CN112223861B - Energy-saving silicon phenol fireproof insulation board - Google Patents
Energy-saving silicon phenol fireproof insulation board Download PDFInfo
- Publication number
- CN112223861B CN112223861B CN202011085384.3A CN202011085384A CN112223861B CN 112223861 B CN112223861 B CN 112223861B CN 202011085384 A CN202011085384 A CN 202011085384A CN 112223861 B CN112223861 B CN 112223861B
- Authority
- CN
- China
- Prior art keywords
- parts
- phenolic resin
- insulation board
- woven fabric
- fireproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000009413 insulation Methods 0.000 title claims abstract description 53
- MJRKSNLCQOSKTL-UHFFFAOYSA-N phenol;silicon Chemical compound [Si].OC1=CC=CC=C1 MJRKSNLCQOSKTL-UHFFFAOYSA-N 0.000 title claims abstract description 53
- 238000002360 preparation method Methods 0.000 claims abstract description 50
- -1 maleimide modified phenolic resin Chemical class 0.000 claims abstract description 41
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 40
- 239000012948 isocyanate Substances 0.000 claims abstract description 26
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 19
- 239000003575 carbonaceous material Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 239000010703 silicon Substances 0.000 claims abstract description 8
- 239000005011 phenolic resin Substances 0.000 claims description 71
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 69
- 229920001568 phenolic resin Polymers 0.000 claims description 64
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 50
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 48
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 39
- 239000002041 carbon nanotube Substances 0.000 claims description 39
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 33
- ZVEMLYIXBCTVOF-UHFFFAOYSA-N 1-(2-isocyanatopropan-2-yl)-3-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC(C(C)(C)N=C=O)=C1 ZVEMLYIXBCTVOF-UHFFFAOYSA-N 0.000 claims description 31
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 27
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 11
- 238000010521 absorption reaction Methods 0.000 abstract description 8
- 239000002253 acid Substances 0.000 abstract description 2
- 239000003513 alkali Substances 0.000 abstract description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 21
- 239000000203 mixture Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- OKTJSMMVPCPJKN-YPZZEJLDSA-N carbon-10 atom Chemical group [10C] OKTJSMMVPCPJKN-YPZZEJLDSA-N 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
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- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
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- 229920001169 thermoplastic Polymers 0.000 description 5
- 239000004416 thermosoftening plastic Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005937 allylation reaction Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 238000001132 ultrasonic dispersion Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 2
- OJQSISYVGFJJBY-UHFFFAOYSA-N 1-(4-isocyanatophenyl)pyrrole-2,5-dione Chemical compound C1=CC(N=C=O)=CC=C1N1C(=O)C=CC1=O OJQSISYVGFJJBY-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- PQFOUIMVTGBFRN-UHFFFAOYSA-N 2-isocyanato-1-methyl-4-nitrobenzene Chemical compound CC1=CC=C([N+]([O-])=O)C=C1N=C=O PQFOUIMVTGBFRN-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 229910018557 Si O Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 125000000746 allylic group Chemical group 0.000 description 2
- 229920013822 aminosilicone Polymers 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000001721 carbon Chemical class 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- YGZSVWMBUCGDCV-UHFFFAOYSA-N chloro(methyl)silane Chemical compound C[SiH2]Cl YGZSVWMBUCGDCV-UHFFFAOYSA-N 0.000 description 2
- GTPDFCLBTFKHNH-UHFFFAOYSA-N chloro(phenyl)silicon Chemical compound Cl[Si]C1=CC=CC=C1 GTPDFCLBTFKHNH-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910021397 glassy carbon Inorganic materials 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229920003225 polyurethane elastomer Polymers 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000007086 side reaction Methods 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- ZOYFEXPFPVDYIS-UHFFFAOYSA-N trichloro(ethyl)silane Chemical compound CC[Si](Cl)(Cl)Cl ZOYFEXPFPVDYIS-UHFFFAOYSA-N 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 208000005156 Dehydration Diseases 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- UZBDLHYCYNXFRF-UHFFFAOYSA-N chloro(prop-1-enyl)silane Chemical compound C(=CC)[SiH2]Cl UZBDLHYCYNXFRF-UHFFFAOYSA-N 0.000 description 1
- NELRINSZCVVEAD-UHFFFAOYSA-N chloro-ethenyl-methylsilane Chemical compound C[SiH](Cl)C=C NELRINSZCVVEAD-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- JDDPGRVMAVYUOZ-UHFFFAOYSA-N ethenyl(trihydroxy)silane Chemical compound O[Si](O)(O)C=C JDDPGRVMAVYUOZ-UHFFFAOYSA-N 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
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- 239000003607 modifier Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- 230000002265 prevention Effects 0.000 description 1
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- 239000002210 silicon-based material Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000967 suction filtration Methods 0.000 description 1
- 238000004227 thermal cracking Methods 0.000 description 1
Classifications
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
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- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
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Abstract
The invention belongs to the technical field of fireproof plates, and particularly relates to an energy-saving silicon phenol fireproof insulation board. The invention provides a novel energy-saving silicon phenol fireproof insulation board which comprises a non-woven fabric layer and a main body layer; the non-woven fabric layer comprises an upper non-woven fabric layer and a lower non-woven fabric layer; the preparation raw materials of the main body layer comprise the following components in parts by weight: 20-45 parts of maleimide modified phenolic resin, 10-22.5 parts of organic silicon, 0.08-0.3 part of potassium persulfate and 3-7 parts of isocyanate modified carbon material. The prepared silicon phenol fireproof insulation board is a fireproof board with good fireproof performance and low water absorption rate, and the fireproof board prepared by the method is free of acid and alkali, so that pollution in the preparation process is avoided, corrosive influence of the prepared fireproof board on external components is prevented, and the application value of the fireproof board is improved.
Description
Technical Field
The invention belongs to the technical field of fireproof plates, and particularly relates to an energy-saving silicon phenol fireproof insulation board.
Background
The fire-proof board, also called fire-proof board, is a fire-proof building material for decoration. With the increasing importance of China and countries around the world on building fire prevention, wooden combustible organic boards have been strictly limited, and inorganic fire-proof boards such as gypsum plasterboards and calcium silicate boards have been limited in their popularization and use due to the requirements of strength, toughness and water resistance.
At present, a great amount of phenolic resin fireproof plates are used by people, and the phenolic resin fireproof plates mainly take phenolic resin as a main raw material, are fully mixed under the action of additives, modifiers and catalysts, and are cured at a specified temperature to obtain the required fireproof plates.
But the efforts of the applicant are directed to how to prepare a fireproof plate with more excellent heat resistance and fireproof grade under the condition of ensuring that the preparation raw materials are environment-friendly and energy-saving.
Disclosure of Invention
In order to solve the technical problem, the invention provides a novel energy-saving silicon phenol fireproof insulation board which comprises a non-woven fabric layer and a main body layer;
the non-woven fabric layer comprises an upper non-woven fabric layer and a lower non-woven fabric layer;
the preparation raw materials of the main body layer comprise the following components in parts by weight: 20-45 parts of maleimide modified phenolic resin, 10-22.5 parts of organic silicon, 0.08-0.3 part of potassium persulfate and 3-7 parts of isocyanate modified carbon material.
As a preferable technical scheme, the organosilicon is at least one selected from methyl chlorosilane, phenyl chlorosilane, methyl vinyl chlorosilane, ethyl trichlorosilane, hexamethyldisiloxane, octamethylcyclotetrasiloxane, methyl silicone oil, amino silicone oil and vinyl triethoxysilane.
As a preferable technical solution, the carbon material in the isocyanate modified carbon material is at least one selected from carbon nanotubes, graphene, carbon fibers and glassy carbon.
As a preferable technical scheme, the isocyanate in the isocyanate modified carbon material is selected from at least one of toluene diisocyanate, diphenylmethane diisocyanate, 1, 6-hexamethylene diisocyanate, methylene di-p-phenyl diisocyanate, 2-methyl-5-nitrophenyl isocyanate, 4-maleimidophenyl isocyanate and 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate.
As a preferred technical solution, the weight ratio of the organosilicon to the maleimide-modified phenolic resin is 1: 0.5-2.
As a preferred technical scheme, the phenolic resin in the maleimide modified phenolic resin is selected from allylated phenolic resin.
As a preferable technical scheme, the inner diameter of the carbon nano tube is 1-15 nm.
As a preferable technical scheme, the inner diameter of the carbon nano tube is 5-10 nm.
As a preferred technical scheme, the main layer preparation raw material also comprises 10-18 parts of solvent.
As a preferable technical scheme, the solvent is at least one selected from ethylene glycol, ethanol, tetrahydrofuran, N-dimethylformamide, water and toluene.
Has the advantages that: the prepared silicon phenol fireproof insulation board is a fireproof board with good fireproof performance and low water absorption rate, the fireproof board prepared by the method is free of acid and alkali, the pH value is neutral, pollution in the preparation process is avoided, corrosive influence of the prepared fireproof board on external components is also prevented, and the application value of the fireproof board is improved.
Detailed Description
The invention will be further understood by reference to the following detailed description of preferred embodiments of the invention and the examples included therein. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. To the extent that a definition of a particular term disclosed in the prior art is inconsistent with any definitions provided herein, the definition of the term provided herein controls.
As used herein, a feature that does not define a singular or plural form is also intended to include a plural form of the feature unless the context clearly indicates otherwise. It will be further understood that the term "prepared from …," as used herein, is synonymous with "comprising," including, "comprising," "having," "including," and/or "containing," when used in this specification means that the recited composition, step, method, article, or device is present, but does not preclude the presence or addition of one or more other compositions, steps, methods, articles, or devices. Furthermore, the use of "preferred," "preferably," "more preferred," etc., when describing embodiments of the present application, is meant to refer to embodiments of the invention that may provide certain benefits, under certain circumstances. However, other embodiments may be preferred, under the same or other circumstances. In addition, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
In order to solve the technical problem, the invention provides a novel energy-saving silicon phenol fireproof insulation board which comprises a non-woven fabric layer and a main body layer;
the non-woven fabric layer comprises an upper non-woven fabric layer and a lower non-woven fabric layer;
the preparation raw materials of the main body layer comprise the following components in parts by weight: 20-45 parts of maleimide modified phenolic resin, 10-22.5 parts of organic silicon, 0.08-0.3 part of potassium persulfate and 3-7 parts of isocyanate modified carbon material.
In some preferred embodiments, the silicone is selected from at least one of methylchlorosilane, phenylchlorosilane, methylvinylchlorosilane, ethyltrichlorosilane, hexamethyldisiloxane, octamethylcyclotetrasiloxane, methylsilicone oil, aminosilicone oil, and vinyltriethoxysilane.
Preferably, the silicone is selected from vinyltriethoxysilane.
Vinyl triethoxy silane
Vinyltriethoxysilane, a colorless transparent liquid. CAS number 78-08-0, readily hydrolyzed, releasing ethanol, producing a condensate of vinyl silanetriol.
In some preferred embodiments, the carbon material in the isocyanate modified carbon material is selected from at least one of carbon nanotubes, graphene, carbon fibers, and glassy carbon.
Preferably, the carbon material is selected from carbon nanotubes.
Carbon nanotube
Carbon nanotubes, also known as buckytubes, are one-dimensional quantum materials with a special structure (radial dimension is nanometer magnitude, axial dimension is micrometer magnitude, both ends of the tube are basically sealed). Carbon nanotubes are coaxial circular tubes consisting of several to tens of layers of carbon atoms arranged in a hexagonal pattern.
The structure of carbon nanotubes is similar to that of polymer materials, but is much more stable than polymer materials. Carbon nanotubes are the highest specific strength material that can be produced at present. If other engineering materials are used as a matrix and the carbon nano tube is prepared into the composite material, the composite material can show good strength, elasticity, fatigue resistance and isotropy, and the performance of the composite material is greatly improved.
In some preferred embodiments, the weight ratio of silicone to maleimide-modified phenolic resin is from 1: 0.5-2.
In some preferred embodiments, the phenolic resin of the maleimide-modified phenolic resin is selected from allylated phenolic resins.
The application field of the phenolic resin serving as matrix resin with poor heat resistance has certain limitation, the applicant is obtained through a large amount of experimental researches, Si can be introduced into the phenolic resin structure through chemical reaction under the action of vinyl triethoxysilane and maleimide modified allylated phenolic resin, Si can be loaded inside a phenolic resin molecular chain through mutual crosslinking between siloxane and phenolic resin adopted by the application, partial C-C bonds in phenolic resin molecules are replaced by Si-O, more heat required by decomposition between Si-O bonds is increased, the heat resistance of the traditional phenolic resin is improved, experiments prove that the thermal cracking temperature of the phenolic resin can be changed to a higher degree through the change of the phenolic resin by adding the vinyl triethoxysilane in the scheme of the application compared with the modification of the traditional inorganic silicon material, the thermal conductivity of the phenolic resin is reduced.
In addition, applicants have unexpectedly found that reacting vinyltriethoxysilane with a maleimide-modified allylated phenolic resin results in a ratio of vinyltriethoxysilane to maleimide-modified allylated phenolic resin of 1: when the molecular weight is 0.5-2, the problem of poor toughness of the maleimide modified allylated phenolic resin is solved; the maleimide modified allylated phenolic resin and the vinyl triethoxysilane have a cross-linking effect between molecules, and the weight ratio of the maleimide modified allylated phenolic resin to the vinyl triethoxysilane is 1: when the molecular weight is 0.5-2, the flexibility of the original molecule is changed by regulating and controlling the short chain structure grafted on the formed carbon-carbon long chain, the toughness of the molecular chain is improved, the stability of the phenolic resin is enhanced, and the application value of the phenolic resin as a fireproof material is improved.
However, the maleimide modified allylated phenolic resin has a molecular structure with a small space interval such as methylene in the molecular structure, so that the crosslinked resin has a relatively high melting temperature, and the phenomena of difficult processing and difficult curing in the implementation process of applying the phenolic resin to the fireproof insulation board are caused.
The preparation raw materials of the maleimide modified allylated phenolic resin comprise: allyl chloride, thermoplastic phenolic resin, N '-4, 4' -diphenylmethane bismaleimide, N-butyl alcohol and potassium hydroxide.
The thermoplastic phenolic resin, the brand number HK-316, is purchased from Jining HuaKai resin Co.
The preparation method of the maleimide modified allylated phenolic resin refers to the following steps:
(1) adding thermoplastic phenolic resin into a three-neck flask, then adding n-butyl alcohol, and heating in an oil bath at 60-90 ℃ until the thermoplastic phenolic resin is dissolved; (2) adding potassium hydroxide into the mixture obtained in the step (1), stirring and dissolving the mixture, then cooling the mixture to 35-40 ℃, dropwise adding allyl chloride, heating the mixture to 60-80 ℃ after the dropwise adding is finished, and reacting the mixture for 3-6 hours; (3) after the reaction is finished, filtering, washing and distilling the product obtained in the step (2) under reduced pressure to obtain allylation phenolic resin; (4) blending the allylated phenolic resin treated in the step (3) with N, N '-4, 4' -diphenylmethane bismaleimide at the temperature of 120-140 ℃ to obtain the maleimide modified allylated phenolic resin.
In some preferred embodiments, the amount of potassium persulfate used is from 0.8 to 1.2wt% of the vinyltriethoxysilane.
In order to change the heat resistance of the fireproof silicon-phenol insulation board in the experimental process, the vinyl triethoxysilane is reacted with the maleimide modified allylation phenolic resin, but the curing temperature is higher after the two substances are reacted in the experimental process, so that the processing difficulty is improved. The applicant finds that the curing temperature of the fireproof insulation board made of the silicon phenol can be changed by selecting potassium persulfate as an initiator in the experimental process, and the reason is presumed as follows: and (2) adding potassium persulfate, wherein a part of potassium persulfate is used as an initiator to initiate the reaction of vinyltriethoxysilane and maleimide modified allylated phenolic resin, but the self-oxidation of potassium persulfate exists, so that the crystallization performance of the phenolic resin is influenced by side reactions existing in a system, the regularity among molecules is influenced, and a better curing effect can be obtained when the epoxy resin is cured at the temperature of 60-80 ℃.
The applicant unexpectedly finds that when the weight of potassium persulfate adopted in the application is 0.8-1.2wt% of that of vinyl triethoxysilane, the water absorption of the silicon phenol fireproof insulation board can be reduced, and the applicant speculates that: the amount of potassium persulfate influences the crosslinking reaction between the vinyltriethoxysilane and the maleimide-modified allylated phenolic resin, and with the initiation of potassium persulfate, the vinyltriethoxysilane and the maleimide-modified allylated phenolic resin in the system generate free radical polymerization reaction to form a three-dimensional network structure with non-polar long chains intertwined with each other, so that the contact probability of hydrophilic groups and water molecules in the system is hindered, and the water absorption of the silicon phenol fireproof heat-insulating material is obviously reduced.
However, when the weight of the potassium persulfate selected in the system is 0.8-1.2wt% of the weight of the vinyltriethoxysilane, the heat resistance of the silicon-phenol fireproof insulation board is affected due to side reactions.
In some preferred embodiments, the isocyanate in the isocyanate-modified carbon material is selected from at least one of toluene diisocyanate, diphenylmethane diisocyanate, 1, 6-hexamethylene diisocyanate, methylene di-p-phenyl diisocyanate, 2-methyl-5-nitrophenyl isocyanate, 4-maleimidophenyl isocyanate, and 3-isopropenyl- α, α -dimethylbenzyl isocyanate.
In some preferred embodiments, the isocyanate in the isocyanate-modified carbon material is selected from 3-isopropenyl- α, α -dimethylbenzyl isocyanate.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
The preparation method of the isocyanate modified carbon nano tube refers to the following steps:
the first step is as follows: weighing 5-10g of carbon nano tube in a three-neck flask, adding 98% concentrated sulfuric acid and 67% concentrated nitric acid in percentage by mass into the three-neck flask, wherein the volume ratio of the two is 3: 1, ultrasonic dispersion is carried out for 60-90 minutes, condensation reflux is carried out for 2-4 hours at the temperature of 60 ℃, then the obtained reactant is cooled, washed to be neutral, and after drying, the obtained modified carbon nano tube is reserved; the second step is that: taking 1-3g of the modified carbon nano tube obtained in the first step, adding 150 ml of toluene, carrying out dehydration treatment on the toluene, and carrying out ultrasonic dispersion for 30-60 minutes under the protection of nitrogen; heating in oil bath at 60-80 deg.c, adding 3-isopropenyl-alpha, alpha-dimethyl benzyl isocyanate in 30-40g, stirring to react for 5-10 hr, suction filtering, eliminating 3-isopropenyl-alpha, alpha-dimethyl benzyl isocyanate in the system with toluene to obtain modified carbon nanotube, drying and grinding to obtain solid isocyanate modified carbon nanotube for use.
The problem of dispersion of carbon nano materials among organic matters is the biggest problem, and documents report that when KH-560 silane coupling agent is adopted to disperse carbon nano tubes and is used in the preparation process of polyurethane elastomer, the mechanical property of the obtained polyurethane elastomer and the dispersion property of the carbon nano tubes are poor; the isocyanate modified carbon nano tube is arranged in a silicon phenol fireproof insulation board material system, so that the dispersion performance of the carbon nano tube in the system can be ensured, and the inorganic matter agglomeration phenomenon is avoided.
The applicant finds that when the usage amount of the 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate modified carbon nano tube is 15 wt% of the weight of the maleimide modified allylation phenolic resin, the application of the carbon nano tube in the preparation process of the silicon phenol fireproof insulation board can not only ensure that the modified carbon nano tube has better dispersion performance, but also improve the heat resistance of the silicon phenol fireproof insulation board, and speculates possible reasons: in the process of combining the carbon nano tube and the 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate, the entanglement capacity between carbon nano tube aggregates can be damaged due to strong shearing force in the melting process, the interaction force between the carbon nano tubes is weakened, and instead, the compatibility of the 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate and phenolic resin in the carbon nano tubes is promoted, so that the interface acting force between the carbon nano tubes and the polar nodes of the phenolic resin high molecular chain is promoted to be formed, and the active group carried by the 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate can promote the acting force between the polar nodes to be enhanced, the bond energy to be improved and the heat resistance of the phenolic resin to be further improved.
In some preferred embodiments, the carbon nanotube has an inner diameter of 1 to 15 nm.
In some preferred embodiments, the carbon nanotube has an inner diameter of 5 to 10 nm.
The carbon nano tube has the inner diameter of 5-10nm and the product number of C139883, and is purchased from Shanghai Aladdin Biotechnology Co., Ltd.
The applicant has unexpectedly found that the shrinkage of phenolic resin decreases, possibly for the following reasons, for 3-isopropenyl- α, α -dimethylbenzyl isocyanate modified carbon nanotubes having an internal diameter of 5 to 10 nm: the diameter of the carbon nano tube is 5-10nm, so that the phenolic resin has better dispersion performance in a system, the random motion of phenolic resin molecular chains is greatly limited by the high-dispersion carbon nano tube at high temperature, the thermal motion capability of the high molecular chains is weakened, the stable interaction between molecules ensures the lower shrinkage rate of the phenolic resin at high temperature.
In some preferred embodiments, the bulk layer preparation raw material further comprises 10 to 18 parts of a solvent.
In some preferred embodiments, the solvent is selected from at least one of ethylene glycol, ethanol, tetrahydrofuran, N-dimethylformamide, water, and toluene.
Preferably, the solvent is selected from N, N-dimethylformamide.
In some preferred embodiments, the fireproof insulation board of silicon phenol comprises, in order from top to bottom: an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer.
The invention provides a preparation method of an energy-saving silicon phenol fireproof insulation board, which comprises the following steps:
(1) mixing and stirring organic silicon, maleimide modified phenolic resin, isocyanate modified carbon material and solvent; (2) adding potassium persulfate into the step (1) in a nitrogen atmosphere, reacting for 30-90 minutes, and removing the nitrogen device to obtain an adhesive body; (3) coating the prepared adhesive body on an upper non-woven fabric layer and a lower non-woven fabric layer, and then placing the coated silicon phenol fireproof heat-insulation board in an oven at 30-60 ℃ to obtain the cured silicon phenol fireproof heat-insulation board.
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Examples
Example 1
A novel energy-saving silicon phenol fireproof insulation board comprises an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer; the preparation raw materials of the main layer comprise the following components in parts by weight: 20 parts of maleimide modified allylic phenolic resin, 10 parts of vinyl triethoxysilane, 0.08 part of potassium persulfate, 3 parts of 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate modified carbon nano tube and 10 parts of N, N-dimethylformamide.
The carbon nano tube has the inner diameter of 5-10nm and the product number of C139883, and is purchased from Shanghai Aladdin Biotechnology Co., Ltd.
The vinyltriethoxysilane mentioned, CAS number 78-08-0.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
The preparation method of the maleimide modified allylated phenolic resin refers to the following steps:
(1) adding 30g of thermoplastic phenolic resin into a three-neck flask, then adding 150 ml of n-butanol, and heating in an oil bath at 60 ℃ until the resin is dissolved; (2) adding 0.5g of potassium hydroxide into the mixture obtained in the step (1), stirring and dissolving the mixture, then cooling the mixture to 35 ℃, dropwise adding 25g of allyl chloride, after the dropwise addition is finished, heating the mixture to 60 ℃, and reacting the mixture for 5 hours; (3) after the reaction is finished, filtering, washing and distilling the product obtained in the step (2) under reduced pressure to obtain allylation phenolic resin; (4) and (3) blending the allylated phenolic resin treated in the step (3) with 15g N, N '-4, 4' -diphenylmethane bismaleimide at 135 ℃ to obtain the maleimide modified allylated phenolic resin.
The preparation method of the isocyanate modified carbon nano tube refers to the following steps:
the first step is as follows: weighing 10g of carbon nano tube in a three-neck flask, adding 98% concentrated sulfuric acid and 67% concentrated nitric acid in mass fraction into the three-neck flask, wherein the volume ratio of the two is 3: 1, performing ultrasonic dispersion for 60 minutes, performing condensation reflux for 2.5 hours at the temperature of 60 ℃, then cooling the obtained reactant, washing to be neutral, and drying to obtain a modified carbon nano tube for later use; the second step is that: and (2) adding 150 ml of toluene into 3g of the modified carbon nanotube obtained in the first step, dehydrating the toluene, ultrasonically dispersing for 60 minutes under the protection of nitrogen, heating the mixture in an oil bath at 70 ℃, adding 30g of 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate, stirring and reacting for 8 hours, performing suction filtration, removing the 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate in a system by using the toluene to obtain the modified carbon nanotube, drying and grinding the modified carbon nanotube to obtain the solid isocyanate modified carbon nanotube for later use.
The preparation method of the energy-saving silicon phenol fireproof insulation board comprises the following steps:
(1) mixing and stirring organic silicon, maleimide modified phenolic resin, isocyanate modified carbon material and solvent; (2) adding potassium persulfate into the step (1) in a nitrogen atmosphere, reacting for 60 minutes, and removing the nitrogen device to obtain an adhesive body; (3) and coating the prepared adhesive body on an upper non-woven fabric layer and a lower non-woven fabric layer, and then placing the coated silicon phenol fireproof heat-insulation board in an oven at 45 ℃ to obtain the cured silicon phenol fireproof heat-insulation board.
Example 2
A novel energy-saving silicon phenol fireproof insulation board comprises an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer; the preparation raw materials of the main layer comprise the following components in parts by weight: 45 parts of maleimide modified allylic phenolic resin, 22.5 parts of vinyl triethoxysilane, 0.27 part of potassium persulfate, 7 parts of 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate modified carbon nano tube and 10 parts of N, N-dimethylformamide.
The carbon nano tube has the inner diameter of 5-10nm and the product number of C139883, and is purchased from Shanghai Aladdin Biotechnology Co., Ltd.
The vinyltriethoxysilane mentioned, CAS number 78-08-0.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
Preparation of maleimide-modified allylated phenol resin reference was made to example 1.
Preparation method of isocyanate modified carbon nanotube referring to example 1.
The preparation method of the novel energy-saving silicon phenol fireproof insulation board refers to embodiment 1.
Example 3
A novel energy-saving silicon phenol fireproof insulation board comprises an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer; the preparation raw materials of the main layer comprise the following components in parts by weight: 32 parts of maleimide modified allylated phenolic resin, 20 parts of vinyl triethoxysilane, 0.2 part of potassium persulfate, 4.8 parts of 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate modified carbon nano tube and 10 parts of N, N-dimethylformamide.
The carbon nano tube has the inner diameter of 5-10nm and the product number of C139883, and is purchased from Shanghai Aladdin Biotechnology Co., Ltd.
The vinyltriethoxysilane mentioned, CAS number 78-08-0.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
Preparation of maleimide-modified allylated phenol resin reference was made to example 1.
Preparation method of isocyanate modified carbon nanotube referring to example 1.
The preparation method of the novel energy-saving silicon phenol fireproof insulation board refers to embodiment 1.
Example 4
A novel energy-saving silicon phenol fireproof insulation board comprises an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer; the preparation raw materials of the main layer comprise the following components in parts by weight: 32 parts of maleimide modified allylated phenolic resin, 20 parts of vinyl triethoxysilane, 0.1 part of potassium persulfate, 4.8 parts of 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate modified carbon nano tube and 10 parts of N, N-dimethylformamide.
The carbon nano tube has the inner diameter of 5-10nm and the product number of C139883, and is purchased from Shanghai Aladdin Biotechnology Co., Ltd.
The vinyltriethoxysilane mentioned, CAS number 78-08-0.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
Preparation of maleimide-modified allylated phenol resin reference was made to example 1.
Preparation method of isocyanate modified carbon nanotube referring to example 1.
The preparation method of the novel energy-saving silicon phenol fireproof insulation board refers to embodiment 1.
Example 5
A novel energy-saving silicon phenol fireproof insulation board comprises an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer; the preparation raw materials of the main layer comprise the following components in parts by weight: 32 parts of maleimide modified allylated phenolic resin, 20 parts of vinyl triethoxysilane, 0.4 part of potassium persulfate, 4.8 parts of 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate modified carbon nano tube and 10 parts of N, N-dimethylformamide.
The carbon nano tube has the inner diameter of 5-10nm and the product number of C139883, and is purchased from Shanghai Aladdin Biotechnology Co., Ltd.
The vinyltriethoxysilane mentioned, CAS number 78-08-0.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
Preparation of maleimide-modified allylated phenol resin reference was made to example 1.
Preparation method of isocyanate modified carbon nanotube referring to example 1.
The preparation method of the novel energy-saving silicon phenol fireproof insulation board refers to embodiment 1.
Example 6
A novel energy-saving silicon phenol fireproof insulation board comprises an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer; the preparation raw materials of the main layer comprise the following components in parts by weight: 32 parts of maleimide modified allylated phenolic resin, 20 parts of vinyl triethoxysilane, 0.2 part of potassium persulfate, 4.8 parts of 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate modified carbon nano tube and 10 parts of N, N-dimethylformamide.
The carbon nano tube has the inner diameter of 20-50nm and the product number of 10338, and is purchased from Jiangsu Xiancheng nano material Co.
The vinyltriethoxysilane mentioned, CAS number 78-08-0.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
Preparation of maleimide-modified allylated phenol resin reference was made to example 1.
Preparation method of isocyanate modified carbon nanotube referring to example 1.
The preparation method of the novel energy-saving silicon phenol fireproof insulation board refers to embodiment 1.
Example 7
A novel energy-saving silicon phenol fireproof insulation board comprises an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer; the preparation raw materials of the main layer comprise the following components in parts by weight: 32 parts of maleimide modified allylated phenolic resin, 20 parts of vinyl triethoxysilane, 0.2 part of potassium persulfate, 4.8 parts of carbon nano tube and 10 parts of N, N-dimethylformamide.
The carbon nano tube has the inner diameter of 5-10nm and the product number of C139883, and is purchased from Shanghai Aladdin Biotechnology Co., Ltd.
The vinyltriethoxysilane mentioned, CAS number 78-08-0.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
Preparation of maleimide-modified allylated phenol resin reference was made to example 1.
The preparation method of the novel energy-saving silicon phenol fireproof insulation board refers to embodiment 1.
Example 8
A novel energy-saving silicon phenol fireproof insulation board comprises an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer; the preparation raw materials of the main layer comprise the following components in parts by weight: 32 parts of phenolic resin, 20 parts of vinyl triethoxysilane, 0.2 part of potassium persulfate, 4.8 parts of 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate modified carbon nano tube and 10 parts of N, N-dimethylformamide.
The phenolic resin, number HK-316, was purchased from Jining HuaKai resin Co.
The carbon nano tube has the inner diameter of 5-10nm and the product number of C139883, and is purchased from Shanghai Aladdin Biotechnology Co., Ltd.
The vinyltriethoxysilane mentioned, CAS number 78-08-0.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
Preparation method of isocyanate modified carbon nanotube referring to example 1.
The preparation method of the novel energy-saving silicon phenol fireproof insulation board refers to embodiment 1.
Example 9
A novel energy-saving silicon phenol fireproof insulation board comprises an upper non-woven fabric layer, a main body layer and a lower non-woven fabric layer; the preparation raw materials of the main layer comprise the following components in parts by weight: 32 parts of maleimide modified allylated phenolic resin, 20 parts of vinyl triethoxysilane, 0.2 part of potassium persulfate, 16 parts of 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate modified carbon nano tube and 10 parts of N, N-dimethylformamide.
The carbon nano tube has the inner diameter of 5-10nm and the product number of C139883, and is purchased from Shanghai Aladdin Biotechnology Co., Ltd.
The vinyltriethoxysilane mentioned, CAS number 78-08-0.
The 3-isopropenyl-alpha, alpha-dimethylbenzyl isocyanate has a CAS number of 2094-99-7.
Preparation of maleimide-modified allylated phenol resin reference was made to example 1.
Preparation method of isocyanate modified carbon nanotube referring to example 1.
The preparation method of the novel energy-saving silicon phenol fireproof insulation board refers to embodiment 1.
And (3) performance testing:
1. water absorption test: the fireproof silicon phenol heat-insulation boards prepared in the embodiments 1 to 9 are used for water absorption tests, the test method refers to GB/T8810-.
2. And (3) testing the heat conductivity coefficient: the silicon phenol fireproof insulation boards prepared in the embodiments 1 to 9 are used for heat conductivity coefficient tests, the test method refers to GB/T10801.1-2002, and the results are counted in the following table.
3. And (3) shrinkage testing: the silicon phenol fireproof insulation boards prepared in the embodiments 1 to 9 are used for shrinkage rate test, the test method refers to GB/T15585-1995, and the results are counted in the following table.
4. And (3) testing the curing effect: the silicon phenol fireproof insulation boards prepared in the embodiments 1 to 9 are placed in a 60 ℃ oven for curing effect test, the curing effect of the completely cured silicon phenol fireproof insulation board is specified to be excellent, the curing effect with molten colloid is good, the curing effect of the obviously uncured silicon phenol fireproof insulation board is poor, and the results are counted in the following table.
| Experiment of | Water absorption/%) | Coefficient of thermal conductivity (lambda) | Shrinkage ratio/% | Curing effect |
| Example 1 | 0.6 | 0.026W/m·K | 0.24 | Superior food |
| Example 2 | 0.5 | 0.024W/m·K | 0.18 | Superior food |
| Example 3 | 0.3 | 0.023W/m·K | 0.15 | Superior food |
| Example 4 | 1.0 | 0.076W/m·K | 0.35 | Good wine |
| Example 5 | 2.1 | 0.15W/m·K | 0.28 | Difference (D) |
| Example 6 | 1.6 | 0.053W/m·K | 0.39 | Good wine |
| Example 7 | 1.2 | 1.25W/m·K | 1.5 | Difference (D) |
| Example 8 | 2.6 | 0.27W/m·K | 2.1 | Difference (D) |
| Example 9 | 1.1 | 0.31W/m·K | 0.84 | Difference (D) |
The test results show that the silicon phenol fireproof insulation board prepared by the method has good fireproof performance, low shrinkage rate and water absorption rate, the curing temperature of the silicon phenol fireproof insulation board prepared by the method is appropriate, the processing conditions are simple, and the application value and the application prospect are increased.
Finally, it should be understood that the above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. An energy-saving silicon phenol fireproof insulation board is characterized by comprising a non-woven fabric layer and a main body layer;
the non-woven fabric layer comprises an upper non-woven fabric layer and a lower non-woven fabric layer;
the preparation raw materials of the main body layer comprise the following components in parts by weight: 20-45 parts of maleimide modified phenolic resin, 10-22.5 parts of organic silicon, 0.08-0.3 part of potassium persulfate and 3-7 parts of isocyanate modified carbon material;
the isocyanate in the isocyanate modified carbon material is selected from 3-isopropenyl-alpha, alpha-dimethyl benzyl isocyanate;
the organic silicon is selected from vinyl triethoxysilane;
the using amount of the potassium persulfate is 0.8 to 1.2 weight percent of the vinyl triethoxysilane;
the carbon material is selected from carbon nanotubes, and the inner diameter of the carbon nanotube is 5-10 nm;
the phenolic resin in the maleimide modified phenolic resin is selected from allylated phenolic resin.
2. The energy-saving silicon-phenol fireproof heat-insulation board according to claim 1, wherein the weight ratio of the organic silicon to the maleimide modified phenolic resin is 1: 0.5-2.
3. The energy-saving silicon phenol fireproof heat-insulation board according to claim 1, wherein the main body layer preparation raw material further comprises 10-18 parts of a solvent.
4. The energy-saving silicon phenol fireproof heat-insulation board according to claim 3, wherein the solvent is at least one selected from ethylene glycol, ethanol, tetrahydrofuran, N-dimethylformamide, water and toluene.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105155700A (en) * | 2015-08-20 | 2015-12-16 | 谢亚春 | Silicon and phenol fireproof insulation board |
| CN111286071A (en) * | 2018-07-27 | 2020-06-16 | 成都新柯力化工科技有限公司 | Graphene oxide reinforced modified phenolic foam plastic and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105155700A (en) * | 2015-08-20 | 2015-12-16 | 谢亚春 | Silicon and phenol fireproof insulation board |
| CN111286071A (en) * | 2018-07-27 | 2020-06-16 | 成都新柯力化工科技有限公司 | Graphene oxide reinforced modified phenolic foam plastic and preparation method thereof |
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| Title |
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| 有机硅改性酚醛树脂的制备与研究;周力;《中国优秀硕士学位论文全文数据库（电子期刊） 工程科技Ⅰ辑》;20140615;B016-111页 * |
| 酚醛树脂的增韧及其泡沫性能;熊伟;《中国优秀硕士学位论文全文数据库（电子期刊） 工程科技Ⅰ辑》;20141115;B016-151页 * |
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