CN112213886A - Support piece, preparation method, lamp panel assembly, backlight module and assembly method - Google Patents
Support piece, preparation method, lamp panel assembly, backlight module and assembly method Download PDFInfo
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- CN112213886A CN112213886A CN202011167897.9A CN202011167897A CN112213886A CN 112213886 A CN112213886 A CN 112213886A CN 202011167897 A CN202011167897 A CN 202011167897A CN 112213886 A CN112213886 A CN 112213886A
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- substrate
- support
- supporting
- colloid
- glue
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000000758 substrate Substances 0.000 claims description 103
- 239000000084 colloidal system Substances 0.000 claims description 78
- 239000003292 glue Substances 0.000 claims description 46
- 238000009792 diffusion process Methods 0.000 claims description 29
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000000741 silica gel Substances 0.000 claims description 9
- 229910002027 silica gel Inorganic materials 0.000 claims description 9
- 239000000499 gel Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a support piece and a preparation method thereof, a lamp panel assembly, a backlight module and an assembly method thereof.
Description
Technical Field
The invention relates to the technical field of liquid crystal display, in particular to a support piece, a preparation method, a lamp panel assembly, a backlight module and an assembly method.
Background
The backlight module of the liquid crystal display system is responsible for providing uniform, high-brightness and high-color-gamut-coverage white light, wherein the uniformity of the backlight source is mainly ensured by adjusting the lamp spacing and the appropriate OD value. And the distance between the optical membrane component and the LED lamp bead is the OD value. However, the smaller and smaller OD size of the mini LED backlight module brings difficulties to the lamp support option. The common solution is to use a very small support to ensure the OD, but under the condition of small OD, a small-sized support is needed, but the small-sized support has the problems of complex structure and inconvenient assembly.
Disclosure of Invention
The invention mainly aims to provide a support piece, a preparation method, a lamp panel assembly, a backlight module and an assembly method, and aims to solve the problems that in the prior art, a small-size support piece is required under a small OD condition, but the small-size support piece is complex in structure and inconvenient to assemble.
In order to achieve the above object, the present invention provides a supporting member for a backlight module, including:
a substrate;
and the supporting colloid is arranged on one side surface of the substrate.
Optionally, the substrate is provided with white ink on a mounting surface close to the support colloid.
Optionally, the substrate is a circuit board, and a pad is arranged at the bottom of the circuit board; and/or the presence of a gas in the gas,
one surface of the support colloid, which is deviated from the substrate, is a spherical surface.
Optionally, the supporting colloid is made of silica gel or resin; and/or the presence of a gas in the gas,
the supporting colloid is cubic, and the surface of the supporting colloid, which is far away from the substrate, is an arc surface; and/or the presence of a gas in the gas,
the supporting colloid is made of transparent materials.
In order to achieve the above object, the present invention provides a method for manufacturing a supporting member, comprising the steps of:
providing a substrate;
and coating glue on one side surface of the substrate, and solidifying for a first preset time to form a support colloid to obtain the support piece.
Optionally, the step of forming a supporting colloid in the first preset time period of solidification to obtain a supporting member includes:
and cutting the substrate coated with the glue for a plurality of times to obtain a plurality of sub-substrates with glue, wherein the sub-substrates are supporting pieces and comprise bases and supporting glue.
Optionally, the step before applying the glue to the one side of the substrate comprises forming a white ink layer on one side of the substrate; and/or the presence of a gas in the gas,
the step of coating glue on one side of the substrate comprises coating whole glue on one side of the substrate or performing single-point glue dispensing on one side of the substrate; and/or
The substrate is a circuit board; and/or the presence of a gas in the gas,
the glue is silica gel or resin.
In order to achieve the above object, the present invention further provides a lamp panel assembly, including:
a substrate;
the light-emitting chips are arranged on one side surface of the substrate at intervals;
and the plurality of supporting colloids are arranged on one side surface of the substrate, which is provided with the light-emitting chip, at intervals.
In order to achieve the above object, the present invention further provides a backlight module, including:
a back plate;
the diffusion plate is arranged opposite to the back plate at intervals; and the number of the first and second groups,
as above-mentioned lamp plate assembly, lamp plate assembly locates the backplate with between the diffuser plate, including base plate, a plurality of luminous chip and a plurality of support colloid, it is a plurality of luminous chip interval set up in a side of base plate, it is a plurality of support colloid interval sets up the base plate has a side of luminous chip, it is a plurality of support colloid keep away from the one end of base plate all with the diffuser plate butt.
In order to achieve the above object, the present invention further provides an assembly method of the lamp panel assembly, including the following steps:
providing a substrate, wherein one side surface of the substrate is provided with a plurality of first mounting areas and a plurality of second mounting areas which are arranged at intervals respectively;
providing a plurality of light-emitting chips, and fixing the light-emitting chips in the first mounting areas;
glue coating is carried out on the light-emitting chip and the second mounting area, and the second preset time is solidified to obtain the packaged light source and the support colloid
Optionally, the step of coating the light emitting chip and the second mounting region with glue includes synchronously dispensing the light emitting chip and the second mounting region; and/or the presence of a gas in the gas,
the substrate is a circuit board.
In order to achieve the above object, the present invention further provides an assembling method of a backlight module, including the steps of:
providing a back plate;
providing the lamp panel assembly, and installing the lamp panel assembly to the backboard, wherein the lamp panel assembly comprises a substrate, a plurality of light-emitting chips and a plurality of supporting colloids, the plurality of light-emitting chips are arranged on one side surface of the substrate at intervals, and the plurality of supporting colloids are arranged on one side surface of the substrate with the light-emitting chips at intervals;
and providing a diffusion plate, and placing the diffusion plate on one side of the support colloid, which is far away from the backboard.
In the technical scheme provided by the invention, the size of the supporting colloid can be processed to be small enough and easy to process, so that the requirement of supporting the diffusion plate when the backlight module has a small OD size is met, the diffusion plate is supported by the supporting colloid, the structure of the supporting piece 100 under the small OD is simplified, and the assembly of the supporting piece is convenient.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a backlight module according to an embodiment of the present invention, including a supporting member;
FIG. 2 is a schematic structural diagram of a backlight module including a supporting member according to another embodiment of the present invention;
FIG. 3 is a process flow diagram of one embodiment of a method for fabricating a support according to the present invention;
FIG. 4 is a schematic flow chart illustrating an embodiment of a method for fabricating the support member shown in FIG. 3;
fig. 5 is a schematic flow chart illustrating an embodiment of a method for assembling a lamp panel assembly according to the present invention;
fig. 6 is a flowchart illustrating an assembling method of a backlight module according to an embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1000 | |
300 | |
| 100 | |
400 | Copper foil |
| 1 | |
500 | |
| 11 | |
600 | |
| 2 | Supporting |
700 | Colloid |
| 200 | Back plate | a | Submount for electronic component |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indication is involved in the embodiment of the present invention, the directional indication is only used for explaining the relative positional relationship, the motion situation, and the like between the components in a certain posture, and if the certain posture is changed, the directional indication is changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The backlight module of the liquid crystal display system is responsible for providing uniform, high-brightness and high-color-gamut-coverage white light, wherein the uniformity of the backlight source is mainly ensured by adjusting the lamp spacing and the appropriate OD value. And the distance between the optical membrane component and the LED lamp bead is the OD value. However, the smaller and smaller OD size of the mini LED backlight module brings difficulties to the lamp support option. The common solution is to use a very small support to ensure the OD, but in the case of a small OD, especially under the limit condition that the OD is not more than 5mm, the processing and assembly of the small-sized support have more problems, such as complex and tedious processing, inconvenient assembly and the like.
In view of the above, the present invention provides a support member and a manufacturing method thereof, a lamp panel assembly, a backlight module and an assembling method thereof, wherein fig. 1 to 2 are schematic diagrams of embodiments of the backlight module provided by the present invention, which includes the support member.
Referring to fig. 1, the supporting member 100 includes a substrate 11 and a supporting colloid 2, and the supporting colloid 2 is disposed on a side surface of the substrate 11.
In the technical scheme provided by the invention, the size of the supporting colloid 2 can be processed to be small enough and easy to process, so that the requirement of supporting the diffusion plate when the backlight module has a small OD size is met, and the diffusion plate is supported by the supporting colloid 2, so that the processing of the small OD lower supporting piece 100 is simplified.
It should be noted that, the support of the diffuser plate with different heights is realized by replacing the base 11 with different thicknesses and matching the support colloid 2, and it is needless to say that the support colloid 2 with different heights may be processed to match the base 11 or the support colloid 2 with different heights may be processed and the base 11 with different thicknesses may be replaced to cooperate to support the diffuser plate.
Referring to fig. 2, the substrate 11 and the support colloid 2 may be integrally formed, so that the installation time is saved and the processing of the support 100 with a small OD is simplified.
Specifically, white ink is arranged on the mounting surface of the substrate 11 close to the support colloid 2, so that the reflectivity of the support member 100 is improved, and when the support member is applied to a backlight module, the light emitting efficiency of the backlight module can be improved.
In order to mount the supporting member 100, the substrate 11 is a circuit board, a pad is disposed at the bottom of the circuit board, and the mounting of the supporting member 100 is achieved by soldering the pad, which facilitates the implementation of a mounting process.
In the actual use process, the supporting member 100 needs to be fixedly mounted on the backplate, and in order to fix the supporting member 100 on the backplate 200, a fixing component is disposed between the substrate 11 and the backplate 200, and the substrate 11 is fixed on the backplate 200 by the fixing component.
Specifically, the fixing component includes a double-sided adhesive tape, and the substrate 11 and the backplane 200 are fixed by the double-sided adhesive tape, so that the assembly efficiency of the backlight module 1000 is improved, and the operation is simple.
In one embodiment, the fixing component includes a copper foil 400, the copper foil 400 is fixed on the surface of the substrate 11 facing the backboard 200, and the substrate 11 is fixed on the backboard 200 by an SMT process, so that the substrate 11 is firmly mounted and is easy to operate.
In another embodiment, the fixing component includes a first magnetic portion and a second magnetic portion attracting the first magnetic portion, one of the first magnetic portion and the second magnetic portion is disposed on the substrate 11, and the other is disposed on the backplate 200, so that the substrate 11 is fixed and the substrate 11 is easily detached from the backplate 200.
Referring to fig. 1, one surface of the support colloid 2 departing from the substrate 11 is a spherical surface, and the forming processing of the support colloid 2 can be realized through dispensing, so that the operation is simple.
It should be noted that, the material that supports colloid 2 has a lot, specifically, in the embodiment of this application, support colloid 2 and be silica gel or resin material, so set up because silica gel or resin adsorptivity are strong, make support colloid 2 with 11 firm in connection of basement, silica gel or resin can set up to the state of transparence or high light transmittance, improve backlight unit light-emitting effect, and the problem such as dark spot display effect is inhomogeneous is avoided to the display.
Referring to fig. 3, the supporting colloid 2 is a cube, and the surface of the supporting colloid 2 departing from the substrate 11 is an arc surface, because the supporting colloid 2 is used for supporting the diffusion plate 300, the arrangement prevents the diffusion plate 300 from being scratched when the diffusion plate 300 is installed due to the fact that the supporting colloid 2 is provided with structures such as corners or convex ribs, and the like, and the reflectivity is affected.
In order to increase the light transmittance of the supporting colloid 2, the supporting colloid 2 is made of a transparent material, and in other embodiments, the material of the supporting colloid 2 may also be one of black, white and gray, which is not limited in this application.
The invention also provides a preparation method of the support 100, which aims to solve the problems in the prior art that under the condition of small OD, especially under the limit condition that the OD is not more than 5mm, the processing and the assembly of the small-size support 100 have more problems. Fig. 3 to 4 are a schematic process flow diagram and a schematic flow diagram of an embodiment of the supporting colloid preparation method.
Referring to fig. 3 and 4, in the technical solution provided by the present invention, a method for manufacturing the supporting member 100 includes:
step S10, providing a substrate 1;
step S30, coating glue on one side of the substrate 1, and solidifying for a first preset time to form a supporting colloid 2, so as to obtain the supporting member 100.
In the above preparation method, the substrate 1 is used as a carrier, one side of the substrate 1 is coated with glue, and the support colloid 2 is formed after a first preset time is solidified to obtain the support member 100, so that the support colloid 2 is simple to machine and form, the support colloids 2 with different heights can be machined according to needs, and the requirement of supporting the diffusion plate 300 when the backlight module 1000 has a small OD size can be met.
It should be noted that the substrate 1 is made of a circuit board, and in this way, a pad may be disposed on the substrate 1 to fix the substrate by welding, specifically, a plate of the circuit board may be one of FR-4, CEM-3, BT, and an aluminum substrate, which is not limited in this application.
It should be noted that, the material of the support colloid 2 has a lot, specifically, in the embodiment of this application, the support colloid 2 is silica gel or resin material, so set up, utilize silica gel with the resin material has better adsorptivity, is convenient for the support colloid 2 bonds and is fixed in the base plate 1.
Further, in step S30, the step of forming the support gel 2 during the first preset period of solidification to obtain the support 100 includes:
step S302, performing cutting processing on the substrate 1 coated with the glue for several times to obtain several sub-substrates a with glue, where the sub-substrates a are supporting pieces 100, and each sub-substrate a includes a base 11 and a supporting glue 2.
In the preparation method, after the glue is cured and formed, the substrate 1 after the glue is cured is cut by the cutting device to form a plurality of sub-substrates a with glue bodies, the sub-substrates a are the supporting piece 100, and the sub-substrates a comprise the base 11 and the supporting glue bodies 2, so that the supporting piece 100 is simple in processing and forming operation, namely the supporting glue bodies 2 with different heights can be processed by changing the thickness of the coated glue, and the production efficiency of the supporting piece 100 is greatly improved.
Specifically, the step of applying glue on one side of the substrate in step S30 includes:
step S301, coating a whole surface glue on one side surface of the substrate 1 or performing single-point dispensing on one side of the substrate 1.
In the steps, the whole glue is coated on one side surface of the substrate 1, so that the operation is simple and the gluing efficiency is high. And single-point glue dispensing is carried out on one side of the substrate 1, so that the glue consumption is saved.
Specifically, the step of step S30 before the step of applying glue on one side of the substrate 1 includes:
step S20 is to form a white ink layer on one side of the substrate 1.
In the above steps, a white ink layer is formed on one side of the substrate 1 to increase the reflectivity of the supporter 100.
The invention also provides a lamp panel assembly, which comprises a substrate 1, a plurality of light-emitting chips 600 and a plurality of supporting colloids 2, wherein the plurality of light-emitting chips 600 are arranged on one side surface of the substrate 1 at intervals, the plurality of supporting colloids 2 are arranged on one side surface of the substrate 1 with the light-emitting chips 600 at intervals, the light-emitting chips 600 and the supporting colloids 2 are arranged in such a way, the light-emitting chips 600 and the supporting colloids 2 are arranged in a plurality of groups, the brightness of a light source is ensured, and the supporting colloids 2 are arranged in a plurality of groups, so that the supporting diffusion plate 300 can be stabilized.
Referring to fig. 1 and 2, the surface of the light emitting chip 600 is coated with a colloid 700, so that the luminous flux of the light emitting chip 600 can be increased, and the effect is good.
It should be noted that, in the above preparation method, the first preset time period is a time period that satisfies the requirement of glue solidification, and the time period here may be adjusted as needed.
The invention also provides an assembling method of the lamp panel assembly, and fig. 5 is a flow diagram of an embodiment of the assembling method of the lamp panel assembly, which includes the following steps:
step S100, providing a substrate 1, wherein a plurality of first mounting areas and a plurality of second mounting areas are arranged on one side surface of the substrate 1 at intervals respectively;
step S200, providing a plurality of light-emitting chips 600, and fixing the plurality of light-emitting chips 600 in a plurality of first mounting areas;
step S300, glue is coated on the light-emitting chip 600 and the second mounting area, and the second preset time is solidified to obtain the packaged light source and the support colloid 2.
In the above assembling method, the plurality of light emitting chips 600 are fixed in the plurality of first mounting regions, the plurality of light emitting chips 600 and the plurality of second mounting regions are coated with glue, and the second preset time period is set to obtain the packaged light source and the support colloid 2, so that the luminous flux of the packaged light source is improved, the effect is good, the support colloid 2 obtained by coating the glue and setting the second preset time period meets the requirement of the backlight module 300 for supporting the diffusion plate 300 in a small OD size of 1000, and the processing of the support 100 in a small OD is simplified.
The first preset time and the second preset time can be equal or unequal, and can be specifically set according to specific working conditions so as to cure glue after coating or dispensing, and meet the requirement of existing rigidity.
It should be noted that, a side surface of the substrate 1 has a plurality of first mounting areas and a plurality of second mounting areas which are respectively arranged at intervals, and the manner that the plurality of first mounting areas and the plurality of second mounting areas are arranged at intervals is various, for example, the substrate 1 has two large areas, that is, a plurality of first mounting areas are located in one area and a plurality of second mounting areas are located in another area, wherein each first mounting area is arranged at intervals, each second mounting area is arranged at intervals, or a plurality of first mounting areas and a plurality of second mounting areas are alternately arranged at intervals on the substrate, which is not limited in the present application.
Further, in step S300, the performing glue coating on the plurality of light emitting chips 600 and the plurality of second mounting regions includes synchronously performing glue dispensing on the plurality of light emitting chips 600 and the plurality of second mounting regions.
In the above steps, the synchronous dispensing treatment of the light emitting chips 600 and the second mounting areas can be interpreted as dispensing a plurality of the light emitting chips 600 while the light emitting chips 600 are dispensed and packaged, so that the processing procedures are saved, the operation is simple, and the assembly efficiency of the lamp panel assembly is improved.
Specifically, base plate 1 is the circuit board, so set up, can realize emitting chip 600 with base plate 1's electricity is connected, has simplified the structure of lamp plate subassembly.
The invention further provides a backlight module, and fig. 1 to 2 are schematic structural views of an embodiment of the backlight module.
The backlight module 1000 includes a backplate 200, a diffuser plate 300 and a lamp panel assembly, the diffuser plate 300 and the backplate 200 are arranged at an interval, the lamp panel assembly is arranged between the backplate 200 and the diffuser plate 300, and the specific structure of the lamp panel assembly refers to the above embodiment, so that all the beneficial effects brought by the technical scheme of the above embodiment are achieved, and are not repeated here. One end of the supporting colloid 2 away from the substrate 1 abuts against the diffusion plate 300.
In the technical scheme provided by the invention, the lamp panel assembly comprises a substrate 1, a plurality of light emitting chips 600 and a plurality of supporting colloids 2, the plurality of supporting colloids 2 are arranged on one side surface of the substrate 1 with the light emitting chips 600 at intervals, and one ends of the plurality of supporting colloids 2 far away from the substrate 1 are abutted to the diffusion plate 300, so that the size of the supporting colloids 2 can be processed to be small enough and easy to process, the requirement of supporting the diffusion plate 300 when the backlight module 1000 is in a small OD size is met, the diffusion plate 300 is supported by the plurality of supporting colloids 2, and the processing of the small OD lower supporting piece 100 is simplified.
Referring to fig. 1 and 2, the surface of the back plate 200 facing the diffusion plate 300 is provided with a reflective sheet 500, so that the light emitted from the light emitting chips 600 and the diffusion plate 300 can be reflected to the diffusion plate 300 by the reflective sheet 500, which is good.
The present invention further provides an assembling method of a backlight module, and fig. 6 is a schematic flow chart of an embodiment of the assembling method of the backlight module, including the following steps:
step S1000, providing a backboard 200;
step S2000, providing the lamp panel assembly as described above, where the lamp panel assembly adopts all technical solutions of all the embodiments described above, so that the lamp panel assembly at least has all the beneficial effects brought by the technical solutions of the embodiments described above, and the lamp panel assembly is installed on the backplane 1 without being described in detail herein;
step S3000, providing a diffusion plate 300, and placing the diffusion plate 300 on a side of the support colloid 2 away from the backplate 200.
In the above assembling method, the lamp panel assembly is mounted to the backplane 200, the diffusion plate 300 is disposed on one side of the support colloid 2 away from the backplane 200, and the diffusion plate 300 is supported by the support colloids 2, so that the backlight module 1000 is assembled, the operation is simple, the requirement of supporting the diffusion plate 300 when the backlight module 1000 has a small OD size is met, and the processing of the support 100 under a small OD is simplified.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents made by the contents of the present specification and drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (12)
1. A support member for a backlight module, comprising:
a substrate;
and the supporting colloid is arranged on one side surface of the substrate.
2. A support according to claim 1, wherein the base is provided with white ink adjacent to the mounting surface of the support gel.
3. The support member according to claim 2, wherein the substrate is a circuit board, and a bottom of the circuit board is provided with a pad; and/or the presence of a gas in the gas,
one surface of the support colloid, which is deviated from the substrate, is a spherical surface.
4. The supporting member according to claim 1, wherein the supporting colloid is made of silica gel or resin; and/or the presence of a gas in the gas,
the supporting colloid is cubic, and the surface of the supporting colloid, which is far away from the substrate, is an arc surface; and/or the presence of a gas in the gas,
the supporting colloid is made of transparent materials.
5. A method for preparing a support member, comprising the steps of:
providing a substrate;
and coating glue on one side surface of the substrate, and solidifying for a first preset time to form a support colloid to obtain the support piece.
6. The method for preparing a ceramic support according to claim 5, wherein the step of forming a support gel after the first preset time period of solidification to obtain a support comprises:
and cutting the substrate coated with the glue for a plurality of times to obtain a plurality of sub-substrates with glue, wherein the sub-substrates are supporting pieces and comprise bases and supporting glue.
7. The method according to claim 5, wherein the step of applying the glue to the one side of the substrate comprises forming a white ink layer on one side of the substrate; and/or the presence of a gas in the gas,
the step of coating glue on one side of the substrate comprises coating whole glue on one side of the substrate or performing single-point glue dispensing on one side of the substrate; and/or
The substrate is a circuit board; and/or the presence of a gas in the gas,
the glue is silica gel or resin.
8. The utility model provides a lamp plate subassembly which characterized in that includes:
a substrate;
the light-emitting chips are arranged on one side surface of the substrate at intervals;
and the plurality of supporting colloids are arranged on one side surface of the substrate, which is provided with the light-emitting chip, at intervals.
9. A backlight module, comprising:
a back plate;
the diffusion plate is arranged opposite to the back plate at intervals; and the number of the first and second groups,
the lamp panel assembly of claim 8, wherein the support gel is disposed between the housing and the diffuser plate, and ends of the support gel away from the substrate abut against the diffuser plate.
10. The assembling method of the lamp panel assembly is characterized by comprising the following steps of:
providing a substrate, wherein one side surface of the substrate is provided with a plurality of first mounting areas and a plurality of second mounting areas which are arranged at intervals respectively;
providing a plurality of light-emitting chips, and fixing the light-emitting chips in the first mounting areas;
and coating glue on the light-emitting chip and the second mounting area, and solidifying for a second preset time to obtain the packaged light source and the support colloid.
11. The assembly method of claim 10, wherein the applying glue to the light emitting chip and the second mounting region comprises synchronously dispensing the light emitting chip and the second mounting region; and/or the presence of a gas in the gas,
the substrate is a circuit board.
12. The assembling method of the backlight module is characterized by comprising the following steps:
providing a back plate;
providing a light panel assembly as claimed in claim 10 or 11, mounting the light panel assembly to the back panel;
and providing a diffusion plate, and placing the diffusion plate on one side of the support colloid, which is far away from the backboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011167897.9A CN112213886A (en) | 2020-10-27 | 2020-10-27 | Support piece, preparation method, lamp panel assembly, backlight module and assembly method |
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| CN202011167897.9A CN112213886A (en) | 2020-10-27 | 2020-10-27 | Support piece, preparation method, lamp panel assembly, backlight module and assembly method |
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| CN202011167897.9A Pending CN112213886A (en) | 2020-10-27 | 2020-10-27 | Support piece, preparation method, lamp panel assembly, backlight module and assembly method |
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Application publication date: 20210112 |