CN105155700A - Silicon and phenol fireproof insulation board - Google Patents
Silicon and phenol fireproof insulation board Download PDFInfo
- Publication number
- CN105155700A CN105155700A CN201510511955.8A CN201510511955A CN105155700A CN 105155700 A CN105155700 A CN 105155700A CN 201510511955 A CN201510511955 A CN 201510511955A CN 105155700 A CN105155700 A CN 105155700A
- Authority
- CN
- China
- Prior art keywords
- silicon
- phenol fireproof
- silicon phenol
- heat insulating
- heated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 title abstract description 9
- 229910052710 silicon Inorganic materials 0.000 title abstract description 9
- 239000010703 silicon Substances 0.000 title abstract description 9
- 238000009413 insulation Methods 0.000 title abstract 9
- 229920000742 Cotton Polymers 0.000 claims abstract description 53
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000005011 phenolic resin Substances 0.000 claims abstract description 17
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 17
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 17
- 239000003085 diluting agent Substances 0.000 claims abstract description 6
- MJRKSNLCQOSKTL-UHFFFAOYSA-N phenol;silicon Chemical compound [Si].OC1=CC=CC=C1 MJRKSNLCQOSKTL-UHFFFAOYSA-N 0.000 claims description 61
- 238000001467 acupuncture Methods 0.000 claims description 51
- 150000001875 compounds Chemical class 0.000 claims description 37
- 239000004604 Blowing Agent Substances 0.000 claims description 26
- 238000001802 infusion Methods 0.000 claims description 26
- 235000013312 flour Nutrition 0.000 claims description 16
- 229940125773 compound 10 Drugs 0.000 claims description 6
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- 150000007513 acids Chemical class 0.000 claims description 5
- 125000003158 alcohol group Chemical group 0.000 claims description 5
- 150000001335 aliphatic alkanes Chemical group 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- GHYOCDFICYLMRF-UTIIJYGPSA-N (2S,3R)-N-[(2S)-3-(cyclopenten-1-yl)-1-[(2R)-2-methyloxiran-2-yl]-1-oxopropan-2-yl]-3-hydroxy-3-(4-methoxyphenyl)-2-[[(2S)-2-[(2-morpholin-4-ylacetyl)amino]propanoyl]amino]propanamide Chemical compound C1(=CCCC1)C[C@@H](C(=O)[C@@]1(OC1)C)NC([C@H]([C@@H](C1=CC=C(C=C1)OC)O)NC([C@H](C)NC(CN1CCOCC1)=O)=O)=O GHYOCDFICYLMRF-UTIIJYGPSA-N 0.000 claims description 3
- 229940125797 compound 12 Drugs 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 239000006260 foam Substances 0.000 abstract 1
- 239000004088 foaming agent Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 15
- 239000002184 metal Substances 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 238000001192 hot extrusion Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000010276 construction Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- ONBQEOIKXPHGMB-VBSBHUPXSA-N 1-[2-[(2s,3r,4s,5r)-3,4-dihydroxy-5-(hydroxymethyl)oxolan-2-yl]oxy-4,6-dihydroxyphenyl]-3-(4-hydroxyphenyl)propan-1-one Chemical compound O[C@@H]1[C@H](O)[C@@H](CO)O[C@H]1OC1=CC(O)=CC(O)=C1C(=O)CCC1=CC=C(O)C=C1 ONBQEOIKXPHGMB-VBSBHUPXSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229940126142 compound 16 Drugs 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Building Environments (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
The invention discloses a silicon and phenol fireproof insulation board. The silicon and phenol fireproof insulation board comprises a silicon and phenol fireproof insulation foundation layer; an upper needling cotton layer is arranged on the upper surface of the silicon and phenol fireproof insulation foundation layer; a lower needling cotton layer is arranged on the lower surface of the silicon and phenol fireproof insulation foundation layer; the silicon and phenol fireproof insulation foundation layer comprises the following materials in percentage by weight: 4%-60% of silica powder, 7%-50% of phenolic resin, 0.6%-4% of foam uniformizing agent, 2%-12% of foaming agent, 0.6%-10% of diluents and 10%-30% of curing agent. By the structural design and the material matching design, the silicon and phenol fireproof insulation board has the advantages of novel structural design, good protection and insulation properties and convenience and speediness in mounting.
Description
Technical field
The present invention relates to building material technical field, particularly relate to a kind of silicon phenol fireproof heated board.
Background technology
Due to the generation of a lot of building heat preservation event of fire in recent years, cause the thinking of each bound pair insulated fire, the beyond example great attention causing all circles in the industry of the fireproof performance of heat insulating material.But, a lot of heat insulating material is on fire all to be produced in work progress, as: electric welding, naked light, bad construction custom, what these materials constantly produced in combustion melts droplet thing and a toxic smoke, and the gases such as the CFC simultaneously discharged, hydrofluorocarbons, freon are also very important to the harm of environment.
The fireproof heat insulating panel products of existence form various kinds in prior art; But, for existing fireproof heat insulating panel products, the defect of its ubiquity fireproof heat insulating poor performance, installation inconvenience.
Summary of the invention
The object of the invention is to provide a kind of silicon phenol fireproof heated board for the deficiencies in the prior art, this silicon phenol fireproof heated board novel in structural design, protection good heat insulating and quick and easy for installation.
For achieving the above object, the present invention is achieved through the following technical solutions.
A kind of silicon phenol fireproof heated board, includes silicon phenol fireproof heat insulating basal layer, and the upper surface of silicon phenol fireproof heat insulating basal layer is equiped with upside acupuncture cotton layer, and the soffit of silicon phenol fireproof heat insulating basal layer is equiped with downside acupuncture cotton layer;
Silicon phenol fireproof heat insulating basal layer includes the material of following weight portion, is specially:
Silica flour 4%-60%
Phenolic resins 7%-50%
Equal infusion 0.6%-4%
Blowing agent 2%-12%
Thinner 0.6%-10%
Curing compound 10%-30%.
Further, described silicon phenol fireproof heat insulating basal layer includes the material of following weight portion, is specially:
Silica flour 30%-50%
Phenolic resins 20%-40%
Equal infusion 2%-4%
Blowing agent 5%-12%
Thinner 3%-10%
Curing compound 10%-20%.
Further, described silicon phenol fireproof heat insulating basal layer includes the material of following weight portion, is specially:
Silica flour 40%
Phenolic resins 30%
Equal infusion 2%
Blowing agent 8%
Thinner 8%
Curing compound 12%.
Wherein, described equal infusion is the equal infusion of methyl.
Wherein, described blowing agent is alkanes blowing agent.
Wherein, described thinner is
alcohol diluent.
Wherein, described curing compound is acids curing compound.
Wherein, the grammes per square metre of described upside acupuncture cotton layer, described downside acupuncture cotton layer is respectively 25-50.
Beneficial effect of the present invention is: a kind of silicon phenol fireproof heated board of the present invention, it includes silicon phenol fireproof heat insulating basal layer, the upper surface of silicon phenol fireproof heat insulating basal layer is equiped with upside acupuncture cotton layer, and the soffit of silicon phenol fireproof heat insulating basal layer is equiped with downside acupuncture cotton layer; Silicon phenol fireproof heat insulating basal layer includes the material of following weight portion, is specially: silica flour 4%-60%, phenolic resins 7%-50%, all infusion 0.6%-4%, blowing agent 2%-12%, thinner 0.6%-10%, curing compound 10%-30%.Designed by said structure and material proportion design, silicon phenol fireproof heated board of the present invention has novel in structural design, protects good heat insulating and advantage quick and easy for installation.
Accompanying drawing explanation
Utilize accompanying drawing to be further detailed the present invention below, but the embodiment in accompanying drawing does not form any limitation of the invention.
Fig. 1 is structural representation of the present invention.
Include in FIG:
1---silicon phenol fireproof heat insulating basal layer
2---upside acupuncture cotton layer
3---downside acupuncture cotton layer.
Detailed description of the invention
Below in conjunction with concrete embodiment, the present invention will be described.
Embodiment one, as shown in Figure 1, a kind of silicon phenol fireproof heated board, includes silicon phenol fireproof heat insulating basal layer 1, and the upper surface of silicon phenol fireproof heat insulating basal layer 1 is equiped with upside acupuncture cotton layer 2, and the soffit of silicon phenol fireproof heat insulating basal layer 1 is equiped with downside acupuncture cotton layer 3.
Further, silicon phenol fireproof heat insulating basal layer 1 includes the material of following weight portion, is specially:
Silica flour 40%
Phenolic resins 30%
Equal infusion 2%
Blowing agent 8%
Thinner 8%
Curing compound 12%.
Prepare in process at the silicon phenol fireproof heated board of the present embodiment one,
silica flour, phenolic resins, all infusion, blowing agent, thinner, prior to mixing and stirring in mixing plant, then add curing compound and again by mixing plant by silica flour, phenolic resins, all infusion, blowing agent, thinner, curing compound mixing and stirring,by extruder head, extruder discharge extremely tiles on pipeline compound after mixing and stirring, wherein, tiling pipeline has acupuncture cotton in the continuous lay in the below of compound, and the rearward end of tiling pipeline is equiped with the acupuncture cotton laying device in the continuous lay acupuncture cotton of compound upper surface; After treating each acupuncture cotton and compound lay, each acupuncture cotton adds in hot extrusion molding device along with compound enters to, add hot extrusion molding device to be extruded to shape heating to compound, and compound is foamed and final molding becomes silicon phenol fireproof heated board; After treating silicon phenol fireproof heat insulating sheet metal forming, continuous print silicon phenol fireproof heated board cuts into the plate construction of given size by cutter sweep.
Need point out further, for the upside acupuncture cotton layer 2 of the present embodiment one, downside acupuncture cotton layer 3, in the present embodiment one assembling process, upside acupuncture cotton layer 2, downside acupuncture cotton layer 3 can be convenient to the inner metal plate of wallboard, outside metal sheet is adhesively fixed, and then realizes fast and easy assembling.
Wherein, the equal infusion of the present embodiment one is the equal infusion of methyl, and blowing agent is alkanes blowing agent, and thinner is
alcohol diluent, curing compound is acids curing compound, and the grammes per square metre of upside acupuncture cotton layer 2, downside acupuncture cotton layer 3 is respectively 25-50.
Comprehensive above-mentioned situation is known, is designed and material proportion design by said structure, and the silicon phenol fireproof heated board of the present embodiment one has novel in structural design, protects good heat insulating and advantage quick and easy for installation.
Embodiment two, as shown in Figure 1, a kind of silicon phenol fireproof heated board, includes silicon phenol fireproof heat insulating basal layer 1, and the upper surface of silicon phenol fireproof heat insulating basal layer 1 is equiped with upside acupuncture cotton layer 2, and the soffit of silicon phenol fireproof heat insulating basal layer 1 is equiped with downside acupuncture cotton layer 3.
Further, silicon phenol fireproof heat insulating basal layer 1 includes the material of following weight portion, is specially:
Silica flour 50%
Phenolic resins 30%
Equal infusion 2%
Blowing agent 5%
Thinner 3%
Curing compound 10%.
Prepare in process at the silicon phenol fireproof heated board of the present embodiment two,
silica flour, phenolic resins, all infusion, blowing agent, thinner, prior to mixing and stirring in mixing plant, then add curing compound and again by mixing plant by silica flour, phenolic resins, all infusion, blowing agent, thinner, curing compound mixing and stirring,by extruder head, extruder discharge extremely tiles on pipeline compound after mixing and stirring, wherein, tiling pipeline has acupuncture cotton in the continuous lay in the below of compound, and the rearward end of tiling pipeline is equiped with the acupuncture cotton laying device in the continuous lay acupuncture cotton of compound upper surface; After treating each acupuncture cotton and compound lay, each acupuncture cotton adds in hot extrusion molding device along with compound enters to, add hot extrusion molding device to be extruded to shape heating to compound, and compound is foamed and final molding becomes silicon phenol fireproof heated board; After treating silicon phenol fireproof heat insulating sheet metal forming, continuous print silicon phenol fireproof heated board cuts into the plate construction of given size by cutter sweep.
Need point out further, for the upside acupuncture cotton layer 2 of the present embodiment two, downside acupuncture cotton layer 3, in the present embodiment two assembling process, upside acupuncture cotton layer 2, downside acupuncture cotton layer 3 can be convenient to the inner metal plate of wallboard, outside metal sheet is adhesively fixed, and then realizes fast and easy assembling.
Wherein, the equal infusion of the present embodiment two is the equal infusion of methyl, and blowing agent is alkanes blowing agent, and thinner is
alcohol diluent, curing compound is acids curing compound, and the grammes per square metre of upside acupuncture cotton layer 2, downside acupuncture cotton layer 3 is respectively 25-50.
Comprehensive above-mentioned situation is known, is designed and material proportion design by said structure, and the silicon phenol fireproof heated board of the present embodiment two has novel in structural design, protects good heat insulating and advantage quick and easy for installation.
Embodiment three, as shown in Figure 1, a kind of silicon phenol fireproof heated board, includes silicon phenol fireproof heat insulating basal layer 1, and the upper surface of silicon phenol fireproof heat insulating basal layer 1 is equiped with upside acupuncture cotton layer 2, and the soffit of silicon phenol fireproof heat insulating basal layer 1 is equiped with downside acupuncture cotton layer 3.
Further, silicon phenol fireproof heat insulating basal layer 1 includes the material of following weight portion, is specially:
Silica flour 30%
Phenolic resins 30%
Equal infusion 4%
Blowing agent 12%
Thinner 10%
Curing compound 16%.
Prepare in process at the silicon phenol fireproof heated board of the present embodiment three,
silica flour, phenolic resins, all infusion, blowing agent, thinner, prior to mixing and stirring in mixing plant, then add curing compound and again by mixing plant by silica flour, phenolic resins, all infusion, blowing agent, thinner, curing compound mixing and stirring,by extruder head, extruder discharge extremely tiles on pipeline compound after mixing and stirring, wherein, tiling pipeline has acupuncture cotton in the continuous lay in the below of compound, and the rearward end of tiling pipeline is equiped with the acupuncture cotton laying device in the continuous lay acupuncture cotton of compound upper surface; After treating each acupuncture cotton and compound lay, each acupuncture cotton adds in hot extrusion molding device along with compound enters to, add hot extrusion molding device to be extruded to shape heating to compound, and compound is foamed and final molding becomes silicon phenol fireproof heated board; After treating silicon phenol fireproof heat insulating sheet metal forming, continuous print silicon phenol fireproof heated board cuts into the plate construction of given size by cutter sweep.
Need point out further, for the upside acupuncture cotton layer 2 of the present embodiment three, downside acupuncture cotton layer 3, in the present embodiment three assembling process, upside acupuncture cotton layer 2, downside acupuncture cotton layer 3 can be convenient to the inner metal plate of wallboard, outside metal sheet is adhesively fixed, and then realizes fast and easy assembling.
Wherein, the equal infusion of the present embodiment three is the equal infusion of methyl, and blowing agent is alkanes blowing agent, and thinner is
alcohol diluent, curing compound is acids curing compound, and the grammes per square metre of upside acupuncture cotton layer 2, downside acupuncture cotton layer 3 is respectively 25-50.
Comprehensive above-mentioned situation is known, is designed and material proportion design by said structure, and the silicon phenol fireproof heated board of the present embodiment three has novel in structural design, protects good heat insulating and advantage quick and easy for installation.
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (8)
1. a silicon phenol fireproof heated board, it is characterized in that: include silicon phenol fireproof heat insulating basal layer (1), the upper surface of silicon phenol fireproof heat insulating basal layer (1) is equiped with upside acupuncture cotton layer (2), and the soffit of silicon phenol fireproof heat insulating basal layer (1) is equiped with downside acupuncture cotton layer (3);
Silicon phenol fireproof heat insulating basal layer (1) includes the material of following weight portion, is specially:
Silica flour 4%-60%
Phenolic resins 7%-50%
Equal infusion 0.6%-4%
Blowing agent 2%-12%
Thinner 0.6%-10%
Curing compound 10%-30%.
2. a kind of silicon phenol fireproof heated board according to claim 1, is characterized in that: described silicon phenol fireproof heat insulating basal layer (1) includes the material of following weight portion, is specially:
Silica flour 30%-50%
Phenolic resins 20%-40%
Equal infusion 2%-4%
Blowing agent 5%-12%
Thinner 3%-10%
Curing compound 10%-20%.
3. a kind of silicon phenol fireproof heated board according to claim 2, is characterized in that: described silicon phenol fireproof heat insulating basal layer (1) includes the material of following weight portion, is specially:
Silica flour 40%
Phenolic resins 30%
Equal infusion 2%
Blowing agent 8%
Thinner 8%
Curing compound 12%.
4. a kind of silicon phenol fireproof heated board according to claim 3, is characterized in that: described equal infusion is the equal infusion of methyl.
5. a kind of silicon phenol fireproof heated board according to claim 4, is characterized in that: described blowing agent is alkanes blowing agent.
6. a kind of silicon phenol fireproof heated board according to claim 5, is characterized in that: described thinner is
alcohol diluent.
7. a kind of silicon phenol fireproof heated board according to claim 6, is characterized in that: described curing compound is acids curing compound.
8. a kind of silicon phenol fireproof heated board according to claim 1 to 7 any one, is characterized in that: the grammes per square metre of described upside acupuncture cotton layer (2), described downside acupuncture cotton layer (3) is respectively 25-50.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510511955.8A CN105155700A (en) | 2015-08-20 | 2015-08-20 | Silicon and phenol fireproof insulation board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510511955.8A CN105155700A (en) | 2015-08-20 | 2015-08-20 | Silicon and phenol fireproof insulation board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105155700A true CN105155700A (en) | 2015-12-16 |
Family
ID=54796710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510511955.8A Pending CN105155700A (en) | 2015-08-20 | 2015-08-20 | Silicon and phenol fireproof insulation board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105155700A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108407183A (en) * | 2018-03-08 | 2018-08-17 | 广东猛人高科技防火保温材料有限公司 | A kind of silicon phenol plate foaming flow sheet equipment |
| CN112223861A (en) * | 2020-10-12 | 2021-01-15 | 广东华瑞环保材料有限公司 | Energy-saving silicon phenol fireproof insulation board |
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| CN201520084U (en) * | 2009-08-12 | 2010-07-07 | 北京月格碧波商贸中心 | Fireproofing board |
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| CN103173169A (en) * | 2013-03-01 | 2013-06-26 | 北京中铁润海科技有限公司 | Composite impregnating adhesive for making fireproof heat insulation plate, and its use method |
| CN103333457A (en) * | 2013-07-25 | 2013-10-02 | 天津城建大学 | High-smoke suppression and high-oxygen index phenolic aldehyde fire-proof heat-preserving board and preparation method thereof |
| CN203270826U (en) * | 2013-04-19 | 2013-11-06 | 苏州佰家丽新材料科技有限公司 | Compound insulation board |
-
2015
- 2015-08-20 CN CN201510511955.8A patent/CN105155700A/en active Pending
Patent Citations (6)
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|---|---|---|---|---|
| JP2006348542A (en) * | 2005-06-14 | 2006-12-28 | Kanaya Sekkei:Kk | Opening part structure |
| CN201520084U (en) * | 2009-08-12 | 2010-07-07 | 北京月格碧波商贸中心 | Fireproofing board |
| CN101824883A (en) * | 2010-02-01 | 2010-09-08 | 山东中南集团有限公司 | Imitation stone thermal insulating decoration board and making process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108407183A (en) * | 2018-03-08 | 2018-08-17 | 广东猛人高科技防火保温材料有限公司 | A kind of silicon phenol plate foaming flow sheet equipment |
| CN112223861A (en) * | 2020-10-12 | 2021-01-15 | 广东华瑞环保材料有限公司 | Energy-saving silicon phenol fireproof insulation board |
| CN112223861B (en) * | 2020-10-12 | 2021-06-22 | 广东华瑞环保材料有限公司 | Energy-saving silicon phenol fireproof insulation board |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
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| TA01 | Transfer of patent application right |
Effective date of registration: 20170821 Address after: 523900, Songshan, Fifth Industrial Zone patrol Town, Humen, Guangdong, Dongguan Province, No. 3 Applicant after: Guangdong fierce hi tech fireproof heat insulating material Co., Ltd. Address before: 523900 Guangdong province Dongguan city Humen town gate five good market No. 3 Applicant before: Xie Yachun |
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| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151216 |
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| RJ01 | Rejection of invention patent application after publication |