CN112745799A - Photolytic adhesive pressure-sensitive adhesive and photolytic adhesive sub-sensitive adhesive tape - Google Patents
Photolytic adhesive pressure-sensitive adhesive and photolytic adhesive sub-sensitive adhesive tape Download PDFInfo
- Publication number
- CN112745799A CN112745799A CN202110065512.6A CN202110065512A CN112745799A CN 112745799 A CN112745799 A CN 112745799A CN 202110065512 A CN202110065512 A CN 202110065512A CN 112745799 A CN112745799 A CN 112745799A
- Authority
- CN
- China
- Prior art keywords
- component
- sensitive adhesive
- photolytic
- adhesive
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a photolytic pressure-sensitive adhesive which comprises a component A, a component B and a component C in the following formula, and is characterized in that: the component A comprises a polyurethane acrylate prepolymer, the component B is an allyl alcohol complex, the component C is an antioxidant 5-tert-butyl-4-hydroxy-2-methyl phenyl sulfide (K300), an initiator is 2-hydroxy-2-methyl-1-phenyl ketone, and an auxiliary agent pentaerythritol triacrylate, wherein the weight part ratio of the component A to the component C is 1: 2-5: 2-5, wherein the weight part ratio of the component A, the component B and the component C is as follows: 70: 20-29: 1-10. According to the invention, the polyurethane acrylic prepolymer prepared specially and the allyl alcohol complex are added, so that the prepared photolysis pressure-sensitive adhesive is easily penetrated by ultraviolet rays, and real photolysis is realized.
Description
Technical Field
The invention belongs to the technical field of adhesive tape preparation, and relates to a photolytic adhesive pressure-sensitive adhesive and a photolytic adhesive sub-sensitive adhesive tape.
Background
In the bearing processing of semiconductor materials and flexible electronic parts, a protective film is often used to protect the semiconductor materials such as wafers and flexible electronic parts. This protective film is a temporary protective film having high adhesive force and capable of adhering to a semiconductor wafer and a flexible electronic component. The wafer is protected from displacement, peeling or flying during the grinding and cutting processes of the semiconductor wafer. After the processing is finished, the temporary protective film can be easily peeled off from the semiconductor wafer or the flexible electronic part, no residual glue is left, the wafer or the flexible electronic part is not polluted, and the picking rate during crystal picking is improved.
Chinese patent application 202010725225.9 discloses an ultraviolet photolysis-bonding polyacrylate pressure-sensitive adhesive and a preparation method thereof, wherein the ultraviolet photolysis-bonding polyacrylate pressure-sensitive adhesive comprises a component A and a component B; wherein the component A comprises a high-strength pressure-sensitive adhesive prepolymer, modified epoxy acrylate, an antioxidant 5-tert-butyl-4-hydroxy-2-methyl phenyl sulfide, a photoinitiator 2,4, 6-trimethyl benzoyl phosphine oxide and polyisobutylene; the component B comprises epoxidized m-xylylenediamine, xylene and ethyl acetate. The ultraviolet photolysis-bonding polyacrylate pressure-sensitive adhesive can be used as a high-strength pressure-sensitive adhesive, and can be debonded without residual adhesive under the irradiation of ultraviolet light with specified wavelength. The pressure-sensitive adhesive prepared by the technology has poor light transmittance, and ultraviolet rays are difficult to penetrate through the bonding surface of the pressure-sensitive adhesive, so that the effect of photolysis cannot be realized in the real technology.
Chinese patent application 201911062912.0 discloses a photolysis adhesive infusion patch, which comprises a base film, an adhesive layer and a dressing block, wherein the adhesive layer comprises the following components in parts by weight: 70-95 parts of waterborne polyurethane, 2-15 parts of polyvinyl alcohol, 2.9-14.8 parts of chitosan and 0.1-0.2 part of ultraviolet curing agent. And (3) uniformly mixing the adhesive layer composition, coating the adhesive layer composition on the surface of the base film through a coating machine, and arranging an applying block to obtain the photolysis bonding infusion patch. The infusion patch has the beneficial effects that the problems that the existing infusion patch is high in viscosity, has residual glue and cannot be quickly removed are solved. But the technique cannot be applied to the technical field of electronic parts.
Disclosure of Invention
The invention aims to solve the problems of difficult stripping and residue in stripping of high-viscosity pressure-sensitive adhesives commonly used in electronic equipment and vehicle-mounted equipment in the prior art, and discloses a photolysis-bonding pressure-sensitive adhesive and a preparation method thereof.
In order to achieve the purposes, the specific scheme is as follows:
the photolytic pressure-sensitive adhesive comprises a component A, a component B and a component C in the following formula, and is characterized in that: the component A comprises a polyurethane acrylate prepolymer, the component B is an allyl alcohol complex, the component C is an antioxidant 5-tert-butyl-4-hydroxy-2-methyl phenyl sulfide (K300), an initiator is 2-hydroxy-2-methyl-1-phenyl ketone, and an auxiliary agent pentaerythritol triacrylate, wherein the weight part ratio of the component A to the component C is 1: 2-5: 2-5, wherein the weight part ratio of the component A, the component B and the component C is as follows: 70: 20-29: 1-10.
The preparation method of the polyurethane acrylate prepolymer comprises the following steps: adding isophorone diisocyanate, polyether polyol, butyl acrylate and arylamine in parts by weight into a reaction kettle, and uniformly stirring at the temperature of 60-90 ℃ for 3-8 hours to obtain the stable polyurethane acrylic prepolymer.
The adhesive comprises isophorone diisocyanate, polyether polyol, butyl acrylate and arylamine in a weight portion ratio of 10:20-50:10-20: 1-3.
The preparation method of the propenol complex comprises the following steps: firstly, the polyoxypropylene alcohol is vacuumized and dehydrated for 30min at the temperature of 120 ℃. And then, under the protection of nitrogen, dropwise adding polyoxypropylene alcohol into excessive diisocyanate while stirring (the molar ratio of (-NCO to-OH groups is 2:1), adding a small amount of catalyst dibutyltin dilaurate, controlling the reaction temperature at 95-100 ℃, stopping heating after 1h of reaction, cooling and discharging to obtain the allyl alcohol complex.
The preparation method of the photolytic adhesive pressure-sensitive adhesive comprises the following steps:
1) preparing a component A: adding isophorone diisocyanate, polyether polyol, butyl acrylate and arylamine into a reaction kettle according to parts by weight, and uniformly stirring at the temperature of 60-90 ℃ for 3-8 hours to obtain a stable polyurethane acrylic prepolymer;
2) preparing a component B: firstly, the polyoxypropylene alcohol is vacuumized and dehydrated for 30min at the temperature of 120 ℃. Then, under the protection of nitrogen, dropwise adding polyoxypropylene alcohol into excessive diisocyanate while stirring (-the molar ratio of NCO to-OH groups is 2:1), adding a small amount of catalyst dibutyltin dilaurate, controlling the reaction temperature at 95-100 ℃, stopping heating after reacting for 1h, cooling and discharging to obtain an allyl alcohol complex;
3) and mixing the component A and the component B uniformly, adding the component C, and mixing uniformly at the temperature of 30-50 ℃ to prepare the photolysis pressure-sensitive adhesive.
The preparation method of the photolytic adhesive sub-sensitive adhesive tape comprises the following steps:
coating the photolysis pressure-sensitive adhesive on a base material, drying at 40-50 ℃ for 10-20min, attaching a release film, and detecting the peel strength of the adhesive tape before and after ultraviolet irradiation according to the standard GB/T2792-2014.
Compared with the prior art, the invention has the following technical effects:
1. according to the invention, the polyurethane acrylic prepolymer prepared specially and the allyl alcohol complex are added, so that the prepared photolysis pressure-sensitive adhesive is easily penetrated by ultraviolet rays, and real photolysis is realized.
2. The stripping strength of the photolytic adhesive prepared by the invention is greatly different in the presence or absence of ultraviolet irradiation.
3. Tests prove that the reaction of the allyl alcohol complex and the polyurethane acrylic prepolymer can increase the internal coupling of the colloid and enhance the shearing resistance of the photolysis pressure-sensitive adhesive.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A first part:
preparing a polyurethane acrylate prepolymer: weighing 10kg of isophorone diisocyanate, 20kg of polyether polyol, 15kg of butyl acrylate and 2kg of arylamine, adding into a reaction kettle, and uniformly stirring at 80 ℃ for 9 hours to obtain the stable polyurethane acrylic prepolymer A1.
Preparing a polyurethane acrylate prepolymer: weighing 10kg of isophorone diisocyanate, 30kg of polyether polyol, 18kg of butyl acrylate and 4kg of arylamine, adding into a reaction kettle, and uniformly stirring at 70 ℃ for 5 hours to obtain the stable polyurethane acrylic prepolymer A2.
Preparing a polyurethane acrylate prepolymer: weighing 10kg of isophorone diisocyanate, 40kg of polyether polyol, 20kg of butyl acrylate and 6kg of arylamine, adding into a reaction kettle, and uniformly stirring at 90 ℃ for 4 hours to obtain the stable polyurethane acrylic prepolymer A3.
Preparing a polyurethane acrylate prepolymer: weighing 10kg of isophorone diisocyanate, 50kg of polyether polyol, 10kg of butyl acrylate and 8kg of arylamine, adding the materials into a reaction kettle, and uniformly stirring at the temperature of 60 ℃ for 6 hours to obtain the stable polyurethane acrylic prepolymer A4.
Preparing an allyl alcohol complex: firstly, the polyoxypropylene alcohol is vacuumized and dehydrated for 30min at the temperature of 120 ℃. And then, under the protection of nitrogen, dropwise adding polyoxypropylene alcohol into excessive diisocyanate while stirring (the molar ratio of (-NCO to-OH groups is 2:1), adding a small amount of catalyst dibutyltin dilaurate, controlling the reaction temperature at 95-100 ℃, stopping heating after 1h of reaction, cooling and discharging to obtain an allyl alcohol complex, namely the component B.
Weighing the component C:
c1 kg of 5-tert-butyl-4-hydroxy-2-methylphenylsulfanyl (K300), 2kg of 2-hydroxy-2-methyl-1-phenylmethanone and 2kg of pentaerythritol triacrylate.
C2 kg of 5-tert-butyl-4-hydroxy-2-methylphenylsulfanyl (K300), 3kg of 2-hydroxy-2-methyl-1-phenylmethanone and 5kg of pentaerythritol triacrylate.
C3 kg of 5-tert-butyl-4-hydroxy-2-methylphenylsulfanyl (K300), 4kg of 2-hydroxy-2-methyl-1-phenylmethanone and 4kg of pentaerythritol triacrylate.
C2 kg of 5-tert-butyl-4-hydroxy-2-methylphenylsulfanyl (K300), 5kg of 2-hydroxy-2-methyl-1-phenylmethanone and 3kg of pentaerythritol triacrylate.
Example 1
Weighing the following materials in parts by weight: 70kg of component A, 20kg of component B and 30kg of component C.
The photolytic adhesive pressure sensitive adhesive is prepared by mixing the component A1 and the component B, mixing them uniformly, adding the component C1, and mixing them uniformly at 30-50 deg.C to obtain the photolytic adhesive pressure sensitive adhesive of example 1.
The photolytic adhesive pressure-sensitive adhesive tape is prepared by coating the photolytic adhesive pressure-sensitive adhesive of example 1 on a substrate and attaching a release film to the substrate to prepare the photolytic adhesive sub-sensitive adhesive tape of example 1.
The preparation methods of the examples 1 to 20 are the same, and the specific formulations are as follows:
the photolytic adhesive subbing tapes of examples 1-20 were subjected to a pressure sensitive adhesive 180 ° peel strength test:
according to GB/T2792-2014 180-degree peel strength test method of the pressure-sensitive adhesive tape, an electronic universal tester is adopted for measurement (the adhered material is a standard test steel plate, and the peeling rate is 300 mm/min).
The test results were as follows:
a second part: the ABC components were combined in different combinations to give examples 21-80 as follows:
the above examples were tested to find that the peel strength after UV hook irradiation changed closer to examples 1-20.
Comparative example 1: referring to example 1, the A1 component and the C1 component were mixed without using the B component and mixed uniformly at a temperature of 30 to 50 ℃ to prepare the pressure sensitive adhesive of comparative example 1.
Comparative example 2: referring to example 6, the A1 component and the C2 component were mixed without using the B component and mixed uniformly at a temperature of 30 to 50 ℃ to prepare a pressure sensitive adhesive of comparative example 2.
Comparative example 3: referring to example 11, without using the B component, the A1 component and the C3 component were mixed and mixed uniformly at a temperature of 30 to 50 ℃ to prepare a pressure sensitive adhesive of comparative example 3.
Comparative example 4: referring to example 6, the A1 component and the C4 component were mixed without using the B component and mixed uniformly at a temperature of 30 to 50 ℃ to prepare a pressure sensitive adhesive of comparative example 4.
The pressure-sensitive adhesives of comparative examples 1 to 4 were subjected to performance tests, and the results were as follows:
the test results are given in the following table:
the inventor finds that compared with comparative examples 1-4, the viscosity of the pressure-sensitive adhesive changes before and after ultraviolet irradiation in examples 1-20, the examples change greatly, and the comparative examples also change to a certain extent, but the photolysis effect of the examples is high, the test effect of examples 21-80 is closer to that of examples 1-20, specific data is not counted, and if the examiner approves, the inventor will quote subsequent test data. It can be seen from the above data that examples 1-20 of the present invention provide significant advantages over the prior art.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (7)
1. The photolytic pressure-sensitive adhesive comprises a component A, a component B and a component C in the following formula, and is characterized in that: the component A comprises a polyurethane acrylate prepolymer, the component B is an allyl alcohol complex, the component C is an antioxidant 5-tert-butyl-4-hydroxy-2-methyl phenyl sulfide (K300), an initiator is 2-hydroxy-2-methyl-1-phenyl ketone, and an auxiliary agent pentaerythritol triacrylate, wherein the weight part ratio of the component A to the component C is 1: 2-5: 2-5, wherein the weight part ratio of the component A, the component B and the component C is as follows: 70: 20-29: 1-10.
2. The photolytic pressure sensitive adhesive of claim 1, wherein: the preparation method of the polyurethane acrylate prepolymer comprises the following steps: adding isophorone diisocyanate, polyether polyol, butyl acrylate and arylamine in parts by weight into a reaction kettle, and uniformly stirring at the temperature of 60-90 ℃ for 3-8 hours to obtain the stable polyurethane acrylic prepolymer.
3. The photolytic pressure sensitive adhesive of claim 2, wherein: the adhesive comprises isophorone diisocyanate, polyether polyol, butyl acrylate and arylamine in a weight portion ratio of 10:20-50:10-20: 1-3.
4. The photolytic pressure sensitive adhesive of claim 2, wherein: the adhesive comprises isophorone diisocyanate, polyether polyol, butyl acrylate and arylamine in a weight portion ratio of 10:22-50:12-20: 1-3.
5. The photolytic pressure sensitive adhesive of claim 1, wherein: the preparation method of the propenol complex comprises the following steps: firstly, the polyoxypropylene alcohol is vacuumized and dehydrated for 30min at the temperature of 120 ℃. And then, under the protection of nitrogen, dropwise adding polyoxypropylene alcohol into excessive diisocyanate while stirring (the molar ratio of (-NCO to-OH groups is 2:1), adding a small amount of catalyst dibutyltin dilaurate, controlling the reaction temperature at 95-100 ℃, stopping heating after 1h of reaction, cooling and discharging to obtain the allyl alcohol complex.
6. The photolytic pressure sensitive adhesive of claim 1, wherein: the preparation method comprises the following steps: 1) preparing a component A: adding isophorone diisocyanate, polyether polyol, butyl acrylate and arylamine into a reaction kettle according to parts by weight, and uniformly stirring at the temperature of 60-90 ℃ for 3-8 hours to obtain a stable polyurethane acrylic prepolymer; 2) preparing a component B: firstly, the polyoxypropylene alcohol is vacuumized and dehydrated for 30min at the temperature of 120 ℃. Then, under the protection of nitrogen, dropwise adding polyoxypropylene alcohol into excessive diisocyanate while stirring (-the molar ratio of NCO to-OH groups is 2:1), adding a small amount of catalyst dibutyltin dilaurate, controlling the reaction temperature at 95-100 ℃, stopping heating after reacting for 1h, cooling and discharging to obtain an allyl alcohol complex; 3) and mixing the component A and the component B uniformly, adding the component C, and mixing uniformly at the temperature of 30-50 ℃ to prepare the photolysis pressure-sensitive adhesive.
7. A photolytic adhesive sub-sensitive adhesive tape is prepared by the following steps: the photolytic pressure sensitive adhesive prepared according to claim 6 is coated on a substrate, dried at 40-50 ℃ for 10-20min, and attached to a release film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110065512.6A CN112745799A (en) | 2021-01-19 | 2021-01-19 | Photolytic adhesive pressure-sensitive adhesive and photolytic adhesive sub-sensitive adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110065512.6A CN112745799A (en) | 2021-01-19 | 2021-01-19 | Photolytic adhesive pressure-sensitive adhesive and photolytic adhesive sub-sensitive adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112745799A true CN112745799A (en) | 2021-05-04 |
Family
ID=75652394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110065512.6A Withdrawn CN112745799A (en) | 2021-01-19 | 2021-01-19 | Photolytic adhesive pressure-sensitive adhesive and photolytic adhesive sub-sensitive adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112745799A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113698900A (en) * | 2021-07-22 | 2021-11-26 | 张秋月 | Reusable pressure-sensitive adhesive and preparation method thereof |
-
2021
- 2021-01-19 CN CN202110065512.6A patent/CN112745799A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113698900A (en) * | 2021-07-22 | 2021-11-26 | 张秋月 | Reusable pressure-sensitive adhesive and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100469758B1 (en) | Energy-curing pressure-sensitive adhesive composition and its use method | |
| CN104837942B (en) | Holding membrane forming film | |
| CN103571367B (en) | Pressure-sensitive adhesive for wafer grinding and preparation method thereof | |
| CN102533147B (en) | Dicing die bonding film, semiconductor wafer, and semiconductor device | |
| CN110903790A (en) | UV (ultraviolet) viscosity-reducing composition and UV viscosity-reducing adhesive tape with same | |
| CN106978130B (en) | UV pressure-sensitive adhesive for label identification | |
| CN108611010A (en) | A kind of two-sided UV Protection glues band of easy-clear and preparation method thereof | |
| EP0902071B1 (en) | Thermosetting pressure-sensitive adhesive and adhesive sheets made by using the same | |
| CN114196354B (en) | Carboxyl-containing viscose-reducing composition and preparation method and application thereof | |
| CN110699019A (en) | High-temperature-resistant acrylate pressure-sensitive adhesive and double-sided adhesive without base material | |
| CN104797423A (en) | Sheet provided with curable resin film-forming layer and method for manufacturing semiconductor device using sheet | |
| CN114015388A (en) | Hydroxyl-containing viscose reducing agent composition and preparation method and application thereof | |
| CN114015405A (en) | High-performance polyurethane pressure-sensitive adhesive and preparation method and application thereof | |
| CN112745799A (en) | Photolytic adhesive pressure-sensitive adhesive and photolytic adhesive sub-sensitive adhesive tape | |
| CN105658422B (en) | Resin film formation sheet material | |
| CN110655834A (en) | PET (polyethylene terephthalate) base film primer, modified PET film and adhesive tape for CMOS (complementary metal oxide semiconductor) chip cutting process as well as preparation method and application of adhesive tape | |
| CN113416497A (en) | Segmented thermal viscosity reduction protective film and preparation method thereof | |
| WO2015079903A1 (en) | Surface-protecting adhesive sheet, and method for using surface-protecting adhesive sheet | |
| CN117089014A (en) | Acrylate copolymer, adhesive and protective film | |
| CN113583575A (en) | Photolytic-adhesive pressure-sensitive adhesive and preparation method thereof | |
| CN115926690A (en) | Viscosity-reducing adhesive composition, viscosity-reducing adhesive tape and preparation method thereof | |
| CN109852303A (en) | A kind of high temperature resistant double faced adhesive tape and preparation method | |
| CN115637116A (en) | High-temperature-resistant low-climbing protective film and preparation method thereof | |
| CN115820173A (en) | Glue for die-cutting PET protective film and preparation method of glue | |
| TWI627250B (en) | Adhesive composition and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20210504 |