CN112236013A

CN112236013A - Intelligent heat dissipation device for new generation information technology

Info

Publication number: CN112236013A
Application number: CN202011157569.0A
Authority: CN
Inventors: 李智杰; 潘志淇
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-10-26
Filing date: 2020-10-26
Publication date: 2021-01-15

Abstract

The invention discloses a new-generation information technology intelligent heat dissipation device, and relates to the field of new-generation information technology. According to the invention, the refrigerating machine is arranged, when the temperature of the high-performance integrated circuit board is overhigh, the refrigerating machine can be used for sending the cooling liquid into the heat dissipation copper pipe from the connecting copper pipe, so that the heat of the high-performance integrated circuit board is taken away by the circulating cooling liquid, and the purpose of rapidly cooling the high-performance integrated circuit board is achieved.

Description

Intelligent heat dissipation device for new generation information technology

Technical Field

The invention relates to the technical field of new-generation information, in particular to an intelligent heat dissipation device for the new-generation information technology.

Background

The new-generation information technology is one of seven strategic emerging industries determined by the state department, and the state department requires to increase the supporting policy strength of finance, tax and finance and the like. The new generation of information technology is divided into six aspects, namely, a next generation communication network, an internet of things, integration of three networks, novel flat panel display, a high-performance integrated circuit and high-end software represented by cloud computing. The performance of the high-performance integrated circuit can be improved greatly compared with that of a common integrated circuit, but the high-performance integrated circuit is complex, so that more heat can be generated in work, and compared with the traditional integrated circuit, the high-performance integrated circuit has higher working temperature in work and needs a heat dissipation device with better heat dissipation effect.

At present, the existing integrated circuit heat dissipation device has poor heat dissipation effect when in use, and can not achieve good heat dissipation effect when in use on a high-performance integrated circuit, thereby causing certain obstruction to the development of the high-performance integrated circuit in the new generation of information technology, and the existing heat dissipation device can not intelligently control the heat dissipation strength according to specific temperature when dissipating heat of the integrated circuit, thereby leading the heat dissipation device to operate at high load all the time, and wasting a lot of electric energy.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides a new generation of information technology intelligent heat dissipation device which has the advantages of enhancing the heat dissipation performance of a high-performance integrated circuit, adjusting the heat dissipation according to the condition of the integrated circuit and the like, and solves the problems in the background art.

(II) technical scheme

In order to achieve the purpose of enhancing the heat dissipation performance of the high-performance integrated circuit and adjusting the heat dissipation according to the condition of the integrated circuit, the invention provides the following technical scheme: a new generation of information technology intelligent heat dissipation device comprises a protection frame, wherein a heat insulation plate is arranged in the middle of the protection frame, one side face of the heat insulation plate is fixedly connected with a mounting column, the mounting column is fixedly connected with a high-performance integrated circuit board through a connecting screw, the inner side face of the high-performance integrated circuit board is fixedly connected with a heat dissipation copper pipe, and the middle part of the inner side face of the high-performance integrated circuit board is fixedly connected with a heat dissipation control box; the heat dissipation control box is characterized in that a bimetallic strip is arranged inside the heat dissipation control box and fixedly connected with a high-performance integrated circuit board through heat-conducting glue, one end of the bimetallic strip is fixedly connected with an insulating table, the inner top wall of the heat dissipation control box is fixedly connected with an electromagnet, the inner side wall of the heat dissipation control box is fixedly connected with a rotating rod through a pin shaft, the middle part of the rotating rod is fixedly connected with the inner top wall of the heat dissipation control box through a connecting spring, an iron block matched with the electromagnet is arranged in the middle part of the rotating rod, one end of the rotating rod is fixedly connected with a bottom electrode, and the inner top wall of the heat dissipation control box is fixedly connected with a top electrode matched; the front side and the rear side of the protective frame are respectively detachably connected with a front radiating fan and a rear radiating fan through a mounting frame; one side face of the protection frame is fixedly connected with a fixed side plate, and the bottom of the protection frame is fixedly connected with a refrigerator through an I-shaped frame.

Preferably, the protection frame and the high-performance integrated circuit board are separated by a heat insulation plate, two ends of the heat dissipation copper pipe are respectively and fixedly connected with a connection copper pipe, the middle parts of the two connection copper pipes penetrate through the heat insulation plate, and the two connection copper pipes are respectively and fixedly connected with a liquid outlet pipe and a return pipe of the refrigerator.

Preferably, the inner wall of heat dissipation control box is respectively through different insulating station fixedly connected with lead electrical pillar and protective resistor, it is connected with bimetallic strip looks adaptation to lead electrical pillar, the bimetallic strip passes through the wire and is connected with the electro-magnet electricity, it is connected with the protective resistor electricity through the wire to lead electrical pillar, the protective resistor passes through the wire and is connected with the electro-magnet electricity.

Preferably, the top electrode and the bottom electrode are both electrically connected with the refrigerator through leads, the refrigerator is connected with the rear heat dissipation fan in parallel through leads, and the front heat dissipation fan is connected with the switch of the high-performance integrated circuit board in parallel through leads.

Preferably, an electrical component is welded on one outer side surface of the high-performance integrated circuit board, and the electrical component comprises a diode, a triode, a capacitor and a resistor.

Preferably, the side face of the fixed side plate is fixedly connected with four bolt connecting columns, the bolt connecting columns are fixedly connected with the glass side plate through mounting bolts, the number of the bolt connecting columns is four, the bolt connecting columns are distributed on the fixed side plate in a rectangular array, and connecting holes matched with the bolt connecting columns are formed in the glass side plate.

Preferably, the top and the bottom of the protection frame are both provided with air outlets, the air outlets are provided with a plurality of air outlets which are divided into two groups in equal positions, and the two groups of air outlets are distributed at the top and the bottom of the protection frame at equal intervals respectively.

Preferably, the number of the front heat dissipation fans and the number of the rear heat dissipation fans are three, the front heat dissipation fans and the rear heat dissipation fans are distributed at equal intervals, and dust screens matched with the front heat dissipation fans and the rear heat dissipation fans are arranged outside the mounting frame.

Preferably, the bottom of the protection frame is fixedly connected with two supporting bottom plates, the two supporting bottom plates are symmetrically arranged at the bottom of the protection frame, and the bottom of each supporting bottom plate is fixedly connected with an anti-skidding rubber pad.

Three beneficial effects

Compared with the prior art, the invention provides a new generation of information technology intelligent heat dissipation device, which has the following beneficial effects:

1. this new generation information technology intelligence heat abstractor through setting up the refrigerator, when high performance integrated circuit board's temperature was too high, can utilize the refrigerator to send the coolant liquid into heat dissipation copper pipe from connecting the copper pipe, makes the heat of circulating coolant liquid with high performance integrated circuit board take away, reaches the purpose to high performance integrated circuit board cooling rapidly.

2. This new generation information technology intelligence heat abstractor through setting up the heat dissipation control box, when high performance integrated circuit board operating temperature was too high, can switch on the electro-magnet through the deformation of bimetallic strip, utilizing top electrode and bottom electrode to put through the refrigerator, avoids the bimetallic strip not only to warp but also to switch on the heavy current, can reach the radiating purpose of intelligent control simultaneously.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the internal perspective structure of the present invention;

FIG. 3 is a schematic perspective view of a heat dissipation copper tube according to the present invention;

fig. 4 is a schematic cross-sectional view of the heat dissipation control box of the present invention.

In the figure: 1. a protective frame; 2. a front heat radiation fan; 3. installing a frame; 4. a support base plate; 5. a glass side plate; 6. installing a bolt; 7. an air outlet; 8. connecting a column by a bolt; 10. a high performance integrated circuit board; 11. mounting a column; 12. connecting a copper pipe; 13. an I-shaped frame; 14. a refrigerator; 15. a rear heat radiation fan; 16. fixing the side plate; 17. an electrical component; 18. a heat dissipation control box; 19. a heat dissipation copper pipe; 20. a conductive post; 21. a bimetal; 22. heat conducting glue; 23. an insulating stage; 24. rotating the rod; 25. a connecting spring; 26. an electromagnet; 27. an iron block; 28. a top electrode; 29. a bottom electrode; 30. and (4) protecting the resistor.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, a new generation of information technology intelligent heat dissipation device includes a protection frame 1, air outlets 7 are respectively formed at the top and the bottom of the protection frame 1, the air outlets 7 are a plurality of air outlets 7, the air outlets 7 are divided into two groups, the two groups of air outlets 7 are respectively distributed at the top and the bottom of the protection frame 1 at equal intervals, the bottom of the protection frame 1 is fixedly connected with two supporting bottom plates 4, the two supporting bottom plates 4 are symmetrically arranged at the bottom of the protection frame 1, the bottom of the supporting bottom plate 4 is fixedly connected with an anti-slip rubber pad, a heat insulation board is arranged at the middle of the protection frame 1, a mounting column 11 is fixedly connected to one side of the heat insulation board, the mounting column 11 is fixedly connected with a high performance integrated circuit board 10 through a connecting screw, an electrical component 17 is welded to one side of the high performance integrated circuit board, The inner side surface of the high-performance integrated circuit board 10 is fixedly connected with a heat dissipation copper pipe 19, and the middle part of the inner side surface of the high-performance integrated circuit board 10 is fixedly connected with a heat dissipation control box 18; the interior of the heat dissipation control box 18 is provided with a bimetallic strip 21, the bimetallic strip 21 is fixedly connected with the high performance integrated circuit board 10 through a heat conducting adhesive 22, one end of the bimetallic strip 21 is fixedly connected with an insulating table 23, the inner top wall of the heat dissipation control box 18 is fixedly connected with an electromagnet 26, the inner side wall of the heat dissipation control box 18 is fixedly connected with a rotating rod 24 through a pin shaft, the middle part of the rotating rod 24 is fixedly connected with the inner top wall of the heat dissipation control box 18 through a connecting spring 25, the middle part of the rotating rod 24 is provided with an iron block 27 matched with the electromagnet 26, one end of the rotating rod 24 is fixedly connected with a bottom electrode 29, the inner top wall of the heat dissipation control box 18 is fixedly connected with a top electrode 28 matched with the bottom electrode 29, the inner wall of the heat dissipation control box 18 is respectively and fixedly connected with a conductive column, the bimetallic strip 21 is electrically connected with the electromagnet 26 through a conducting wire, the conductive column 20 is electrically connected with the protective resistor 30 through a conducting wire, and the protective resistor 30 is electrically connected with the electromagnet 26 through a conducting wire; the front side and the rear side of the protective frame 1 are respectively detachably connected with a front radiating fan 2 and a rear radiating fan 15 through a mounting frame 3, the number of the front radiating fans 2 and the number of the rear radiating fans 15 are three, the front radiating fans 2 and the rear radiating fans 15 are distributed at equal intervals, and a dustproof net matched with the front radiating fans 2 and the rear radiating fans 15 is arranged outside the mounting frame 3; a fixed side plate 16 is fixedly connected to one side surface of the protective frame 1, bolt connecting columns 8 are fixedly connected to the side surface of the fixed side plate 16, the bolt connecting columns 8 are fixedly connected with a glass side plate 5 through mounting bolts 6, four bolt connecting columns 8 are arranged on the fixed side plate 16 in a rectangular array, connecting holes matched with the bolt connecting columns 8 are formed in the glass side plate 5, a refrigerator 14 is fixedly connected to the bottom of the protective frame 1 through an I-shaped frame 13, the protective frame 1 and the high-performance integrated circuit board 10 are separated by a heat insulation plate, connecting copper pipes 12 are respectively and fixedly connected to two ends of a heat dissipation copper pipe 19, the middle parts of the two connecting copper pipes 12 penetrate through the heat insulation plate, the two connecting copper pipes 12 are respectively and fixedly connected with a liquid outlet pipe and a return pipe of the refrigerator 14, and a top electrode, the refrigerator 14 is connected in parallel to the rear radiator fan 15 by a wire, and the front radiator fan 2 is connected in parallel to the switch of the high performance integrated circuit board 10 by a wire.

When the high-performance integrated circuit board 10 is used, firstly, the circuit of the high-performance integrated circuit board 10 is switched on through the switch, the front heat-radiating fan 2 starts to radiate heat to the electrical component 17 on the outer surface of the high-performance integrated circuit board 10 after the high-performance integrated circuit board 10 is electrified, because the high-performance integrated circuit board 10 generates more heat during operation, the temperature of the high-performance integrated circuit board 10 can rise quickly when the high-performance integrated circuit board 10 starts to operate, when the temperature of the high-performance integrated circuit board 10 is overhigh, because the bimetallic strip 21 is connected with the high-performance integrated circuit board 10 through the heat-conducting glue 22, the bimetallic strip 21 can deform and bend, the end part of the bimetallic strip 21 is in contact with the conductive column 20 for electrification, under the protection of the protection resistor 30, the coil on the electromagnet 26 is electrified to enable the electromagnet 26 to generate magnetism, so that the, the bottom electrode 29 is lifted to contact with the top electrode 28, the power supply of the refrigerator 14 is connected by utilizing the top electrode 28 and the bottom electrode 29, because the working current ratio of the refrigerator 14 is larger, the situation that the bimetallic strip 21 directly connects the refrigerator 14 to lead the bimetallic strip 21 to generate heat under large current is avoided, the influence of the self reason of the bimetallic strip 21 on temperature control is avoided, after the refrigerator 14 is started to work, cooling liquid in the refrigerator 14 enters the radiating copper pipe 19 through the connecting copper pipe 12, the cooling liquid in the radiating copper pipe 19 takes away the heat, the high-performance integrated circuit board 10 is radiated after the circulating cooling of the refrigerator 14, meanwhile, because the rear radiating fan 15 is connected with the refrigerator 14 in parallel, when the refrigerator 14 works, the rear radiating fan 15 blows the external cold air to the refrigerator 14, and because of the combined action of the front radiating fan 2 and the rear radiating fan 15, the hot air will be discharged from the air outlet 7, so that both the high performance ic board 10 and the refrigerator 14 can be cooled.

In summary, the new generation of information technology intelligent heat dissipation device is provided with the refrigerator 14, when the temperature of the high performance integrated circuit board 10 is too high, the refrigerator 14 can be used for sending the cooling liquid into the heat dissipation copper pipe 19 from the connection copper pipe 12, so that the heat of the high performance integrated circuit board 10 is taken away by the circulating cooling liquid, and the purpose of rapidly cooling the high performance integrated circuit board 10 is achieved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, the use of the verb "comprise a" to define an element does not exclude the presence of another, same element in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a new generation information technology intelligence heat abstractor, includes protecting frame (1), its characterized in that: the heat insulation board is arranged in the middle of the protection frame (1), a mounting column (11) is fixedly connected to one side face of the heat insulation board, a high-performance integrated circuit board (10) is fixedly connected to the mounting column (11) through a connecting screw, a heat dissipation copper pipe (19) is fixedly connected to the inner side face of the high-performance integrated circuit board (10), and a heat dissipation control box (18) is fixedly connected to the middle of the inner side face of the high-performance integrated circuit board (10); the heat dissipation control box (18) is internally provided with a bimetallic strip (21), the bimetallic strip (21) is fixedly connected with the high-performance integrated circuit board (10) through heat-conducting glue (22), one end of the bimetallic strip (21) is fixedly connected with an insulating table (23), the inner top wall of the heat dissipation control box (18) is fixedly connected with an electromagnet (26), the inner side wall of the heat dissipation control box (18) is fixedly connected with a rotating rod (24) through a pin shaft, the middle part of the rotating rod (24) is fixedly connected with the inner top wall of the heat dissipation control box (18) through a connecting spring (25), an iron block (27) matched with the electromagnet (26) is arranged in the middle of the rotating rod (24), one end of the rotating rod (24) is fixedly connected with a bottom electrode (29), and the inner top wall of the heat dissipation control box (18) is fixedly connected with a top electrode (28) matched with the bottom electrode (29); the front side and the rear side of the protective frame (1) are respectively detachably connected with a front radiating fan (2) and a rear radiating fan (15) through a mounting frame (3); one side face of the protection frame (1) is fixedly connected with a fixed side plate (16), and the bottom of the protection frame (1) is fixedly connected with a refrigerator (14) through an I-shaped frame (13).

2. The new-generation information technology intelligent heat dissipation device of claim 1, wherein: the protection frame (1) and the high-performance integrated circuit board (10) are separated by a heat insulation plate, two ends of a heat dissipation copper pipe (19) are respectively and fixedly connected with connecting copper pipes (12), the middle parts of the connecting copper pipes (12) penetrate through the heat insulation plate, and the connecting copper pipes (12) are respectively and fixedly connected with a liquid outlet pipe and a return pipe of the refrigerator (14).

3. The new-generation information technology intelligent heat dissipation device of claim 1, wherein: the inner wall of heat dissipation control box (18) is respectively through different insulating platform (23) fixedly connected with lead electrical pillar (20) and protective resistance (30), it matches with bimetallic strip (21) to lead electrical pillar (20), bimetallic strip (21) is connected with electro-magnet (26) electricity through the wire, it is connected with protective resistance (30) electricity through the wire to lead electrical pillar (20), protective resistance (30) are connected with electro-magnet (26) electricity through the wire.

4. The new-generation information technology intelligent heat dissipation device of claim 1, wherein: the top electrode (28) and the bottom electrode (29) are both electrically connected with the refrigerator (14) through leads, the refrigerator (14) is connected with the rear heat dissipation fan (15) in parallel through leads, and the front heat dissipation fan (2) is connected with a switch of the high-performance integrated circuit board (10) in parallel through leads.

5. The new-generation information technology intelligent heat dissipation device of claim 1, wherein: an electrical component (17) is welded on one outer side face of the high-performance integrated circuit board (10), and the electrical component (17) comprises a diode, a triode, a capacitor and a resistor.

6. The new-generation information technology intelligent heat dissipation device of claim 1, wherein: the side fixedly connected with bolt spliced pole (8) of fixed curb plate (16), bolt spliced pole (8) are through construction bolt (6) fixedly connected with glass curb plate (5), bolt spliced pole (8) have four, four bolt spliced pole (8) are the rectangular array and distribute on fixed curb plate (16), set up the connecting hole with bolt spliced pole (8) looks adaptation on glass curb plate (5).

7. The new-generation information technology intelligent heat dissipation device of claim 1, wherein: exhaust vent (7) have all been seted up to the top and the bottom of protecting frame (1), exhaust vent (7) have a plurality of, a plurality of exhaust vent (7) divide equally to divide the position two sets ofly, two sets of exhaust vent (7) are at the top of protecting frame (1) and equidistant distribution in the bottom respectively.

8. The new-generation information technology intelligent heat dissipation device of claim 1, wherein: the front radiating fan (2) and the rear radiating fan (15) are all three, the front radiating fan (2) and the rear radiating fan (15) are distributed at equal intervals, and the dustproof net matched with the front radiating fan (2) and the rear radiating fan (15) is arranged outside the mounting frame (3).

9. The new-generation information technology intelligent heat dissipation device of claim 1, wherein: the bottom fixedly connected with supporting baseplate (4) of protective frame (1), supporting baseplate (4) have two, two supporting baseplate (4) are in the bottom symmetry setting of protective frame (1), the bottom fixedly connected with anti-skidding rubber pad of supporting baseplate (4).