supporting function for the electronic elements or functional components in the electronic device 20 so as to mount the electronic elements or functional components in the electronic device 20 together. For example, functional components such as a camera, a receiver, a circuit board, and a battery in the electronic device 20 may be mounted on the middle frame 410 for fixing.

In some embodiments, the material of the middle frame 410 may include metal or plastic, or a combination of metal and plastic. For example, the middle frame 410 may include a plastic portion and a metal portion, and the middle frame 410 may be a housing structure with a metal and a plastic engaged with each other. Specifically, the metal part may be formed first, for example, a magnesium alloy substrate is formed by injection molding, and then plastic is injected on the magnesium alloy substrate to form a plastic substrate, so as to form a complete housing structure.

As shown in fig. 3, fig. 3 is a schematic structural diagram of a middle frame in the display module shown in fig. 2. The middle frame 410 is provided with a receiving groove 412, and the receiving groove 412 can be used for receiving an electronic device or other structural members of the electronic apparatus 20. For example, the middle frame 410 may include a rim 414, the rim 414 may be disposed on an inner surface of the substrate 416, and the rim 414 may be disposed around a periphery of the substrate 416, and a receiving groove 412 may be formed on the substrate 416 to receive the components of the electronic apparatus 20. In some embodiments, the bezel 414 and the substrate 416 may be integrally formed, such as by injection molding.

As shown in fig. 2, the display assembly 400 may include a display module 420. The Display module 420 may be an OLED (Organic Light Emitting Diode) module, and the Display module 420 may also be an LCD (Liquid Crystal Display) module. The display module 420 may be installed in the middle frame 410, for example, the display module 420 may be installed in the receiving groove 412. The display module 420 is used for displaying a picture. The display module 420 may have a regular shape, such as a rectangular parallelepiped structure or a rounded rectangular structure, and the display module 420 may also have an irregular shape.

Referring to fig. 2 and 4, fig. 4 is a schematic structural diagram of the first glue structure and the buffer structure in the display panel assembly shown in fig. 2. The display module 420 may include a first glue structure 421, a substrate 424, and an encapsulation plate 425, the first glue structure 421, and the substrate 424 being sequentially stacked, the first glue structure 421 being used to connect the substrate 424 and the encapsulation plate 425 together. The first cement structure 421 may be formed by bonding glass powder and ceramic powder with a binder, and is a glass-like structure formed by laser melting, has poor flexibility, and is more easily broken after being impacted than other regions.

The display panel assembly 400 may include a buffer structure 430, the buffer structure 430 is disposed between the display module 420 and the middle frame 410, the buffer structure 430 is disposed at a distance from the first glue structure 421, for example, the first glue structure 421 and the buffer structure 430 may be disposed at a distance from the substrate 424. The buffer structure 430 may be made of foam, rubber, or other materials with buffer function.

In an actual dropping process, the electronic device 20 usually causes deformation of the middle frame 410 when dropped, the deformed middle frame 410 may be pressed to an edge position of the buffer structure 430, the edge position of the buffer structure 430 transmits a pressing force to the substrate 424, and then the pressing force is transmitted to the first glue structure 421 by the substrate 424, the first glue structure 421 has poor impact resistance, and the first glue structure 421 is easy to break after being stressed.

In the embodiment of the present application, from a practical situation, a first hollow area 432 is formed between the periphery of the buffer structure 430 and the middle frame, and the first hollow area 432 and the first glue structure 421 are disposed opposite to each other in a direction perpendicular to the display plane. The display plane refers to a plane on which a user displays a screen in the display screen assembly 400, and it can also be understood that the display screen assembly 400 may include a display plane and a non-display plane, where the display plane is a plane on which a screen can be displayed (as shown in fig. 2), and the non-display plane is a plane on which a screen cannot be displayed. When the electronic device 20 falls, the middle frame 410 is impacted, and then the middle frame 410 is attached to the middle frame 410, and a squeezing force is generated on the buffer structure 430 disposed in the accommodating groove 412, and the squeezing force can be transmitted to other layers of the display module 420 after the buffer structure 430 is stressed. Since the first hollow area 432 is located at the position corresponding to the first rubber structure 421 of the buffer structure 430, the acting force transmitted from the buffer structure 430 to the first rubber structure 421 can be reduced to prevent the first rubber structure 421 from being broken by the force, thereby improving the impact resistance of the display module 420.

It can be understood that, due to the first hollow area 432 between the middle frame 410 and the display module 420, the force applied to the middle frame 410 is directly applied to other positions of the middle frame 410 and the position directly attached to the middle frame 410, so as to reduce the force applied to the position of the first glue structure 421.

The first hollow area 432 may further increase a distance between the buffer structure 430 and the frame 414 of the middle frame 410, so that when the frame 414 of the middle frame 410 is subjected to an external impact force, the acting force applied to the frame 414 is prevented from being directly transmitted to the buffer structure 430.

The projection of the first hollow-out area 432 on the display plane covers the projection of the first glue structure 421 on the display plane. For example, the size of the first cement structure 421 may be smaller than the size of the first hollowed-out area 432, such that in a direction perpendicular to the display plane, the projection of the first cement structure 421 on the display plane is located within the projection of the first hollowed-out area 432 on the display plane. For another example, the size of the first cement structure 421 may be equal to the size of the first hollowed-out area 432, such that in the direction perpendicular to the display plane, the projection of the first cement structure 421 on the display plane just completely overlaps the projection of the first hollowed-out area 432 on the display plane.

Referring to fig. 4, the first glue structure 421 is a hollow frame structure, for example, the first glue structure 421 includes a plurality of side portions connected to each other, the buffer structure 430 may include a plurality of side surfaces, a first hollow area is formed between an edge of each of the side surfaces and the middle frame 410, the first hollow areas corresponding to the side surfaces are connected to each other, and the first hollow area located on one side surface is disposed opposite to one side portion. For example, the first cement structure 421 may include a first side portion, a second side portion, a third side portion, and a fourth side portion connected in this order. The buffer structure 430 may include a first side, a second side, a third side, and a fourth side that are sequentially connected, where the first side, the second side, the third side, and the fourth side are all provided with first hollow areas 432, the first hollow areas 432 on the four sides are mutually communicated, and the first hollow area on one side and one side are located. It can be understood that a first hollow area 432 is formed between the peripheral ring of the buffer structure 430 and the middle frame 410.

In some other embodiments, a first hollow area 432 may be formed between at least a portion of the side and the middle frame 410, for example, the first hollow area 432 may be formed between a portion of or all of the edge of the first side and the middle frame 410. Or first hollow-out areas 432 are formed between two or three of the side surfaces and the middle frame 410, and the first hollow-out areas 432 corresponding to two adjacent side surfaces are communicated with each other.

As shown in fig. 5, fig. 5 is a second structural diagram of a display module in the display screen assembly shown in fig. 2. . The display module 420 includes a light-shielding layer 422, the light-shielding layer 422 is disposed in the first hollow area 432, the size of the light-shielding layer 422 is equal to the size of the first hollow area 432, the thickness of the light-shielding layer 422 is much smaller than the thickness of the first hollow area 432, and the light-shielding layer 422 can block external light from being emitted into the first hollow area 432. The light-shielding layer 422 can be made of black PET material, and the light-shielding layer 422 can prevent appearance problems caused by light transmission from the front side. The light-shielding layer 422 may be made of other light-shielding materials, and is not limited to PET materials.

With continued reference to fig. 3 to 5, the display module 420 may further include a second adhesive structure 423, a substrate 424 and an encapsulation plate 425, and the substrate 424 and the encapsulation plate 425 may be made of glass. The buffer structure 430, the second glue structure 423, the substrate 424 and the package plate 425 are sequentially stacked, the second glue structure 423 is used for bonding the buffer structure 430 and the substrate 424, the substrate 424 is an active layer of a thin film transistor, the substrate 424 is formed with a light-emitting material, when the substrate 424 is powered on, the light-emitting material can emit light, so that a light source is provided for the display module 420, and in addition, the substrate 424 further comprises an integrated circuit board for controlling the power-on and power-off of the substrate 424 and the like. The encapsulating plate 425 and the first glue structure 421 work together to prevent air from contacting the substrate 424, thereby encapsulating and protecting the upper surface of the substrate 424.

The substrate 424 may be an LTPS (Low Temperature polysilicon) substrate. Various display components such as thin film transistors, gate lines, data lines, capacitors, cathodes, organic light emitting layers, color filters, and the like may also be disposed on the substrate 424.

The buffer structure 430 of the embodiment of the application is formed with a first hollow area 432 by forming the first hollow area 432 with the middle frame 410, and the first hollow area 432 may separate the frame 414 of the middle frame 410, or the buffer structure 430 is separated from the sidewall of the receiving groove 412 by the first hollow area 432. When the frame 414 is subjected to external impact, the acting force applied to the frame 414 can be prevented from being directly transmitted to the two sides of the buffer structure 430, and the acting force applied to the buffer structure 430 can be reduced, so that the acting force applied to the first adhesive structure is reduced, and the first adhesive structure is prevented from being broken due to overlarge stress.

In practical applications, when the electronic device 20 is dropped vertically, the substrate 424 may move in a plane, such that delamination and air leakage between the substrate 424 and the package plate 425 occur, and the light emitting material on the substrate 424 may be corroded to form a black screen.

In the embodiment of the present application, the first glue structure 412 includes a plurality of side portions connected to each other, and the plurality of side portions and the plurality of first hollow areas 432 are disposed in a one-to-one correspondence in a direction perpendicular to the display plane; in the first hollow-out area 432 and the side portion which are oppositely arranged, the width of the first hollow-out area 432 in a reference direction perpendicular to the side surface corresponding to the first hollow-out area is D, and the width of the side portion in the reference direction is D, wherein D is at least twice of D.

As shown in fig. 4, the width of the first hollow area 432 at one side of the buffer structure 430 in a direction perpendicular to the one side (the reference direction as shown) is at least 2 times the width of one side opposite to the first hollow area 432 at one side of the buffer structure 430. For example, taking the first side portion 4211 as an example, the first hollow area 432 opposite to the first side portion 4211 in the direction perpendicular to the display plane is adjacent to the first side surface 434 as shown by the dotted frame in fig. 4. In a reference direction (as shown in fig. 4) perpendicular to the first side 434, a width D of the first hollowed-out area 432 adjacent to the first side 434 is at least 2 times a width D of the first side 4211, such as D may be 1mm, D may be 0.5 mm; a hollow area with sufficient width is formed between the middle frame 410 and the display module 420, so as to avoid an excessive force transmitted from the buffer layer 420 to the first glue structure 420 through the substrate 424 due to an excessively small width of the hollow area.

For example, taking the first side portion 4211 as an example, when the width D of the first side portion 4211 in the reference direction is equal to 0.5mm, the width D of the first hollowed-out area 432 opposite to the first side portion 4211 in the direction perpendicular to the display plane may be equal to 1mm, or D may be equal to 2mm, 4mm, 6mm, as long as D is equal to or greater than 2D; when the width D of the first side portion 4211 in the reference direction is equal to 5mm, the width D of the first hollowed-out area 432 disposed opposite to the first side portion 4211 in the direction perpendicular to the display plane is equal to 10 mm.

It can be understood that, in the embodiment of the present application, most of the area of the buffer structure 430 is reserved, and only a small area is reserved at the periphery of the buffer structure 430, so that the connection strength between the display module 420 and the middle frame 410 can be improved, and when the middle frame 410 is subjected to an external impact, the separation between the encapsulation plate 425 and the substrate 424 and the misalignment between the encapsulation plate 425 and the substrate 424 at the first glue structure 421 can be prevented, thereby preventing the screen from being cracked and delaminated.

In the embodiment of the present application, the second glue structure 423 may be a grid structure, which has a plurality of exhaust holes spaced apart from each other. When the buffer structure 430 and the substrate 424 are bonded by using the second glue structure 423, the air vent can exhaust air between the buffer structure 430 and the second glue structure 423 and air between the substrate 424 and the second glue structure 423, so that generation of air bubbles during bonding can be prevented, and a sealed vacuum layer can be formed between the substrate 424 and the packaging plate 425.

The second hollow-out area 426 may be disposed on the second glue structure 423, and the second hollow-out area 426 is communicated with the first hollow-out area 432, so as to reduce the acting force transmitted from the second glue structure 423 to the substrate 424, and prevent the substrate 424 from being broken due to an excessive stress.

In the embodiment of the present application, for example, the periphery of the outer surface of the buffer structure 430 is flush with the periphery of the outer surface of the second cement structure 423, so that the width of the second hollow-out region 426 is equal to the width of the first hollow-out region 432, as shown in fig. 5. Of course, in other embodiments, the outer surface periphery of the second hollow-out area 426 may not be flush with the outer surface periphery of the second cement structure 423, so that the width of the second hollow-out area 426 is greater than or less than the width of the first hollow-out area 432.

As shown in fig. 6, fig. 6 is a schematic view illustrating a third structure of a display module in the display assembly shown in fig. 2. The light-shielding layer 422 may be disposed in the second hollow-out region 426, for example, the light-shielding layer 422 may be attached on a surface of the substrate 424 facing the buffer structure 430. The size of the light-shielding layer 422 may be equal to the size of the second hollow-out region 426, and the thickness of the light-shielding layer 422 is much smaller than the thickness of the second hollow-out region 426, so that the light-shielding layer 430 may prevent light from penetrating into the second hollow-out region 426 and the first hollow-out region 432 through the display module 420, prevent the structure inside the accommodating groove 412 from being visible from the outside, and ensure the aesthetic appearance.

As shown in fig. 7, fig. 7 is a fourth structural diagram of the display module in the display assembly shown in fig. 2. The display module 420 may further include a polarizer 427, and the polarizer 427 may be laminated on the encapsulation plate 425. The number of the polarizers 427 may be one, for example, the display module 420 may include only one polarizer 427, and the polarizer 427 may be disposed on the side of the packaging plate 425 facing away from the substrate 424 or between the packaging plate 425 and the substrate 424. The number of the polarizers 427 may also be plural, for example, the number of the polarizers 427 is two, wherein one polarizer 427 is disposed on the side of the packaging plate 425 facing away from the substrate 424, and the other polarizer 427 may be disposed on the packaging plate 425 and the substrate 424. Of course, the number of the polarizers is not limited to this, for example, the display module 420 may also have three polarizers or four polarizers, and the number of the polarizers may be set according to actual situations, which is not limited in this embodiment of the present application. Wherein the polarizer 427 and the package plate 425 may be bonded together by means of optical glue.

To further illustrate the manner in which the module 420 is formed, the following description is made in view of a method of manufacturing the display module 420.

A first glue structure 421, a buffer structure 430, a substrate 424, an encapsulation plate 425, and a polarizer 427 are provided. Arranging the buffer structure 430, the substrate 424, the packaging plate 425 and the polarizer 427 in a laminated manner, adhering the substrate 424 and the packaging plate 425 together through a first adhesive structure 421, and adhering the polarizer 427 to the upper surface of the packaging plate 425 by adopting optical adhesive; then, the buffer structure 430 is bonded to the lower surface of the substrate 424 by using the glue layer 430, and a region of the buffer structure 430 corresponding to the first glue structure 421 is hollowed out to form a first hollowed-out region 432.

It should be noted that, the buffer structure 430 may also be processed in advance to form the first hollow area 432, and when the buffer structure 420 is adhered to the lower surface of the substrate 424, the first hollow area 432 and the first glue structure 421 are disposed opposite to each other, so that no buffer structure 430 is located at a position corresponding to the first glue structure 421.

Referring to fig. 8, fig. 8 is a flowchart illustrating a process of fabricating the package plate, the substrate and the first glue structure in the display panel assembly shown in fig. 2. Firstly, performing laser on an encapsulation plate 425 to laser a mark in the encapsulation plate 425, cleaning the encapsulation plate 425 after the laser is finished, baking, dehydrating, cleaning by atmospheric pressure plasma (AP plasma), coating materials (such as glass powder, ceramic powder and adhesive) for forming a first adhesive structure 421 on the encapsulation plate 425 along the mark after the cleaning is finished, then performing pre-baking, checking, sintering and cooling to form the first adhesive structure 421, checking the first adhesive structure 421 after the first adhesive structure 421 is formed, judging whether the requirement is met, cleaning by the atmospheric pressure plasma (AP plasma) again if the requirement is met, then coating UV glue on the first adhesive structure, laminating a substrate 424 which is evaporated on the encapsulation plate 425, pressing the encapsulation plate 425 and the substrate 424 together by adopting a vacuum pressing technology, melting the first adhesive structure 421 into a liquid state at high temperature in the vacuum pressing process, the substrate 424 (or LTPS substrate) and package plate 425 are then bonded together by curing.

Referring to fig. 2, the electronic device 20 may further include a cover plate 600, and the cover plate 600 may cover the display module 420 to protect the display module 420 and prevent the display screen assembly 400 from being scratched or damaged by water. The cover 600 may be covered on the polarizer 427, and the cover 600 may be a transparent glass cover, so that a user can view contents displayed by the display module 420 through the cover 600. For example, the cover 600 may be a glass cover made of sapphire.

In this embodiment, the size of the cover plate 600 is larger than that of the display module 420, for example, the cover plate 600 may include a first area and a second area, the first area is disposed at an edge of the second area, the second area is covered on the display module 420, the first area is connected to the middle frame 410, for example, the first area is connected to a sidewall or a frame 414 of the accommodating groove 412 to close the accommodating groove 412, so that the display module 420 is packaged inside the accommodating groove 412. Grooves can be formed in the frame 414 at intervals, and the first region of the cover plate 600 can be clamped in the grooves, so that the cover plate 600 is fixedly connected with the middle frame 410.

In the embodiment of the present application, an opening may be formed in the cap plate 600. For example, an opening may be formed in the cover plate 600 to accommodate a button, such as a push button. Openings may also be formed in the cover plate 600 to accommodate ports such as speaker ports. Openings may also be formed in the bezel 414 of the bezel 410 to form communication ports (e.g., audio jack ports, digital data ports, etc.). Openings in the bezel 414 may also be formed for audio components such as speakers and/or microphones.

It should be noted that fig. 1 is merely an example, and the electronic device 20 may further include other structures, for example, the electronic device 20 may further include a circuit board and a battery, and the circuit board may be mounted on the middle frame 410. The circuit board may be a motherboard of the electronic device 20. The circuit board is provided with a grounding point so as to realize the grounding of the circuit board. One, two or more of functional components such as a microphone, a loudspeaker, a receiver, an earphone interface, a universal serial bus interface (USB interface), a camera, a distance sensor, an ambient light sensor, a gyroscope, a processor and the like can be integrated on the circuit board. Meanwhile, the display module 420 may be electrically connected to the circuit board.

In some embodiments, a display control circuit is disposed on the circuit board. The display control circuit outputs an electrical signal to the display module 420 to control the display module 420 to display information.

The battery may be mounted on the middle frame 410. Meanwhile, the battery is electrically connected to the circuit board to enable the battery to supply power to the electronic device 20. Wherein, the circuit board can be provided with a power management circuit. The power management circuit is used to distribute the voltage provided by the battery to the various electronic components in the electronic device 20.

The display screen assembly and the electronic device provided by the embodiment of the application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A display screen assembly, comprising:

a middle frame provided with a storage groove;

the buffer structure is arranged between the display module and the middle frame, a first hollowed-out area is formed between the periphery of the buffer structure and the middle frame, the first hollowed-out area and the first glue structure are oppositely arranged in the direction perpendicular to the display plane, and the projection of the first hollowed-out area on the display plane covers the projection of the first glue structure on the display plane.

2. The display screen assembly of claim 1, wherein the buffer structure includes a plurality of sides, at least a portion of the sides and the middle frame forming the first hollowed-out area therebetween.

3. The display screen assembly of claim 2, wherein the first hollowed-out area is formed between each side periphery and the middle frame, and two adjacent first hollowed-out areas are communicated with each other.

4. The display screen assembly of claim 3, wherein the first glue structure comprises a plurality of interconnected sides, the plurality of sides being in one-to-one correspondence with the plurality of first hollowed-out areas in a direction perpendicular to the display plane;

in the first hollowed-out area and the side part which are oppositely arranged, the width of the first hollowed-out area in a reference direction perpendicular to the side surface corresponding to the first hollowed-out area is D, the width of the side part in the reference direction is D, and D is larger than or equal to 2D.

5. The display screen assembly of claim 4, wherein D is 1mm ≦ D ≦ 10mm, and D is 0.5mm ≦ D ≦ 5 mm.

6. The display screen assembly of any of claims 1-5, wherein the first gel structure is a glassy structure formed by solidification after laser melting.

7. The display screen assembly of claim 6, wherein the display module further comprises a second glue structure connecting the buffer structure and the substrate, wherein a second hollowed-out area is formed between a periphery of the second glue structure and the middle frame, and the second hollowed-out area is communicated with the first hollowed-out area.

8. The display screen assembly of any one of claims 1 to 5, further comprising a polarizer and a cover plate, wherein the polarizer is covered on the packaging plate, the cover plate is covered on the polarizer, and the cover plate is connected with the middle frame to seal the accommodating groove.

9. An electronic device, characterized in that: comprising a display screen assembly according to any one of claims 1 to 8 and a housing, the housing being provided with a receiving space in which the display screen assembly is accommodated.