CN112239867A - Plating method of aluminum-based composite material electronic packaging shell - Google Patents
Plating method of aluminum-based composite material electronic packaging shell Download PDFInfo
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- CN112239867A CN112239867A CN202011165035.2A CN202011165035A CN112239867A CN 112239867 A CN112239867 A CN 112239867A CN 202011165035 A CN202011165035 A CN 202011165035A CN 112239867 A CN112239867 A CN 112239867A
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- 238000007747 plating Methods 0.000 title claims abstract description 87
- 239000002131 composite material Substances 0.000 title claims abstract description 67
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 54
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 178
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 89
- 239000000126 substance Substances 0.000 claims abstract description 63
- 230000004913 activation Effects 0.000 claims abstract description 59
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 57
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims abstract description 34
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000009713 electroplating Methods 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 29
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000010931 gold Substances 0.000 claims abstract description 23
- 229910052737 gold Inorganic materials 0.000 claims abstract description 23
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 18
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 18
- 229910052763 palladium Inorganic materials 0.000 claims description 12
- 230000003213 activating effect Effects 0.000 claims description 11
- 229910052698 phosphorus Inorganic materials 0.000 claims description 11
- 239000011574 phosphorus Substances 0.000 claims description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 235000019270 ammonium chloride Nutrition 0.000 claims description 9
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 abstract description 7
- 239000007921 spray Substances 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000007704 transition Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract 8
- 239000011247 coating layer Substances 0.000 abstract 6
- 238000001914 filtration Methods 0.000 description 12
- 239000011159 matrix material Substances 0.000 description 9
- 238000004806 packaging method and process Methods 0.000 description 6
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910001453 nickel ion Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000006056 electrooxidation reaction Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
Abstract
The invention discloses a plating method of an aluminum-based composite material electronic packaging shell, which comprises the following steps: the aluminum-base composite material electronic packaging shell comprises a first palladium atom activation layer, a nickel-phosphorus chemical nickel coating layer, a second palladium atom activation layer, a nickel-boron chemical nickel coating layer, an electroplating nickel layer and an electroplating gold layer, wherein a compact intermediate transition coating layer is formed on the double-layer palladium atom activation layer and the multi-layer composite nickel coating layer, an effective filling and covering effect is generated on the microporous aluminum-base composite material, the coating is compact, a high-purity gold coating layer is coated on the outermost layer, the salt spray resistance is fully improved, the composite coating layer can effectively overcome the defect of surface inconsistency of the aluminum-base composite material, and the requirement of 48-hour salt spray resistance is completely met.
Description
Technical Field
The invention belongs to the field of microelectronic packaging, and particularly relates to a plating method of an aluminum-based composite material electronic packaging shell.
Background
The aluminum-based composite material is an excellent base material for packaging shells, and has the following remarkable performance advantages compared with packaging metal materials such as kovar, cold-rolled phase steel, oxygen-free copper and the like. The aluminum matrix composite has the characteristics of high thermal conductivity, adjustable thermal expansion coefficient, low density, moderate mechanical strength and the like; the expansion coefficient is adjustable, and the method can be suitable for the assembly requirements of circuit substrates made of different materials inside; and the density is low, the weight of the device can be greatly reduced, and the high-reliability integrated circuit packaging structure is widely applied to high-reliability integrated circuit packaging of aviation, aerospace and the like.
However, the aluminum matrix composite has the structural characteristics of multiple phases and multiple micropores, so that the aluminum matrix composite has poor wear resistance and corrosion resistance, and is easy to corrode in the using process, thereby reducing the service life. In the prior art, a plating method is generally used to form a dense plating structure such as nickel plating, gold plating, etc. on the surface of a composite material to improve the performance of an aluminum matrix composite material, so that the aluminum matrix composite material is suitable for the development and production of package housings. However, the existing plating layer structure has limited improvement on the corrosion resistance of the aluminum matrix composite, and the aluminum matrix composite has low comprehensive performance and cannot meet the requirements of practical application.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a plating method of an aluminum-based composite material electronic packaging shell.
A plating method of an aluminum-based composite material electronic packaging shell comprises the following steps:
first activation: and (2) immersing the aluminum-based composite material into an activating solution containing palladium, controlling the temperature at 45-65 ℃, performing circulating filtration, immersing for 1-5 minutes, taking out and washing, and forming a first palladium atom activating layer on the surface of the aluminum-based composite material, wherein the thickness of the first palladium atom activating layer is 0.01-0.05 mu m.
Chemical nickel and phosphorus plating: immersing the aluminum-based composite material subjected to the first activation into a nickel-phosphorus plating solution, controlling the temperature to be 86-92 ℃, and performing circulating filtration to form a nickel-phosphorus chemical nickel plating layer on the outer side of the first palladium atom activation layer; the thickness of the nickel-phosphorus chemical nickel coating is 2.5-15 mu m, and the mass content of phosphorus in the nickel-phosphorus chemical nickel coating is 10-13 percent, so that the nickel-phosphorus chemical nickel coating is formed. The first palladium atom activation layer is a chemical nickel trigger layer, and forms a priming coating with the nickel-phosphorus chemical nickel coating.
And (3) second activation: immersing the aluminum-based composite material subjected to chemical nickel-phosphorus plating into a palladium-containing activation solution again, controlling the temperature at 45-65 ℃, performing cyclic filtration, soaking for 1-5 minutes, taking out and washing, and forming a second palladium atom activation layer on the outer side of the nickel-phosphorus chemical nickel plating layer; the thickness of the second palladium atom activation layer is 0.01-0.05 μm. The second palladium atom activation layer is formed on the outer side of the nickel-phosphorus chemical nickel coating, so that coating flaws and blind spots existing in the nickel-phosphorus chemical nickel coating can be compensated, larger micropores in the base material can be activated again, and a more uniformly activated surface is provided for subsequent coating.
Chemical nickel-boron plating: immersing the aluminum-based composite material subjected to the second activation into a nickel-boron plating solution, controlling the temperature to be 60-70 ℃, and performing circulating filtration to form a nickel-boron chemical nickel plating layer on the outer side of the second palladium atom activation layer; the thickness of the nickel-boron chemical nickel coating is 2.5-15 mu m, and the mass content of boron in the nickel-boron chemical nickel coating is 0.1-1%. The nickel-boron chemical nickel coating has excellent electrochemical corrosion resistance.
Electroplating nickel: carrying out nickel electroplating on the aluminum-based composite material subjected to chemical nickel-boron plating, and forming an electroplated nickel layer on the outer side of the nickel-boron chemical nickel plating layer; the current density of the electroplated nickel is 0.5-2A/dm2The temperature is 35-55 ℃; the thickness of the electroplated nickel layer is 2.5-15 μm. The electroplated nickel layer forms a potential valley, and can form a sacrificial layer for electrochemical corrosion, thereby reducing the corrosion of matrix materials such as aluminum matrix composite materials.
Gold electroplating: aluminum base to be nickel-platedPerforming gold electroplating on the composite material, and forming an electroplating gold layer on the outer side of the electroplating nickel layer; the current density of the electrogilding is 0.1-0.6A/dm2The temperature is 50-70 ℃; the thickness of the gold-plating layer is 1.3-5.7 μm. The electroplated gold layer is formed on the outermost side of the material, so that the requirement of salt mist resistance of the packaging shell can be met, and the performance requirements of subsequent soldering, bonding and the like can also be met.
As a preferable technical solution, in the first activation and the second activation, the palladium-containing activation solution contains palladium chloride, hydrochloric acid and ammonium chloride, wherein: the concentration of palladium chloride is 0.05-0.5 g/L, the concentration of hydrochloric acid is 2-10 ml/L, and the concentration of ammonium chloride is 0.5-3 g/L.
In order to achieve the purpose, the invention adopts the technical scheme that:
according to the plating method disclosed by the invention, a composite plating layer structure of a first palladium atom activation layer, a nickel-phosphorus chemical nickel plating layer, a second palladium atom activation layer, a nickel-boron chemical nickel plating layer, an electroplated nickel layer and an electroplated gold layer can be sequentially formed on the outer side of an electronic packaging shell of the aluminum-based composite material, wherein a compact intermediate transition plating layer is formed by the double-layer palladium atom activation layer and the multi-layer composite nickel plating layer, an effective filling and covering effect is generated on the multi-microporous aluminum-based composite material, the plating layer is compact, a high-purity gold plating layer is plated on the outermost layer, the salt spray resistance is fully improved, the surface inconsistency defect of the aluminum-based composite material can be effectively overcome by the composite plating layer, and the salt spray resistance requirement in.
Drawings
FIG. 1 is a schematic longitudinal sectional view of a composite coating structure produced by the method of the present invention;
reference numerals: the electronic packaging shell comprises a 100-aluminum-based composite material electronic packaging shell, 1-a first palladium atom activation layer, 2-a nickel-phosphorus chemical nickel coating, 3-a second palladium atom activation layer, 4-a nickel-boron chemical nickel coating, 5-an electroplated nickel coating and 6-an electroplated gold coating.
Detailed Description
The invention is further described with reference to the following figures and examples. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "inside", "outside", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. The terms "first" and "second" used herein do not denote any particular order or quantity, but rather are used to distinguish one element from another.
It should be noted that, in the following examples, except for the steps specifically described, other steps are conventional in the art, and those skilled in the art can know the corresponding specific operation method on the premise of mastering the related technology in the art, so that the detailed description of some operations is not given. The aluminum-based composite material, nickel-phosphorus plating solution, nickel-boron plating solution, palladium chloride, hydrochloric acid, ammonium chloride and other raw materials used in the following examples are all commercially available products.
Example 1
A plating method of an aluminum-based composite material electronic packaging shell comprises the following steps:
first activation: and (2) immersing the aluminum-based composite material into an activating solution containing palladium, controlling the temperature at 50 +/-5 ℃, circularly filtering, immersing for 1 minute, taking out and washing to form a first palladium atom activating layer on the surface of the aluminum-based composite material.
Chemical nickel and phosphorus plating: immersing the aluminum-based composite material subjected to the first activation into a nickel-phosphorus plating solution, controlling the temperature at 89 +/-2 ℃, the pH at 4.6 +/-0.2 and the concentration of nickel ions at 5 +/-0.2 g/L, and performing circulating filtration to form a nickel-phosphorus chemical nickel plating layer on the outer side of the first palladium atom activation layer; the thickness of the nickel-phosphorus chemical nickel coating is 3 +/-0.5 mu m, and the mass content of phosphorus in the nickel-phosphorus chemical nickel coating is 12 percent, thereby being a high-phosphorus chemical nickel coating.
And (3) second activation: and (3) immersing the aluminum-based composite material after chemical nickel-phosphorus plating into the palladium-containing activation solution again, controlling the temperature at 50 +/-5 ℃, circularly filtering, immersing for 1 minute, taking out and washing, and forming a second palladium atom activation layer on the outer side of the nickel-phosphorus chemical nickel plating layer.
Chemical nickel-boron plating: immersing the aluminum-based composite material subjected to the second activation into a nickel-boron plating solution, controlling the temperature at 62 +/-2 ℃, the pH value at 6.2 +/-0.2 and the concentration of nickel ions at 5.8 +/-0.2 g/L, and performing circulating filtration to form a nickel-boron chemical nickel plating layer on the outer side of the second palladium atom activation layer; the thickness of the nickel-boron chemical nickel coating is 3 +/-0.5 mu m.
Electroplating nickel: carrying out nickel electroplating on the aluminum-based composite material subjected to chemical nickel-boron plating, and forming an electroplated nickel layer on the outer side of the nickel-boron chemical nickel plating layer; the current density of the electroplated nickel is 0.5A/dm2The temperature is 40 +/-5 ℃; the thickness of the electroplated nickel layer is 3.25 +/-0.75 mu m.
Gold electroplating: carrying out gold electroplating on the aluminum-based composite material subjected to nickel electroplating, and forming an electroplating gold layer on the outer side of the electroplating nickel layer; the current density of the electrogilding is 0.1A/dm2The temperature is 55 +/-5 ℃; the thickness of the gold-plated layer is 1.9 +/-0.6 mu m.
In the first activation and the second activation, the palladium-containing activation solution contains palladium chloride, hydrochloric acid and ammonium chloride, wherein: the concentration of palladium chloride is 0.35g/L, the concentration of hydrochloric acid is 5ml/L, and the concentration of ammonium chloride is 3 g/L.
Example 2
A plating method of an aluminum-based composite material electronic packaging shell comprises the following steps:
first activation: and (2) immersing the aluminum-based composite material into an activating solution containing palladium, controlling the temperature at 50 +/-5 ℃, circularly filtering, immersing for 5 minutes, taking out and washing to form a first palladium atom activating layer on the surface of the aluminum-based composite material.
Chemical nickel and phosphorus plating: immersing the aluminum-based composite material subjected to the first activation into a nickel-phosphorus plating solution, controlling the temperature at 89 +/-2 ℃, the pH at 4.6 +/-0.2 and the concentration of nickel ions at 5 +/-0.2 g/L, and performing circulating filtration to form a nickel-phosphorus chemical nickel plating layer on the outer side of the first palladium atom activation layer; the thickness of the nickel-phosphorus chemical nickel coating is 6.5 +/-1 mu m, and the mass content of phosphorus in the nickel-phosphorus chemical nickel coating is 11 percent, so that the nickel-phosphorus chemical nickel coating is a high-phosphorus chemical nickel coating.
And (3) second activation: and (3) immersing the aluminum-based composite material after chemical nickel-phosphorus plating into the palladium-containing activation solution again, controlling the temperature at 50 +/-5 ℃, circularly filtering, immersing for 5 minutes, taking out and washing, and forming a second palladium atom activation layer on the outer side of the nickel-phosphorus chemical nickel plating layer.
Chemical nickel-boron plating: immersing the aluminum-based composite material subjected to the second activation into a nickel-boron plating solution, controlling the temperature at 62 +/-2 ℃, the pH value at 6.2 +/-0.2 and the concentration of nickel ions at 5.8 +/-0.2 g/L, circularly filtering, and forming a nickel-boron chemical nickel plating layer on the outer side of the second palladium atom activation layer; the thickness of the nickel-boron chemical nickel coating is 6.5 +/-1 mu m.
Electroplating nickel: carrying out nickel electroplating on the aluminum-based composite material subjected to chemical nickel-boron plating, and forming an electroplated nickel layer on the outer side of the nickel-boron chemical nickel plating layer; the current density of the electroplated nickel is 1.5A/dm2The temperature is 40 +/-5 ℃; the thickness of the electroplated nickel layer is 6 +/-1.5 mu m.
Gold electroplating: carrying out gold electroplating on the aluminum-based composite material subjected to nickel electroplating, and forming an electroplating gold layer on the outer side of the electroplating nickel layer; the current density of the electrogilding is 0.5A/dm2The temperature is 50 +/-5 ℃; the thickness of the gold-plated layer is 1.9 +/-0.6 mu m.
In the first activation and the second activation, the palladium-containing activation solution contains palladium chloride, hydrochloric acid and ammonium chloride, wherein: the concentration of palladium chloride is 0.15g/L, the concentration of hydrochloric acid is 5ml/L, and the concentration of ammonium chloride is 3 g/L.
The composite plating layer structure prepared on the surface of the aluminum-based composite material electronic packaging shell 100 by the plating method of the invention is shown in fig. 1, and comprises a first palladium atom activation layer 1, a nickel-phosphorus chemical nickel plating layer 2, a second palladium atom activation layer 3, a nickel-boron chemical nickel plating layer 4, an electroplated nickel layer 5 and an electroplated gold layer 6 from inside to outside in sequence. The double-layer palladium atom activation layer and the multi-layer composite nickel plating layer form a compact intermediate transition plating layer, effective filling and covering effects are generated on the microporous aluminum-based composite material, the plating layer is compact, the outermost layer is plated with the high-purity gold plating layer, the salt spray resistance is fully improved, the composite plating layer can effectively overcome the defect of surface inconsistency of the aluminum-based composite material, and the salt spray resistance requirement in 48 hours is completely met.
Claims (8)
1. A plating method of an aluminum-based composite material electronic packaging shell is characterized by comprising the following steps: the method comprises the following steps:
first activation: immersing the aluminum-based composite material into an activating solution containing palladium, soaking for 1-5 minutes at 45-65 ℃, taking out and washing to form a first palladium atom activating layer on the surface of the aluminum-based composite material;
chemical nickel and phosphorus plating: immersing the aluminum-based composite material subjected to the first activation into a nickel-phosphorus plating solution at the temperature of 86-92 ℃, and forming a nickel-phosphorus chemical nickel plating layer on the outer side of the first palladium atom activation layer;
and (3) second activation: immersing the aluminum-based composite material subjected to chemical nickel-phosphorus plating into the palladium-containing activating solution again, soaking for 1-5 minutes at 45-65 ℃, taking out and washing, and forming a second palladium atom activating layer on the outer side of the nickel-phosphorus chemical nickel plating layer;
chemical nickel-boron plating: immersing the aluminum-based composite material subjected to the second activation into a nickel-boron plating solution at the temperature of 60-70 ℃, and forming a nickel-boron chemical nickel plating layer on the outer side of the second palladium atom activation layer;
electroplating nickel: carrying out nickel electroplating on the aluminum-based composite material subjected to chemical nickel-boron plating, and forming an electroplated nickel layer on the outer side of the nickel-boron chemical nickel plating layer;
gold electroplating: and electroplating gold on the nickel-electroplated aluminum-based composite material, and forming an electroplating gold layer on the outer side of the nickel electroplating layer.
2. The plating method according to claim 1, characterized in that: in the first activation and the second activation, the palladium-containing activation solution contains palladium chloride, hydrochloric acid and ammonium chloride, wherein: the concentration of palladium chloride is 0.05-0.5 g/L, the concentration of hydrochloric acid is 2-10 ml/L, and the concentration of ammonium chloride is 0.5-3 g/L.
3. The plating method according to claim 1, characterized in that: the thickness of the first palladium atom activation layer is 0.01-0.05 μm.
4. The plating method according to claim 1, characterized in that: in the step of chemically plating nickel and phosphorus, the thickness of the nickel-phosphorus chemical nickel plating layer is 2.5-15 mu m, and the mass content of phosphorus in the nickel-phosphorus chemical nickel plating layer is 10-13%.
5. The plating method according to claim 1, characterized in that: in the second activation step, the thickness of the second palladium atom activation layer is 0.01-0.05 μm.
6. The plating method according to claim 1, characterized in that: in the step of chemically plating nickel and boron, the thickness of the nickel-boron chemical nickel coating is 2.5-15 mu m, and the mass content of boron in the nickel-boron chemical nickel coating is 0.1-1%.
7. The plating method according to claim 1, characterized in that: in the step of electroplating nickel, the current density of the electroplating nickel is 0.5-2A/dm2The temperature is 35-55 ℃; the thickness of the electroplated nickel layer is 2.5-15 μm.
8. The plating method according to claim 1, characterized in that: in the step of gold electroplating, the current density of the gold electroplating is 0.1-0.6A/dm2The temperature is 50-70 ℃; the thickness of the gold-plating layer is 1.3-5.7 μm.
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| CN111118480A (en) * | 2020-01-14 | 2020-05-08 | 常州大学 | Chemical plating solution for low-temperature chemical plating of Ni-B binary alloy layer and chemical plating method |
| CN111334795A (en) * | 2020-03-12 | 2020-06-26 | 成都四威高科技产业园有限公司 | Surface plating process for diamond aluminum composite material |
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| US6362089B1 (en) * | 1999-04-19 | 2002-03-26 | Motorola, Inc. | Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formed |
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| WO2008153026A1 (en) * | 2007-06-12 | 2008-12-18 | Tokuyama Corporation | Metallized substrate and process for producing the same |
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