CN112207085A - Belt cleaning device is used in production of chip wafer - Google Patents
Belt cleaning device is used in production of chip wafer Download PDFInfo
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- CN112207085A CN112207085A CN202011005279.4A CN202011005279A CN112207085A CN 112207085 A CN112207085 A CN 112207085A CN 202011005279 A CN202011005279 A CN 202011005279A CN 112207085 A CN112207085 A CN 112207085A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 55
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 241001233242 Lontra Species 0.000 claims description 7
- 230000003068 static effect Effects 0.000 abstract description 13
- 230000005611 electricity Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 7
- 238000005192 partition Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
- B08B3/123—Cleaning travelling work, e.g. webs, articles on a conveyor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/04—Carrying-off electrostatic charges by means of spark gaps or other discharge devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a cleaning device for chip wafer production, which comprises a device main body, wherein an air pump is arranged on the outer surface of the side end of the device main body, a water pump is arranged on the side end of the air pump, a cleaning liquid box is arranged on the outer surface of the side end of the water pump, a cover plate is arranged on the outer surface of the upper end of the device main body, a hinge is arranged at the joint of the device main body and the cover plate, and a handle is arranged on the outer surface of the front end of the cover plate. According to the cleaning device for producing the chip wafer, the upper end of the telescopic rod can be adjusted according to the size of the chip through the matching of the fixed rod, the telescopic rod and the clamp, the chip can be stably fixed on the metal screen plate through the matching of the crossed fixed rod and the clamp, the limitation of the device main body is reduced, and through the matching of the sealing plate, the second groove and the ion wind rod, static electricity in the device main body can be removed before the device main body runs, so that the chip is prevented from being damaged by the static electricity.
Description
Technical Field
The invention relates to the field of chip wafer cleaning, in particular to a cleaning device for chip wafer production.
Background
In the chip production process, need to wash the wafer on chip surface, this just needs to use chip wafer belt cleaning device, current patent publication CN209663875U, CN211160813U wafer belt cleaning device is when using, still have certain drawback, firstly, current wafer belt cleaning device is fixing the chip on metal otter board structure comparatively simple, fixed not inseparable enough, lead to the phenomenon that can appear breaking away from the metal otter board in the cleaning process, and it is great to the size limitation of wasing the chip, secondly, current chip wafer belt cleaning device is when using, for considering the influence of the inside static that exists of device main part to the chip, for this reason, we have proposed a cleaning device for chip wafer production.
Disclosure of Invention
The invention mainly aims to provide a cleaning device for chip wafer production, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a belt cleaning device is used in production of chip wafer, includes the device main part, the side surface of device main part is provided with the air pump, the side of air pump is provided with the water pump, the side surface of water pump is provided with the cleaning solution case, the upper end surface of device main part is provided with the apron, the junction of device main part and apron is provided with the hinge, the front end surface of apron is provided with the handle, control panel has been inlayed to the upper end surface of apron, control panel's side is provided with a recess, the upper end of a recess is provided with spacing.
Preferably, the lower extreme fixed mounting of air pump has the fixed plate, the side of fixed plate is fixed to be inlayed in the inboard of device main part, be provided with the breather pipe between device main part and the air pump, the right side end of breather pipe is fixed to be inlayed in the inboard of air pump, the inboard fixed mounting of device main part has the baffle, the inboard fixed mounting of baffle has the air inlet plate, the left side end of breather pipe runs through in device main part and baffle, and fixed the inboard of inlaying in the air inlet plate.
By adopting the technical scheme, the following technical effects can be achieved: the air pump inflates air into the air inlet plate through the vent pipe.
Preferably, the lower extreme of air inlet plate corresponds the inboard fixed mounting of device main part and has supersonic generator, the junction of water pump and device main part is provided with the water pipe, the right side end fixed of water pipe inlays in the inboard of water pump, the right side end of connecting the water pipe runs through in device main part and baffle, fixed mounting has the water pipe between water pump and the cleaning solution case, control panel fixed inlays in the inboard of apron, the inboard surface that corresponds the baffle of device main part is provided with the motor.
By adopting the technical scheme, the following technical effects can be achieved: ultrasonic waves generated by the ultrasonic generator can clean up dirt on the wafer when the wafer is cleaned.
Preferably, the quantity of motor is two sets of, and is the symmetry and arranges, the lower extreme fixed mounting of motor has the fixed plate, the fixed plate inlays in the inboard of baffle and device main part, the inboard fixed mounting of metal mesh board has the connecting axle, the side all runs through in the baffle about the connecting axle, and fixed the inboard that inlays in the motor, the upper end of air inlet plate is provided with a plurality of gas pocket, and is the rectangle array and arranges.
By adopting the technical scheme, the following technical effects can be achieved: the motors which are symmetrically arranged can drive the metal screen plate to rotate through the connecting shaft, and the metal screen plate drives the chip wafer to rotate and clean in the cleaning liquid, so that the cleaning work efficiency is improved.
Preferably, the upper end of metal otter board is provided with the dead lever, the side all inlays in the telescopic link about the dead lever, the lower extreme fixed mounting of telescopic link has anchor clamps, the upper end surface of metal otter board is provided with a plurality of meshes, and the rectangular array arranges, anchor clamps and the mutual gomphosis of mesh, the inboard fixed mounting that the lower extreme of spacing frame corresponds a recess has the bracing piece, the fixed closing plate that is provided with of lower extreme of bracing piece.
By adopting the technical scheme, the following technical effects can be achieved: the length of the telescopic rods at the two ends of the fixing rod can be changed according to the size of the chip, so that the clamp is embedded in the inner side of the mesh, and the chip is tightly connected with the metal mesh plate.
Preferably, the inner side of the cover plate is provided with a groove, the groove is internally and fixedly provided with an ion wind rod, the lower end of the groove is provided with a second groove, the second groove is embedded with the sealing plate, the number of the support rods and the number of the first grooves are two, the support rods and the first grooves are arranged in a symmetrical relationship, and the support rods and the first grooves are embedded with each other.
By adopting the technical scheme, the following technical effects can be achieved: static electricity in the device main body can be removed through the ion air bar, and cleaning liquid is prevented from splashing on the ion air bar when the device main body runs through the embedding of the sealing plate and the second groove.
Compared with the prior art, the invention has the following beneficial effects: when the cleaning device for chip wafer production is used, a user can stretch the telescopic rods at the two ends of the fixed rods according to the size of a chip, the user can place the two fixed rods in a crossed manner, then the clamp is embedded in the inner sides of meshes to fix the chip, the user can enable the ion wind rod to operate through the control panel to remove static electricity in the main body of the device and prevent the static electricity from damaging the chip, when the wafer at the upper end of the chip is cleaned, the user enables the water pump to suck cleaning liquid in the cleaning liquid box to enter the main body of the device and the inner parts of the partition plates through the control panel, the suction can be stopped when the cleaning liquid overflows the metal mesh plate, the cover plate is closed with the main body of the device through the handle, the user enables the limiting frame to slide in the second groove through the sealing plate connected with the supporting rod by pushing the limiting frame, the ion wind rod is sealed in, in the cleaning process, the user makes supersonic generator produce the ultrasonic wave through control panel, under the effect of ultrasonic wave, can make the dirt on wafer surface break away from fast, cooperation through motor and connecting axle, can make the metal mesh board rotate in the washing liquid and wash, the cleaning efficiency is improved, cooperation through dead lever and telescopic link and anchor clamps, can adjust the upper end of telescopic link according to the size of chip size, cooperation through criss-cross dead lever and anchor clamps can make the chip stable fix on the metal mesh board, and reduce the limitation of device main part, cooperation through closing plate and No. two recesses and ion wind stick, can clear away the inside static of device main part before the device main part operation, prevent that static from causing the damage to the chip.
Drawings
FIG. 1 is a schematic view of the overall structure of a cleaning device for producing a chip wafer according to the present invention;
FIG. 2 is a cross-sectional view of a cleaning apparatus for producing a chip wafer according to the present invention;
FIG. 3 is a schematic structural view of an ion wind rod of the cleaning device for producing a chip wafer according to the present invention;
FIG. 4 is a top view of a cleaning apparatus for producing a chip wafer according to the present invention;
fig. 5 is a schematic diagram of a fixing rod structure of the cleaning device for producing the chip wafer.
In the figure: 1. a device main body; 2. an air pump; 3. a water pump; 4. a cleaning solution tank; 5. a hinge; 6. a first groove; 7. a limiting frame; 8. a handle; 9. a cover plate; 10. a control panel; 11. an air intake plate; 12. an ultrasonic generator; 13. a motor; 14. a partition plate; 15. a metal mesh plate; 16. fixing the rod; 17. a telescopic rod; 18. a clamp; 19. an ion wind rod; 20. a support bar; 21. a sealing plate; 22. groove II.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
The first embodiment is as follows:
as shown in fig. 1, 2 and 3, a cleaning device for chip wafer production comprises a device main body 1, an air pump 2 is arranged on the outer surface of the side end of the device main body 1, a water pump 3 is arranged on the side end of the air pump 2, the water pump 3 is WQ, a cleaning liquid tank 4 is arranged on the outer surface of the side end of the water pump 3, a cover plate 9 is arranged on the outer surface of the upper end of the device main body 1, a hinge 5 is arranged at the joint of the device main body 1 and the cover plate 9, a handle 8 is arranged on the outer surface of the front end of the cover plate 9, a control panel 10 is embedded on the outer surface of the upper end of the cover plate 9, a first groove 6 is arranged on the side end of the control panel 10, a limit frame 7 is arranged on the upper end of the first groove 6, a fixing plate is fixedly installed on the lower end of the air pump, a baffle plate 14 is fixedly arranged on the inner side of the device main body 1, an air inlet plate 11 is fixedly arranged on the inner side of the baffle plate 14, the left end of the air pipe penetrates through the device main body 1 and the baffle plate 14 and is fixedly embedded on the inner side of the air inlet plate 11, the air pump 2 inflates air into the air inlet plate 11 through the air pipe, an ultrasonic generator 12 is fixedly arranged at the lower end of the air inlet plate 11 corresponding to the inner side of the device main body 1, the model of the ultrasonic generator 12 is JP-1072I, a water pipe is arranged at the joint of the water pump 3 and the device main body 1, the right end of the water pipe is fixedly embedded on the inner side of the water pump 3, the right end of the water pipe penetrates through the device main body 1 and the baffle plate 14, the water pipe is fixedly arranged between the water pump 3 and the cleaning liquid tank 4, the control panel 10 is fixedly embedded on, the ultrasonic wave generated by the ultrasonic generator 12 can clean the dirt on the wafer when the wafer is cleaned.
Example two:
on the basis of the first embodiment, as shown in fig. 1, 4, and 5, the number of the motors 13 is two, and the motors are symmetrically arranged, a fixing plate is fixedly installed at the lower end of each motor 13, the fixing plate is embedded in the inner sides of the partition plate 14 and the device body 1, a connecting shaft is fixedly installed at the inner side of the metal mesh plate 15, the left and right side ends of the connecting shaft both penetrate through the partition plate 14 and are fixedly embedded in the inner side of the motor 13, a plurality of air holes are formed at the upper end of the air inlet plate 11, and the air holes are arranged in a rectangular array, the symmetrically arranged motors 13 can drive the metal mesh plate 15 to rotate through the connecting shaft, the metal mesh plate 15 drives the chip wafer to rotate and clean in the cleaning solution, the cleaning efficiency is improved, a fixing rod 16 is arranged at the upper end of the metal mesh plate 15, the left and right side ends of, the rectangular array is arranged, the clamps 18 are mutually embedded with meshes, the lower end of the limiting frame 7 is fixedly provided with a support rod 20 corresponding to the inner side of the first groove 6, the lower end of the support rod 20 is fixedly provided with a sealing plate 21, the length of the telescopic rods 17 at the two ends of the fixing rod 16 can be changed according to the size of the chip, the clamps 18 are embedded in the inner side of the meshes, so that the chip is tightly connected with the metal mesh plate 15, the inner side of the cover plate 9 is provided with grooves, the grooves are internally and fixedly provided with ion wind rods 19, the lower ends of the grooves are provided with second grooves 22, the second grooves 22 are mutually embedded with the sealing plate 21, the support rods 20 and the first grooves 6 are respectively arranged in two groups and are in a symmetrical relation, the support rods 20 and the first grooves 6 are mutually embedded, the static electricity in the device main body 1 can be removed through the ion wind, the cleaning liquid is prevented from splashing on the ion wind rod 19.
It should be noted that the invention is a cleaning device for producing a chip wafer, a user can stretch the telescopic rods 17 at the two ends of the fixed rods 16 according to the size of the chip, the user can place the two fixed rods 16 in a crossed manner, then embed the clamp 18 in the inner side of the mesh to fix the chip, the user can operate the ion air bar 19 through the control panel 10 to remove static electricity inside the device main body 1 and prevent the static electricity from damaging the chip, when cleaning the wafer at the upper end of the chip, the user can make the water pump 3 suck cleaning liquid in the cleaning liquid tank 4 through the control panel 10 and enter the device main body 1 and the partition plate 14, the suction can be stopped when the cleaning liquid overflows the metal mesh plate 15, the user closes the cover plate 9 and the device main body 1 through the handle 8, the user can make the limiting frame 7 slide in the second groove 22 through the sealing plate 21 connected with the supporting rod 20 by pushing the limiting frame 7, the ion wind rod 19 is sealed in the groove, cleaning liquid is prevented from splashing to the upper end of the ion wind rod 19 when the device main body 1 runs, a user enables the ultrasonic generator 12 to generate ultrasonic waves through the control panel 10 in the cleaning process, dirt on the surface of a wafer can be quickly separated under the action of the ultrasonic waves, the metal mesh plate 15 can be rotated and cleaned in the cleaning liquid through the matching of the motor 13 and the connecting shaft, the cleaning efficiency is improved, the upper end of the telescopic rod 17 can be adjusted according to the size of a chip through the matching of the fixed rod 16, the chip can be stably fixed on the metal mesh plate 15 through the matching of the crossed fixed rod 16 and the clamp 18, the limitation of the device main body 1 is reduced, and static electricity in the device main body 1 can be removed before the device main body 1 runs through the matching of the sealing plate 21, the second groove 22 and the ion wind rod 19, prevent that static from causing the damage to the chip, comparatively use.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a belt cleaning device is used in production of chip wafer, includes device main part (1), its characterized in that: the device is characterized in that an air pump (2) is arranged on the outer surface of the side end of the device main body (1), a water pump (3) is arranged on the side end of the air pump (2), a cleaning liquid box (4) is arranged on the outer surface of the side end of the water pump (3), an cover plate (9) is arranged on the outer surface of the upper end of the device main body (1), a hinge (5) is arranged at the joint of the device main body (1) and the cover plate (9), a handle (8) is arranged on the outer surface of the front end of the cover plate (9), a control panel (10) is embedded on the outer surface of the upper end of the cover plate (9), a first groove (6) is formed in the side end of the control panel.
2. The cleaning device for chip wafer production according to claim 1, wherein: the lower extreme fixed mounting of air pump (2) has the fixed plate, the side of fixed plate is fixed to be inlayed in the inboard of device main part (1), be provided with the breather pipe between device main part (1) and air pump (2), the right side end of breather pipe is fixed to be inlayed in the inboard of air pump (2), the inboard fixed mounting of device main part (1) has baffle (14), the inboard fixed mounting of baffle (14) has air inlet plate (11), the left side end of breather pipe runs through in device main part (1) and baffle (14), and fixed the inboard of inlaying in air inlet plate (11).
3. The cleaning device for chip wafer production according to claim 1, wherein: the lower extreme of air inlet plate (11) corresponds inboard fixed mounting of device main part (1) has supersonic generator (12), the junction of water pump (3) and device main part (1) is provided with the water pipe, the right side end of water pipe is fixed to be embedded in the inboard of water pump (3), the right side end of connecting the water pipe runs through in device main part (1) and baffle (14), fixed mounting has the water pipe between water pump (3) and cleaning solution case (4), control panel (10) are fixed to be embedded in the inboard of apron (9), the surface that the inboard of device main part (1) corresponds baffle (14) is provided with motor (13).
4. The cleaning device for chip wafer production according to claim 1, wherein: the quantity of motor (13) is two sets of, and is the symmetry and arranges, the lower extreme fixed mounting of motor (13) has the fixed plate, the fixed plate inlays in the inboard of baffle (14) and device main part (1), the inboard fixed mounting of metal otter board (15) has the connecting axle, the side all runs through in baffle (14) about the connecting axle, and fixed the inboard that inlays in motor (13), the upper end of air inlet plate (11) is provided with a plurality of gas pocket, and is the rectangle array and arranges.
5. The cleaning device for chip wafer production according to claim 1, wherein: the upper end of metal otter board (15) is provided with dead lever (16), the side all inlays in telescopic link (17) about dead lever (16), the lower extreme fixed mounting of telescopic link (17) has anchor clamps (18), the upper end surface of metal otter board (15) is provided with a plurality of meshes, and the rectangular array arranges, anchor clamps (18) and the mutual gomphosis of mesh, the inboard fixed mounting that the lower extreme of spacing (7) corresponds recess (6) has bracing piece (20), the fixed closing plate (21) that is provided with of lower extreme of bracing piece (20).
6. The cleaning device for chip wafer production according to claim 1, wherein: the utility model discloses a sealing structure, including apron (9), recess, bracing piece (20) and recess (6), the inboard of apron (9) is provided with the recess, the recess internal fixation is provided with ion wind stick (19), the lower extreme of recess is provided with No. two recesses (22), No. two recesses (22) and closing plate (21) gomphosis each other, the quantity of bracing piece (20) and recess (6) is two sets of, and is the symmetrical relation and arranges, bracing piece (20) and recess (6) gomphosis each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011005279.4A CN112207085A (en) | 2020-09-23 | 2020-09-23 | Belt cleaning device is used in production of chip wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011005279.4A CN112207085A (en) | 2020-09-23 | 2020-09-23 | Belt cleaning device is used in production of chip wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112207085A true CN112207085A (en) | 2021-01-12 |
Family
ID=74049842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011005279.4A Pending CN112207085A (en) | 2020-09-23 | 2020-09-23 | Belt cleaning device is used in production of chip wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112207085A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735995A (en) * | 2021-04-06 | 2021-04-30 | 亚电科技南京有限公司 | Cleaning device and method for semiconductor wafer based on ultrasonic vibration type processing |
| CN113976520A (en) * | 2021-11-26 | 2022-01-28 | 强一半导体(上海)有限公司 | 3DMEMS probe cleaning device, key structure and cleaning method |
| WO2023246394A1 (en) * | 2022-06-23 | 2023-12-28 | 盛美半导体设备(上海)股份有限公司 | Substrate processing apparatus |
-
2020
- 2020-09-23 CN CN202011005279.4A patent/CN112207085A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112735995A (en) * | 2021-04-06 | 2021-04-30 | 亚电科技南京有限公司 | Cleaning device and method for semiconductor wafer based on ultrasonic vibration type processing |
| CN112735995B (en) * | 2021-04-06 | 2021-06-04 | 亚电科技南京有限公司 | Cleaning device and method for semiconductor wafer based on ultrasonic vibration type processing |
| CN113976520A (en) * | 2021-11-26 | 2022-01-28 | 强一半导体(上海)有限公司 | 3DMEMS probe cleaning device, key structure and cleaning method |
| CN113976520B (en) * | 2021-11-26 | 2022-12-20 | 强一半导体(上海)有限公司 | 3DMEMS probe belt cleaning device |
| WO2023246394A1 (en) * | 2022-06-23 | 2023-12-28 | 盛美半导体设备(上海)股份有限公司 | Substrate processing apparatus |
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| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210112 |
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| WD01 | Invention patent application deemed withdrawn after publication |