CN112194997A - Acrylic pressure-sensitive adhesive and ultraviolet curing adhesive tape obtained by using same and used for laser cutting of thin glass - Google Patents
Acrylic pressure-sensitive adhesive and ultraviolet curing adhesive tape obtained by using same and used for laser cutting of thin glass Download PDFInfo
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- CN112194997A CN112194997A CN202010958744.XA CN202010958744A CN112194997A CN 112194997 A CN112194997 A CN 112194997A CN 202010958744 A CN202010958744 A CN 202010958744A CN 112194997 A CN112194997 A CN 112194997A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/106—Presence of homo or copolymers of propene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
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- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an acrylic pressure-sensitive adhesive and an ultraviolet curing adhesive tape for laser cutting of thin glass, which is obtained by using the acrylic pressure-sensitive adhesive, and belongs to the technical field of special adhesive tapes. The substrate layer is PVC, PE, CPP, PO material, pressure sensitive adhesive layer is acrylic acid pressure sensitive adhesive layer, can carry out heat crosslinking reaction and photocuring reaction, the protective layer is PET, CPP, PP or the PE membrane of top layer coating organosilicon release agent. The ultraviolet curing adhesive tape for thin glass laser cutting has good flexibility and very low adhesive force, and can realize the process of picking up a film by directly feeding the film to a picking machine without falling after the film is cut and separated by thin optical glass laser.
Description
Technical Field
The invention belongs to the field of special adhesive tapes, and particularly relates to an acrylic pressure-sensitive adhesive and an ultraviolet curing adhesive tape obtained by using the same and used for thin glass laser cutting.
Background
The special adhesive tape is widely applied in various fields, such as building materials, electronics, automobiles, household appliances and the like, plays roles of protection and carrier tape in the manufacturing process of semi-finished products, and plays roles of fixation, protection and buffering in finished products. In the field of thin glass, the special adhesive tape is mainly used as a processing carrier tape and a processing protective adhesive tape.
In recent years, with the rapid development of the electronic industry, thin glass has been widely used, such as optical filters in the optical field, substrates in the semiconductor field, and the like. In the application fields, the thickness of the thin glass is generally 0.1-5 mm, the traditional cutting mode is generally mechanical knife cutting, but the mechanical knife cutting has the problems of large edge breakage in quality, low production efficiency in efficiency, high material consumption cost in cost, low effective utilization rate of the glass, large water resource pollution and waste in environmental protection and the like, and the problems are gradually replaced by laser cutting.
With the application of laser cutting to thin glass, the pursuit of efficiency and quality by the industry is higher and higher. According to the traditional adhesive tape for laser cutting, due to the reasons that the adhesive force of the pressure-sensitive adhesive after ultraviolet curing is high and the flexibility of the base material is poor, thin glass must be transferred to an electrostatic film after ultraviolet curing, a piece is picked up by a piece picking machine on the electrostatic film, the piece picking machine is not directly mounted on the adhesive tape for the electrostatic film, and the problem that the glass cannot be taken away from the cutting adhesive tape exists. The process of transferring the thin glass to the electrostatic film increases the raw material cost of the electrostatic film, increases the labor cost of the transfer, increases the probability of dirt and scratch by one process, and solves the problems that the electrostatic film is easy to have residual glue and film marks. Therefore, a cutting adhesive tape which can be directly picked up by a picking machine after being cured by ultraviolet light is urgently needed to reduce the cost and improve the yield, which is a blank in domestic and foreign markets.
Disclosure of Invention
The invention aims to provide an acrylic pressure-sensitive adhesive and an ultraviolet curing adhesive tape obtained by using the same and used for laser cutting of thin glass.
An acrylic pressure sensitive adhesive, comprising: 90-110 parts of OH-containing acrylate, 1-10 parts of an auxiliary agent, 5-10 parts of a reactive diluent, 0.5-1 part of a thermal curing agent, 0.5-1.5 parts of a photoinitiator, 15-35 parts of a solvent, wherein the thermal curing agent is an isocyanate curing agent, the photoinitiator is at least one of 2-hydroxy-2-methyl-1-phenyl acetone, 1-hydroxycyclohexyl phenyl ketone and diphenyl- (2,4, 6-trimethylbenzoyl) oxyphosphorus (TPO), the reactive diluent is trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, pentaerythritol triacrylate and propoxylated glycerol triacrylate, the auxiliary agent is epoxy resin, and the solvent is at least one of ethyl acetate, toluene and cyclohexanone. The photoinitiator is one or more initiator combinations with light absorption peaks between 240nm and 410nm, which undergo chain extension reactions with-C = C-unsaturated bonds in acrylate molecules, coagents and reactive diluents.
Wherein: the OH-containing acrylate is LKG1705 or TP755, the assistant is Atlac430 or Fuchen880, the reactive diluent is trimethylolpropane triacrylate, and the heat curing agent is L75 or N3300.
The preparation method of the acrylic pressure-sensitive adhesive comprises the following steps: and sequentially adding the acrylate containing OH, the reactive diluent and the auxiliary agent into a reactor, adding the solvent, starting stirring (200 rpm), sequentially adding the photoinitiator and the thermal curing agent, and continuously stirring at 500rpm for 30-60 min to obtain the epoxy acrylate modified epoxy resin.
The ultraviolet curing adhesive tape for laser cutting of the thin glass, which is obtained by using the acrylic pressure-sensitive adhesive, sequentially comprises the following components from top to bottom: the acrylic pressure-sensitive adhesive layer comprises a base material layer, an acrylic pressure-sensitive adhesive layer and a protective layer;
(1) the base material layer is made of PVC, PE, CPP and PO materials, the thickness of the base material layer is 30-150 mu m, the elongation at break is more than 100%, the tensile elongation is 20-40%, the longitudinal tensile modulus of the material is 3-40 MPa, and the transverse tensile modulus is 50-200% of the longitudinal tensile modulus.
One surface of the substrate layer, which is in contact with the acrylic pressure-sensitive adhesive, is subjected to corona or precoating primer treatment, and the surface tension coefficient is not lower than 42 dyn/cm.
(2) The thickness of the pressure-sensitive adhesive layer is 5-35 mu m, the adhesive force after thermosetting is 3000mN/25mm-45000mN/25mm, and the adhesive force after photocuring is 10 mN/25 mm-700 mN/25 mm;
(3) the protective layer is a PET, CPP, PP or PE film with the surface coated with an organic silicon release agent, the color can be any one of transparent, milky white, blue, green and red, the thickness of the protective layer is 20-155 mu m, the release force is 10 mN/25mm and 100mN/25mm, the surface coated with the organic silicon is contacted with the pressure-sensitive adhesive layer, and the thickness of the organic silicon release agent layer is 100nm-5 mu m.
The preparation method of the ultraviolet curing adhesive tape comprises the following steps: using a coater at 10g/m2~20g/m2Coating the prepared acrylic pressure-sensitive adhesive on a release agent layer of a protective layer, drying the acrylic pressure-sensitive adhesive in a 6-section 3-meter drying oven at the speed of 10m/min, wherein the drying oven is sequentially at the temperature of 90 ℃, 110 ℃, 120 ℃, 130 ℃, 120 ℃ or 90 ℃, 110 ℃, 120 ℃ and 110 ℃, and the selected substrate layer and the acrylic pressure-sensitive adhesive layer with the protective film are compounded at normal temperature through a compounding device, and the surface of the substrate layer subjected to corona treatment is required to be in contact with the acrylic pressure-sensitive adhesive; and baking the compounded product at 35-45 ℃ for 48-96 hours to obtain the composite material.
The ultraviolet curing adhesive tape for laser cutting of thin glass, which is obtained by the invention, has good flexibility and very low adhesive force, and can realize the process of directly picking up a piece by a piece picking machine without falling a film after laser cutting and glue releasing of thin optical glass.
Drawings
FIG. 1 is a photograph showing a UV curable adhesive tape product obtained in example 1 of the present invention.
Detailed Description
The technical solutions of the present invention are further described in detail below with reference to the drawings and examples, but should not be construed as limiting the technical solutions of the present invention.
Example 1
An ultraviolet curing adhesive tape for laser cutting of thin glass comprises the following components:
substrate layer:
selecting a milky PO base film with the thickness of 100 mu m, wherein the elongation at break is 630 percent, the tensile elongation is 30 percent, the longitudinal tensile modulus is 10.2Mpa, the transverse tensile modulus is 12.1MPa, and the surface tension coefficient reaches 52dyn/cm through corona treatment;
acrylic pressure sensitive adhesive layer:
the acrylic resin adopts LKG1705 in the rattan chemical industry, the reactive diluent adopts TMPTA to improve the reaction efficiency, the auxiliary agent adopts Atlac430 in DSM to improve the molecular weight, the mixture of ethyl acetate, toluene and cyclohexanone is used as a solvent, the mixture of Pasf 1173 (chemical name: 2-hydroxy-2-methyl-1-phenyl acetone) is used as a light curing agent, and the Bayer L75 is used as a heat curing agent;
the preparation method comprises the following steps:
protective layer:
H350A (H350A is that silicone release agent is coated on the PET surface) with thickness of 51 μm of Taiwan south Asia company is selected as a protective layer, the thickness of the release agent layer is 1 μm, and the release force is 15g/25 mm.
Using a coater at 20g/m2Coating the prepared acrylic pressure-sensitive adhesive on a release agent layer of a protective layer, drying the acrylic pressure-sensitive adhesive in a drying oven with the speed of 10m/min and the length of 6 sections and the length of 3 meters, wherein the temperature of the drying oven is 90 ℃, 110 ℃, 120 ℃, 130 ℃ and 120 ℃, the selected base material layer and the acrylic pressure-sensitive adhesive layer with the protective film are compounded at normal temperature through a compounding device, and the surface of the base material layer subjected to corona treatment is required to be contacted with the pressure-sensitive adhesive; and (3) putting the compounded product into a drying oven at 40 ℃ for baking for 48 hours to obtain the product.
Through the above steps, the product of the present invention can be manufactured, as shown in fig. 1.
The properties are as follows:
example 2
An ultraviolet light curing adhesive tape for laser cutting of thin glass,
substrate layer:
a milky PO base film with the thickness of 150 mu m is selected, the breaking elongation of the PO base film is 660 percent, the tensile elongation of the PO base film is 30 percent, the longitudinal tensile modulus is 10.2MPa, the transverse tensile modulus is 9.5MPa, and the surface tension coefficient of the PO base film is 44dyn/cm through corona treatment.
Acrylic pressure sensitive adhesive layer:
the acrylic resin is TP755 of Nanbao resin, the reactive diluent is TMPTA to improve the reaction efficiency, the auxiliary agent is Fuchen880 to improve the molecular weight, the mixture of ethyl acetate and cyclohexanone is used as a solvent, I184 (1-hydroxycyclohexyl phenyl ketone) of basf is used as a light curing agent, and N3300 of Bayer is used as a heat curing agent.
The preparation method comprises the following steps:
protective layer:
H350A with the thickness of 51 mu mm and the surface coated with an organic silicon release agent produced in south Taiwan Asia is selected as a protective layer, the thickness of the release agent layer is 1 mu m, and the release force is 15g/25 mm.
Using a coater at 10g/m2Coating the prepared acrylic pressure-sensitive adhesive on a release agent layer of a protective layer, drying the acrylic pressure-sensitive adhesive in a drying oven with the speed of 10m/min and the length of 6 sections and the length of 3 meters, wherein the temperature of the drying oven is 90 ℃, 110 ℃, 120 ℃ and 110 ℃, the selected base material layer and the acrylic pressure-sensitive adhesive layer with the protective film are compounded at normal temperature through a compounding device, and the surface of the base material layer subjected to corona treatment is required to be in contact with the acrylic pressure-sensitive adhesive; and (3) putting the compounded product into a baking oven at 45 ℃ for baking for 72 hours to obtain the product.
Through the steps, the product of the invention can be manufactured.
The properties are as follows:
example 3
A preparation method of an ultraviolet curing adhesive tape for thin glass laser cutting comprises the following specific steps:
substrate layer:
a colorless PVC film with the thickness of 80 mu m is selected, the breaking elongation of the film is 280 percent, the tensile elongation of the film is 30 percent, the longitudinal tensile modulus is 7.2MPa, the transverse tensile modulus is 5.5MPa, and the surface tension coefficient of the film is up to 46dyn/cm through corona treatment.
Acrylic pressure sensitive adhesive layer:
the acrylic resin adopts LKG1705 in the rattan chemical industry, the reactive diluent adopts TMPTA to improve the reaction efficiency, the auxiliary agent adopts Fuchen880 in Shanghai Fuchen chemical industry Co., Ltd to improve the molecular weight, the mixture of ethyl acetate and cyclohexanone is used as a solvent, TPO (chemical name: diphenyl- (2,4, 6-trimethylbenzoyl) oxyphosphorus) in Pasf is used as a light curing agent, and N3300 in Bayer is used as a heat curing agent.
The preparation method comprises the following steps:
protective layer:
H350A with thickness of 51 μm and surface coated with organosilicon release agent of south Taiwan Asia company is selected as a protective layer, the thickness of the release agent layer is 1 μm, and the release force is 15g/25 mm.
Using a coater at 20g/m2Coating the prepared acrylic pressure-sensitive adhesive on a release agent layer of a protective layer, drying by a 6-section oven at the temperature of 90 ℃, 110 ℃, 120 ℃, 130 ℃ and 120 ℃ in sequence, compounding the selected base material layer and the acrylic pressure-sensitive adhesive layer with the protective film at normal temperature by a compounding device, and contacting the surface of the base material layer subjected to corona treatment with the acrylic pressure-sensitive adhesive; and (3) putting the compounded product into a baking oven with the temperature of 35 ℃ for baking for 96 hours to obtain the product.
Through the steps, the product of the invention can be manufactured.
The properties are as follows:
the above embodiments are only for illustrating the preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention within the knowledge of those skilled in the art should be considered as the protection scope of the present application.
Claims (7)
1. An acrylic pressure-sensitive adhesive is characterized by comprising the following components: 90-110 parts of OH-containing acrylate, 1-10 parts of an auxiliary agent, 5-10 parts of a reactive diluent, 0.5-1 part of a thermal curing agent, 0.5-1.5 parts of a photoinitiator and 15-35 parts of a solvent, wherein the thermal curing agent is an isocyanate curing agent, the photoinitiator is at least one of 2-hydroxy-2-methyl-1-phenyl acetone, 1-hydroxycyclohexyl phenyl ketone and diphenyl- (2,4, 6-trimethylbenzoyl) oxyphosphorus, the reactive diluent is trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, pentaerythritol triacrylate and propoxylated glycerol triacrylate, the auxiliary agent is epoxy resin, and the solvent is at least one of ethyl acetate, toluene and cyclohexanone.
2. The acrylic pressure-sensitive adhesive of claim 1, wherein the OH-containing acrylate is LKG1705 or TP755, the auxiliary agent is Atlac430 or Fuchen880, the reactive diluent is trimethylolpropane triacrylate, and the thermal curing agent is L75 or N3300.
3. The method for preparing the acrylic pressure sensitive adhesive according to claim 1 or 2, wherein the process is as follows: and sequentially adding the acrylate containing OH, the reactive diluent and the auxiliary agent into a reactor, adding the solvent, starting stirring, sequentially adding the photoinitiator and the thermal curing agent, and continuously stirring for 30-60 min to obtain the epoxy acrylate modified epoxy resin.
4. The ultraviolet curing adhesive tape for laser cutting of thin glass, which is obtained by using the acrylic pressure sensitive adhesive as defined in claim 1 or 2, is characterized by comprising the following components in sequence from top to bottom: the acrylic pressure-sensitive adhesive layer comprises a base material layer, an acrylic pressure-sensitive adhesive layer and a protective layer; one surface of the substrate layer, which is in contact with the acrylic pressure-sensitive adhesive, is subjected to corona or precoating primer treatment, and the surface tension coefficient is not less than 42 dyn/cm; the thickness of the pressure-sensitive adhesive layer is 5-35 μm, the adhesive force after thermal curing is 3000mN/25mm-45000mN/25mm, and the adhesive force after photo-curing is 10 mN/25 mm-700 mN/25 mm.
5. The special adhesive tape for laser cutting of thin-layer glass according to claim 4, wherein the base material layer is made of PVC, PE, CPP or PO, the thickness of the base material layer is 30-150 μm, the elongation at break is 100%, the tensile elongation is 20-40%, the longitudinal tensile modulus of the material is 3-40 MPa, and the transverse tensile modulus of the material is 50-200% of the longitudinal tensile modulus.
6. The special adhesive tape for laser cutting of thin glass according to claim 4, wherein the protective layer is a PET, CPP, PP or PE film coated with an organic silicon release agent on the surface, the thickness of the release agent layer is 0.1-5 μm, the total thickness is 20-155 μm, the release force is 10-25-100 mN/25mm, and the surface coated with the organic silicon release agent is in contact with the pressure-sensitive adhesive layer.
7. The method for preparing the UV curable adhesive tape according to any one of claims 4 to 6, wherein the process comprises: using a coater at 10g/m2~20g/m2Coating the prepared acrylic pressure-sensitive adhesive on a release agent layer of a protective layer, drying the acrylic pressure-sensitive adhesive in a 6-section 3-meter drying oven at the speed of 10m/min, wherein the drying oven is sequentially at the temperature of 90 ℃, 110 ℃, 120 ℃, 130 ℃, 120 ℃ or 90 ℃, 110 ℃, 120 ℃ and 110 ℃, and the selected substrate layer and the acrylic pressure-sensitive adhesive layer with the protective film are compounded at normal temperature through a compounding device, and the surface of the substrate layer subjected to corona treatment is required to be in contact with the acrylic pressure-sensitive adhesive; and baking the compounded product at 35-45 ℃ for 48-96 hours to obtain the composite material.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113214746A (en) * | 2021-06-29 | 2021-08-06 | 郑州磨料磨具磨削研究所有限公司 | Ultraviolet curing adhesive tape for invisible cutting, preparation method and application |
| CN113372835A (en) * | 2021-06-29 | 2021-09-10 | 郑州磨料磨具磨削研究所有限公司 | High-temperature-resistant ultraviolet-curing adhesive reducing film and preparation method thereof |
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| CN110903790A (en) * | 2019-11-22 | 2020-03-24 | 苏州高泰电子技术股份有限公司 | UV (ultraviolet) viscosity-reducing composition and UV viscosity-reducing adhesive tape with same |
| CN111334216A (en) * | 2020-03-13 | 2020-06-26 | 安徽荣泽科技有限公司 | Dual visbreaking film |
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2020
- 2020-09-14 CN CN202010958744.XA patent/CN112194997A/en active Pending
Patent Citations (3)
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| CN108300352A (en) * | 2018-02-02 | 2018-07-20 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings composition of acid and alkali-resistance, UV visbreaking films and preparation method thereof |
| CN110903790A (en) * | 2019-11-22 | 2020-03-24 | 苏州高泰电子技术股份有限公司 | UV (ultraviolet) viscosity-reducing composition and UV viscosity-reducing adhesive tape with same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113214746A (en) * | 2021-06-29 | 2021-08-06 | 郑州磨料磨具磨削研究所有限公司 | Ultraviolet curing adhesive tape for invisible cutting, preparation method and application |
| CN113372835A (en) * | 2021-06-29 | 2021-09-10 | 郑州磨料磨具磨削研究所有限公司 | High-temperature-resistant ultraviolet-curing adhesive reducing film and preparation method thereof |
| CN113372835B (en) * | 2021-06-29 | 2023-03-14 | 郑州磨料磨具磨削研究所有限公司 | High-temperature-resistant ultraviolet-curing adhesive reducing film and preparation method thereof |
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