CN112203201A - Microphone chip and MEMS microphone - Google Patents
Microphone chip and MEMS microphone Download PDFInfo
- Publication number
- CN112203201A CN112203201A CN202011060622.5A CN202011060622A CN112203201A CN 112203201 A CN112203201 A CN 112203201A CN 202011060622 A CN202011060622 A CN 202011060622A CN 112203201 A CN112203201 A CN 112203201A
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- Prior art keywords
- microphone chip
- shielding plate
- microphone
- back plate
- plate
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- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 230000008093 supporting effect Effects 0.000 claims description 50
- 230000000903 blocking effect Effects 0.000 claims description 36
- 230000004888 barrier function Effects 0.000 claims description 15
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 239000002245 particle Substances 0.000 description 18
- 238000011109 contamination Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000010276 construction Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000013618 particulate matter Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Pressure Sensors (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention discloses a microphone chip and an MEMS microphone, wherein the microphone chip comprises: the chip structure comprises a semiconductor substrate, and a back plate and a vibrating diaphragm which are oppositely arranged on the semiconductor substrate; the dustproof structure is arranged above the back plate and at least partially shields the perforated area of the back plate. Therefore, the microphone chip provided by the embodiment of the invention has the advantages of low failure rate, long service life and high sensitivity.
Description
Technical Field
The invention relates to the technical field of microphones, in particular to a microphone chip and an MEMS (micro-electromechanical systems) microphone.
Background
For the microphone, after the chip is manufactured by the MEMS process, in transportation, packaging and normal use, the pollution particles such as dust floating in the air may float on the back plate of the microphone and enter between the back plate and the diaphragm through the sound hole on the back plate, causing the diaphragm to fail to vibrate normally, so that the microphone chip fails, which is the highest failure mode at present. In the related art, a mesh-shaped film is adhered to a sound inlet hole of a microphone during a microphone packaging process to filter out dust and other pollution particles in the air. However, this structure has no way of preventing particle contamination of the microphone chip before packaging and in transportation, and the mesh film is easily peeled off in use, resulting in failure of the microphone.
Disclosure of Invention
The invention aims to provide a microphone chip which can prevent pollution particles from entering between a diaphragm and a back plate, reduce particle pollution and reduce failure rate.
In order to solve the technical problem, the invention provides a microphone chip.
The microphone chip according to the embodiment of the present invention includes: the chip structure comprises a semiconductor substrate, and a back plate and a vibrating diaphragm which are oppositely arranged on the semiconductor substrate; the dustproof structure is arranged above the back plate and at least partially shields the perforated area of the back plate.
Therefore, according to the microphone chip provided by the embodiment of the invention, by arranging the dustproof structure, pollution particles in the environment can be prevented from falling between the back plate and the diaphragm in transportation, packaging and normal use, and the normal vibration of the diaphragm is prevented from being influenced, so that the failure rate of the microphone chip can be reduced, the service life of the microphone chip is prolonged, the cost is reduced, and the sensitivity of the microphone chip can also be improved.
According to some embodiments of the present invention, the dust-proof structure includes a shielding plate and a supporting portion, the shielding plate and the back plate are spaced apart in an up-down direction and expose the electrode connecting portion of the chip structure, and the supporting portion is connected and supported between the back plate and the shielding plate.
Optionally, the shielding plate shields the opening region of the back plate.
Optionally, the shielding plate corresponds to the shape of the opening region of the back plate to cover the opening region of the back plate.
Further, the shielding plate is formed in a circular shape.
Optionally, the shielding plate is formed with a notch exposing the electrode connection part.
Optionally, the shielding plate is formed with a through hole corresponding to the electrode connection part to expose the electrode connection part.
Optionally, the support part comprises a plurality of support members spaced apart along the circumferential direction of the shielding plate, and the plurality of support members surround the opening region of the back plate.
Further, the supporter is formed in a cylindrical shape.
Optionally, the support is formed in a plate shape surrounding an opening region of the back plate to shield the opening region at a side of the opening region.
Optionally, the support is formed as an outwardly projecting arcuate plate.
Optionally, the support is disposed at a corner of the back plate and extends along a corner shape of the back plate to surround the opening region.
Optionally, the dustproof structure further comprises a blocking portion, and the blocking portion is arranged on the supporting pieces and between the adjacent supporting pieces.
Optionally, a blocking portion is formed between any adjacent supporting members.
Optionally, the barrier is formed as a barrier plate.
Optionally, the blocking portion includes a first blocking member and a second blocking member, the first blocking member and the second blocking member are respectively disposed on adjacent supports, and the first blocking member and the second blocking member are disposed at a distance and at least partially overlap in a direction surrounding the opening area.
Further, the first blocking member and the second blocking member are respectively formed in a plate shape, the first blocking member extends obliquely toward the opening area, and the second blocking member is provided outside the first blocking member and extends obliquely away from the opening area.
Optionally, the support portion and the shutter are integrally formed.
The invention further provides the MEMS microphone.
The MEMS microphone comprises the microphone chip of the embodiment.
Drawings
Fig. 1 is a schematic structural diagram of a microphone chip according to an embodiment of the invention;
FIG. 2 is a schematic cross-sectional view of a support portion of a microphone chip according to one embodiment of the invention;
fig. 3 is a schematic structural diagram of a microphone chip according to another embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of a support part of a microphone chip according to another embodiment of the present invention;
fig. 5 is a schematic cross-sectional view of a support part of a microphone chip according to still another embodiment of the present invention;
fig. 6 is a schematic cross-sectional view of a support part of a microphone chip according to still another embodiment of the present invention;
fig. 7 is a schematic structural diagram of a microphone chip according to yet another embodiment of the present invention;
fig. 8 is a schematic cross-sectional view of a support part of a microphone chip according to still another embodiment of the present invention;
fig. 9 is a schematic cross-sectional view of a support portion of a microphone chip according to yet another embodiment of the present invention;
FIG. 10 is an enlarged view of portion A of FIG. 9;
fig. 11 is a schematic cross-sectional view of a support portion of a microphone chip according to yet another embodiment of the present invention;
fig. 12 is an enlarged view of a portion B in fig. 11.
Reference numerals:
100: a microphone chip;
1: semiconductor substrate, 11: silicon substrate, 12: first sacrificial layer, 13: second sacrificial layer, 14: vibrating diaphragm;
2: chip structure, 21: back plate, 22: an opening area;
3: dustproof structure, 31: shielding plate, 311: notch, 312: through hole, 32: a support part for supporting the support part,
33: support, 34: blocking portion, 35: first stopper, 36: a second barrier.
Detailed Description
The following describes a microphone chip according to the present invention in detail with reference to the accompanying drawings and the detailed description.
The microphone chip 100 according to the embodiment of the present invention is described below with reference to the drawings.
Referring to fig. 1, 3 and 7, a microphone chip 100 according to an embodiment of the present invention includes a chip structure 2 and a dustproof structure 3, where the chip structure 2 includes a semiconductor substrate 1, and a back plate 21 and a diaphragm 14 formed on the semiconductor substrate 1 and disposed opposite to each other, specifically, the diaphragm 14 is formed in the semiconductor substrate 1, the diaphragm 14 forms a cavity between the semiconductor substrate 1 and the back plate 21 and the diaphragm 14, and the back plate 21 forms an open region 22 communicated with the cavity, so that air vibration generated by sound is transmitted to the vibration cavity through the open region 22 and transmitted to the diaphragm 14, so that a distance between the diaphragm 14 and the back plate 21 changes, and further a capacitance formed by the back plate 21 and the diaphragm 14 changes, thereby converting a sound signal into an electrical signal.
Therefore, according to the microphone chip 100 of the embodiment of the present invention, by providing the dustproof structure 3, in transportation, packaging and normal use, pollution particles in the environment can be prevented from falling on the back plate 21 and the diaphragm 14 to affect the normal motion of the diaphragm, so that the failure rate of the microphone chip 100 can be reduced, the service life of the microphone chip 100 can be prolonged, the cost can be reduced, and the sensitivity of the microphone chip 100 can also be improved.
As shown in fig. 1, 3 and 7, the semiconductor substrate 1 may include a silicon substrate 11, a first sacrificial layer 12 and a second sacrificial layer 13, which are stacked, a diaphragm 14 is formed between the first sacrificial layer 12 and the second sacrificial layer 13, a back plate 21 is formed on an upper surface of the second sacrificial layer 13, an opening region 22 corresponding to the diaphragm 14 is formed on the back plate 21, and the dust-proof structure 3 is formed above the back plate 21.
As shown in fig. 1 to 8, the dustproof structure 3 may include a shielding plate 31 and a supporting portion 32, the shielding plate 31 is disposed above the back plate 21 and spaced apart from the back plate 21 in the up-down direction, and exposes the electrode connecting portion of the chip structure 2, so that the shielding plate 31 can prevent the contaminant particles from entering between the back plate 21 and the diaphragm 14, and the shielding plate 31 does not shield the electrode connecting portion of the chip structure 2, that is, the electrode connecting portion of the chip structure 2 exposes the shielding plate 31, thereby facilitating the electrical connection of the electrode connecting portion of the chip structure 2.
The supporting portion 32 is connected and supported between the chip structure 2 and the shielding plate 31, so that not only can the shielding plate 31 and the chip structure 2 be supported and fixed, but also the shielding plate 31 can be supported by the supporting portion 32, the shielding plate 31 is spaced apart from the back plate 21 on the chip structure 2, and sound can be conveniently transmitted to the diaphragm 14 through air, further, pollution particles can be prevented from entering between the back plate 21 and the diaphragm 14 from the side portion through the supporting portion 32, so that the effect of particle pollution is further improved, and the sensitivity of the microphone chip 100 is improved.
Alternatively, as shown in fig. 1, the supporting portion 32 may be connected between the back plate 21 and the shielding plate 31, that is, the lower end of the supporting portion 32 is connected to the back plate 21, so as to surround the opening region 22 of the back plate 21, not only to shield the opening region 22, but also to make the volume of the microphone chip 100 relatively small. As shown in fig. 3, the supporting portion 32 may be supported on the upper surface of the chip structure 2 without being connected to the back plate 21, for example, the supporting portion 32 may be supported on other structures on the surface of the chip structure 2 as long as it can support the shielding plate 31 shielding the back plate 21.
Alternatively, the supporting portion 32 and the shielding plate 31 are integrally formed, so that the supporting portion 32 and the shielding plate 31 are an integral structure, which not only can enhance the structural strength of the dust-proof structure 3, but also can simplify the forming process of the shielding plate 32 and the supporting portion 32.
In some embodiments of the present invention, the shielding plate 31 shields the opening region 22 of the back plate 21, as shown in fig. 1, fig. 3 and fig. 7, the shielding plate 31 is disposed above the back plate 21 and parallel to the back plate 21, and the opening region 22 of the back plate 21 can be completely shielded by the shielding plate 31, so that the contamination particles can be further prevented from falling into between the back plate 21 and the diaphragm 14 from the opening region 22, so as to improve the effect of the shielding plate 31 on preventing the diaphragm 14 from being inoperable due to the contamination of the particles.
In some specific examples of the present invention, the shielding plate 31 corresponds to the shape of the opening region of the back plate 21 to cover the opening region 22 of the back plate 21, that is, the shielding plate 31 matches the shape of the back plate 21, the opening region 22 of the back plate 21 can be completely shielded by the shielding plate 31, and the shielding plate 31 does not shield the electrode connection portion of the chip structure 2. For example, as shown in fig. 1, the opening region 22 of the back plate 21 is formed in a circular shape, and the shielding plate 31 is formed in a circular shape and is disposed above the opening region 22 of the back plate 21 so as to completely cover the opening region 22 of the back plate 21.
In other examples of the present invention, the shielding plate 31 may be formed in other shapes, for example, the shielding plate 31 may be formed in a polygonal shape, a square shape, a rectangular shape, or the like, or the shielding plate 31 may be formed in an irregular pattern, and the present invention is not particularly limited as long as the shielding plate can shield the opening region 22 of the back plate 21.
Alternatively, the shape of the shielding plate 31 may correspond to the shape of the back plate 21, that is, the shielding plate 31 has substantially the same shape as the back plate 21, for example, the back plate 21 is formed in a square shape, and the shielding plate 31 may also be formed in a square shape and shield the upper surface of the back plate 21, so that the shielding plate 31 has a simple structure and is convenient for shielding the opening region 22 of the back plate 21, wherein the shielding plate 31 may have a notch 311 formed thereon corresponding to the electrode connecting portion of the chip structure 2, so that the electrode connecting portion can be exposed through the notch 311 for electrical connection with other components.
Alternatively, as shown in fig. 3, the shielding plate 31 has a shape that matches the shape of the back plate 21 and completely shields the upper surface of the back plate 21, the shielding plate 31 is formed with a through hole 312 corresponding to the electrode connecting portion to expose the electrode connecting portion, the through hole 312 facilitates electrical connection between the electrode connecting portion and other components, and the shielding area of the shielding plate 31 can be further enlarged to reduce the falling of pollution particles.
As for the support portion 32, the support portion 32 may be vertically connected between the shielding plate 31 and the back plate 21 to support the shielding plate 31. As shown in fig. 1 to 9 and 11, the supporting portion 32 may include a plurality of supporting members 33 spaced apart from each other in the circumferential direction of the shielding plate 31, and the plurality of supporting members 33 are disposed around the opening region 22 of the back plate 21. Alternatively, a plurality of supporting members 33 may be provided at regular intervals along the circumferential direction of the shielding plate 31, which can make the structure of the microphone chip 100 more stable. As shown in fig. 5, 7 and 8, the plurality of supporting members 33 may be formed in a column shape, that is, each supporting member 33 may be formed as a supporting column, and the arrangement and number and height of the plurality of supporting columns may be adjusted and selected according to actual situations.
In other examples of the present invention, as shown in fig. 1 to 4 and fig. 6, the supporting member 33 may be formed in a plate shape to shield the opening region 22 at a side portion of the opening region 22, in other words, the supporting member 33 may be formed as a supporting plate by which the back plate 21 can be shielded from the side portion to laterally shield the back plate 21, which not only can improve an effect of preventing the diaphragm 14 from malfunctioning due to particle contamination, but also can enhance a supporting effect of the supporting portion 32 and the back plate 21 and the shielding plate 31.
As shown in fig. 1 and 2, the supporting members 33 may be formed as arc plates protruding outward, and a plurality of supporting members 33 are spaced around the opening region 22 of the back plate 21. As shown in fig. 6, the support member 33 is formed as a flat plate having a width direction coinciding with a width direction of the edge of the back plate 21. As shown in fig. 3 and 4, the supporters 33 may be provided at corners of the back plate 21, each supporter 33 is formed in a plate-shaped structure, and the plate-shaped structure of each supporter 33 is adapted to the corner shape of the back plate 21, for example, the cross-section of the supporter 33 is formed in a semi-enclosed structure having the same shape as the corner shape.
In the example shown in fig. 1 and 2, the shielding plate 31 is formed in a circular shape, the supporting members 33 are formed in a columnar shape, the number of the supporting members 33 may be four, and the four supporting members 33 are evenly spaced apart in the circumferential direction of the shielding plate 31. In the example shown in fig. 3 and 4, the shielding plate 31 may be formed in a square shape and correspond to the shape of the back plate 21, and a plurality of supporting members 33 are provided at the edges of the shielding plate 31 and the back plate 21, arranged along the extending direction of the four sides of the shielding plate 31 and the back plate 21, for example, the number of the supporting members 33 may be four, and the four supporting members 33 may be respectively provided at the four corners of the shielding plate 31. In the example shown in fig. 7 and 8, the shielding plate 31 is provided with notches 311 corresponding to the electrode connecting portions, and the supporting members 33 may be six, with six supporting members 33 being provided at intervals along the edge shape of the shielding plate 31.
In some embodiments of the present invention, as shown in fig. 9 to 12, the dust-proof structure 3 may further include a blocking portion 35, the blocking portion 35 is disposed on the supporting members 33 and between the adjacent supporting members 33, the adjacent supporting members 33 are spaced apart and have a certain spacing gap, and the blocking portion 35 is formed on a side of the supporting members 33 facing the spacing gap, so that the blocking portion 35 can enter from the spacing gap between the supporting members 33 and float down to the back plate 21 through the blocking portion 35.
Preferably, a blocking portion 35 is formed between any two adjacent supporting members 33, that is, a spacing gap between any two adjacent supporting members 33 is provided with the blocking portion 35, so that the effect of placing particle contamination can be further improved. Alternatively, the blocking portion 35 may be formed as a blocking plate, thereby further increasing a blocking area and improving an effect of preventing particle contamination.
In some embodiments of the present invention, as shown in fig. 10 and 12, the blocking portion 35 may include a first blocking member 35 and a second blocking member 36, and the first blocking member 35 and the second blocking member 36 are respectively provided on the adjacent supporters 33 and spaced apart. In other words, the first barrier 35 and the second barrier 36 together constitute the barrier portion 35, the first barrier 35 is provided on one of the adjacent two support members 33, the second barrier 36 is provided on the other of the adjacent two support members 33, and the first barrier 35 and the second barrier 36 are each provided between the adjacent two support members 33 and are disposed in a spaced-apart relation to each other, so that by providing the first barrier 35 and the second barrier 36, not only can the effect of preventing particle contamination be enhanced, but also the spaced-apart arrangement of the first barrier 35 and the second barrier 36 can form a certain spacing space to allow sound to be transmitted to the diaphragm 14 by air vibration, and on the other hand, during the manufacturing process of the microphone chip 100, can also allow the corrosive solution to flow into the semiconductor substrate 1 to form the chip configuration 2.
As shown in fig. 10 and 9, a first stopper 35 and a second stopper 36 are respectively formed on a side of the support 33 facing the adjacent other support 33, wherein the first stopper 35 and the second stopper 36 are oppositely disposed, the first stopper 35 and the second stopper 36 are disposed at a distance in a width direction of the gap of the adjacent support 33, and at this time, the first stopper 35 and the second stopper 36 cover a part of the width direction of the gap of the adjacent support 33, so that prevention of particle contamination from the side can be further achieved by the first stopper 35 and the second stopper 36.
As shown in fig. 11 and 12, the first and second stoppers 35 and 36 may be formed in a plate shape, and optionally, the first and second stoppers 35 and 36 may at least partially overlap in a direction surrounding the open hole region 22, that is, the first and second stoppers 35 and 36 cover the width of the gap of the adjacent support 33, and the gap can be completely blocked in the width direction of the gap of the adjacent support 33 by the first and second stoppers 35 and 36, so that the effect of preventing the side portion from particle contamination can be improved, wherein the first and second stoppers 35 and 36 are spaced apart in the length direction of the gap of the adjacent support 33.
In the example shown in fig. 11 and 12, the second stopper 36 is provided outside the first stopper 35, the first stopper 35 is formed as a sloping plate extending obliquely toward the direction in which the aperture area 22 is located, the second stopper 36 is formed as a sloping plate extending obliquely away from the aperture area 22, and the first stopper 35 and the second stopper 36 are provided in parallel and partially overlap.
The present invention also proposes a MEMS microphone, which includes the microphone chip 100 of the above embodiment.
Therefore, according to the MEMS microphone of the embodiment of the present invention, by providing the microphone chip 100 of the embodiment, it is possible to avoid that the diaphragm 14 cannot normally operate due to the contaminant particles entering between the back plate 21 and the diaphragm 14, and further improve the sensitivity of the MEMS microphone, and the microphone chip 100 of the embodiment has a small failure rate, and can also improve the service life of the MEMS microphone and reduce the cost.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (19)
1. A microphone chip, comprising:
the chip structure comprises a semiconductor substrate, and a back plate and a vibrating diaphragm which are oppositely arranged on the semiconductor substrate;
the dustproof structure is arranged above the back plate and at least partially shields the perforated area of the back plate.
2. The microphone chip according to claim 1, wherein the dust-proof structure includes a shielding plate and a supporting portion, the shielding plate and the back plate are disposed at a distance in an up-down direction and expose the electrode connecting portion of the chip structure, and the supporting portion is connected and supported between the chip structure and the shielding plate.
3. The microphone chip of claim 2, wherein the shielding plate shields the opening region of the backplate.
4. The microphone chip as claimed in claim 3, wherein the shielding plate corresponds to the shape of the opening region of the backplate to cover the opening region of the backplate.
5. The microphone chip according to claim 4, wherein the shielding plate is formed in a circular shape.
6. The microphone chip as defined by claim 3, wherein the shielding plate is formed with a notch exposing the electrode connecting portion.
7. The microphone chip according to claim 3, wherein the shielding plate is formed with a through hole corresponding to the electrode connection part to expose the electrode connection part.
8. The microphone chip as defined by claim 3 wherein the support portion comprises a plurality of support members spaced apart along the circumference of the shielding plate, the plurality of support members surrounding the aperture region of the backplate.
9. The microphone chip according to claim 8, wherein the support member is formed in a columnar shape.
10. The microphone chip according to claim 8, wherein the support is formed in a plate shape surrounding an opening region of the backplate to shield the opening region at a side of the opening region.
11. The microphone chip of claim 10, wherein the support is formed as an outwardly convex arc-shaped plate.
12. The microphone chip of claim 10, wherein the support is disposed at a corner of the backplate and extends along a corner shape of the backplate to surround the opening region.
13. The microphone chip of claim 2 further comprising a stop disposed on the support members and between adjacent support members.
14. The microphone chip of claim 13, wherein a barrier is formed between any adjacent support members.
15. The microphone chip of claim 13, wherein the blocking portion comprises a first blocking member and a second blocking member, the first blocking member and the second blocking member being respectively disposed on adjacent supports and spaced apart.
16. The microphone chip of claim 15, wherein the first support and the second support at least partially overlap in a direction around the open area.
17. The microphone chip according to claim 16, wherein the first and second stoppers are respectively formed in a plate shape, the first stopper extends obliquely toward the opening area, and the second stopper is provided outside the first stopper and extends obliquely away from the opening area.
18. The microphone chip according to claim 2, wherein the supporting portion and the shielding plate are integrally molded.
19. A MEMS microphone comprising the microphone chip of any one of claims 1 to 18.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011060622.5A CN112203201A (en) | 2020-09-30 | 2020-09-30 | Microphone chip and MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011060622.5A CN112203201A (en) | 2020-09-30 | 2020-09-30 | Microphone chip and MEMS microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112203201A true CN112203201A (en) | 2021-01-08 |
Family
ID=74012514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011060622.5A Pending CN112203201A (en) | 2020-09-30 | 2020-09-30 | Microphone chip and MEMS microphone |
Country Status (1)
| Country | Link |
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| CN (1) | CN112203201A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114513731A (en) * | 2022-04-20 | 2022-05-17 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101025A (en) * | 2014-05-07 | 2015-11-25 | 鑫创科技股份有限公司 | Micro-electro-mechanical system microphone |
| US20180302726A1 (en) * | 2017-03-28 | 2018-10-18 | Nanofone Ltd. | High performance sealed-gap capacitive microphone |
| CN211209929U (en) * | 2019-11-04 | 2020-08-07 | 歌尔微电子有限公司 | Dustproof anti-blowing micro-electromechanical microphone chip |
-
2020
- 2020-09-30 CN CN202011060622.5A patent/CN112203201A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101025A (en) * | 2014-05-07 | 2015-11-25 | 鑫创科技股份有限公司 | Micro-electro-mechanical system microphone |
| US20180302726A1 (en) * | 2017-03-28 | 2018-10-18 | Nanofone Ltd. | High performance sealed-gap capacitive microphone |
| CN211209929U (en) * | 2019-11-04 | 2020-08-07 | 歌尔微电子有限公司 | Dustproof anti-blowing micro-electromechanical microphone chip |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114513731A (en) * | 2022-04-20 | 2022-05-17 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
| CN114513731B (en) * | 2022-04-20 | 2022-06-21 | 苏州敏芯微电子技术股份有限公司 | Microphone assembly and electronic equipment |
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