CN112255531B - Testing machine matching detection system and method thereof - Google Patents
Testing machine matching detection system and method thereof Download PDFInfo
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- CN112255531B CN112255531B CN202011533224.0A CN202011533224A CN112255531B CN 112255531 B CN112255531 B CN 112255531B CN 202011533224 A CN202011533224 A CN 202011533224A CN 112255531 B CN112255531 B CN 112255531B
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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Abstract
A matching detection system and method for a testing machine are provided, wherein the matching detection method for the testing machine comprises the following steps: (S1) respectively configured to collect configuration information of the tester and test item related information of the wafer to be tested; (S2) automatically receiving the configuration information of the tester acquired by the acquisition and transcribing the configuration information to a pair of templates defined by templates related to wafer test items recorded by a wafer manufacturer; (S3) comparing the information related to the test item of the wafer to be tested with the information transcribed in the comparison template; and (S4) outputting the alignment result; by the testing machine matching detection system, an operator can use the corresponding recommended testing machine to detect the wafer to be tested in time.
Description
Technical Field
The invention relates to the field of detection systems of wafer test machines, in particular to a test machine matching detection system and a test machine matching detection method.
Background
At present, the manufacturing process of integrated circuits is changing day by day, the diameter of a wafer reaches 300mm, the line of a tube core reaches 60nm and is even finer, and the area of a chip is smaller. More than ten thousand die can be made on one wafer; testing of the die is accomplished by the test system and probe station (Prober) together with a close fit in time.
The performance of all the dies is tested and analyzed by a wafer tester to detect failed dies and qualified dies, or dies that need repair. Currently, common testers are the J750 tester and the Advantest 93K tester. The J750 tester is usually configured relatively high, and the detection efficiency and the detection accuracy are also relatively high. But there are different levels of configuration even for the J750 tester. That is, even for the same type of tester, the test items that can be used to test the wafer to be tested are different.
The number and types of test items required to be tested on the fabricated wafer are often very different for different wafer manufacturers. Some wafer manufacturers need to detect a few parameters of the wafer after completing the wafer fabrication, while some other wafer manufacturers need to detect more parameters of the wafer after completing the wafer fabrication. This is not always possible for a wafer fab to configure the tester installed in the wafer fab in a top-loading configuration. In other words, the wafer inspection manufacturer has a test line with different test items for wafers that can be inspected by the tester on the test line.
For such technical problems, the existing methods are all through manual judgment. After receiving the inspection task, the inspection personnel firstly have to manually record the test items to be inspected of the wafer manufactured by the corresponding wafer manufacturer in the inspection task, and then search for the tester meeting the test requirements. This not only reduces the efficiency of the operation. Problems can also easily arise due to human intervention. For example, if the tester forgets to record the test item, the tester will fail to check the test item.
In addition, the types of testers in wafer test plants are often different. When the tester receives the test order from the wafer manufacturer, it is often impossible to directly determine whether the tester can cover the wafer test items requested by the wafer manufacturer.
Disclosure of Invention
An object of the present invention is to provide a system and a method for testing machine matching detection, wherein the system can automatically match a corresponding testing machine for a product to be tested, so as to prevent the wafer to be tested from being missed.
Another objective of the present invention is to provide a matching detection system for a testing machine and a method thereof, wherein the matching detection system for a testing machine can improve the detection efficiency of a wafer to be tested.
Another objective of the present invention is to provide a system and a method for testing machine matching detection, wherein the system can recommend at least one testing machine meeting the requirements of the testing items according to the product of the user, so as to facilitate the operator to use the corresponding recommended testing machine to detect the wafer to be tested in time.
To achieve at least one of the above objects, the present invention provides a matching detection system for a testing machine, wherein the matching detection system for a testing machine comprises:
the parameter acquisition unit comprises a tester parameter acquisition module and a wafer parameter acquisition module to be tested, wherein the tester parameter acquisition module and the wafer parameter acquisition module to be tested are respectively arranged to be capable of acquiring configuration information of a tester and related information of a test item of a wafer to be tested;
a processing unit, wherein the processing unit comprises a transcription module and an analysis module, wherein the transcription module is communicably connected to the tester parameter collecting module, the transcription module presets a comparison template defined by a template related to wafer test items recorded by a wafer manufacturer, the transcription module is configured to automatically receive configuration information of the tester obtained by collecting and transcribe the configuration information to the comparison template, the analysis module is communicably connected to the transcription module and communicably connected to the wafer parameter collecting module to be tested, the analysis module is configured to receive information related to the test items of the wafer to be tested obtained by collecting and information transcribed to the comparison template, and automatically compare the obtained information related to the test items of the wafer to be tested, so as to form a comparison result related to whether the current tester can test the wafer to be tested; and
an output unit, the output unit is connected to the analysis module in a communication way so as to output the comparison result.
According to an embodiment of the present invention, the matching condition is a matching degree between the information related to the test item of the wafer to be tested and the information transcribed in the comparison template.
According to an embodiment of the present invention, the matching condition is whether a preset key item in the related information of the test item of the wafer to be tested belongs to the subset of the information in the comparison template.
According to an embodiment of the present invention, the system for testing machine matching detection further includes a recommending unit, the recommending unit includes a recommending module, the recommending module is communicably connected to the analyzing module and the output unit, the recommending module recommends a testing machine that covers the test items of the wafer to be tested according to the comparison result formed by the analyzing module, and the output unit can output a testing machine that covers the test items of the wafer to be tested by the recommending module.
According to an embodiment of the present invention, the recommending unit further includes a combining module communicably connected to the analyzing module, the combining module is capable of analyzing the comparison result formed by the analyzing module, and when there is no tester covering the test items of the wafer to be tested in the comparison result formed by the analyzing module, the combining module combines information in the comparison templates corresponding to any predetermined number of testers and compares the combined information with information related to the test items of the wafer to be tested to form a corresponding analysis result, and the output unit is configured to output information related to a predetermined number of testers covering information related to the test items of the wafer to be tested.
According to an embodiment of the invention, the predetermined number is 2.
According to another aspect of the present invention, there is provided a matching method of a tester, comprising the steps of:
(S1) respectively configured to collect configuration information of the tester and test item related information of the wafer to be tested;
(S2) automatically receiving the configuration information of the tester acquired by the acquisition and transcribing the configuration information to a pair of templates defined by templates related to wafer test items recorded by a wafer manufacturer;
(S3) comparing the information related to the test item of the wafer to be tested with the information transcribed in the comparison template to form a comparison result related to whether the current tester can test the wafer to be tested; and
(S4) outputting the comparison result of the step (S3).
According to an embodiment of the present invention, the matching method of the testing machine further includes the steps of:
recommending a testing machine covering the testing items of the wafer to be tested according to the formed comparison result; and
test machine for outputting recommended test items of wafer to be tested
According to an embodiment of the present invention, the matching method of the testing machine further includes the steps of:
when the formed comparison result does not contain a tester of the test item of the wafer to be tested, combining information in the comparison templates corresponding to any predetermined number of testers and then comparing the information with the related information of the test item of the wafer to be tested to form a corresponding analysis result; and
and outputting the related information of the tester with a preset number covering the related information of the test items of the wafer to be tested.
Further objects and advantages of the invention will be fully apparent from the ensuing description.
These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description.
Drawings
FIG. 1 shows a table of data collected regarding the configuration of a current J750 tester.
FIG. 2 is a schematic diagram of the transcription module of the present invention converting data collected by the tester parameter collection module regarding the configuration of a current J750 tester to a pair template.
Fig. 3 shows information related to test items of the wafer to be tested currently in this embodiment.
Fig. 4 shows a block diagram of the matching detection system of the tester.
Detailed Description
The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
A testing machine matching detection system and a method thereof according to a preferred embodiment of the present invention will be described in detail below with reference to fig. 1 to 4 of the specification.
Specifically, the matching detection system of the testing machine comprises a parameter acquisition unit 10, a processing unit 20 and an output unit 30.
The parameter collecting unit 10 includes a tester parameter collecting module 11 and a wafer parameter collecting module 12 to be tested. Preferably, the testing machine is a J750 testing machine.
That is, the tester parameter collecting module 11 and the wafer parameter collecting module 12 are respectively configured to collect configuration information of the J750 tester and information related to test items of a wafer to be tested.
The processing unit 20 comprises a transcription module 21 and an analysis module 22. The transcription module 21 is arranged to be communicatively connected to the tester parameter acquisition module 11. The transcription module 21 presets a comparison template, and the transcription module 21 is configured to automatically receive configuration information of all testing machines acquired through collection and transcribe the configuration information to the comparison template.
The comparison template is set as a template related to wafer test items recorded by a wafer manufacturer.
The analysis module 22 is respectively connected to the transcription module 21 and the output unit 30 in a communication manner, and the analysis module 22 is connected to the wafer parameter collection module 12 in a communication manner. The analysis module 22 is configured to receive the acquired information about the test items of the wafer to be tested and the information transcribed in the comparison template, and the analysis module 22 is configured to automatically compare the acquired information about the test items of the wafer to be tested according to a matching condition to form a comparison result about whether each current tester can test the wafer to be tested.
The output unit 30 can output the comparison result.
In one embodiment, the matching condition is a matching degree between the information related to the test item of the wafer to be tested and the information transcribed in the comparison template. The matching degree can be obtained by the number of the related information of the test item of the wafer to be tested and the information transcribed in the comparison template.
In another embodiment, the matching condition is whether a predetermined key item in the related information of the test item of the wafer to be tested belongs to the subset of the information in the comparison template.
Specifically, when the current tester can test the wafer to be tested, the configuration of the tester covers the test items of the wafer to be tested. Accordingly, when the analysis module 22 compares the information related to the test item of the wafer to be tested with the information transcribed in the comparison template, the information related to the test item of the wafer to be tested is covered by the information in the comparison template, and accordingly, the output unit 30 outputs a result that the current testing machine can detect the wafer to be tested. On the contrary, when there is an item in the information related to the test item of the wafer to be tested that cannot be covered by the information in the comparison template, correspondingly, the output unit 30 outputs a result that the current testing machine can implement the test on the wafer to be tested.
Fig. 1 to 3 are schematic diagrams illustrating a matching detection process of a J750 tester and a wafer to be tested, for example, where fig. 1 shows a data table related to the configuration of a current J750 tester collected by the tester parameter collection module 11. Accordingly, the transcription module 21 can convert the data related to the configuration of the current J750 tester collected by the tester parameter collection module 11 into a pair template, as shown in FIG. 2.
The wafer parameter collecting module 12 to be tested can collect information related to the test item of the wafer to be tested, as shown in fig. 3.
Accordingly, the analysis module 22 can automatically compare the information converted into a comparison template with the information related to the test items of the wafer to be tested. As can be seen from fig. 3. The current testing machine can realize the detection of the wafer to be tested.
Preferably, the testing machine matching detection system further comprises a recommendation unit 40.
Specifically, the recommending unit 40 includes a recommending module 41. The recommendation module 41 is communicatively connected to the analysis module 22 and the output unit 30. The recommending module 41 recommends a tester covering the test items of the wafer to be tested according to the comparison result formed by the analyzing module 22. The output unit 30 can output the tester whose recommended module 41 covers the test items of the wafer to be tested.
With such an arrangement, when the plurality of tester matching detection systems are integrated into the plurality of interconnected testers, the tester matching detection systems can recommend the testers covering the test items of the wafer to be tested. Therefore, the test items of the wafer to be tested do not need to be compared with the configuration information of the tester one by the detection personnel.
More preferably, the recommending module 40 further comprises a combining module 42. The combination module 41 is communicatively connected to the analysis module 22. The combination module 42 can analyze the comparison result formed by the analysis module 22, and when the comparison result formed by the analysis module 22 does not include a tester of the test item of the wafer to be tested, combine the information in the comparison templates corresponding to any predetermined number of testers and compare the combined information with the information related to the test item of the wafer to be tested to form a corresponding analysis result.
The output unit 30 is configured to output the related information of a predetermined number of the testers covering the information about the test items of the wafer to be tested. In other words, at this time, although none of the test machines can detect the wafer to be tested, the test items of the wafer to be tested can be detected by combining a predetermined number of the test machines covering the information about the test items of the wafer to be tested.
Preferably, the predetermined number is 2 or more.
It will be appreciated that in the manner described above, differently configured testers may be used in combination to provide testing.
More preferably, the testing machine matching detection system further includes a testing path planning module 50. The test path planning module 50, the test path planning module 50 is configured to be communicably connected to the wafer parameter collection module 12 to be tested, the combination module 42, and the output unit.
The test path planning module 50 is configured to plan a test path based on a predetermined threshold and the parameters of the testing machine covered by the combined result formed by the combining module 42. In one embodiment, the threshold is implemented as a minimum number of stage movements of the probe station that carry the wafer.
In another embodiment of the present invention, the threshold is implemented as a minimum total movement distance and a minimum total rotation angle of a stage carrying the wafer on the probe station.
In this way, the test machine matching detection system can not only judge whether a test machine capable of meeting the test items exists in the current test factory, but also can detect the wafer to be tested by recommending a predetermined number of test machine sets when the test machine capable of meeting the test items does not exist in the current test factory. More importantly, after the test unit is formed, the test machine matching detection system can also form a test path for testing the wafer to be tested, so that the detection efficiency is improved.
It will be appreciated by persons skilled in the art that the embodiments of the invention shown in the foregoing description are by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (12)
1. A test machine match detection system, wherein the test machine match detection system comprises:
the parameter acquisition unit comprises a tester parameter acquisition module and a wafer parameter acquisition module to be tested, wherein the tester parameter acquisition module and the wafer parameter acquisition module to be tested are respectively arranged to be capable of acquiring configuration information of a tester and related information of a test item of a wafer to be tested;
a processing unit, wherein the processing unit comprises a transcription module and an analysis module, wherein the transcription module is communicably connected to the tester parameter collecting module, the transcription module presets a comparison template defined by templates related to wafer test items recorded by a wafer manufacturer, the transcription module is configured to automatically receive configuration information of the tester obtained by collecting and transcribe the configuration information to the comparison template, the analysis module is communicably connected to the transcription module, the analysis module is communicably connected to the wafer parameter collecting module to be tested, the analysis module is configured to receive information related to test items of the wafer to be tested obtained by collecting and information transcribed to the comparison template, and the analysis module is configured to perform a matching operation according to a matching condition, automatically comparing the obtained related information of the test items of the wafer to be tested to form a comparison result related to whether the current test machine can test the wafer to be tested; and
an output unit, the output unit is connected to the analysis module in a communication way so as to output the comparison result.
2. The matching detection system of claim 1, wherein the matching condition is a matching degree between information related to the test item of the wafer to be tested and information transcribed in the comparison template.
3. The matching detection system for testing machine as claimed in claim 1, wherein the matching condition is whether a predetermined key item in the information related to the testing item of the wafer under test belongs to the subset of the information in the comparison template.
4. The system as claimed in any one of claims 1 to 3, further comprising a recommendation unit, the recommendation unit including a recommendation module communicably connected to the analysis module and the output unit, the recommendation module recommending a tester covering the test items of the wafer to be tested according to the comparison result formed by the analysis module, and the output unit being capable of outputting a tester covering the test items of the wafer to be tested by the recommendation module.
5. The matching detection system of claim 4, wherein the recommendation unit further includes a combination module communicably connected to the analysis module, the combination module is capable of analyzing the comparison result formed by the analysis module, and when there is no tester covering the test items of the wafer to be tested in the comparison result formed by the analysis module, the combination module combines the information in the comparison templates corresponding to any predetermined number of testers and compares the information with the information about the test items of the wafer to be tested to form a corresponding analysis result, and the output unit is configured to output the information about the predetermined number of testers covering the information about the test items of the wafer to be tested.
6. The match detection system of claim 5, wherein the predetermined number is 2.
7. The system as claimed in claim 5, further comprising a test path planning unit, the test path planning unit configured to be communicatively connected to the wafer parameter collecting module to be tested, the combination module, and the output unit, the test path planning unit configured to form a test path according to a preset threshold and parameters of the combined result covered by the combination module, the test path corresponding to a path along which the wafer to be tested moves in the testing machine when all the testing machines corresponding to the combined result are tested, and the output unit configured to output the test path.
8. The test machine match detection system of claim 7, wherein the threshold is implemented as a minimum number of stage movements of a probe station carrying the wafer connected to all of the test machines corresponding to the combined result.
9. The match detection system of claim 7, wherein the threshold is implemented as a minimum total movement distance and a minimum total rotation angle of a stage carrying the wafer on a probe station connected to all testers corresponding to the combined result.
10. A matching detection method for a testing machine is characterized by comprising the following steps:
(S1) respectively configured to collect configuration information of the tester and test item related information of the wafer to be tested;
(S2) automatically receiving the configuration information of the tester acquired by the acquisition and transcribing the configuration information to a pair of templates defined by templates related to wafer test items recorded by a wafer manufacturer;
(S3) comparing the information related to the test item of the wafer to be tested with the information transcribed in the comparison template according to a matching condition to form a comparison result related to whether each of the current testers can test the wafer to be tested; and
(S4) outputting the comparison result of the step (S3).
11. The method for testing machine match detection as claimed in claim 10, further comprising the steps of:
recommending a testing machine covering the testing items of the wafer to be tested according to the formed comparison result; and
and outputting the recommended test items of the wafer to be tested.
12. The method for testing machine match detection as claimed in claim 11, wherein the method for testing machine match detection further comprises the steps of:
when the formed comparison result does not contain a tester of the test item of the wafer to be tested, combining information in the comparison templates corresponding to any predetermined number of testers and then comparing the information with the related information of the test item of the wafer to be tested to form a corresponding analysis result; and
and outputting the related information of the tester with a preset number covering the related information of the test items of the wafer to be tested.
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| TW529114B (en) * | 2002-01-22 | 2003-04-21 | Promos Technologies Inc | Method for confirming test function of wafer testing machine |
| JP4692835B2 (en) * | 2006-06-01 | 2011-06-01 | 横河電機株式会社 | Semiconductor test system |
| US7403864B2 (en) * | 2006-11-06 | 2008-07-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for centrally-controlled semiconductor wafer correlation |
| CN101458301B (en) * | 2007-12-13 | 2011-11-02 | 上海华虹Nec电子有限公司 | Method for implementing matching test for automatic test equipment |
| CN103348327B (en) * | 2011-01-27 | 2016-05-04 | 爱德万测试公司 | For testing test card and the tester of one or more Devices to tests |
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| CN108063101B (en) * | 2017-12-15 | 2021-01-12 | 武汉新芯集成电路制造有限公司 | Sampling method for wafer defect test |
| CN210401582U (en) * | 2019-07-03 | 2020-04-24 | 苏州欧菲特电子股份有限公司 | Printed circuit board on-line measuring equipment |
| CN111930579B (en) * | 2020-07-15 | 2024-08-06 | 深圳忆联信息系统有限公司 | Deployment permission verification method and device of testing machine, computer equipment and storage medium |
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