CN102609053A - Industrial personal computer provided with CPU (central processing unit) protection mechanism and radiating through housing - Google Patents
Industrial personal computer provided with CPU (central processing unit) protection mechanism and radiating through housing Download PDFInfo
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- CN102609053A CN102609053A CN2011100239589A CN201110023958A CN102609053A CN 102609053 A CN102609053 A CN 102609053A CN 2011100239589 A CN2011100239589 A CN 2011100239589A CN 201110023958 A CN201110023958 A CN 201110023958A CN 102609053 A CN102609053 A CN 102609053A
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Abstract
The invention relates to the electronic field, specifically to an industrial personal computer. The industrial personal computer provided with a CPU (central processing unit) protection mechanism and radiating through a housing comprises the housing of the industrial personal computer, wherein a main board is arranged inside the housing of the industrial personal computer, a CPU module is arranged on the main board, and a heat conducting mechanism is arranged on the CPU module and connected with a radiating mechanism; the heat conducting mechanism comprises upper radiating fins and lower radiating fins, wherein the upper radiating fins can be plugged with the lower radiating fins in a sliding manner; and the lower radiating fins are connected with the CPU module, the upper radiating fins are connected with the housing of the industrial personal computer, and the housing of the industrial personal computer is used as the radiating mechanism. Due to the adoption of the technical scheme, the heat conducting mechanism with anti-impact capability is adopted to effectively reduce the damage of an external device to the CPU module and protect the CPU module well. The industrial personal computer further improves the radiation function of a CPU, so that the overall radiation efficiency of the industrial personal computer is increased.
Description
Technical field
The present invention relates to electronic applications, be specifically related to a kind of industrial computer.
Background technology
Industrial computer is the computing machine that designs for industry spot specially, and industry spot generally has strong vibrations, and dust is more, so the working environment of industrial computer generally all compare badly, thus for the stable requirement of each assembly of industrial computer inside also than higher.The subject matter of industrial computer when work is its heat dissipation problem, and industrial computer adopts heat radiator, radiator fan to realize the CPU in the industrial computer is dispelled the heat usually.Heat radiator can take some industrial computer inner spaces, is unfavorable for the industrial computer miniaturization; And the radiator fan that the principle of utilizing thermal convection is dispelled the heat tends to bring the dust in the environment into industrial computer inside, influences the operate as normal of each inner assembly of industrial computer.
In addition, it is thinner that the industrial computer housing of industrial computer is made usually, and when external unit impacted to the industrial computer housing, because the conduction of assemblies such as heat radiator, impulsive force often had influence on the operate as normal of CPU.
Summary of the invention
The objective of the invention is to, the industrial computer that a kind of CPU of having protection mechanism is provided and adopts shell to dispel the heat solves above technical matters.
The technical matters that the present invention solved can adopt following technical scheme to realize:
The industrial computer that has the CPU protection mechanism and adopt shell to dispel the heat; Comprise an industrial computer housing, be provided with a mainboard in the said industrial computer housing, said mainboard is provided with a CPU module; Said CPU module is provided with a heat-conducting mechanism, and said heat-conducting mechanism connects a cooling mechanism;
Said heat-conducting mechanism comprises a top heat radiator, a bottom heat radiator, slidably pegs graft between said top heat radiator and the said bottom heat radiator;
Said bottom heat radiator connects said CPU module, and said top heat radiator connects said industrial computer housing, with said industrial computer housing as said cooling mechanism.
The present invention sends the heat on the CPU module to the industrial computer housing through heat-conducting mechanism, and is big as the area of dissipation of the industrial computer housing of cooling mechanism, can dispel the heat for the CPU module rapidly, realizes the high efficiency and heat radiation purpose.Secondly, the industrial computer structure of preferred no fan structure among the present invention reduces the thermal convection in the industrial computer housing, effectively avoids extraneous dust to get into the industrial computer enclosure interior.In addition, when external unit impacts to the industrial computer housing, because the effect of slidably pegging graft between top heat radiator and the bottom heat radiator has effectively reduced the impulsive force of external unit to heat-conducting mechanism, and then reduced the impulsive force to the CPU module.The present invention adopts the heat-conducting mechanism with impact resistance, has effectively reduced the destruction of external unit to the CPU module, can well protect the CPU module.
The bottom of said top heat radiator is provided with radiation tooth, and the top of said bottom heat radiator is provided with and the supporting groove of said radiation tooth, and said top heat radiator and said bottom heat radiator are slidably pegged graft.Do not agree with grafting between top heat radiator and the bottom heat radiator entirely, so that leave the leeway of buffering for the radiation tooth between top heat radiator and the bottom heat radiator.
Be provided with an electronic cooling sheet between said CPU module and the said bottom heat radiator.The electronic cooling sheet only need be switched on and just can be realized that heat transmits, need not any cold-producing medium, pollution-free source, can not produce gyroscopic action, heat transference efficiency is high, and do not have during work vibrations and noise, life-span long, install easy.
Be filled with heat conductive silica gel between said top heat radiator and the said industrial computer housing.Heat conductive silica gel is the material that is used for filling the space between heat-conducting mechanism and the industrial computer housing, and its effect is to be used for conducting the heat that heat-conducting mechanism comes out to the industrial computer housing.
Screw retention is passed through on said mainboard in the bottom of said bottom heat radiator.Be convenient to dismounting and maintenance.
Screw retention is passed through on said industrial computer housing in the top of said top heat radiator;
The side at the top of said top heat radiator and middle part all adopt screw retention on said industrial computer housing.Because it is thinner that the industrial computer housing is made usually, adopts a plurality of screw retention heat-conducting mechanisms, can better fix heat-conducting mechanism.
The whole height of said heat-conducting mechanism is less than 4cm.So that save the space in the industrial computer housing.
Said CPU module adopts a CPU module based on the ARM framework.With the reduction power consumption, and practice thrift cost.
Said CPU module connects a wireless sensor system.Wireless sensor system is used for the monitoring of environment to external world, adopts wireless technology, need not wiring, have cost low, advantages such as simple are set.
Said wireless sensor system comprises numerous wireless sensers such as a radio temperature sensor, wireless humidity sensor, wireless pressure sensor, wireless liquid level sensor.Can omnibearing monitoring external environment.
Said CPU module also connects a ZigBee network communication module.The ZigBee network communication module is a kind of short distance, low rate, low-power consumption, wireless network transmission technology cheaply, can be used for and a plurality of wireless senser netting mesh networks.
Said industrial computer housing can adopt a metal shell.Metal shell heat conduction is rapid, so that the present invention further realizes the high efficiency and heat radiation purpose under the big prerequisite of area of dissipation.
Said industrial computer housing employing one is not more than the cabinet of 1U.Help the miniaturization of industrial computer.
Beneficial effect: owing to adopt technique scheme, the present invention adopts the heat-conducting mechanism with impact resistance, has effectively reduced the destruction of external unit to the CPU module, can well protect the CPU module; The present invention has also improved the heat sinking function of CPU, and then has improved the entire heat dissipation efficient of industrial computer; The present invention does not use radiator fan, has avoided dust to get into the inside of industrial computer housing.
Description of drawings
Fig. 1 is an one-piece construction synoptic diagram of the present invention.
Embodiment
For technological means, creation characteristic that the present invention is realized, reach purpose and effect and be easy to understand and understand, further set forth the present invention below in conjunction with concrete diagram.
With reference to Fig. 1, the industrial computer that has the CPU protection mechanism and adopt shell to dispel the heat comprises an industrial computer housing 1, and industrial computer housing 1 can adopt a metal shell.1 employing one of industrial computer housing is not more than the cabinet of 1U.Be provided with a mainboard 2 in the industrial computer housing 1, mainboard 2 is provided with a CPU module 3, and CPU module 3 is provided with a heat-conducting mechanism, and heat-conducting mechanism connects a cooling mechanism.The whole height of heat-conducting mechanism is less than 4cm.Heat-conducting mechanism comprises a top heat radiator 41, a bottom heat radiator 42, slidably pegs graft between top heat radiator 41 and the bottom heat radiator 42.Bottom heat radiator 42 connects CPU modules 3, and top heat radiator 41 connects industrial computer housings 1, with industrial computer housing 1 as cooling mechanism.The bottom of top heat radiator 41 is provided with radiation tooth, and the top of bottom heat radiator 42 is provided with the groove supporting with radiation tooth, and top heat radiator 41 is slidably pegged graft with bottom heat radiator 42.Grafting as shown in Figure 1, as not exclusively to agree with between top heat radiator 41 and the bottom heat radiator 42, top heat radiator 41 can be under the effect of external force like this, and radiation tooth inserts in the groove, plays buffer action.Annexation between top heat radiator 41 and the bottom heat radiator 42 can also be: top heat radiator 41 comprises at least two heat radiator; Bottom heat radiator 42 comprises at least two heat radiator, the grafting that the mutual not full weight of the heat radiator in heat radiator in the top heat radiator 41 and the bottom heat radiator 42 is closed.
The present invention sends the heat on the CPU module 3 to industrial computer housing 1 through heat-conducting mechanism, and is big as the area of dissipation of the industrial computer housing 1 of cooling mechanism, can dispel the heat for CPU module 3 rapidly, realizes the high efficiency and heat radiation purpose.Secondly, the industrial computer structure of preferred no fan structure among the present invention reduces the thermal convection in the industrial computer housing 1, effectively avoids extraneous dust to get into industrial computer housing 1 inside.In addition, it is thinner that industrial computer housing 1 is all done usually, when external unit impacts to industrial computer housing 1; Because the effect of slidably pegging graft between top heat radiator 41 and the bottom heat radiator 42; Effectively reduced the impulsive force of external unit, and then reduced impulsive force, through above-mentioned design CPU module 3 to heat-conducting mechanism; The present invention has reduced the destruction of external unit to CPU, can well protect CPU module 3.
Be provided with an electronic cooling sheet 5 between CPU module 3 and the bottom heat radiator 42.5 of electronic cooling sheets need energising just can realize heat transmission, need not any cold-producing medium, pollution-free source, can not produce gyroscopic action, heat transference efficiency is high, and do not have during work vibrations with noise, the life-span is long, installation is easy.Be filled with heat conductive silica gel between top heat radiator 41 and the industrial computer housing 1.Heat conductive silica gel is the material that is used for filling the space between heat-conducting mechanism and the industrial computer housing 1, and its effect is to be used for conducting the heat that heat-conducting mechanism comes out to industrial computer housing 1.The bottom of bottom heat radiator 42 is fixed on the mainboard 2 through screw 6.Be convenient to dismounting and maintenance.The top of top heat radiator 41 is fixed on the industrial computer housing 1 through screw 6; The side of top heat radiator 41 and middle part all adopt screw 6 to be fixed on the industrial computer housing 1.Because it is thinner that industrial computer housing 1 is made usually, adopts fixedly heat-conducting mechanism of a plurality of screws 6, can better fix heat-conducting mechanism.
CPU module 3 adopts a CPU module 3 based on the ARM framework.With the reduction power consumption, and practice thrift cost.CPU module 3 connects a wireless sensor system.Wireless sensor system comprises numerous wireless sensers such as a radio temperature sensor, wireless humidity sensor, wireless pressure sensor, wireless liquid level sensor.Can omnibearing monitoring external environment.CPU module 3 also connects a ZigBee network communication module.
More than show and described ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; The present invention is not restricted to the described embodiments; That describes in the foregoing description and the instructions just explains principle of the present invention; Under the prerequisite that does not break away from spirit and scope of the invention, the present invention also has various changes and modifications, and these variations and improvement all fall in the scope of the invention that requires protection.The present invention requires protection domain to be defined by appending claims and equivalent thereof.
Claims (10)
1. the industrial computer that has the CPU protection mechanism and adopt shell to dispel the heat comprises an industrial computer housing, is provided with a mainboard in the said industrial computer housing; Said mainboard is provided with a CPU module; It is characterized in that said CPU module is provided with a heat-conducting mechanism, said heat-conducting mechanism connects a cooling mechanism;
Said heat-conducting mechanism comprises a top heat radiator, a bottom heat radiator, slidably pegs graft between said top heat radiator and the said bottom heat radiator;
Said bottom heat radiator connects said CPU module, and said top heat radiator connects said industrial computer housing, with said industrial computer housing as said cooling mechanism.
2. the industrial computer that has the CPU protection mechanism and adopt the shell heat radiation according to claim 1, it is characterized in that: said CPU module adopts a CPU module based on the ARM framework.
3. the industrial computer that has the CPU protection mechanism and adopt the shell heat radiation according to claim 1; It is characterized in that: the bottom of said top heat radiator is provided with radiation tooth; The top of said bottom heat radiator is provided with and the supporting groove of said radiation tooth, and said top heat radiator and said bottom heat radiator are slidably pegged graft through said radiation tooth and said groove.
4. according to claim 1, the 2 or 3 described industrial computers that have the CPU protection mechanism and adopt the shell heat radiation, it is characterized in that: be provided with an electronic cooling sheet between said CPU module and the said bottom heat radiator.
5. the industrial computer that has the CPU protection mechanism and adopt the shell heat radiation according to claim 4 is characterized in that: be filled with heat conductive silica gel between said top heat radiator and the said industrial computer housing.
6. the industrial computer that has the CPU protection mechanism and adopt the shell heat radiation according to claim 4 is characterized in that: screw retention is passed through on said mainboard in the bottom of said bottom heat radiator;
Screw retention is passed through on said industrial computer housing in the top of said top heat radiator;
The side at the top of said top heat radiator and middle part all adopt screw retention on said industrial computer housing.
7. the industrial computer that has the CPU protection mechanism and adopt the shell heat radiation according to claim 6 is characterized in that: said industrial computer housing employing one is not more than the cabinet of 1U;
The height of said heat-conducting mechanism is less than 4cm.
8. the industrial computer that has the CPU protection mechanism and adopt the shell heat radiation according to claim 4, it is characterized in that: said CPU module connects a wireless sensor system.
9. the industrial computer that has the CPU protection mechanism and adopt the shell heat radiation according to claim 8, it is characterized in that: said wireless sensor system comprises a radio temperature sensor, wireless humidity sensor, wireless pressure sensor and wireless liquid level sensor.
10. the industrial computer that has the CPU protection mechanism and adopt the shell heat radiation according to claim 8, it is characterized in that: said CPU module also connects a ZigBee network communication module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100239589A CN102609053A (en) | 2011-01-21 | 2011-01-21 | Industrial personal computer provided with CPU (central processing unit) protection mechanism and radiating through housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100239589A CN102609053A (en) | 2011-01-21 | 2011-01-21 | Industrial personal computer provided with CPU (central processing unit) protection mechanism and radiating through housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102609053A true CN102609053A (en) | 2012-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100239589A Pending CN102609053A (en) | 2011-01-21 | 2011-01-21 | Industrial personal computer provided with CPU (central processing unit) protection mechanism and radiating through housing |
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| CN (1) | CN102609053A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112198946A (en) * | 2020-09-22 | 2021-01-08 | 唐山师范学院 | Computer host heat abstractor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201191959Y (en) * | 2008-03-17 | 2009-02-04 | 讯凯国际股份有限公司 | Heat conducting construction |
| CN201583886U (en) * | 2010-01-12 | 2010-09-15 | 北京中科腾越科技发展有限公司 | Radiator system of computer |
| CN201654600U (en) * | 2009-12-24 | 2010-11-24 | 上海网环信息科技有限公司 | Industrial computer realizing sufficient contact between CPU and outer casing through spring |
-
2011
- 2011-01-21 CN CN2011100239589A patent/CN102609053A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201191959Y (en) * | 2008-03-17 | 2009-02-04 | 讯凯国际股份有限公司 | Heat conducting construction |
| CN201654600U (en) * | 2009-12-24 | 2010-11-24 | 上海网环信息科技有限公司 | Industrial computer realizing sufficient contact between CPU and outer casing through spring |
| CN201583886U (en) * | 2010-01-12 | 2010-09-15 | 北京中科腾越科技发展有限公司 | Radiator system of computer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112198946A (en) * | 2020-09-22 | 2021-01-08 | 唐山师范学院 | Computer host heat abstractor |
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Application publication date: 20120725 |