CN203164827U - Industrial control all-in-one machine with heat conduction mechanism - Google Patents
Industrial control all-in-one machine with heat conduction mechanism Download PDFInfo
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- CN203164827U CN203164827U CN 201320031472 CN201320031472U CN203164827U CN 203164827 U CN203164827 U CN 203164827U CN 201320031472 CN201320031472 CN 201320031472 CN 201320031472 U CN201320031472 U CN 201320031472U CN 203164827 U CN203164827 U CN 203164827U
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- heat
- heat radiator
- conducting mechanism
- shell
- cpu module
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Abstract
The utility model relates to an industrial computer. An industrial control all-in-one machine with a heat conduction mechanism comprises an all-in-one industrial control machine body, wherein the all-in-one industrial control machine body comprises a displayer, a host, an outer shell and a fan. The outer shell of the host is not provided with a ventilation opening, the host is provided with a mainboard, a CPU module is arranged on the mainboard, the CPU module is connected with the heat conduction mechanism, and the heat conduction mechanism comprises an upper portion cooling fin and a lower portion cooling fin. The upper portion cooling fin and the lower portion cooling fin are connected in an inserted and sliding mode, the lower portion cooling fin is arranged in the air supplying direction of the fan, the upper portion cooling fin is connected with a cooling mechanism, and the cooling mechanism is communicated with the outside world. The host conducts heat outwards through the cooling mechanism, therefore, the outer shell does not need the ventilation opening, and the strength of the outer shell of the host is increased. Meanwhile, the dust can not enter the outer shell through the ventilation opening, and the industrial control all-in-one machine can be suitable for the dusty environment.
Description
Technical field
The utility model relates to computing machine, is specifically related to industrial computer.
Background technology
Industrial computer provides best solution for man-machine interface and production procedure control.Different with general commercial computer, the industrial computer product line possesses firm, shockproof, moistureproof, dustproof, high temperature resistant many slots and is easy to characteristics such as expansion.It is the optimal platform of other various application in various Industry Control, traffic control, environment protection control and the automatic field.
But, industrial computer on the market relies on the conventional fan heat radiation more, and main frame one side is provided with thermovent, and the bulk strength that is arranged so that industrial computer of thermovent reduces greatly, and owing to dust in the environment for use of industrial computer is more, dust is entered by thermovent easily.Portability and the serviceable life of industrial computer have directly been influenced.
The utility model content
The purpose of this utility model is to provide the industry control all-in-one of band heat-conducting mechanism, to solve the problems of the technologies described above.
The technical matters that the utility model solves can realize by the following technical solutions:
The industry control all-in-one of band heat-conducting mechanism, comprise integral type industrial computer main body, described integral type industrial computer main body comprises display, main frame, shell, fan, it is characterized in that, described host housing does not have ventilating opening, and described main frame is provided with a mainboard, and described mainboard is provided with a CPU module, described CPU module connects a heat-conducting mechanism
Described heat-conducting mechanism comprises a top heat radiator, a bottom heat radiator, slidably pegs graft between described top heat radiator and the described bottom heat radiator;
Described bottom heat radiator is positioned at the air supply direction of described fan, and described top heat radiator connects a cooling mechanism, and described cooling mechanism is in communication with the outside.
The heat that will produce when the CPU module will be worked by heat-conducting mechanism conducts to the cooling mechanism that is in communication with the outside, and by cooling mechanism heat is left.Main frame outwards conducts heat by cooling mechanism, and shell need not air vent like this, and this just makes host housing intensity increase, and dust can not enter in the shell by ventilating opening simultaneously, can adapt to the environment of many dusts.
Described fan is provided with a blast pipe, a discharge pipe, and described blast pipe is away from described CPU module, and described discharge pipe is towards described CPU module.Can effectively control the direction of thermal convection into and out of the design of airduct, make the cold air away from the CPU module blow to the CPU module effectively.
The mode of slidably pegging graft between top heat radiator and the bottom heat radiator can effectively reduce the impulsive force of external unit to heat-conducting mechanism, and then reduce the impulsive force to the CPU module.The utility model adopts the heat-conducting mechanism with impact resistance, has effectively reduced the destruction of external unit to the CPU module, can well protect the CPU module.
The bottom of described top heat radiator is provided with radiation tooth, and the top of described bottom heat radiator is provided with the groove supporting with described radiation tooth, and described top heat radiator and described bottom heat radiator are slidably pegged graft.Do not agree with grafting between top heat radiator and the bottom heat radiator entirely, in order to leave the leeway of buffering for the radiation tooth between top heat radiator and the bottom heat radiator.
Be filled with heat conductive silica gel between described top heat radiator and the described shell.Heat conductive silica gel is the material of filling the space between heat-conducting mechanism and the shell, and its effect is the heat that comes out to shell conduction heat-conducting mechanism.
The bottom of described bottom heat radiator is fixed on the described mainboard by screw.Be convenient to dismounting and maintenance.
The top of described top heat radiator is fixed on the described shell by screw; The side at the top of described top heat radiator and middle part all adopt screw to be fixed on the described shell.Because it is thinner that shell is made usually, adopts fixedly heat-conducting mechanism of a plurality of screws, can better fix heat-conducting mechanism.
Described CPU module adopts a CPU module based on the ARM framework.With the reduction power consumption, and save cost.
Can be with described shell as described cooling mechanism.Send the heat on the CPU module to shell by heat-conducting mechanism, big as the area of dissipation of the shell of cooling mechanism, can dispel the heat for the CPU module rapidly, realize the high efficiency and heat radiation purpose.
Described shell can adopt a metal shell.Metal shell heat conduction is rapid, so that the utility model is further realized the high efficiency and heat radiation purpose under the big prerequisite of area of dissipation.Described shell also can be made of heat radiator, moves towards about described heat radiator.
Described shell can be provided with the heat radiation groove.Can effectively increase the contact area of shell and air by the heat radiation groove, and form a diffusing wind and use the air channel, further improve radiating effect.Described shell can also be made of heat radiator.
In order to increase area of dissipation, play thermolysis, described host housing rear portion is provided with outside heat sink, can be with described outside heat sink as cooling mechanism.Consider that the machine works state is conducive to air convection current up and down, better heat radiation, described outside heat sink is moved towards up and down.
Described main frame both sides interface is provided with the proof rubber cover, and described proof rubber cover can play the water proof and dust proof effect.
Use for convenience, the industry control all-in-one of band heat-conducting mechanism is built-in with wireless network card, and described wireless network card connects described CPU module.
Description of drawings
Fig. 1 is the part-structure synoptic diagram at the utility model mainboard place.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose with effect is easy to understand, below in conjunction with the further elaboration the utility model of concrete diagram.
With reference to Fig. 1, the industry control all-in-one of band heat-conducting mechanism comprises integral type industrial computer main body, and integral type industrial computer main body comprises display, main frame, shell 1, fan etc.Main frame is provided with a mainboard 2, and mainboard 2 is provided with a CPU module 4, and CPU module 4 connects a heat-conducting mechanism, and heat-conducting mechanism comprises a top heat radiator 3, a bottom heat radiator 5, slidably pegs graft between top heat radiator 3 and the bottom heat radiator 5; Bottom heat radiator 5 is positioned at the air supply direction of fan, and top heat radiator 3 connects a cooling mechanism, and cooling mechanism is in communication with the outside.The heat that will produce when CPU module 4 will be worked by heat-conducting mechanism conducts to the cooling mechanism that is in communication with the outside, and by cooling mechanism heat is left.Main frame outwards conducts heat by cooling mechanism, and host housing 1 need not air vent like this, and this just makes host housing 1 intensity increase, and dust can not enter in the shell 1 by ventilating opening simultaneously, can adapt to the environment of many dusts.
Fan is provided with a blast pipe, a discharge pipe, and blast pipe is away from CPU module 4, and discharge pipe is towards CPU module 4.Can effectively control the direction of thermal convection into and out of the design of airduct, make the cold air away from CPU module 4 blow to CPU module 4 effectively.
The mode of slidably pegging graft between top heat radiator 3 and the bottom heat radiator 5 can effectively reduce the impulsive force of external unit to heat-conducting mechanism, and then reduce the impulsive force to CPU module 4.The utility model adopts the heat-conducting mechanism with impact resistance, has effectively reduced the destruction of external unit to CPU module 4, can well protect CPU module 4.The bottom of top heat radiator 3 is provided with radiation tooth, and the top of bottom heat radiator 5 is provided with the groove supporting with radiation tooth, and top heat radiator 3 is slidably pegged graft with bottom heat radiator 5.Do not agree with grafting between top heat radiator 3 and the bottom heat radiator 5 entirely, in order to leave the leeway of buffering for the radiation tooth between top heat radiator 3 and the bottom heat radiator 5.Be filled with heat conductive silica gel between top heat radiator 3 and the shell 1.Heat conductive silica gel is the material of filling the space between heat-conducting mechanism and the shell 1, and its effect is the heat that comes out to shell 1 conduction heat-conducting mechanism.The bottom of bottom heat radiator 5 is fixed on the mainboard 2 by screw.Be convenient to dismounting and maintenance.The top of top heat radiator 3 is fixed on the shell 1 by screw; The side at the top of top heat radiator 3 and middle part all adopt screw to be fixed on the shell 1.Because it is thinner that shell 1 is made usually, adopts fixedly heat-conducting mechanism of a plurality of screws, can better fix heat-conducting mechanism.
Can be with shell 1 as cooling mechanism.Send the heat on the CPU module 4 to shell 1 by heat-conducting mechanism, big as the area of dissipation of the shell 1 of cooling mechanism, can dispel the heat for CPU module 4 rapidly, realize the high efficiency and heat radiation purpose.Shell 1 can adopt a metal shell.Metal shell heat conduction is rapid, so that the utility model is further realized the high efficiency and heat radiation purpose under the big prerequisite of area of dissipation.Shell 1 also can be made of heat radiator, moves towards about heat radiator.Shell 1 can be provided with the heat radiation groove.Can effectively increase the contact area of shell 1 and air by the heat radiation groove, and form the wind that looses and use the air channel, further improve radiating effect.Shell 1 can also be made of heat radiator.
In order to increase area of dissipation, play thermolysis, host housing 1 rear portion is provided with outside heat sink, can be with outside heat sink as cooling mechanism.Consider that the machine works state is conducive to air convection current up and down, better heat radiation, outside heat sink is moved towards up and down.
CPU module 4 adopts a CPU module based on the ARM framework.With the reduction power consumption, and save cost.Main frame both sides interface is provided with the proof rubber cover, and the proof rubber cover can play the water proof and dust proof effect.
More than show and described ultimate principle of the present utility model and principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; that describes in above-described embodiment and the instructions just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (10)
1. be with the industry control all-in-one of heat-conducting mechanism, comprise integral type industrial computer main body, described integral type industrial computer main body comprises display, main frame, shell, fan, it is characterized in that, described host housing does not have ventilating opening, and described main frame is provided with a mainboard, and described mainboard is provided with a CPU module, described CPU module connects a heat-conducting mechanism
Described heat-conducting mechanism comprises a top heat radiator, a bottom heat radiator, slidably pegs graft between described top heat radiator and the described bottom heat radiator;
Described bottom heat radiator is positioned at the air supply direction of described fan, and described top heat radiator connects a cooling mechanism, and described cooling mechanism is in communication with the outside.
2. the industry control all-in-one of band heat-conducting mechanism according to claim 1 is characterized in that, described fan is provided with a blast pipe, a discharge pipe, and described blast pipe is away from described CPU module, and described discharge pipe is towards described CPU module.
3. the industry control all-in-one of band heat-conducting mechanism according to claim 1, it is characterized in that, the bottom of described top heat radiator is provided with radiation tooth, and the top of described bottom heat radiator is provided with the groove supporting with described radiation tooth, and described top heat radiator and described bottom heat radiator are slidably pegged graft.
4. the industry control all-in-one of band heat-conducting mechanism according to claim 1 is characterized in that, as described cooling mechanism, described shell adopts a metal shell with described shell.
5. the industry control all-in-one of band heat-conducting mechanism according to claim 1 is characterized in that, as described cooling mechanism, described shell is made of heat radiator with described shell, moves towards about described heat radiator.
6. the industry control all-in-one of band heat-conducting mechanism according to claim 1 is characterized in that, described host housing rear portion is provided with outside heat sink, and as cooling mechanism, described outside heat sink is moved towards up and down with described outside heat sink.
7. according to the industry control all-in-one of any described band heat-conducting mechanism in the claim 1 to 6, it is characterized in that, be filled with heat conductive silica gel between described top heat radiator and the described shell.
8. according to the industry control all-in-one of any described band heat-conducting mechanism in the claim 1 to 6, it is characterized in that the bottom of described bottom heat radiator is fixed on the described mainboard by screw;
The top of described top heat radiator is fixed on the described shell by screw.
9. according to the industry control all-in-one of any described band heat-conducting mechanism in the claim 1 to 6, it is characterized in that described CPU module adopts a CPU module based on the ARM framework.
10. according to the industry control all-in-one of any described band heat-conducting mechanism in the claim 1 to 6, it is characterized in that the industry control all-in-one of band heat-conducting mechanism is built-in with wireless network card, described wireless network card connects described CPU module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320031472 CN203164827U (en) | 2013-01-22 | 2013-01-22 | Industrial control all-in-one machine with heat conduction mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320031472 CN203164827U (en) | 2013-01-22 | 2013-01-22 | Industrial control all-in-one machine with heat conduction mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN203164827U true CN203164827U (en) | 2013-08-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320031472 Expired - Fee Related CN203164827U (en) | 2013-01-22 | 2013-01-22 | Industrial control all-in-one machine with heat conduction mechanism |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407804A (en) * | 2018-11-14 | 2019-03-01 | 合肥市航嘉电子技术有限公司 | A kind of industry control, server power supply bottom radiating structure |
-
2013
- 2013-01-22 CN CN 201320031472 patent/CN203164827U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109407804A (en) * | 2018-11-14 | 2019-03-01 | 合肥市航嘉电子技术有限公司 | A kind of industry control, server power supply bottom radiating structure |
| CN109407804B (en) * | 2018-11-14 | 2021-10-01 | 合肥市航嘉电子技术有限公司 | Bottom heat radiation structure of industrial control and server power supply |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 Termination date: 20190122 |
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| CF01 | Termination of patent right due to non-payment of annual fee |