CN213772215U - Coating for electrochemical corrosion resistant aluminum-based composite material electronic packaging shell - Google Patents
Coating for electrochemical corrosion resistant aluminum-based composite material electronic packaging shell Download PDFInfo
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- CN213772215U CN213772215U CN202022443325.0U CN202022443325U CN213772215U CN 213772215 U CN213772215 U CN 213772215U CN 202022443325 U CN202022443325 U CN 202022443325U CN 213772215 U CN213772215 U CN 213772215U
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Abstract
The utility model discloses a cladding material for anti electrochemical corrosion's aluminium base combined material electron encapsulation shell includes first palladium atom activation layer, nickel phosphorus chemical nickel cladding material, second palladium atom activation layer, nickel boron chemical nickel cladding material, nickel plating layer and electrogilding layer by interior outside to in proper order. Wherein the first palladium atom activation layer is a chemical nickel trigger layer, and forms a priming coating with a nickel-phosphorus chemical nickel coating plated on the outer side of the first palladium atom activation layer; the second palladium atom activation layer can make up for coating flaws and blind spots existing in the nickel-phosphorus chemical nickel coating and can activate larger micropores in the base material again; the nickel-boron chemical nickel coating has excellent electrochemical corrosion resistance; the electroplated nickel layer forms a potential valley, and can form a sacrificial layer for electrochemical corrosion; the electrogilding layer can meet the salt spray resistance requirement of the packaging shell and can also meet the performance requirements of subsequent soldering, bonding and the like. The plating layer structure prepared by the invention can obviously improve the electrochemical corrosion resistance of the matrix material.
Description
Technical Field
The utility model belongs to the microelectronics packaging field, concretely relates to cladding material that is used for aluminium base composite material electron encapsulation shell of anti electrochemical corrosion.
Background
The aluminum-based composite material is an excellent base material for packaging shells, and has the following remarkable performance advantages compared with packaging metal materials such as kovar, cold-rolled phase steel, oxygen-free copper and the like. The aluminum matrix composite has the characteristics of high thermal conductivity, adjustable thermal expansion coefficient, low density, moderate mechanical strength and the like; the expansion coefficient is adjustable, and the method can be suitable for the assembly requirements of circuit substrates made of different materials inside; and the density is low, the weight of the device can be greatly reduced, and the high-reliability integrated circuit packaging structure is widely applied to high-reliability integrated circuit packaging of aviation, aerospace and the like.
However, the aluminum matrix composite has the structural characteristics of multiple phases and multiple micropores, so that the aluminum matrix composite has poor wear resistance and corrosion resistance, and is easy to corrode in the using process, thereby reducing the service life. In the prior art, a plating method is generally used to form a dense plating structure such as nickel plating, gold plating, etc. on the surface of a composite material to improve the performance of an aluminum matrix composite material, so that the aluminum matrix composite material is suitable for the development and production of package housings. However, the existing plating layer structure has limited improvement on the corrosion resistance of the aluminum matrix composite, and the aluminum matrix composite has low comprehensive performance and cannot meet the requirements of practical application.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model aims to provide a plating layer of an aluminum-based composite material electronic packaging shell for resisting electrochemical corrosion.
A plating layer of an aluminum-based composite material electronic packaging shell for resisting electrochemical corrosion sequentially comprises a first palladium atom activation layer, a nickel-phosphorus chemical nickel plating layer, a second palladium atom activation layer, a nickel-boron chemical nickel plating layer, an electroplated nickel layer and an electroplated gold layer from inside to outside.
Preferably, the thickness of the first palladium atom activation layer is 0.01-0.05 μm.
According to a preferable technical scheme, the thickness of the nickel-phosphorus chemical nickel coating is 2.5-15 mu m. The nickel-phosphorus chemical nickel coating is a high-phosphorus chemical nickel coating, and the phosphorus content is 10-13% by mass.
Preferably, the thickness of the second palladium atom activation layer is 0.01-0.05 μm.
According to the preferable technical scheme, the thickness of the nickel-boron chemical nickel coating is 2.5-15 mu m, and the mass content of boron in the nickel-boron chemical nickel coating is 0.1-1%.
Preferably, the thickness of the electroplated nickel layer is 2.5-15 μm.
As a preferable technical scheme, the thickness of the electroplating gold layer is 1.3-5.7 μm.
In order to achieve the above object, the utility model adopts the following technical scheme:
the first palladium atom activation layer in the coating structure provided by the invention is a chemical nickel trigger layer, the chemical nickel trigger layer and the nickel-phosphorus chemical nickel coating plated on the outer side of the chemical nickel trigger layer form a priming coating, and then the second palladium atom activation layer is formed on the outer side of the nickel-phosphorus chemical nickel coating, so that the defects and blind spots of the coating in the nickel-phosphorus chemical nickel coating can be compensated, larger micropores in a base material can be activated again, and a more uniformly activated surface is provided for subsequent coating. The nickel-boron chemical nickel coating has excellent electrochemical corrosion resistance. In the finally formed electroplated nickel layer and electroplated gold layer, the electroplated nickel layer forms a potential valley, and can form a sacrificial layer of electrochemical corrosion, thereby reducing the corrosion of a base material; the electrogilding layer can meet the salt spray resistance requirement of the packaging shell and can also meet the performance requirements of subsequent soldering, bonding and the like. The coating structure prepared by the invention can form a compact composite coating on the surface of matrix composite materials such as aluminum silicon, aluminum carbon silicon and the like, obviously improves the electrochemical corrosion resistance of the matrix material, and enables the matrix material to meet the salt spray resistance requirement in 48 hours.
Drawings
FIG. 1 is a schematic view of a longitudinal section structure of a plating layer structure provided by the present invention;
reference numerals: the electronic packaging shell comprises a 100-aluminum-based composite material electronic packaging shell, 1-a first palladium atom activation layer, 2-a nickel-phosphorus chemical nickel coating, 3-a second palladium atom activation layer, 4-a nickel-boron chemical nickel coating, 5-an electroplated nickel coating and 6-an electroplated gold coating.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. In the present invention, the terms "first" and "second" do not denote any particular quantity or order, but are merely used to distinguish names.
Referring to fig. 1, a plating layer of an aluminum-based composite electronic package casing for electrochemical corrosion resistance sequentially includes, from inside to outside, a first palladium atom activation layer 1, a nickel-phosphorus chemical nickel plating layer 2, a second palladium atom activation layer 3, a nickel-boron chemical nickel plating layer 4, an electroplated nickel layer 5, and an electroplated gold layer 6.
Preferably, the thickness of the first palladium atom activation layer 1 is 0.01 to 0.05 μm. The thickness of the nickel-phosphorus chemical nickel coating 2 is 2.5-15 mu m. The first palladium atom activation layer 1 is a chemical nickel trigger layer which forms a primer plating layer with a nickel-phosphorus chemical nickel plating layer 2 plated on the outer side thereof.
Preferably, the thickness of the second palladium atom activation layer 3 is 0.01 to 0.05 μm. By forming the second palladium atom activation layer 3 on the outer side of the nickel-phosphorus electroless nickel plating layer 2, coating flaws and blind spots existing in the nickel-phosphorus electroless nickel plating layer 2 can be compensated, larger micropores in the base material 100 can be activated again, and a more uniformly activated surface is provided for subsequent plating. The thickness of the nickel-boron chemical nickel coating 4 is 2.5-15 mu m. The nickel-boron electroless nickel plating layer 4 has excellent electrochemical corrosion resistance.
Preferably, the thickness of the electroplated nickel layer 5 is 2.5-15 μm. The thickness of the gold electroplating layer 6 is 1.3-5.7 mu m. The electroplated nickel layer 5 forms a potential valley, and can form a sacrificial layer for electrochemical corrosion, so that the corrosion of matrix materials such as aluminum matrix composite materials is reduced; the electrogilding layer 6 at the outermost side can meet the salt spray resistance requirement of the packaging shell and can also meet the performance requirements of subsequent soldering, bonding and the like.
The preparation process of the plating layer structure comprises the following steps:
first activation: immersing the aluminum-based composite material into palladium-containing activating solution for activation, and forming a first palladium atom activating layer on the surface of the aluminum-based composite material;
chemical nickel and phosphorus plating: immersing the aluminum-based composite material subjected to the first activation into a nickel-phosphorus plating solution for chemical nickel-phosphorus plating, and forming a nickel-phosphorus chemical nickel plating layer on the outer side of the first palladium atom activation layer;
and (3) second activation: immersing the aluminum-based composite material after chemical nickel-phosphorus plating into the palladium-containing activation solution again for secondary activation, taking out and washing to form a second palladium atom activation layer on the outer side of the nickel-phosphorus chemical nickel plating layer;
chemical nickel-boron plating: immersing the aluminum-based composite material subjected to the second activation into a nickel-boron plating solution for chemical nickel-boron plating, and forming a nickel-boron chemical nickel plating layer on the outer side of the second palladium atom activation layer;
electroplating nickel: carrying out nickel electroplating on the aluminum-based composite material subjected to chemical nickel-boron plating, and forming an electroplated nickel layer on the outer side of the nickel-boron chemical nickel plating layer;
gold electroplating: and (4) carrying out gold electroplating on the aluminum-based composite material subjected to nickel electroplating, and forming an electroplated gold layer on the outer side of the electroplated nickel layer to obtain the final product.
The coating structure prepared by the invention can form a compact composite coating on the surface of matrix composite materials such as aluminum silicon, aluminum carbon silicon and the like, obviously improves the electrochemical corrosion resistance of the matrix material, and enables the matrix material to meet the salt spray resistance requirement in 48 hours.
Claims (7)
1. A cladding material for an aluminum-based composite material electronic packaging shell resistant to electrochemical corrosion is characterized in that: the nickel-phosphorus chemical nickel plating layer comprises a first palladium atom activation layer, a nickel-phosphorus chemical nickel plating layer, a second palladium atom activation layer, a nickel-boron chemical nickel plating layer, an electroplated nickel layer and an electroplated gold layer from inside to outside in sequence.
2. The coating of claim 1, wherein: the thickness of the first palladium atom activation layer is 0.01-0.05 μm.
3. The coating of claim 1, wherein: the thickness of the nickel-phosphorus chemical nickel coating is 2.5-15 mu m.
4. The coating of claim 1, wherein: the thickness of the second palladium atom activation layer is 0.01-0.05 μm.
5. The coating of claim 1, wherein: the thickness of the nickel-boron chemical nickel coating is 2.5-15 mu m.
6. The coating of claim 1, wherein: the thickness of the electroplated nickel layer is 2.5-15 mu m.
7. The coating of claim 1, wherein: the thickness of the gold electroplating layer is 1.3-5.7 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022443325.0U CN213772215U (en) | 2020-10-27 | 2020-10-27 | Coating for electrochemical corrosion resistant aluminum-based composite material electronic packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022443325.0U CN213772215U (en) | 2020-10-27 | 2020-10-27 | Coating for electrochemical corrosion resistant aluminum-based composite material electronic packaging shell |
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| CN213772215U true CN213772215U (en) | 2021-07-23 |
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| CN202022443325.0U Active CN213772215U (en) | 2020-10-27 | 2020-10-27 | Coating for electrochemical corrosion resistant aluminum-based composite material electronic packaging shell |
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