CN112198946A - Computer host heat abstractor - Google Patents
Computer host heat abstractor Download PDFInfo
- Publication number
- CN112198946A CN112198946A CN202011002668.1A CN202011002668A CN112198946A CN 112198946 A CN112198946 A CN 112198946A CN 202011002668 A CN202011002668 A CN 202011002668A CN 112198946 A CN112198946 A CN 112198946A
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- Prior art keywords
- water
- cooling
- heat dissipation
- cpu
- unit
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- 238000001816 cooling Methods 0.000 claims abstract description 94
- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 238000012544 monitoring process Methods 0.000 claims abstract description 45
- 238000004891 communication Methods 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 230000005855 radiation Effects 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a computer host heat sink, which is arranged in a host case and connected with a computer, and comprises: the system comprises a water-cooling heat dissipation unit, a temperature monitoring unit, a humidity monitoring unit and a wireless communication unit, wherein the water-cooling heat dissipation unit, the temperature monitoring unit and the humidity monitoring unit are all electrically connected with a CPU; the temperature monitoring unit is used for monitoring the temperature in the host case at regular time and transmitting data to the CPU through the wireless communication unit; the tidal humidity monitoring unit is used for monitoring the tidal volume in the host case at regular time and transmitting data to the CPU through the wireless communication unit; and the CPU processes the received data and controls the water-cooling heat dissipation unit. The invention not only effectively improves the heat dissipation speed of the CPU, but also can achieve the purpose of saving energy and effectively protect the host.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a heat dissipation device of a computer host.
Background
The computer is one of the most advanced scientific and technical inventions in the 20 th century, has extremely important influence on the production activities and social activities of human beings, and rapidly develops the application field of the computer with strong vitality from the initial military scientific research application to various fields of society.
The host refers to the main body part of the computer except the input and output equipment. And is also a control box (container Mainframe) for placing the main board and other main components. Typically including a CPU, memory, hard disk, optical drive, power supply, and other input/output controllers and interfaces.
After the computer is used for a long time, the CPU and a plurality of circuit boards in the host computer can be overheated, the running speed of the computer is seriously influenced, and faults such as halt and the like can be caused; if some other computer hosts which need to run for a long time are restarted at high temperature, great loss can be caused. The existing computer mainframe has a heat radiation fan, but the heat radiation fan can only radiate the heat generated by the electrical element into the mainframe box, and the heat cannot be discharged out of the mainframe box as soon as possible, so that the heat radiation efficiency is low.
Therefore, how to provide a heat dissipation device with high heat dissipation efficiency for a computer host is a problem that needs to be solved urgently by those skilled in the art.
Disclosure of Invention
In view of this, the invention provides a heat dissipation device for a computer host, which not only can effectively improve heat dissipation efficiency, but also is energy-saving, environment-friendly and strong in practicability.
In order to achieve the purpose, the invention adopts the following technical scheme:
a heat dissipation device for a host computer is installed in a host computer case and connected to the computer, as shown in FIG. 1, comprising: the system comprises a water-cooling heat dissipation unit, a temperature monitoring unit, a humidity monitoring unit and a wireless communication unit, wherein the water-cooling heat dissipation unit, the temperature monitoring unit and the humidity monitoring unit are all electrically connected with a CPU;
the temperature monitoring unit is used for monitoring the temperature in the host case at regular time and transmitting data to the CPU through the wireless communication unit;
the tidal humidity monitoring unit is used for monitoring the tidal volume in the host case at regular time and transmitting data to the CPU through the wireless communication unit;
the water-cooling heat dissipation unit is used for dissipating heat and cooling the CPU;
and the CPU processes the received data and controls the water-cooling heat dissipation unit.
Preferably, the water-cooling heat dissipation unit comprises a water-cooling head and a water-cooling bar, the water-cooling head is connected with the water-cooling bar through a water-cooling pipe, the water-cooling head is installed on the CPU through a buckle, and the water-cooling bar is installed on the inner side wall of the host case.
Preferably, the water-cooling heat dissipation unit further comprises a water pump, the water pump is installed on the inner side wall of the host case and connected with the water cooling head and the water cooling row through a water cooling pipe, and the water pump is inserted into a socket of the computer motherboard.
Preferably, the water-cooling heat dissipation unit further comprises a fan, the fan is installed on the inner side of the water-cooling row and used for cooling the water-cooling row, and the fan is inserted into the socket on the main board.
Preferably, the temperature monitoring unit comprises a water-cooling head temperature sensor and a water-cooling discharge temperature sensor, the water-cooling head temperature sensor and the water-cooling discharge temperature sensor respectively collect the temperature of the water-cooling head and the water-cooling discharge during working at fixed time intervals, and transmit data to the CPU through the wireless communication unit.
Preferably, the wireless communication unit is a data receiver, the data receiver is plugged on a mainboard of the computer through a USB, and the data receiver receives the temperature data and the humidity data sent by the temperature monitoring unit and the humidity monitoring unit and sends the temperature data and the humidity data to the CPU through the mainboard of the computer.
Preferably, a temperature threshold and a humidity threshold are preset in the CPU.
According to the technical scheme, compared with the prior art, the invention provides the heat dissipation device for the computer host, the water-cooling heat dissipation unit in the heat dissipation device for the computer host dissipates heat and cools the CPU, the temperature monitoring unit and the humidity monitoring unit transmit the acquired data to the CPU through the wireless communication unit, the CPU respectively compares the acquired data with the threshold value, and controls the start and stop of the water-cooling heat radiator according to the condition in the case of the computer host, so that the heat dissipation speed of the CPU is effectively improved, the aim of saving energy is fulfilled by further controlling the work of the water-cooling heat radiator through monitoring the temperature at regular time, and the humidity is monitored to effectively monitor whether the package of the water-cooling heat radiator is intact, so that the aim of protecting the computer host is fulfilled.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic diagram of an overall structure of a heat dissipation device of a computer host according to the present invention;
fig. 2 is a diagram illustrating a specific connection relationship of water-cooling heat dissipation units in a heat dissipation device of a computer host according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment of the invention discloses a computer host heat sink, which is arranged in a host case and connected with a computer, and comprises: the system comprises a water-cooling heat dissipation unit, a temperature monitoring unit, a humidity monitoring unit and a wireless communication unit, wherein the water-cooling heat dissipation unit, the temperature monitoring unit and the humidity monitoring unit are all electrically connected with a CPU;
the temperature monitoring unit is used for monitoring the temperature in the host case at regular time and transmitting data to the CPU through the wireless communication unit;
the tidal humidity monitoring unit is used for monitoring the tidal volume in the host case at regular time and transmitting data to the CPU through the wireless communication unit;
the water-cooling radiating unit is used for radiating and cooling the CPU;
and the CPU processes the received data and controls the water-cooling heat dissipation unit.
In order to further optimize the technical scheme, the water-cooling radiating unit comprises a water-cooling head and a water-cooling row, the water-cooling head is connected with the water-cooling row through a water-cooling pipe, the water-cooling head is installed on the CPU through a buckle, and the water-cooling row is installed on the inner side wall of the host case.
In order to further optimize the technical scheme, the water-cooling heat dissipation unit further comprises a water pump, the water pump is installed on the inner side wall of the host case and is connected with the water-cooling head and the water-cooling row through a water-cooling pipe, and the water pump is inserted into a socket of the computer mainboard.
In order to further optimize the technical scheme, the water-cooling heat dissipation unit further comprises a fan, the fan is installed on the inner side of the water-cooling row and used for cooling the water-cooling row, the fan is inserted into a socket on the mainboard, and the fan is powered through the mainboard.
In order to further optimize the technical scheme, the temperature monitoring unit comprises a water-cooling head temperature sensor and a water-cooling discharge temperature sensor, the water-cooling head temperature sensor and the water-cooling discharge temperature sensor respectively carry out timing section acquisition on the temperature of a water-cooling head and the temperature of a water-cooling discharge during working, and data are transmitted to the CPU through the wireless communication unit.
In order to further optimize the technical scheme, the wireless communication unit is a data receiver, the data receiver is plugged on a mainboard of the computer through a USB, and the data receiver receives the temperature data and the humidity data sent by the temperature monitoring unit and the humidity monitoring unit and sends the temperature data and the humidity data to the CPU through the mainboard of the computer.
In order to further optimize the technical scheme, a temperature threshold and a humidity threshold are preset in the CPU.
The specific working principle of the invention is as follows:
the water-cooling heat dissipation unit is used for cooling a CPU, the water-cooling head temperature sensor and the water-cooling exhaust temperature sensor are used for respectively sending temperature data to the CPU through the wireless communication unit, the humidity monitoring unit is used for collecting humidity in the host case and then sending the collected humidity to the CPU through the wireless communication unit, the CPU is used for respectively comparing the collected data with a threshold value, if the temperature of the water-cooling head and the temperature on the water-cooling exhaust are higher than the threshold value, the water-cooling heat dissipation unit is used for continuing working, if the temperature of the water-cooling head and the temperature on the water-cooling exhaust are lower than the threshold value, the water-cooling heat dissipation unit is stopped temporarily; and if the humidity data is higher than a preset threshold value in the CPU, stopping the work of the water-cooled radiator and reminding a user to carry out sealing check on the water-cooled radiator.
As shown in fig. 2, a water pump in the water-cooling heat dissipation unit pumps out cooling liquid, which absorbs heat of the CPU, in the water-cooling head to the water-cooling row, and the fan blows the water-cooling row to assist in heat dissipation, and the cooling liquid circulates into the water-cooling head again after heat dissipation through the water-cooling row, so as to realize heat dissipation of the CPU as a circulation, and the CPU controls the water-cooling heat dissipation unit by controlling the start and stop of the water pump and the fan electrically connected with the main board.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. The utility model provides a computer host computer heat abstractor, installs in host computer machine incasement, and links to each other with the computer, its characterized in that includes: the system comprises a water-cooling heat dissipation unit, a temperature monitoring unit, a humidity monitoring unit and a wireless communication unit, wherein the water-cooling heat dissipation unit, the temperature monitoring unit and the humidity monitoring unit are all electrically connected with a CPU;
the temperature monitoring unit is used for monitoring the temperature in the host case at regular time and transmitting data to the CPU through the wireless communication unit;
the tidal humidity monitoring unit is used for monitoring the tidal volume in the host case at regular time and transmitting data to the CPU through the wireless communication unit;
the water-cooling heat dissipation unit is used for dissipating heat and cooling the CPU;
and the CPU processes the received data and controls the water-cooling heat dissipation unit.
2. The heat dissipation device of a host computer according to claim 1, wherein the water-cooled heat dissipation unit comprises a water-cooled head and a water-cooled row, the water-cooled head is connected with the water-cooled row through a water-cooled tube, the water-cooled head is mounted on the CPU through a buckle, and the water-cooled row is mounted on an inner side wall of the host computer case.
3. The heat dissipation device of a host computer according to claim 2, wherein the water-cooled heat dissipation unit further comprises a water pump, the water pump is mounted on an inner side wall of the host computer case and connected with the water-cooled head and the water-cooled row through a water-cooled tube, and the water pump is plugged into a socket of a motherboard of a computer.
4. The heat dissipation device of a host computer according to claim 3, wherein the water-cooling heat dissipation unit further comprises a fan, the fan is installed inside the water-cooling row and used for cooling the water-cooling row, and the fan is plugged into a socket on the motherboard.
5. The heat dissipation device of a host computer according to claim 2, wherein the temperature monitoring unit comprises a water-cooling head temperature sensor and a water-cooling discharge temperature sensor, the water-cooling head temperature sensor and the water-cooling discharge temperature sensor respectively perform timing acquisition on the temperatures of the water-cooling head and the water-cooling discharge during operation, and transmit data to the CPU through the wireless communication unit.
6. The heat dissipation device of a host computer according to claim 1, wherein the wireless communication unit includes a data receiver, the data receiver is plugged into a motherboard of the computer through a USB, and the data receiver receives the temperature data and the humidity data sent by the temperature monitoring unit and the humidity monitoring unit, and sends the temperature data and the humidity data to the CPU through the motherboard of the computer.
7. The heat sink apparatus according to claim 1, wherein a temperature threshold and a humidity threshold are preset in the CPU.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011002668.1A CN112198946A (en) | 2020-09-22 | 2020-09-22 | Computer host heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011002668.1A CN112198946A (en) | 2020-09-22 | 2020-09-22 | Computer host heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112198946A true CN112198946A (en) | 2021-01-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011002668.1A Pending CN112198946A (en) | 2020-09-22 | 2020-09-22 | Computer host heat abstractor |
Country Status (1)
| Country | Link |
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| CN (1) | CN112198946A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609053A (en) * | 2011-01-21 | 2012-07-25 | 上海研强电子科技有限公司 | Industrial personal computer provided with CPU (central processing unit) protection mechanism and radiating through housing |
| US20190150321A1 (en) * | 2017-11-16 | 2019-05-16 | Fujitsu Limited | Device for cooling electronic components |
| CN211375539U (en) * | 2019-12-25 | 2020-08-28 | 中科可控信息产业有限公司 | Prevent condensation server water-cooling radiator |
-
2020
- 2020-09-22 CN CN202011002668.1A patent/CN112198946A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609053A (en) * | 2011-01-21 | 2012-07-25 | 上海研强电子科技有限公司 | Industrial personal computer provided with CPU (central processing unit) protection mechanism and radiating through housing |
| US20190150321A1 (en) * | 2017-11-16 | 2019-05-16 | Fujitsu Limited | Device for cooling electronic components |
| CN211375539U (en) * | 2019-12-25 | 2020-08-28 | 中科可控信息产业有限公司 | Prevent condensation server water-cooling radiator |
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Application publication date: 20210108 |