CN112251157A - Holding film substrate for COF packaging - Google Patents
Holding film substrate for COF packaging Download PDFInfo
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- CN112251157A CN112251157A CN202010952104.8A CN202010952104A CN112251157A CN 112251157 A CN112251157 A CN 112251157A CN 202010952104 A CN202010952104 A CN 202010952104A CN 112251157 A CN112251157 A CN 112251157A
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- waterproof layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/062—HDPE
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/06—Properties of polyethylene
- C08L2207/066—LDPE (radical process)
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the technical field of COFs (chip on film) and discloses a retaining film substrate for COFs (chip on film) packaging, which comprises a base film, wherein an anti-static layer is arranged above the base film, a blocking layer is arranged at the bottom of the base film, a first waterproof layer is arranged at the bottom of the blocking layer, a second waterproof layer is arranged at the bottom of the first waterproof layer, and an adhesive layer is arranged at the bottom of the second waterproof layer; the first waterproof layer is composed of high-density polyethylene, polyurethane resin and toluene, and the first waterproof layer comprises 5-10 parts of high-density polyethylene, 2-5 parts of polyurethane resin and 5-8 parts of toluene. According to the invention, the waterproof layer I and the waterproof layer II are arranged, and the high-density polyethylene, the polyurethane resin and the toluene in the waterproof layer I, and the olefine acid emulsion, the low-density polyethylene and the ultraviolet absorbent in the waterproof layer II are utilized to ensure that water and oxygen cannot permeate into the device through cracks when the flexible device is bent, so that the packaging performance is reduced.
Description
Technical Field
The invention relates to the technical field of COF (chip on film), in particular to a holding film substrate for COF packaging.
Background
COF (Chip On Flex, or, Chip On Film), commonly called as Chip On Film, is a flexible packaging technology for a die in which an Integrated Circuit (IC) is fixed On a flexible circuit board, and a flexible additional circuit board is used as a carrier for packaging a Chip to combine the Chip with a flexible substrate circuit, or a flexible additional circuit board without a packaged Chip is used, including tape-On-tape packaging production (TAB substrate, the manufacturing process is called TCP), flexible board connection Chip assembly, and flexible IC carrier packaging.
In the prior art, a barrier layer in the protective film is mostly made of an inorganic material, and when a flexible device is bent, water and oxygen can permeate into the device through a crack, so that the packaging performance is reduced.
Disclosure of Invention
The invention aims to provide a holding film base material for COF packaging.
In order to achieve the purpose, the invention provides the following technical scheme: a holding film substrate for COF packaging comprises a base film, wherein an anti-static layer is arranged above the base film, a blocking layer is arranged at the bottom of the base film, a first waterproof layer is arranged at the bottom of the blocking layer, a second waterproof layer is arranged at the bottom of the first waterproof layer, and an adhesive layer is arranged at the bottom of the second waterproof layer;
the waterproof layer I consists of high-density polyethylene, polyurethane resin and toluene, wherein the high-density polyethylene accounts for 5-10 parts, the polyurethane resin accounts for 2-5 parts and the toluene accounts for 5-8 parts;
the second waterproof layer consists of acrylic emulsion, low-density polyethylene and an ultraviolet absorbent, wherein 6-12 parts of acrylic emulsion, 4-12 parts of low-density polyethylene and 4-10 parts of ultraviolet absorbent.
Preferably, the ultraviolet absorbent consists of 2, 4-di-tert-butylphenol and p-chloro-o-nitroaniline, and the ratio of the 2, 4-di-tert-butylphenol to the p-chloro-o-nitroaniline is 4: 6.
preferably, the bottom of the bonding layer is bonded with mucus, the mucus is composed of thermosetting epoxy, phenolic aldehyde and unsaturated polyester, and the proportion of the thermosetting epoxy, the phenolic aldehyde and the unsaturated polyester is 3: 3: 4.
preferably, the antistatic layer is composed of an antistatic agent and a polyester resin, and the ratio of the antistatic agent to the polyester resin is 3: 7.
preferably, the antistatic agent consists of glycol biphthalate, phosphoric acid derivatives and octadecyl dimethyl quaternary ammonium nitrate, and the ratio of the glycol biphthalate, the phosphoric acid derivatives and the octadecyl dimethyl quaternary ammonium nitrate is 2: 4: 4.
preferably, the thickness of the first waterproof layer is 4-6 μm, and the thickness of the second waterproof layer is 6-8 μm.
The invention provides a holding film base material for COF packaging. The method has the following beneficial effects:
(1) according to the invention, the waterproof layer I and the waterproof layer II are arranged, and the high-density polyethylene, the polyurethane resin and the toluene in the waterproof layer I, and the olefine acid emulsion, the low-density polyethylene and the ultraviolet absorbent in the waterproof layer II are utilized to ensure that water and oxygen cannot permeate into the device through cracks when the flexible device is bent, so that the packaging performance is reduced.
Drawings
FIG. 1 is a schematic view of the structure of the present invention.
In the figure: 1 antistatic coating, 2 base film, 3 barrier layer, 4 waterproof layer one, 5 waterproof layer two, 6 adhesive linkage.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The first embodiment is as follows:
as shown in fig. 1:
a holding film substrate for COF packaging comprises a base film 2, wherein an anti-static layer 1 is arranged above the base film 2, a blocking layer 3 is arranged at the bottom of the base film 2, a waterproof layer I4 is arranged at the bottom of the blocking layer 3, a waterproof layer II 5 is arranged at the bottom of the waterproof layer I4, and an adhesive layer 6 is arranged at the bottom of the waterproof layer II 5;
the first waterproof layer 4 is composed of high-density polyethylene, polyurethane resin and toluene, and comprises 5 parts of high-density polyethylene, 2 parts of polyurethane resin and 5 parts of toluene;
and the second waterproof layer 5 consists of acrylic emulsion, low-density polyethylene and an ultraviolet absorbent, and 6 parts of acrylic emulsion, 4 parts of low-density polyethylene and 4 parts of ultraviolet absorbent.
The ultraviolet absorbent consists of 2, 4-di-tert-butylphenol and p-chloro-o-nitroaniline, and the proportion of the 2, 4-di-tert-butylphenol to the p-chloro-o-nitroaniline is 4: 6.
the bottom of the bonding layer is bonded with mucus, the mucus comprises thermosetting epoxy, phenolic aldehyde and unsaturated polyester, and the proportion of the thermosetting epoxy, the phenolic aldehyde and the unsaturated polyester is 3: 3: 4.
the antistatic layer 1 is composed of an antistatic agent and polyester resin, and the ratio of the antistatic agent to the polyester resin is 3: 7.
the antistatic agent consists of ethylene glycol bisphthalate, phosphoric acid derivatives and octadecyl dimethyl quaternary ammonium nitrate, wherein the proportion of the ethylene glycol bisphthalate, the phosphoric acid derivatives and the octadecyl dimethyl quaternary ammonium nitrate is 2: 4: 4.
the thickness of the first waterproof layer 4 is 4 micrometers, and the thickness of the second waterproof layer 5 is 6 micrometers.
Example two:
as shown in fig. 1:
a holding film substrate for COF packaging comprises a base film 2, wherein an anti-static layer 1 is arranged above the base film 2, a blocking layer 3 is arranged at the bottom of the base film 2, a waterproof layer I4 is arranged at the bottom of the blocking layer 3, a waterproof layer II 5 is arranged at the bottom of the waterproof layer I4, and an adhesive layer 6 is arranged at the bottom of the waterproof layer II 5;
the first waterproof layer 4 is composed of high-density polyethylene, polyurethane resin and toluene, and 6 parts of high-density polyethylene, 3 parts of polyurethane resin and 6 parts of toluene;
and the second waterproof layer 5 consists of acrylic emulsion, low-density polyethylene and an ultraviolet absorbent, and 7 parts of acrylic emulsion, 6 parts of low-density polyethylene and 6 parts of ultraviolet absorbent.
The ultraviolet absorbent consists of 2, 4-di-tert-butylphenol and p-chloro-o-nitroaniline, and the proportion of the 2, 4-di-tert-butylphenol to the p-chloro-o-nitroaniline is 4: 6.
the bottom of the bonding layer is bonded with mucus, the mucus comprises thermosetting epoxy, phenolic aldehyde and unsaturated polyester, and the proportion of the thermosetting epoxy, the phenolic aldehyde and the unsaturated polyester is 3: 3: 4.
the antistatic layer 1 is composed of an antistatic agent and polyester resin, and the ratio of the antistatic agent to the polyester resin is 3: 7.
the antistatic agent consists of ethylene glycol bisphthalate, phosphoric acid derivatives and octadecyl dimethyl quaternary ammonium nitrate, wherein the proportion of the ethylene glycol bisphthalate, the phosphoric acid derivatives and the octadecyl dimethyl quaternary ammonium nitrate is 2: 4: 4.
the thickness of the first waterproof layer 4 is 5 micrometers, and the thickness of the second waterproof layer 5 is 7 micrometers.
Example three:
as shown in fig. 1:
a holding film substrate for COF packaging comprises a base film 2, wherein an anti-static layer 1 is arranged above the base film 2, a blocking layer 3 is arranged at the bottom of the base film 2, a waterproof layer I4 is arranged at the bottom of the blocking layer 3, a waterproof layer II 5 is arranged at the bottom of the waterproof layer I4, and an adhesive layer 6 is arranged at the bottom of the waterproof layer II 5;
the first waterproof layer 4 is composed of high-density polyethylene, polyurethane resin and toluene, and 7 parts of high-density polyethylene, 4 parts of polyurethane resin and 7 parts of toluene;
and the second waterproof layer 5 consists of acrylic emulsion, low-density polyethylene and an ultraviolet absorbent, and 9 parts of acrylic emulsion, 8 parts of low-density polyethylene and 8 parts of ultraviolet absorbent.
The ultraviolet absorbent consists of 2, 4-di-tert-butylphenol and p-chloro-o-nitroaniline, and the proportion of the 2, 4-di-tert-butylphenol to the p-chloro-o-nitroaniline is 4: 6.
the bottom of the bonding layer is bonded with mucus, the mucus comprises thermosetting epoxy, phenolic aldehyde and unsaturated polyester, and the proportion of the thermosetting epoxy, the phenolic aldehyde and the unsaturated polyester is 3: 3: 4.
the antistatic layer 1 is composed of an antistatic agent and polyester resin, and the ratio of the antistatic agent to the polyester resin is 3: 7.
the antistatic agent consists of ethylene glycol bisphthalate, phosphoric acid derivatives and octadecyl dimethyl quaternary ammonium nitrate, wherein the proportion of the ethylene glycol bisphthalate, the phosphoric acid derivatives and the octadecyl dimethyl quaternary ammonium nitrate is 2: 4: 4.
the thickness of the first waterproof layer 4 is 5 micrometers, and the thickness of the second waterproof layer 5 is 7 micrometers.
Example four:
as shown in fig. 1:
a holding film substrate for COF packaging comprises a base film 2, wherein an anti-static layer 1 is arranged above the base film 2, a blocking layer 3 is arranged at the bottom of the base film 2, a waterproof layer I4 is arranged at the bottom of the blocking layer 3, a waterproof layer II 5 is arranged at the bottom of the waterproof layer I4, and an adhesive layer 6 is arranged at the bottom of the waterproof layer II 5;
the first waterproof layer 4 is composed of high-density polyethylene, polyurethane resin and toluene, and 8 parts of high-density polyethylene, 4 parts of polyurethane resin and 7 parts of toluene;
and the second waterproof layer 5 consists of acrylic emulsion, low-density polyethylene and an ultraviolet absorbent, wherein 10 parts of acrylic emulsion, 10 parts of low-density polyethylene and 8 parts of ultraviolet absorbent.
The ultraviolet absorbent consists of 2, 4-di-tert-butylphenol and p-chloro-o-nitroaniline, and the proportion of the 2, 4-di-tert-butylphenol to the p-chloro-o-nitroaniline is 4: 6.
the bottom of the bonding layer is bonded with mucus, the mucus comprises thermosetting epoxy, phenolic aldehyde and unsaturated polyester, and the proportion of the thermosetting epoxy, the phenolic aldehyde and the unsaturated polyester is 3: 3: 4.
the antistatic layer 1 is composed of an antistatic agent and polyester resin, and the ratio of the antistatic agent to the polyester resin is 3: 7.
the antistatic agent consists of ethylene glycol bisphthalate, phosphoric acid derivatives and octadecyl dimethyl quaternary ammonium nitrate, wherein the proportion of the ethylene glycol bisphthalate, the phosphoric acid derivatives and the octadecyl dimethyl quaternary ammonium nitrate is 2: 4: 4.
the thickness of the first waterproof layer 4 is 5 micrometers, and the thickness of the second waterproof layer 5 is 7 micrometers.
Example five:
as shown in fig. 1:
a holding film substrate for COF packaging comprises a base film 2, wherein an anti-static layer 1 is arranged above the base film 2, a blocking layer 3 is arranged at the bottom of the base film 2, a waterproof layer I4 is arranged at the bottom of the blocking layer 3, a waterproof layer II 5 is arranged at the bottom of the waterproof layer I4, and an adhesive layer 6 is arranged at the bottom of the waterproof layer II 5;
the first waterproof layer 4 is composed of high-density polyethylene, polyurethane resin and toluene, and 8 parts of high-density polyethylene, 4 parts of polyurethane resin and 7 parts of toluene;
and the second waterproof layer 5 consists of 11 parts of acrylic emulsion, 11 parts of low-density polyethylene and 9 parts of ultraviolet absorbent.
The ultraviolet absorbent consists of 2, 4-di-tert-butylphenol and p-chloro-o-nitroaniline, and the proportion of the 2, 4-di-tert-butylphenol to the p-chloro-o-nitroaniline is 4: 6.
the bottom of the bonding layer is bonded with mucus, the mucus comprises thermosetting epoxy, phenolic aldehyde and unsaturated polyester, and the proportion of the thermosetting epoxy, the phenolic aldehyde and the unsaturated polyester is 3: 3: 4.
the antistatic layer 1 is composed of an antistatic agent and polyester resin, and the ratio of the antistatic agent to the polyester resin is 3: 7.
the antistatic agent consists of ethylene glycol bisphthalate, phosphoric acid derivatives and octadecyl dimethyl quaternary ammonium nitrate, wherein the proportion of the ethylene glycol bisphthalate, the phosphoric acid derivatives and the octadecyl dimethyl quaternary ammonium nitrate is 2: 4: 4.
the thickness of the first waterproof layer 4 is 5 micrometers, and the thickness of the second waterproof layer 5 is 7 micrometers.
Example six:
as shown in fig. 1:
a holding film substrate for COF packaging comprises a base film 2, wherein an anti-static layer 1 is arranged above the base film 2, a blocking layer 3 is arranged at the bottom of the base film 2, a waterproof layer I4 is arranged at the bottom of the blocking layer 3, a waterproof layer II 5 is arranged at the bottom of the waterproof layer I4, and an adhesive layer 6 is arranged at the bottom of the waterproof layer II 5;
the first waterproof layer 4 is composed of high-density polyethylene, polyurethane resin and toluene, and 10 parts of high-density polyethylene, 5 parts of polyurethane resin and 8 parts of toluene;
and the second waterproof layer 5 consists of acrylic emulsion, low-density polyethylene and an ultraviolet absorbent, wherein the acrylic emulsion accounts for 12 parts, the low-density polyethylene accounts for 12 parts, and the ultraviolet absorbent accounts for 10 parts.
The ultraviolet absorbent consists of 2, 4-di-tert-butylphenol and p-chloro-o-nitroaniline, and the proportion of the 2, 4-di-tert-butylphenol to the p-chloro-o-nitroaniline is 4: 6.
the bottom of the bonding layer is bonded with mucus, the mucus comprises thermosetting epoxy, phenolic aldehyde and unsaturated polyester, and the proportion of the thermosetting epoxy, the phenolic aldehyde and the unsaturated polyester is 3: 3: 4.
the antistatic layer 1 is composed of an antistatic agent and polyester resin, and the ratio of the antistatic agent to the polyester resin is 3: 7.
the antistatic agent consists of ethylene glycol bisphthalate, phosphoric acid derivatives and octadecyl dimethyl quaternary ammonium nitrate, wherein the proportion of the ethylene glycol bisphthalate, the phosphoric acid derivatives and the octadecyl dimethyl quaternary ammonium nitrate is 2: 4: 4.
the thickness of the first waterproof layer 4 is 6 micrometers, and the thickness of the second waterproof layer 5 is 8 micrometers.
In conclusion, the waterproof layer I and the waterproof layer II are arranged, the high-density polyethylene, the polyurethane resin and the toluene in the waterproof layer I and the olefine acid emulsion, the low-density polyethylene and the ultraviolet absorbent in the waterproof layer II are utilized to ensure that water and oxygen cannot permeate into the device through cracks when the flexible device is bent, so that the packaging performance is reduced.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A holding film substrate for COF packaging, comprising a base film (2), characterized in that: an anti-static layer (1) is arranged above the base film (2), a blocking layer (3) is arranged at the bottom of the base film (2), a waterproof layer I (4) is arranged at the bottom of the blocking layer (3), a waterproof layer II (5) is arranged at the bottom of the waterproof layer I (4), and an adhesive layer (6) is arranged at the bottom of the waterproof layer II (5);
the waterproof layer I (4) is composed of high-density polyethylene, polyurethane resin and toluene, wherein the high-density polyethylene is 5-10 parts, the polyurethane resin is 2-5 parts and the toluene is 5-8 parts;
and the second waterproof layer (5) consists of acrylic emulsion, low-density polyethylene and an ultraviolet absorbent, wherein 6-12 parts of acrylic emulsion, 4-12 parts of low-density polyethylene and 4-10 parts of ultraviolet absorbent are used.
2. The holding film substrate for COF packaging according to claim 1, wherein: the ultraviolet absorbent consists of 2, 4-di-tert-butylphenol and p-chloro-o-nitroaniline, and the proportion of the 2, 4-di-tert-butylphenol to the p-chloro-o-nitroaniline is 4: 6.
3. the holding film substrate for COF packaging according to claim 1, wherein: the bottom of the bonding layer is bonded with mucus, the mucus comprises thermosetting epoxy, phenolic aldehyde and unsaturated polyester, and the proportion of the thermosetting epoxy, the phenolic aldehyde and the unsaturated polyester is 3: 3: 4.
4. the holding film substrate for COF packaging according to claim 1, wherein: the antistatic layer (1) is composed of an antistatic agent and polyester resin, and the ratio of the antistatic agent to the polyester resin is 3: 7.
5. the holding film substrate for COF packaging according to claim 4, wherein: the antistatic agent consists of ethylene glycol bisphthalate, phosphoric acid derivatives and octadecyl dimethyl quaternary ammonium nitrate, wherein the proportion of the ethylene glycol bisphthalate, the phosphoric acid derivatives and the octadecyl dimethyl quaternary ammonium nitrate is 2: 4: 4.
6. the holding film substrate for COF packaging according to claim 1, wherein: the thickness of the first waterproof layer (4) is 4-6 mu m, and the thickness of the second waterproof layer (5) is 6-8 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010952104.8A CN112251157A (en) | 2020-09-11 | 2020-09-11 | Holding film substrate for COF packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010952104.8A CN112251157A (en) | 2020-09-11 | 2020-09-11 | Holding film substrate for COF packaging |
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| CN112251157A true CN112251157A (en) | 2021-01-22 |
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| CN202010952104.8A Pending CN112251157A (en) | 2020-09-11 | 2020-09-11 | Holding film substrate for COF packaging |
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2020
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| US5078931A (en) * | 1986-11-17 | 1992-01-07 | Mitsui Toatsu Chemicals, Inc. | Gas-permeable, waterproof film and process for its production |
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| US20160194849A1 (en) * | 2015-01-06 | 2016-07-07 | Garland Industries, Inc. | Containment Membrane |
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| WO2020043741A1 (en) * | 2018-08-27 | 2020-03-05 | Sika Technology Ag | A self-adhering sealing device with an adhesive layer arrangement |
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Application publication date: 20210122 |