CN112257701A - Layout obtaining method and device - Google Patents
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Abstract
The embodiment of the application discloses a layout acquisition method and a device, after an initial image obtained by scanning an etching pattern by using a scanning electron microscope is acquired, because the initial image has the characteristics of the etching pattern, the initial image can be used for predicting the pattern of the etching pattern, particularly, the initial image can be subjected to contour extraction to obtain the contour information of the etched pattern, and the initial image can be provided with a scale used for representing the size of the etched pattern, so that by utilizing the contour information of the etched pattern and the scale of the initial image, the prediction layout with the size and the pattern outline characteristics corresponding to the etching pattern can be generated, the generated prediction layout can accurately reflect the actual characteristics of the etching pattern, the accurate prediction layout is beneficial to the analysis of the etching pattern, or further comparing the generated prediction layout with the actual original layout so as to analyze the etching process.
Description
Technical Field
The present application relates to the field of semiconductors, and in particular, to a layout acquisition method and apparatus.
Background
In the semiconductor field, photolithography is an important process in integrated circuit production, and specifically, an original design pattern (i.e., an original layout) on a mask is transferred to a photoresist layer according to a certain proportion through exposure, and then transferred from the photoresist layer to an object to be processed to obtain an etched pattern, thereby providing conditions for obtaining a circuit with a given target function. Generally speaking, the etched pattern is substantially identical to the original layout.
For example, a photoresist layer may be formed on a metal layer (metal layer), a photoresist pattern may be formed on the metal layer by photolithography, and then the metal layer may be etched using the photoresist pattern, thereby obtaining a metal pattern. Normally, the photoresist pattern is almost identical to the original layout, and the metal pattern is almost identical to the photoresist pattern, i.e., the metal pattern is also almost identical to the original layout.
However, the actually obtained etching pattern may have a deviation, and how to accurately analyze the etching pattern is an important problem in the field.
Disclosure of Invention
In order to solve the above technical problem, embodiments of the present application provide a layout acquisition method and apparatus, which can acquire a corresponding layout by using an etching pattern, and implement accurate analysis on the etching pattern.
The embodiment of the application provides a layout obtaining method, which comprises the following steps:
acquiring an initial image obtained by scanning the etching pattern by using a scanning electron microscope;
extracting the outline of the initial image to obtain the outline information of the etched graph;
and generating a prediction layout corresponding to the etching graph by using the outline information and the scale of the initial image.
Optionally, the performing contour extraction on the initial image to obtain contour information of the etching pattern includes:
carrying out graying processing on the initial image to obtain a grayscale image;
carrying out binarization processing on the gray level image to obtain a binary image;
and carrying out contour extraction on the binary image to obtain contour information of the etching graph.
Optionally, before performing binarization processing on the grayscale image, the method further includes:
and performing median filtering on the gray level image.
Optionally, the extracting the contour of the binary image to obtain the contour information of the etching pattern includes:
extracting the contour of the binary image to obtain the contour of the binary image;
and removing the contour of a region with the area smaller than the area threshold value in the binary image from the contour of the binary image to obtain the contour information of the etching graph.
Optionally, the etching pattern is obtained by etching the metal layer.
Optionally, the etching pattern is obtained by etching using an original layout, and the method further includes:
and adjusting the original layout according to the predicted layout.
The application also provides a territory acquisition device, the device includes:
the initial image acquisition unit is used for acquiring an initial image obtained by scanning the etching pattern by using a scanning electron microscope;
the outline information acquisition unit is used for extracting the outline of the initial image to obtain the outline information of the etched graph;
and the predicted layout generating unit is used for generating the predicted layout corresponding to the etching graph by using the outline information and the ruler of the initial image.
Optionally, the contour information obtaining unit includes:
the graying unit is used for performing graying processing on the initial image to obtain a grayscale image;
a binarization unit, configured to perform binarization processing on the grayscale image to obtain a binary image;
and the contour information acquisition subunit is used for extracting the contour of the binary image to obtain the contour information of the etching graph.
Optionally, the apparatus further comprises:
and the filtering unit is used for performing median filtering on the gray level image before performing binary conversion on the gray level image.
Optionally, the contour information obtaining subunit includes:
the contour extraction unit is used for carrying out contour extraction on the binary image to obtain a contour in the binary image;
and the contour adjusting unit is used for removing the contour of the region with the region area smaller than the area threshold value in the binary image from the contour of the binary image to obtain the contour information of the etching graph.
Optionally, the etching pattern is obtained by etching the metal layer.
Optionally, the etching pattern is obtained by etching using an original layout, and the apparatus further includes:
and the layout adjusting unit is used for adjusting the original layout according to the predicted layout.
The embodiment of the application provides a layout acquisition method and a layout acquisition device, after an initial image obtained by scanning an etching pattern by using a scanning electron microscope is acquired, because the initial image has the characteristics of the etching pattern, the initial image can be used for predicting the pattern of the etching pattern, particularly, the initial image can be subjected to contour extraction to obtain the contour information of the etched pattern, and the initial image can be provided with a scale used for representing the size of the etched pattern, so that by utilizing the contour information of the etched pattern and the scale of the initial image, the prediction layout with the size and the pattern outline characteristics corresponding to the etching pattern can be generated, the generated prediction layout can accurately reflect the actual characteristics of the etching pattern, the accurate prediction layout is beneficial to the analysis of the etching pattern, or further comparing the generated prediction layout with the actual original layout so as to analyze the etching process.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art according to the drawings.
Fig. 1 is a flowchart of a layout obtaining method provided in an embodiment of the present application;
FIG. 2 is a schematic diagram of an initial image provided in an embodiment of the present application;
FIG. 3 is a schematic diagram of a gray scale image according to an embodiment of the present application;
FIG. 4 is a diagram of a median filtered gray scale image according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a binary image in the application example;
FIG. 6 is a schematic diagram of a part of a region of a binary image in an embodiment of the present application;
FIG. 7 is a schematic diagram of another partial region of a binary image in the embodiment of the present application;
fig. 8 is a schematic diagram of a predicted layout provided in an embodiment of the present application;
fig. 9 is a block diagram of a layout obtaining apparatus according to an embodiment of the present application.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
At present, the etching graph can be obtained through photoetching and etching, normally, the etching graph is almost consistent with the original graph, and the shape of the etching graph can be controlled by controlling the shape of the original graph. However, the actually obtained etching pattern may have a deviation, so that the etching pattern may be analyzed in actual operation, and the difference between the etching pattern and the original layout is compared.
Based on the above technical problems, the embodiments of the present application provide a method and an apparatus for obtaining a layout, after obtaining an initial image obtained by scanning an etching pattern with a scanning electron microscope, since the initial image has features of the etching pattern, the initial image can be used for predicting the layout of the etching pattern, specifically, the initial image can be subjected to contour extraction to obtain contour information of the etching pattern, the initial image can have a scale for representing the size of the etching pattern, so that a predicted layout having features of size and pattern contour corresponding to the etching pattern can be generated by using the contour information of the etching pattern and the scale of the initial image, the generated predicted layout can accurately represent the actual features of the etching pattern, the accurate predicted layout is beneficial to analysis of the etching pattern, or the generated predicted layout can be further compared with the actual original layout, thereby analyzing the etching process.
The following describes a specific implementation manner of a layout obtaining method and a layout obtaining device in the embodiments of the present application in detail through embodiments with reference to the accompanying drawings.
Referring to fig. 1, a flowchart of a layout obtaining method provided in an embodiment of the present application is shown, where the method may include the following steps:
s101, obtaining an initial image obtained by scanning the etching pattern by using a scanning electron microscope.
In the embodiment of the application, the etched pattern may be a pattern obtained after photolithography and etching are performed on the film layer to be etched, a layout used in the photolithography process may be used as an original layout, or the original layout may be used to etch the film layer to be etched to obtain the etched pattern, and the format of the original layout may be gds, etc. The etching pattern may be a pattern obtained by etching the semiconductor film layer or a pattern obtained by etching the semiconductor film layer. In the embodiment of the present application, the etching pattern is described by taking an etching pattern obtained by etching a metal layer as an example. The etch pattern may include at least one of the following patterns: line patterns, square patterns, rectangular patterns, L-shaped patterns, U-shaped patterns, T-shaped patterns, H-shaped patterns and the like.
After the etching pattern is obtained by etching, the etching can be scanned by using a Scanning Electron Microscope (SEM), which is also called a scanning electron microscope and is an electron microscope for obtaining sample information by scanning a surface of a sample with an electron beam. The initial image can be obtained by scanning the etching pattern by using a scanning electron microscope, and the initial image can have the shape characteristics of the etching pattern, so that the characteristics of the etching pattern can be obtained by analyzing the initial image, and the domain of the etching pattern can be predicted by using the initial image. For example, whether possible defects such as bad spots, loss, redundancy and the like exist in the etching pattern can be determined, and the performance of the whole circuit can be predicted by analyzing the etching pattern. The format of the initial image obtained by scanning the etching pattern by using a scanning electron microscope may be a picture format, such as a jpg or png format.
Specifically, the color of the initial image may represent the action conditions of the film layer to be etched and the electron beam, and is used to represent the form of the film layer to be etched, so that the pattern including the features of the etched pattern in the film layer to be etched may have substantially the same color as the pattern at the same height. The initial image may also include a scale that indicates the actual distance that the pixels in the initial image are from, and thus represent the size of the etched pattern, from the scale of the initial image, geometric measurement data such as line width, space, etc. of the main pattern can be determined, as shown in fig. 2, which is a schematic diagram of the initial image provided in the embodiment of the present application, wherein the longitudinal strips with lighter color are metal layers, the light-colored circles with the diameter consistent with the width of the longitudinal strips are metal through holes (in the middle elliptical circle) on the metal layers, the circles with the diameter smaller than the width of the longitudinal strips are stray points (in the left elliptical circle), the transverse strips with darker color are metal layers on other layers below the metal layers, the longitudinal stripes with lighter color can be used as the etching patterns to be analyzed, and the distance between the two metal through holes on the right side is 125 nanometers (nm).
After the initial image is obtained by scanning with the scanning electron microscope, the initial image may be stored in a database, and obtaining the initial image may specifically be reading the initial image from the database.
S102, extracting the outline of the initial image to obtain the outline information of the etching graph.
After the initial image is obtained, the profile of the initial image can be extracted to obtain the profile information of the etched graph, and the profile information can represent the characteristics of the etched graph, so that the profile information of the etched graph can be used for predicting the layout corresponding to the etched graph.
Before the contour extraction is carried out on the initial image, the gray level image can be subjected to gray level processing to obtain a gray level image, then the binary processing is carried out on the gray level image to obtain a binary image, and therefore the contour extraction can be carried out on the binary image to obtain the contour information of the etching graph. Compared with the method for directly extracting the polar outline of the initial image, the method for extracting the outline of the binary image has higher convenience and accuracy.
Specifically, the graying process refers to a process of changing an image including brightness and color into a grayscale image, and is shown in fig. 3 as a schematic diagram of a grayscale image in an embodiment of the present application, where the grayscale image is a part of an initial image.
In addition, before the binary conversion of the grayscale image, the grayscale image may be subjected to median filtering, thereby suppressing noise in the grayscale image. In particular, median filtering is a nonlinear signal processing technique based on a sorting statistical theory, and the basic principle is to replace the value of a point in a digital image or a digital sequence with the median of each point value in a neighborhood of the point, so that the surrounding pixel values are close to the true values, and isolated noise points are eliminated. The median filtering can be implemented in many different ways, and can be determined according to actual conditions in actual operation. Fig. 4 is a schematic diagram of a gray scale image subjected to median filtering in an embodiment of the present application.
Specifically, the binarization processing is to set the gray scale values of the pixels on the image to different values, for example, to adjust the gray scale values to 0 and 255, so that the whole image exhibits an obvious black-and-white effect, the data amount in the image is reduced, and the outline in the image is highlighted. Specifically, a threshold may be set for the gray-scale image, so as to set the quantity values on both sides of the threshold to different values, and the threshold may be determined in a variety of different manners, such as the ohq-maximum inter-class variance (OTSU) method. Fig. 5 is a schematic diagram of a binary image in the application embodiment. In addition, since the boundary of the image in the etching pattern shown in fig. 5 affects the area division, and white is the area where the metal is located, the width of the black area at the outermost periphery can be set to zero, so that a plurality of closed areas are formed in the binary image, and the removal of the black area does not affect the shape of the etching pattern.
After the binary image is subjected to contour extraction, contour information of the etching pattern can be obtained, specifically, the binary image can be subjected to contour extraction to obtain a contour in the binary image, and then the contour in the binary image can be directly used as the contour information of the etching pattern, or after the contour of a stray area is removed from the contour of the binary image, the remaining contour can be used as the contour information of the etching pattern.
The contour extraction of the binary image is obtained based on pixel difference in the binary image, the contour extraction can be realized by using a contour extraction algorithm, and the contour in the binary image obtained by the contour extraction is the position of the pixel difference in the binary image. Therefore, the extracted contour in the binary image can be used as the contour information of the etching pattern.
In addition, stray points may exist in the binary image, which may be caused by uneven distribution of the material of the film layer to be etched, or uneven distribution of the electron beam in the initial image acquisition process, or due to an algorithm error in the graying process or the binarization process, the contour in the binary image may include boundary positions of the stray points in addition to the boundary positions of the etching pattern, and the area of the positions of the stray points is usually small. Referring to fig. 6 and 7, which are schematic diagrams of partial areas of a binary image in an embodiment of the present application, in the diagram on the left side of fig. 6, a small white area may exist in a black area, and the white area may be considered as a stray point, so that an outline in the binary image includes an outline of the stray point, and in the diagram on the left side of fig. 7, a small black area may also exist in the white area, and the black area may be considered as a stray point, so that the outline in the binary image includes the outline of the stray point.
Therefore, in the embodiment of the present application, the regions in the binary image having the area smaller than the area threshold may be used as the regions where the stray points are located, and then the outlines of the regions may be removed, and the area threshold may be determined according to actual situations, for example, according to the critical dimension that can be achieved by photolithography. In the right-hand side of fig. 6, the binary image is obtained by removing a small white region existing in a black region, and in the right-hand side of fig. 7, the binary image is obtained by removing a small black region existing in a white region, thereby further removing noise in the binary image.
And S103, generating a prediction layout corresponding to the etching graph by using the contour information and the scale of the initial image.
After the outline information of the etched graph is obtained, a predicted graph corresponding to the etched graph can be generated according to the outline information of the etched graph and a ruler of the initial graph, and the predicted graph can have the characteristics of size and graph outline. Fig. 8 is a schematic diagram of a predicted layout provided in an embodiment of the present application. Specifically, the coordinates of the outline of the etched pattern can be determined according to the scale of the initial image, the layout is drawn, and the region surrounded by the outline is filled, so that the predicted layout is generated. Gds, so as to realize the processing process from the image of the etching graph to the layout.
After the predicted layout is obtained, the predicted layout can accurately reflect the actual characteristics of the etched graph, so that the accurate predicted layout is beneficial to analyzing the etched graph, for example, the predicted layout can be compared with the original layout, so that the difference between the predicted layout and the original layout, such as the problems of possible dead pixel, loss, redundancy and the like, can be obtained.
After the predicted layout is obtained, the predicted layout can be simulated through software, so that the whole circuit is predicted, and generally, the simulation software only supports files in the gds format, so that the actual requirements can be better met.
The embodiment of the application provides a layout obtaining method, after obtaining an initial image obtained by scanning an etching pattern by using a scanning electron microscope, since the initial image has the characteristics of the etching pattern, the layout of the etching pattern can be predicted by using the initial image, in particular, the outline of the initial image can be extracted to obtain the outline information of the etching pattern, the initial image can be provided with a scale used for representing the size of the etching pattern, thus, by using the outline information of the etching pattern and the scale of the initial image, the prediction layout with the characteristics of the size and the pattern outline corresponding to the etching pattern can be generated, the generated prediction layout can accurately embody the actual characteristics of the etching pattern, the accurate prediction layout is beneficial to the analysis of the etching pattern, or, under the condition of having the actual original layout, the generated prediction layout can be further compared with the original layout, thereby analyzing or improving the etching process. Wherein the original layout is a layout which is actually utilized by obtaining the etching graph.
Based on the above layout obtaining method, an embodiment of the present application further provides a layout obtaining apparatus, which is shown in fig. 9 and is a structural block diagram of the layout obtaining apparatus provided in the embodiment of the present application, and the apparatus may include:
an initial image obtaining unit 110, configured to obtain an initial image obtained by scanning the etching pattern with a scanning electron microscope;
a contour information obtaining unit 120, configured to perform contour extraction on the initial image to obtain contour information of the etched pattern;
and a predicted layout generating unit 130, configured to generate a predicted layout corresponding to the etching pattern by using the outline information and the scale of the initial image.
Optionally, the contour information obtaining unit includes:
the graying unit is used for performing graying processing on the initial image to obtain a grayscale image;
a binarization unit, configured to perform binarization processing on the grayscale image to obtain a binary image;
and the contour information acquisition subunit is used for extracting the contour of the binary image to obtain the contour information of the etching graph.
Optionally, the apparatus further comprises:
and the filtering unit is used for performing median filtering on the gray level image before performing binary conversion on the gray level image.
Optionally, the contour information obtaining subunit includes:
the contour extraction unit is used for carrying out contour extraction on the binary image to obtain a contour in the binary image;
and the contour adjusting unit is used for removing the contour of the region with the region area smaller than the area threshold value in the binary image from the contour of the binary image to obtain the contour information of the etching graph.
Optionally, the etching pattern is obtained by etching the metal layer.
Optionally, the etching pattern is obtained by etching using an original layout, and the apparatus further includes:
and the layout adjusting unit is used for adjusting the original layout according to the predicted layout.
The embodiment of the application provides a layout acquisition device, after an initial image obtained by scanning an etching pattern by using a scanning electron microscope is acquired, because the initial image has the characteristics of the etching pattern, the layout of the etching pattern can be predicted by using the initial image, in particular, the outline of the initial image can be extracted to obtain the outline information of the etching pattern, the initial image can be provided with a scale used for representing the size of the etching pattern, thus, by using the outline information of the etching pattern and the scale of the initial image, the prediction layout with the characteristics of the size and the pattern outline corresponding to the etching pattern can be generated, the generated prediction layout can accurately embody the actual characteristics of the etching pattern, the accurate prediction layout is beneficial to the analysis of the etching pattern, or the generated prediction layout can be further compared with the original layout under the condition of having the actual original layout, thereby analyzing or improving the etching process. Wherein the original layout is a layout which is actually utilized by obtaining the etching graph.
As can be seen from the above description of the embodiments, those skilled in the art can clearly understand that all or part of the steps in the above embodiment methods can be implemented by software plus a general hardware platform. Based on such understanding, the technical solution of the present application may be embodied in the form of a software product, which may be stored in a storage medium, such as a read-only memory (ROM)/RAM, a magnetic disk, an optical disk, or the like, and includes several instructions for enabling a computer device (which may be a personal computer, a server, or a network communication device such as a router) to execute the method according to the embodiments or some parts of the embodiments of the present application.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the apparatus embodiment, since it is substantially similar to the method embodiment, it is relatively simple to describe, and reference may be made to some descriptions of the method embodiment for relevant points. The above-described embodiments of the apparatus and system are merely illustrative, wherein modules described as separate parts may or may not be physically separate, and parts shown as modules may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
The above description is only a preferred embodiment of the present application and is not intended to limit the scope of the present application. It should be noted that, for a person skilled in the art, several improvements and modifications can be made without departing from the scope of the present application, and these improvements and modifications should also be considered as the protection scope of the present application.
Claims (10)
1. A layout acquisition method is characterized by comprising the following steps:
acquiring an initial image obtained by scanning the etching pattern by using a scanning electron microscope;
extracting the outline of the initial image to obtain the outline information of the etched graph;
and generating a prediction layout corresponding to the etching graph by using the outline information and the scale of the initial image.
2. The method according to claim 1, wherein the extracting the contour of the initial image to obtain the contour information of the etching pattern comprises:
carrying out graying processing on the initial image to obtain a grayscale image;
carrying out binarization processing on the gray level image to obtain a binary image;
and carrying out contour extraction on the binary image to obtain contour information of the etching graph.
3. The method according to claim 2, wherein before the binarization processing of the grayscale image, the method further comprises:
and performing median filtering on the gray level image.
4. The method according to claim 2, wherein the extracting the contour of the binary image to obtain the contour information of the etching pattern comprises:
extracting the contour of the binary image to obtain the contour of the binary image;
and removing the contour of a region with the area smaller than the area threshold value in the binary image from the contour of the binary image to obtain the contour information of the etching graph.
5. The method according to any one of claims 1 to 4, wherein the etching pattern is an etching pattern obtained by etching the metal layer.
6. The method according to any one of claims 1 to 4, wherein the etched pattern is etched using an original layout, the method further comprising:
and adjusting the original layout according to the predicted layout.
7. A layout acquisition apparatus, characterized in that the apparatus comprises:
the initial image acquisition unit is used for acquiring an initial image obtained by scanning the etching pattern by using a scanning electron microscope;
the outline information acquisition unit is used for extracting the outline of the initial image to obtain the outline information of the etched graph;
and the predicted layout generating unit is used for generating the predicted layout corresponding to the etching graph by using the outline information and the ruler of the initial image.
8. The apparatus according to claim 7, wherein the contour information acquiring unit includes:
the graying unit is used for performing graying processing on the initial image to obtain a grayscale image;
a binarization unit, configured to perform binarization processing on the grayscale image to obtain a binary image;
and the contour information acquisition subunit is used for extracting the contour of the binary image to obtain the contour information of the etching graph.
9. The apparatus of claim 8, further comprising:
and the filtering unit is used for performing median filtering on the gray level image before performing binary conversion on the gray level image.
10. The apparatus of claim 8, wherein the contour information obtaining subunit comprises:
the contour extraction unit is used for carrying out contour extraction on the binary image to obtain a contour in the binary image;
and the contour adjusting unit is used for removing the contour of the region with the region area smaller than the area threshold value in the binary image from the contour of the binary image to obtain the contour information of the etching graph.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011155565.9A CN112257701A (en) | 2020-10-26 | 2020-10-26 | Layout obtaining method and device |
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| CN202011155565.9A CN112257701A (en) | 2020-10-26 | 2020-10-26 | Layout obtaining method and device |
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| CN112949242A (en) * | 2021-03-05 | 2021-06-11 | 深圳市华星光电半导体显示技术有限公司 | Shading tape layout drawing method, photomask layout drawing method and photomask layout |
| CN113781605A (en) * | 2021-09-07 | 2021-12-10 | 武汉中旗生物医疗电子有限公司 | Scale drawing method, device and equipment for ultrasonic panoramic image and storage medium |
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