CN112203475A - Heat radiator for integrated circuit board - Google Patents
Heat radiator for integrated circuit board Download PDFInfo
- Publication number
- CN112203475A CN112203475A CN202011080587.3A CN202011080587A CN112203475A CN 112203475 A CN112203475 A CN 112203475A CN 202011080587 A CN202011080587 A CN 202011080587A CN 112203475 A CN112203475 A CN 112203475A
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- CN
- China
- Prior art keywords
- circuit board
- plate
- integrated circuit
- mounting seat
- cavity
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat dissipation device of an integrated circuit board, which comprises a mounting seat, a butt joint plate mechanism, a rotating rod mechanism and a turning rod mechanism, wherein a rear supporting plate is arranged on the rear side of the mounting seat, and a front supporting plate is arranged on the front side of the mounting seat; the bottom of mount pad is provided with the bottom chamber, two fans are still installed to the bottom chamber, and during fan circular telegram work, the gas of production is upwards discharged by the gas pocket, preceding fagging is fixed in on the mount pad, and just is located the top of right side fan, preceding fagging includes swash plate, gas collection chamber and drainage chamber, on the mount pad was fixed in to the swash plate, on the gas collection chamber was fixed in the swash plate, the circuit board mounting means of this structure was more nimble to adopt double fan formula structure to just in time be located its bottom, can form large tracts of land nature's heat dissipation, the dust that produces after the heat dissipation blocks in the circuit board bottom side, is convenient for these dust regular clearance that block according to its pendulum characteristic of changeing, collects effective heat dissipation and the dust clearance of being convenient for in an.
Description
Technical Field
The invention relates to the technical field of heat dissipation plates, in particular to a heat dissipation device of an integrated circuit board.
Background
The integrated circuit adopts an integrated technology, and is fixed on the PCB circuit board through all element devices, and the electrified current collection circuit board has the advantages that when the integrated circuit is actually used, the elements mounted on the integrated circuit board can generate high heat, so that the heat of the whole integrated circuit board is too high, peculiar smell is generated, the service life of the integrated circuit board is influenced, and therefore, in the actual mounting process, a fan needs to be additionally arranged at the bottom of the integrated circuit board, and the purposes of heat dissipation and temperature reduction are achieved.
However, the inventor found that, when the circuit board with the fan-type cooling structure is actually used, the integrated circuit board is mounted on the fixing base in a compact manner, although the size of the circuit board can be reduced, a large amount of dust is formed at the bottom of the circuit board due to the existence of the fan, the circuit board is not easy to clean, and the heat dissipation fan mostly blows upwards from the bottom to dissipate heat, so that the heat dissipation manner is single, and the heat dissipation effect is poor.
Disclosure of Invention
Based on the structure, the invention provides the heat dissipation device of the integrated circuit board, the air blown out by the heat dissipation fan is guided to the bottom of the circuit board in a diversion mode, the heat dissipation performance is improved, and the circuit board is installed on the installation seat in a switching mode, so that the dust at the bottom of the circuit board can be cleaned regularly, and the structure is more reasonable.
In order to achieve the purpose, the invention provides the following technical scheme:
a heat dissipation device of an integrated circuit board comprises a mounting seat, a butt plate mechanism, a rotating rod mechanism and a turning rod mechanism, wherein a rear supporting plate is mounted on the rear side of the mounting seat, and a front supporting plate is mounted on the front side of the mounting seat;
the bottom of the mounting seat is provided with a bottom cavity, the top of the bottom cavity is provided with an air hole, two fans are further mounted in the bottom cavity, when the fans are powered on to work, generated air is discharged upwards through the air hole, the front supporting plate is fixed on the mounting seat and is positioned right at the top of the right fan, the front supporting plate comprises an inclined plate, an air collecting cavity and a drainage cavity, the inclined plate is fixed on the mounting seat, the air collecting cavity is fixed on the inclined plate, the drainage cavity is arranged at the top of the inclined plate, the air collecting cavity is communicated with the drainage cavity, a cavity opening of the air collecting cavity is arranged downwards, the air sprayed upwards by the right fan is introduced into the air collecting cavity, and the air is led upwards through the drainage cavity;
a row of rotating grooves are formed in the rear supporting plate, a butt plate mechanism is installed in each rotating groove through a rotating shaft, and circuit boards are installed on the butt plate mechanism and the front supporting plate together;
the left side and the right side of the mounting seat are provided with slideways, rotating rod mechanisms are arranged in the slideways, the middle of each rotating rod mechanism is provided with a turning rod mechanism, and when the rotating rod mechanisms rotate, the rotating rod mechanisms are driven to push the circuit board to upwards turn through the butt plate mechanisms.
Preferably, the method comprises the following steps: the butt plate mechanism comprises a butt plate and a butt plate inner side chamfer design, the butt plate and the butt plate inner side chamfer design are arranged in the rotary groove through a damping type rotating shaft, radiating fins are arranged on chamfer faces, and butt-mounting holes used for fixing a circuit board are formed in the outer side face of the butt plate.
Preferably, the method comprises the following steps: the rotating rod mechanism comprises a displacement block sliding in the slide way and a rotating rod penetrating in the two displacement blocks through bearings, and a hand wheel is mounted at the outer end of the rotating rod.
Preferably, the method comprises the following steps: the turning rod mechanism is arranged in the middle of the rotating rod and comprises a spring plate arranged on the rotating rod, a bent plate is arranged at the inner end of the spring plate, and the bent plate is supported on the bottom surface of the circuit board.
Preferably, the method comprises the following steps: the outer wall of bent plate is provided with spacing strip, and the bottom surface of circuit board is provided with the V-arrangement groove that forms antiskid nature contact with spacing strip.
Preferably, the method comprises the following steps: the bottom surface of the circuit board is provided with a rubber sleeve, and the bent plate is inserted into the rubber sleeve.
Preferably, the method comprises the following steps: the spring plate is arranged in a front inclined mode, the bottom surface of the spring plate is provided with a sweeping strip, and the sweeping strip is in contact with the top surface of the mounting seat.
Preferably, the method comprises the following steps: the two fans are both in an inward and downward inclined design, and the two fans are positioned at the bottoms of the air holes.
Compared with the prior art, the invention has the following beneficial effects:
1. be provided with the mount pad of L shape, both sides are provided with preceding fagging and back fagging respectively around the mount pad, three buttjunction boards are installed through the rotary trough to back fagging, it is fixed with the integrated circuit board to utilize three buttjunction boards, make integrated circuit board have the rotating characteristic, when making the circuit board regularly clear up the dust, can upwards rotate, make the dust of its bottom surface adhesion be convenient for clear up, consequently, the circuit board mounting means of this structure is more nimble, and adopt double fan formula structure to be located its bottom just in time, can form the heat dissipation of large tracts of land nature, the dust that produces after the heat dissipation blocks at the circuit board bottom side, the dust that is convenient for these to block according to its pendulum characteristic is regularly cleared up, collect effective heat dissipation and be convenient for dust clearance in an.
2. Preceding fagging bottom is provided with the gas collection chamber, the gas collection chamber is just detained in the mount pad top, and the fan is installed to the mount pad bottom, therefore the gas collection chamber is just to the fan top, when the fan circular telegram was carminative from this, can be with partial gas in the drainage chamber of fagging before introducing from the gas collection chamber, because this drainage chamber top supports the circuit board, consequently, the gas of fagging bottom before leading is led by the drainage chamber, be the mode that the fore-and-aft direction flowed in, fagging cooling before can be faster, and will fall to adorn in the circuit board cooling treatment at drainage chamber top simultaneously, accelerate cooling rate, and the service.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the disassembled structure of the present invention;
FIG. 3 is an enlarged partial schematic view taken from section A of FIG. 2 for viewing the docking plate mechanism in accordance with the present invention;
FIG. 4 is a schematic view of the circuit board of FIG. 2 with the internal structure removed for viewing in accordance with the present invention;
FIG. 5 is a schematic structural view of a front view plane for viewing two fans in an interior-down inclined design according to the present invention;
FIG. 6 is a schematic view of the installation position and structure of the rotating rod mechanism and the tilting rod mechanism viewed from the side plane direction according to the present invention;
FIG. 7 is a schematic view of two specific fan positions viewed from a bottom perspective of the present invention;
fig. 8 is a schematic view of the installation principle and structure of the butt plate mechanism of the present invention.
Description of the main reference numerals:
1. a mounting seat; 101. a bottom cavity; 102. air holes; 103. a slideway; 2. a rear supporting plate; 201. rotating the groove; 3. a front supporting plate; 301. a sloping plate; 302. a gas collection cavity; 303. a drainage lumen; 4. a butt plate mechanism; 401. a butt plate; 402. a heat sink; 403. assembling holes; 5. a fan; 6. a rotating rod mechanism; 601. a displacement block; 602. a rotating rod; 603. a hand wheel; 7. a circuit board; 701. a V-shaped groove; 702. a rubber sleeve; 8. a rod-turning mechanism; 801. a spring plate; 802. bending a plate; 803. a limiting strip; 804. and (6) sweeping the strips.
Detailed Description
The technical solutions of the present invention will be described in detail and fully with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments, but not all embodiments, of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the orientations or positional relationships indicated as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., appear based on the orientations or positional relationships shown in the drawings only for the convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be specifically understood by those skilled in the art.
Referring to fig. 1-8, a heat dissipation device for an integrated circuit board comprises a mounting base 1, a butt plate mechanism 4, a rotating rod mechanism 6 and a turning rod mechanism 8, wherein a rear supporting plate 2 is mounted on the rear side of the mounting base 1, and a front supporting plate 3 is mounted on the front side of the mounting base 1;
the bottom of the mounting seat 1 is provided with a bottom cavity 101, the top of the bottom cavity 101 is provided with air holes 102, two fans 5 are further arranged in the bottom cavity 101, when the fans 5 are powered on to work, generated gas is upwards discharged through the air holes 102 to realize heat dissipation of the whole integrated circuit during working, the integrated circuit is similar to an existing computer display card, the arranged front supporting plate 3 is fixed on the mounting seat 1 and is positioned at the top of the right fan 5, the front supporting plate 3 comprises an inclined plate 301, a gas collecting cavity 302 and a drainage cavity 303, the inclined plate 301 is fixed on the mounting seat 1, the gas collecting cavity 302 is fixed on the inclined plate 301, the drainage cavity 303 is arranged at the top of the inclined plate 301 and is used for mounting a circuit board 7, the gas collecting cavity 302 is communicated with the drainage cavity 303, gas upwards sprayed by the right fan 5 is introduced into the gas collecting cavity 302 and upwards guided out by the drainage cavity 303, because the front part of the circuit board 7 is placed on the top surface of, therefore, the heat dissipation air generated by the right fan 5 during operation can be directly guided to the circuit board 7, the circuit board 7 can not only receive the upward air flow discharged by the bottom fan 5 to dissipate heat, but also can receive the air flow in the transverse direction led out by the drainage cavity 303 to dissipate heat, the heat dissipation speed of the circuit board 7 is accelerated, the heat dissipation efficiency is improved, the structural reasonability of the front supporting plate 3 is greatly improved, the two fans 5 are in the inner-lower inclined design, the two fans 5 are positioned at the bottom of the air hole 102, the downward leaking dust can fall on the fans 5 and then slide out from the inclined surfaces of the fans 5, the sliding speed is accelerated under the air blowing action of the fans 5, and the installation mode of the fans 5 is more reasonable.
As shown in fig. 2, 6, 7 and 8, a row of rotating slots 201 are formed on the rear supporting plate 2, the butt plate mechanism 4 is installed in the rotating slots 201 through a rotating shaft, the butt plate mechanism 4 and the front supporting plate 3 are jointly provided with a circuit board 7, wherein the rear side of the circuit board 7 is arranged on the butt plate mechanism 4, can swing upwards along with the butt joint plate mechanism 4, the front side of the circuit board 7 is directly lapped on the front supporting plate 3, that is, the front support plate 3 supports the circuit board 7, not fixedly, and thus, it can be seen that the circuit board 7 for mounting the integrated circuit has a turning characteristic capable of being rotated upward, after the circuit board 7 is reset downwards, the support is dropped through the butt plate mechanism 4, so when the dust in the bottom area of the circuit board 7 needs to be cleaned, the circuit board 7 is only required to be swung upwards to enable the bottom surface of the circuit board to be leaked, dust can be cleaned quickly, and the flexibility and practicability of the circuit board 7 are improved.
As shown in fig. 2, 4 and 6, the left and right sides of the mounting base 1 are provided with slideways 103, the slideways 103 are provided with rotating rod mechanisms 6, the middle parts of the rotating rod mechanisms 6 are provided with turnover rod mechanisms 8, when the rotating rod mechanisms 6 rotate, the turnover rod mechanisms 8 are driven to push the circuit board 7 to turn upwards through the butt plate mechanisms 4, the circuit board 7 can be conveniently turned upwards when cleaning bottom dust by using the mode, the butt plate mechanisms 4 are arranged in the rotating grooves 201 in a damping type rotating mode, because the turnover rod mechanisms 8 comprise spring plates 801 arranged on the rotating rods 602, the inner ends of the spring plates 801 are provided with bent plates 802, the bent plates 802 are supported on the bottom surface of the circuit board 7, after the front area of the circuit board 7 falls on the top surface of the drainage cavity 303, the bent plates 802 are equivalent to another support on the bottom surface of the circuit board 7, and simultaneously the circuit board 7 is turned to swing, the design of the rod turning mechanism 8 is reasonable, the design of the chamfer on the inner side of the butt joint plate 401, the chamfer surface and the dropped circuit board 7 form a triangular heat dissipation channel, the heat dissipation efficiency of the circuit board 7 during the power-on work can be accelerated, a heat dissipation fin 402 for accelerating the heat dissipation is arranged on the chamfer surface, and a butt-joint hole 403 for fixing the circuit board 7 is formed in the outer side surface of the butt joint plate 401.
As shown in fig. 2, the rotating rod mechanism 6 includes a displacement block 601 sliding in the slide way 103 and a rotating rod 602 passing through the two displacement blocks 601 through bearings, and a hand wheel 603 is mounted at an outer end of the rotating rod 602, so that it can be seen that the rotating rod mechanism 6 can be integrally displaced under the guidance of the slide way 103, and as shown in fig. 6, the spring plate 801 is arranged in a front inclined manner, and a sweeping strip 804 is mounted at a bottom surface thereof, and the sweeping strip 804 contacts with the top surface of the mounting base 1, so that the rotating rod mechanism 6 of the displacement action can drive the sweeping strip 804 to clean dust on the top surface of the mounting base 1, and the application range of the rotating rod mechanism 6 and the rotating rod mechanism 8 is expanded.
Specifically, the method comprises the following steps: the outer wall of bent plate 802 is provided with spacing strip 803, the bottom surface of circuit board 7 is provided with the V-arrangement groove 701 that forms anti-skidding nature contact with spacing strip 803, make bent plate 802 when supporting circuit board 7, utilize V-arrangement groove 701 still to remain better limit function and heat dissipation clearance, make circuit board 7 and bent plate 802 structural design more reasonable, the bottom surface of circuit board 7 is provided with rubber sleeve 702, bent plate 802 cartridge is in rubber sleeve 702, form the bottom and draw firm effect to circuit board 7, when preventing this device from using practically, circuit board 7 non-manpower operation and upwards upset, the setting of rubber sleeve 702, make the structure of circuit board 7 more reasonable, the thin slice formula and for the bent plate 802 of elastic steel material dress all the time in rubber sleeve 702 when upwards rotating, under the effect of V-arrangement groove 701 antiskid texture structure, still can upwards swing circuit board 7.
In practical use, the invention installs components on the circuit board 7, fixes the rear part of the circuit board 7 on the butt-joint plate 401 through the screws and the butt-joint holes 403, only leaves the front side of the circuit board 7 to directly fall on the top surface of the drainage cavity 303, manually rotates the hand wheel 603 to rotate the rotating rod 602, so as to turn over the spring plate 801 installed in the middle part of the rotating rod 602 upwards, makes the bent plate 802 on the spring plate 801 upwards swing, and drives the circuit board 7 upwards, thereby being convenient for cleaning the dust on the bottom surface of the circuit board 7 and the top surface of the installation seat 1 corresponding to the bottom of the circuit board 7, the structure design is more reasonable, the flexibility and practicability are improved, when the two fans 5 are electrified to work (the electrifying principle is similar to a double-fan type display card, which is not described otherwise), the circuit board 7 can be radiated upwards from the bottom, wherein part of the air flow discharged by the fan 5 corresponding to the bottom of the air collection, and the gas is upwards led out by the drainage cavity 303, because the front part of the circuit board 7 is placed on the top surface of the drainage cavity 303 at the topmost section of the front supporting plate 3, the heat dissipation gas generated by the right fan 5 during working can be directly guided onto the circuit board 7, so that the circuit board 7 not only receives the upwards discharged gas flow of the right bottom fan 5 to dissipate heat, but also receives the transverse gas flow led out by the drainage cavity 303 to dissipate heat, the heat dissipation speed of the circuit board 7 is accelerated, the heat dissipation efficiency is improved, and the structural rationality of the front supporting plate 3 is greatly improved.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (8)
1. The utility model provides a heat abstractor of integrated circuit board, includes mount pad (1), butt joint plate mechanism (4), bull stick mechanism (6) and turnover rod mechanism (8), its characterized in that: a rear supporting plate (2) is mounted on the rear side of the mounting seat (1), and a front supporting plate (3) is mounted on the front side of the mounting seat (1);
a bottom cavity (101) is arranged at the bottom of the mounting seat (1), an air hole (102) is arranged at the top of the bottom cavity (101), two fans (5) are also arranged in the bottom cavity (101), when the fans (5) are electrified to work, the generated gas is discharged upwards through the air hole (102), the front supporting plate (3) is fixed on the mounting seat (1), and is positioned at the top of the right fan (5), the front supporting plate (3) comprises a sloping plate (301), a gas collecting cavity (302) and a drainage cavity (303), the inclined plate (301) is fixed on the mounting seat (1), the gas collection cavity (302) is fixed on the inclined plate (301), the drainage cavity (303) is arranged at the top of the inclined plate (301), the air collecting cavity (302) is communicated with the drainage cavity (303), air sprayed upwards by the right fan (5) is introduced into the air collecting cavity (302), and the air is upwards led out by the drainage cavity (303);
a row of rotating grooves (201) are formed in the rear supporting plate (2), a butt joint plate mechanism (4) is installed in each rotating groove (201) through a rotating shaft, and a circuit board (7) is installed on each butt joint plate mechanism (4) and the front supporting plate (3) together;
slide (103) have been seted up to the left and right sides of mount pad (1), and are provided with bull stick mechanism (6) in slide (103), the mid-mounting of bull stick mechanism (6) has turnover rod mechanism (8), when bull stick mechanism (6) is rotatory, upwards overturn through butt joint plate mechanism (4) in circuit board (7) is moved in the top of driving turnover rod mechanism (8).
2. The heat dissipating device of an integrated circuit board according to claim 1, wherein: the butt joint plate mechanism (4) comprises a butt joint plate (401) arranged in the rotary groove (201) through a damping type rotating shaft and an inner side chamfer design of the butt joint plate (401), a radiating fin (402) is arranged on a chamfer surface, and a butt joint hole (403) used for fixing the circuit board (7) is formed in the outer side surface of the butt joint plate (401).
3. The heat dissipating device of an integrated circuit board according to claim 1, wherein: the rotating rod mechanism (6) comprises a displacement block (601) sliding in the slide way (103) and a rotating rod (602) penetrating through the two displacement blocks (601) through bearings, and a hand wheel (603) is mounted at the outer end of the rotating rod (602).
4. The heat dissipating device of an integrated circuit board according to claim 3, wherein: the turning rod mechanism (8) is arranged in the middle of the rotating rod (602), the turning rod mechanism (8) comprises a spring plate (801) arranged on the rotating rod (602), a bent plate (802) is arranged at the inner end of the spring plate (801), and the bent plate (802) is supported on the bottom surface of the circuit board (7).
5. The heat dissipating device of an integrated circuit board according to claim 4, wherein: the outer wall of bent plate (802) is provided with spacing strip (803), and the bottom surface of circuit board (7) is provided with V-arrangement groove (701) that forms anti-skidding nature contact with spacing strip (803).
6. The heat dissipating device of an integrated circuit board according to claim 4, wherein: the bottom surface of the circuit board (7) is provided with a rubber sleeve (702), and the bent plate (802) is inserted into the rubber sleeve (702).
7. The heat dissipating device of an integrated circuit board according to claim 4, wherein: the spring plate (801) is arranged in a front inclined mode, the bottom surface of the spring plate is provided with a sweeping strip (804), and the sweeping strip (804) is in contact with the top surface of the mounting seat (1).
8. The heat dissipating device of an integrated circuit board according to claim 1, wherein: the two fans (5) are in an inward-downward inclined design, and the two fans (5) are positioned at the bottom of the air hole (102).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011080587.3A CN112203475B (en) | 2020-10-11 | 2020-10-11 | Heat radiator for integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011080587.3A CN112203475B (en) | 2020-10-11 | 2020-10-11 | Heat radiator for integrated circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112203475A true CN112203475A (en) | 2021-01-08 |
| CN112203475B CN112203475B (en) | 2021-04-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011080587.3A Expired - Fee Related CN112203475B (en) | 2020-10-11 | 2020-10-11 | Heat radiator for integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112203475B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8035974B1 (en) * | 1997-11-25 | 2011-10-11 | Round Rock Research, Llc | Integrated circuit package support system |
| CN208480031U (en) * | 2018-05-24 | 2019-02-05 | 深圳市海宇达电子科技有限公司 | A kind of circuit board radiating device |
| CN110958771A (en) * | 2019-12-10 | 2020-04-03 | 维沃移动通信有限公司 | Integrated circuit board and electronic equipment |
| CN210470078U (en) * | 2019-09-07 | 2020-05-05 | 惠州市皇佳科技有限公司 | PCB board interconnection structure |
| CN210868597U (en) * | 2020-05-15 | 2020-06-26 | 潍坊新星标签制品有限公司 | Heat dissipation device for circuit board of label printing machine |
-
2020
- 2020-10-11 CN CN202011080587.3A patent/CN112203475B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8035974B1 (en) * | 1997-11-25 | 2011-10-11 | Round Rock Research, Llc | Integrated circuit package support system |
| CN208480031U (en) * | 2018-05-24 | 2019-02-05 | 深圳市海宇达电子科技有限公司 | A kind of circuit board radiating device |
| CN210470078U (en) * | 2019-09-07 | 2020-05-05 | 惠州市皇佳科技有限公司 | PCB board interconnection structure |
| CN110958771A (en) * | 2019-12-10 | 2020-04-03 | 维沃移动通信有限公司 | Integrated circuit board and electronic equipment |
| CN210868597U (en) * | 2020-05-15 | 2020-06-26 | 潍坊新星标签制品有限公司 | Heat dissipation device for circuit board of label printing machine |
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|---|---|
| CN112203475B (en) | 2021-04-23 |
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Effective date of registration: 20210402 Address after: 223400 No.6 workshop, electronic industrial park, Lianshui Economic Development Zone, Huai'an City, Jiangsu Province Applicant after: JIANGSU SUCCESS CIRCUITS Co.,Ltd. Address before: 521 Mintai building, Minkang Road, Minkang Road, Longhua New District, Shenzhen, Guangdong Province Applicant before: Shenzhen mingshitang Trading Co.,Ltd. |
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