CN112201407B - Method and structure for preparing curved surface circuit on surface of metal structure - Google Patents
Method and structure for preparing curved surface circuit on surface of metal structure Download PDFInfo
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- CN112201407B CN112201407B CN202010959569.6A CN202010959569A CN112201407B CN 112201407 B CN112201407 B CN 112201407B CN 202010959569 A CN202010959569 A CN 202010959569A CN 112201407 B CN112201407 B CN 112201407B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Abstract
The invention provides a method and a structure for preparing a curved surface circuit on the surface of a metal structure, wherein the method comprises the following steps: the method comprises six stages of insulating layer coating, insulating layer curing, conducting layer coating, conducting layer sintering, protective layer coating and protective layer curing to form a two-layer or three-layer curved circuit structure, and comprises the steps of firstly forming an insulating layer directly contacting with metal, secondly forming a conducting layer attached to the surface of the insulating layer and finally forming a protective layer covering the conducting layer through an attachment increasing technology based on rapid forming of a space curved surface interconnection circuit and an interconnection structure. The invention has the advantages that: the curved surface circuit has the advantages of being simple to realize, capable of realizing electrical interconnection through welding, high in strength and reliability, capable of replacing an original cable by the curved surface circuit, eliminating product space force/heat effect, and effectively solving the technical problem that organic matters form high reliability on the surface of aluminum alloy metal to increase attachment.
Description
Technical Field
The invention relates to a method and a structure for preparing a curved surface circuit on the surface of a metal structure.
Background
A large number of cables are usually arranged between a metal structure and an outer shell applied to the field of aerospace, so that information and power transmission among electrical equipment is realized. Because the function combination of the novel product is far more than that of the original product, the information transmission quantity is huge, the number of cables is large, the types are many, the internal force/heat effect in a narrow space in the product is obvious, and various transmission modes are needed. It is difficult to realize high-density electrical interconnection. Due to the large difference of physical and chemical properties between the organic matter and the metal, chemical bonds are difficult to form through chemical reaction. The prior art can not effectively prepare a curved surface circuit on the surface of a metal structure, and the reliability of organic matter adhesion increase on the metal surface is not strong.
Disclosure of Invention
Aiming at the problems, the invention provides a method for preparing a curved surface circuit on the surface of a metal structure, which solves the problem of high reliability and adhesion increase of organic matters on the metal surface.
In view of the above, the present invention provides a method for preparing a curved surface circuit on a surface of a metal structure, which is characterized by comprising:
(1) preparation of
Wiping and cleaning the metal surface by using alcohol to remove surface grease and dirt;
(2) insulating layer coating
Coating an insulating material on the surface of the metal, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(3) curing of the insulating layer
Curing the insulating layer in a certain temperature environment;
(4) coating of conductive layers
Wiping the insulating layer with alcohol, removing surface grease and pollutants, preparing a set circuit pattern on a silk-screen mask, flatly fixing the mask on the metal surface, dot-coating a conductive material on the mask, and then uniformly coating the conductive material on the metal surface by using a rubber scraper;
(5) sintering of the conductive layer
Sintering the conductive layer under a certain temperature environment;
(6) protective layer coating
Wiping the conducting layer and the insulating layer with alcohol to remove surface grease and pollutants, coating the insulating material on the surface of the structure, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(7) curing of protective layers
And curing the protective layer under a certain temperature environment.
Furthermore, an insulating material resistant to high temperature of 350-400 ℃ is selected.
Further, the conductive layer material has a resistivity of less than 30 μ Ω · cm.
Further, the coating mode is one of brushing, coagulation coating or spraying.
Further, the protective layer material is polyimide.
Further, the conductive layer is made of nano silver.
Further, sintering the conductive layer at 300-350 ℃.
Further, the insulating material is polyimide resin.
The invention also aims to provide a curved surface circuit structure prepared on the surface of the metal structure, which is characterized by being prepared by adopting the method.
Furthermore, the curved surface circuit structure is a two-layer or three-layer structure, and is composed of a polyimide insulating layer directly contacting with metal, a nano silver conducting layer additionally attached to the surface of the polyimide insulating layer, and a polyimide protective layer covering the nano silver conducting layer.
The present invention achieves the following significant advantageous effects
The realization is simple, include: the method comprises six stages of insulating layer coating, insulating layer curing, conducting layer coating, conducting layer sintering, protective layer coating and protective layer curing to form a two-layer or three-layer curved circuit structure. The curved surface circuit can realize electrical interconnection through welding, has the characteristics of high strength and high reliability, replaces the original cable with the curved surface circuit, eliminates the space force/heat effect of a product, and effectively solves the technical problem that organic matters form high reliability on the surface of aluminum alloy metal to increase the adhesion.
Drawings
FIG. 1 is a schematic diagram of a curved circuit structure prepared on the surface of a metal structure according to the present invention.
Detailed Description
The advantages and features of the present invention will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings and detailed description of specific embodiments of the invention. It is to be noted that the drawings are in a very simplified form and are not to scale, which is intended merely for convenience and clarity in describing embodiments of the invention.
It should be noted that, for clarity of description of the present invention, various embodiments are specifically described to further illustrate different implementations of the present invention, wherein the embodiments are illustrative and not exhaustive. In addition, for simplicity of description, the contents mentioned in the previous embodiments are often omitted in the following embodiments, and therefore, the contents not mentioned in the following embodiments may be referred to the previous embodiments accordingly.
While the invention is amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood that the inventors do not intend to limit the invention to the particular embodiments described, but intend to protect all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the claims. The same meta-module part number may be used throughout the drawings to represent the same or similar parts.
Example 1
The method for preparing the curved surface circuit on the surface of the metal structure comprises the following steps:
(1) preparation of
Wiping and cleaning the metal surface by using alcohol to remove surface grease and dirt;
(2) insulating layer coating
Coating an insulating material on the surface of the metal, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(3) curing of the insulating layer
Curing the insulating layer in a certain temperature environment;
(4) coating of conductive layers
Wiping the insulating layer with alcohol, removing surface grease and pollutants, preparing a set circuit pattern on a silk-screen mask, flatly fixing the mask on the metal surface, dot-coating a conductive material on the mask, and then uniformly coating the conductive material on the metal surface by using a rubber scraper;
(5) sintering of the conductive layer
Sintering the conductive layer under a certain temperature environment;
(6) protective layer coating
Wiping the conducting layer and the insulating layer with alcohol to remove surface grease and pollutants, coating the insulating material on the surface of the structure, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(7) curing of protective layers
And curing the protective layer under a certain temperature environment.
Preferably, the insulating material resistant to the high temperature of 350-400 ℃ is selected.
Preferably, the conductive layer material resistivity is less than 30 μ Ω · cm.
Preferably, the coating means is one of brushing, coagulation or spraying.
Preferably, the protective layer material is polyimide.
Preferably, the conductive layer material is nano silver.
Preferably, the conductive layer is sintered at 300 to 350 ℃.
Preferably, the insulating material is a polyimide resin.
As a specific example, the surface of the aluminum alloy is wiped and cleaned by using alcohol to remove surface grease and dirt. The polyimide resin is used for brushing, coagulating or spraying on the surface of the aluminum alloy. And (4) placing the aluminum alloy structure in a vacuum environment, and removing bubbles in the polyimide coating. And curing the polyimide insulating layer in an environment of 300 ℃. And wiping the insulating layer by using alcohol to remove surface grease, pollutants and the like. The method comprises the steps of preparing a set circuit pattern on a silk-screen mask, flatly fixing the mask on the surface of the aluminum alloy, dot-coating nano silver paste on the mask, and then uniformly coating the nano silver paste on the surface of the aluminum alloy by using a rubber scraper. And sintering the nano silver conductive layer at the temperature of 300 ℃. And wiping the conducting layer and the insulating layer by using alcohol to remove surface grease, pollutants and the like. The polyimide resin is used for brushing, coagulating or spraying on the surface of the structure, the aluminum alloy structure is placed in a vacuum environment, and air bubbles in the polyimide coating are removed. And curing the polyimide protective layer at the temperature of 300 ℃.
As shown in fig. 1, the curved circuit structure formed by the method of this embodiment is a two-layer or three-layer structure, which includes a polyimide insulating layer directly contacting with metal, a nano-silver conductive layer attached to the surface of the polyimide insulating layer, and a polyimide protective layer covering the nano-silver conductive layer.
Example 2
The method for preparing the curved surface circuit on the surface of the metal structure comprises the following steps:
(1) preparation of
Wiping and cleaning the metal surface by using alcohol to remove surface grease and dirt;
(2) insulating layer coating
Coating an insulating material on the surface of the metal, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(3) curing of the insulating layer
Curing the insulating layer in a certain temperature environment;
(4) coating of conductive layers
Wiping the insulating layer with alcohol, removing surface grease and pollutants, preparing a set circuit pattern on a silk-screen mask, flatly fixing the mask on the metal surface, dot-coating a conductive material on the mask, and then uniformly coating the conductive material on the metal surface by using a rubber scraper;
(5) sintering of the conductive layer
Sintering the conductive layer under a certain temperature environment;
(6) protective layer coating
Wiping the conducting layer and the insulating layer with alcohol to remove surface grease and pollutants, coating the insulating material on the surface of the structure, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(7) curing of protective layers
And curing the protective layer under a certain temperature environment.
Preferably, the insulating material resistant to the high temperature of 350-400 ℃ is selected.
Preferably, the conductive layer material resistivity is less than 30 μ Ω · cm.
Preferably, the coating means is one of brushing, coagulation or spraying.
Preferably, the protective layer material is polyimide.
Preferably, the conductive layer material is nano silver.
Preferably, the conductive layer is sintered at 300 to 350 ℃.
Preferably, the insulating material is a polyimide resin.
As a specific example, the surface of the aluminum alloy is wiped and cleaned by using alcohol to remove surface grease and dirt. The polyimide resin is used for brushing, coagulating or spraying on the surface of the aluminum alloy. And (4) placing the aluminum alloy structure in a vacuum environment, and removing bubbles in the polyimide coating. And curing the polyimide insulating layer in an environment at 350 ℃. And wiping the insulating layer by using alcohol to remove surface grease, pollutants and the like. The method comprises the steps of preparing a set circuit pattern on a silk-screen mask, flatly fixing the mask on the surface of the aluminum alloy, dot-coating nano silver paste on the mask, and then uniformly coating the nano silver paste on the surface of the aluminum alloy by using a rubber scraper. And sintering the nano silver conductive layer at 350 ℃. And wiping the conducting layer and the insulating layer by using alcohol to remove surface grease, pollutants and the like. The polyimide resin is used for brushing, coagulating or spraying on the surface of the structure, the aluminum alloy structure is placed in a vacuum environment, and air bubbles in the polyimide coating are removed. And curing the polyimide protective layer at 350 ℃.
The curved circuit structure formed by the method of the embodiment is a two-layer structure, namely, a polyimide insulating layer directly contacting with metal, a nano-silver conducting layer additionally attached to the surface of the polyimide insulating layer, and a polyimide protective layer covering the nano-silver conducting layer.
Example 3
The method for preparing the curved surface circuit on the surface of the metal structure comprises the following steps:
(1) preparation of
Wiping and cleaning the metal surface by using alcohol to remove surface grease and dirt;
(2) insulating layer coating
Coating an insulating material on the surface of the metal, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(3) curing of the insulating layer
Curing the insulating layer in a certain temperature environment;
(4) coating of conductive layers
Wiping the insulating layer with alcohol, removing surface grease and pollutants, preparing a set circuit pattern on a silk-screen mask, flatly fixing the mask on the metal surface, dot-coating a conductive material on the mask, and then uniformly coating the conductive material on the metal surface by using a rubber scraper;
(5) sintering of the conductive layer
Sintering the conductive layer under a certain temperature environment;
(6) protective layer coating
Wiping the conducting layer and the insulating layer by using alcohol to remove surface grease and pollutants, coating the insulating material on the surface of the structure, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(7) curing of protective layers
And curing the protective layer under a certain temperature environment.
Preferably, the insulating material resistant to the high temperature of 350-400 ℃ is selected.
Preferably, the conductive layer material resistivity is less than 30 μ Ω · cm.
Preferably, the coating means is one of brushing, coagulation or spraying.
Preferably, the protective layer material is polyimide.
Preferably, the conductive layer material is nano silver.
Preferably, the conductive layer is sintered at 300 to 350 ℃.
Preferably, the insulating material is a polyimide resin.
As a specific example, the surface of the aluminum alloy is wiped and cleaned by using alcohol to remove surface grease and dirt. The polyimide resin is used for brushing, coagulating or spraying on the surface of the aluminum alloy. And (4) placing the aluminum alloy structure in a vacuum environment, and removing bubbles in the polyimide coating. And curing the polyimide insulating layer at 325 ℃. And wiping the insulating layer by using alcohol to remove surface grease, pollutants and the like. The method comprises the steps of preparing a set circuit pattern on a silk-screen mask, flatly fixing the mask on the surface of the aluminum alloy, dot-coating nano silver paste on the mask, and then uniformly coating the nano silver paste on the surface of the aluminum alloy by using a rubber scraper. And sintering the nano silver conductive layer at 325 ℃. And wiping the conducting layer and the insulating layer by using alcohol to remove surface grease, pollutants and the like. The polyimide resin is brushed, congealed or sprayed on the surface of the structure, the aluminum alloy structure is placed in a vacuum environment, and air bubbles in the polyimide coating are removed. And curing the polyimide protective layer at 325 ℃.
The curved circuit structure formed by the method of the embodiment is a three-layer structure, which includes a polyimide insulating layer directly contacting with metal, a nano-silver conductive layer attached to the surface of the polyimide insulating layer, and a polyimide protective layer covering the nano-silver conductive layer.
The present invention achieves the following significant advantageous effects
The realization is simple, include: the method comprises six stages of insulating layer coating, insulating layer curing, conducting layer coating, conducting layer sintering, protective layer coating and protective layer curing to form a two-layer or three-layer curved circuit structure. The curved surface circuit can realize electrical interconnection through welding, has the characteristics of high strength and high reliability, replaces the original cable with the curved surface circuit, eliminates the space force/heat effect of a product, and effectively solves the technical problem that organic matters form high reliability on the surface of aluminum alloy metal to increase the adhesion.
Any other suitable modifications can be made according to the technical scheme and the conception of the invention. All such alternatives, modifications and improvements as would be obvious to one skilled in the art are intended to be included within the scope of the invention as defined by the appended claims.
Claims (4)
1. A method for preparing a curved surface circuit on the surface of a metal structure is characterized by comprising the following steps:
(1) preparation of
Wiping and cleaning the metal surface by using alcohol to remove surface grease and dirt;
(2) insulating layer coating
Coating an insulating material on the surface of the metal, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(3) curing of the insulating layer
Curing the insulating layer in a certain temperature environment;
(4) coating of conductive layers
Wiping an insulating layer with alcohol, removing surface grease and pollutants, preparing a set circuit pattern on a silk-screen mask, flatly fixing the mask on the surface of the insulating layer, dot-coating a conductive material on the mask, and then uniformly coating the conductive material on the surface of the insulating layer by using a rubber scraper;
(5) sintering of the conductive layer
Sintering the conductive layer under a certain temperature environment;
(6) protective layer coating
Wiping the conducting layer and the insulating layer with alcohol to remove surface grease and pollutants, coating the insulating material on the surface of the structure, putting the metal structure in a vacuum environment, and removing bubbles in the insulating layer;
(7) curing of protective layers
Curing the protective layer in a certain temperature environment;
selecting an insulating material resistant to high temperature of 350-400 ℃;
the resistivity of the conducting layer material is less than 30 mu omega cm;
the protective layer is made of polyimide;
the conductive layer is made of nano silver;
sintering the conductive layer at 300-350 ℃;
the insulating material is polyimide resin.
2. The method of claim 1, wherein the coating is one of brushing, coagulation or spraying.
3. A curved circuit structure prepared on the surface of a metal structure, which is characterized by being prepared by the method according to claim 1.
4. The surface preparation curved circuit structure of claim 3, wherein the curved circuit structure is a stacked two-layer or three-layer structure, and the one-layer structure is a polyimide insulating layer firstly in direct contact with metal, a nano-silver conductive layer additionally attached to the surface of the polyimide insulating layer, and a polyimide protective layer finally covering the nano-silver conductive layer.
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101630540A (en) * | 2009-07-31 | 2010-01-20 | 陈贤斌 | Polyimide film externally coated with metal conductive layer and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH1012983A (en) * | 1996-02-13 | 1998-01-16 | Nitto Denko Corp | Circuit board, suspension board with circuit and production thereof |
| CN1612673A (en) * | 2003-10-27 | 2005-05-04 | 技嘉科技股份有限公司 | Method for manufacturing circuit board |
| CN102111963A (en) * | 2009-12-25 | 2011-06-29 | 天津鑫安天亿电子科技有限公司 | Manufacturing process of high-heat conducting environmental-friendly metal circuit board |
| CN101917823A (en) * | 2010-08-10 | 2010-12-15 | 常州紫寅电子电路有限公司 | Manufacturing method of circuit board |
| CN103313509B (en) * | 2013-04-24 | 2016-08-17 | 上舜电子科技（中国）有限公司 | A kind of Metal Substrate conducting wire plate and preparation method thereof |
| CN104600182B (en) * | 2014-12-23 | 2017-06-16 | 广州市尤特新材料有限公司 | The preparation method of LED metal substrates ceramic size and LED metal substrates |
| CN111491401A (en) * | 2020-04-21 | 2020-08-04 | 苏州好特斯模具有限公司 | Manufacturing process of metal surface thick film heater |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101630540A (en) * | 2009-07-31 | 2010-01-20 | 陈贤斌 | Polyimide film externally coated with metal conductive layer and preparation method thereof |
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