CN112192056A - Method and device for gas-liquid assisted laser machining of micropores - Google Patents
Method and device for gas-liquid assisted laser machining of micropores Download PDFInfo
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- CN112192056A CN112192056A CN202011057513.8A CN202011057513A CN112192056A CN 112192056 A CN112192056 A CN 112192056A CN 202011057513 A CN202011057513 A CN 202011057513A CN 112192056 A CN112192056 A CN 112192056A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
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Abstract
The invention discloses a method and a device for processing micropores by gas-liquid auxiliary laser. The invention forms a complete set of processing method, realizes high-quality processing of laser micropores by gas and liquid assisted laser micropore processing, reduces adhesion of splashes, reduces a material heat affected zone (partial heat is taken away by gas heat dissipation cooling and cooling liquid heat dissipation cooling, heat accumulation is reduced), and improves the surface quality of materials.
Description
Technical Field
The invention belongs to the field of special processing, and particularly relates to a method and a device for processing micropores by gas-liquid assisted laser.
Background
At present, laser processing mainly depends on gas assistance to carry out micropore processing, different auxiliary processing gases (oxygen, hydrogen, argon, nitrogen, compressed air and the like) are selected according to the characteristics of processing materials, and the main purposes are to accelerate material gasification and melting, or remove slag, reduce adhesion of splashes, reduce a material heat affected zone (partial heat is taken away by gas heat dissipation, reduce heat accumulation), reduce material surface and pore wall oxidation and improve the material surface processing quality and the pore wall quality. However, the gas assistance effect is single, and the problems that the local overheating and color change of the material caused by heat accumulation, the expansion of a heat affected zone, the splashing and adhesion of the molten liquid on the hole wall or the surface of the material and the like cannot be well solved, so that the processing quality is seriously influenced.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a method and a device for processing micropores by gas-liquid assisted laser, which form a complete set of processing method, realize high-quality processing of the laser micropores by gas-liquid assisted laser micropore processing, reduce adhesion of splashes, reduce a material heat affected zone (take away part of heat by gas heat dissipation cooling and cooling liquid heat dissipation cooling, reduce heat accumulation), and improve the surface quality of the material.
In order to solve the technical problems, the invention is realized by the following technical scheme:
a gas-liquid assisted laser micropore machining method is characterized in that a laser beam is emitted to machine a position to be machined, an auxiliary gas jet machining position coaxial with the laser beam is adopted, and an auxiliary liquid jet machining position forming a certain included angle with the axis of the laser beam is adopted.
Further, the processing parameters are as follows: the laser pulse width is 0.5-0.8 ms, the laser pulse frequency is 60-100 HZ, the laser power percentage is 70-90%, the laser defocusing amount is-1 mm, and the feeding speed is 60-80 mm/min; the gas pressure is 0.6-0.8 MPa, and the gas flow is 0.8-1.2Nm3The gas switch time interval is 0-1 s, wherein 0 represents normally open; the liquid flow is 0.8-1.5L/min, the liquid pressure is 6-12 MPa, the liquid temperature is 15-20 ℃, and the liquid switching time interval is 0-10 s, wherein 0 represents a normally open state.
Further, the auxiliary liquid is sprayed in a columnar shape or a mist shape to the processing position.
A gas-liquid assisted laser micropore machining device comprises a laser nozzle head, wherein a laser beam channel for emitting laser beams is formed in the center of the laser nozzle head;
a plurality of auxiliary gas channels are uniformly distributed on the head part of the laser nozzle around the axis of the laser beam channel, one end of each auxiliary gas channel is used for inputting auxiliary gas, the other end of each auxiliary gas channel is communicated with the laser beam channel, and the auxiliary gas and the laser beam can be coaxially sprayed at a processing position through the laser beam channel;
the laser nozzle head is wound around a plurality of auxiliary liquid channels are uniformly distributed on the axis of the laser beam channel, one end of each auxiliary liquid channel is used for inputting auxiliary liquid, the other end of each auxiliary liquid channel is connected with a nozzle, each nozzle is arranged at a certain included angle with the axis of the laser beam channel, and the auxiliary liquid can be sprayed at a processing position through the nozzles.
Further, each of the nozzles is a columnar nozzle capable of ejecting a columnar liquid.
Further, each of the nozzles is a mist nozzle capable of spraying a mist liquid.
Furthermore, each columnar nozzle is detachably connected with a mist nozzle.
Furthermore, the included angle between the axis of each cylindrical nozzle and the axis of the laser beam channel is 35-45 degrees; the included angle between the axis of each mist nozzle and the axis of the laser beam channel is 35-45 degrees.
The device further comprises a first control module and a second control module, wherein the first control module is used for controlling the auxiliary gas to be output according to preset parameters, and the second control module is used for controlling the auxiliary liquid to be output according to preset parameters.
Further, the first control module comprises a first analog quantity control module and a first digital quantity control module, the first analog quantity control module is used for controlling the gas flow and the gas pressure parameters, and the first digital quantity control module is used for controlling the gas on-off and gas on-off time interval parameters; the second control module comprises a second analog quantity control module and a second digital quantity control module, the second analog quantity control module is used for controlling liquid flow, liquid pressure and liquid temperature parameters, and the second digital quantity control module is used for controlling liquid on and off and liquid on-off time interval parameters.
Compared with the prior art, the invention has at least the following beneficial effects: the single gas is mainly used for removing slag, particles, dust and local material cooling in the hole, preventing the laser processing area from being oxidized and the like as protective gas, but in actual processing, the single gas is used for assisting and cannot meet the requirement, more large burrs (1-2 mm), a remelted layer (0.04-0.08 mm), a heat affected zone (5-8 mm at the periphery of the hole) can be generated in processing, and the edge of the hole is unclear. The invention relates to a method for processing micropores by gas-liquid assisted laser, which comprises the steps of emitting a laser beam to process a position to be processed, simultaneously adopting an auxiliary gas jet processing position coaxial with the laser beam, and simultaneously adopting an auxiliary liquid jet processing position forming a certain included angle with the axis of the laser beam, processing the micropores by gas-liquid assisted laser, wherein the processing quality is obviously improved, the burr quantity is reduced, the burr is reduced to 0.1-0.2 mm, the remelted layer is 0.02-0.03 mm, the heat affected zone is reduced to 2-3 mm of the periphery of the hole, and the hole edge is clear; the gas-liquid auxiliary processing improves the laser energy, obviously improves the hole processing depth and the processing efficiency, obviously improves the processing quality, reduces the using amount (gas flow) of gas (argon, helium and high-pressure air) and reduces the using cost. Therefore, the invention realizes the high-quality processing of the laser micropores by gas and liquid-assisted laser processing of the micropores, reduces the adhesion of splashes, reduces the heat affected zone of the material (takes away part of heat through gas heat dissipation cooling and auxiliary liquid cooling liquid heat dissipation cooling, reduces heat accumulation), improves the surface quality of the material, reduces dust flying and reduces air pollution to the processing environment.
Further, under the processing parameters provided by the invention, the laser parameters, the gas parameters and the liquid parameters are optimally matched, and the processing quality of the small holes is controlled in a gas-liquid auxiliary mode while the laser processing parameters are controlled. On the basis of optimal matching of gas-liquid auxiliary parameters, laser processing energy can be further provided, and the processing efficiency of small holes is improved. The laser parameters, the gas parameters and the liquid parameters are optimally matched, so that the number of burrs is reduced, the burrs are reduced, the thickness of a remelting layer is reduced, a heat affected zone is reduced, hole edges are clear, the processing quality is improved, the gas consumption is reduced, and the use cost is reduced.
Further, different processing materials are targeted. The thickness of the processed plate, the diameter of the small hole and the shape of the small hole are selected, and different liquid injection modes are selected. When the material is stainless steel, high-temperature alloy and titanium alloy and the plate thickness is thicker (more than 2mm) and the hole is larger (more than phi 2mm), columnar injection is adopted, so that the quantity of burrs, the size of the burrs, the thickness of a remelted layer and a heat affected zone can be effectively controlled; when the material is carbon steel material and has thin plate thickness (less than or equal to 2mm) and small holes (less than or equal to phi 2mm), the atomized spray is adopted instead of columnar spray, so that the phenomenon that the material property is changed due to the heat treatment effect such as quenching and the like caused by the combined action of the liquid quantity and laser energy after the liquid quantity is increased is prevented, the atomized spray and the spray can better play the atomizing adsorption effect in the processing, and the quantity, the size, the thickness and the heat affected zone of burrs are better controlled.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of an apparatus for gas-liquid assisted laser machining of micro-holes according to the present invention;
FIG. 2 is a schematic view of the control principle of the apparatus for gas-liquid assisted laser processing of micro-holes according to the present invention;
FIG. 3 is a schematic diagram of the connection flow of control hardware of a device for gas-liquid assisted laser processing of micro-holes according to the present invention.
1-laser beam channel; 2-an auxiliary gas channel; 3-an auxiliary liquid channel; 4-laser nozzle head; 5-a cylindrical nozzle; 6-mist spray nozzle; 7-an auxiliary liquid; 8-an auxiliary gas; 9-parts; 10-microwell.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In one embodiment of the present invention, a method for gas-liquid assisted laser machining of a micropore includes:
installing a positioning part: mounting and positioning parts on laser processing equipment through a tool;
processing micropores by laser: utilize the laser processing equipment to launch the position of treating on the laser beam processing part, adopt simultaneously with the coaxial supplementary gaseous jet machining position of laser beam, adopt simultaneously with the axis of laser beam become the supplementary liquid jet machining position of certain contained angle, specific, the laser processing parameter is: the laser pulse width is 0.5-0.8 ms, the laser pulse frequency is 60-100 HZ, the laser power percentage is 70-90%, the laser defocusing amount is-1 mm, and the feeding speed is 60-80 mm/min; the output assist gas parameters were: the gas pressure is 0.6-0.8 MPa, and the gas flow is 0.8-1.2 Nm3The gas switch time interval is 0-1 s, wherein 0 represents normally open; the auxiliary gas is oxygen,Hydrogen, argon, nitrogen, compressed air, or the like; the output auxiliary liquid parameters are: the liquid flow is 0.8-1.5L/min, the liquid pressure is 6-12 MPa, the liquid temperature is 15-20 ℃, and the liquid switching time interval is 0-10 s, wherein 0 represents a normally open state; the auxiliary liquid is cooling liquid medium (purified water);
cleaning the surface of the part: blowing water stains and pollutants on the surface of the part by using a compressed air gun;
and (3) checking the micropores of the part: and (6) checking the processing quality of the micropores.
In the present invention, the auxiliary liquid may be sprayed in a columnar form or in a mist form to the processing position.
As shown in fig. 1, the device for processing micropores by gas-liquid assisted laser of the present invention comprises a laser nozzle head 4, wherein a laser beam channel 1 for emitting a laser beam is disposed at the center of the laser nozzle head 4; a plurality of auxiliary gas channels 2 are uniformly distributed on the laser nozzle head part 4 around the axis of the laser beam channel 1, one end of each auxiliary gas channel 2 is used for inputting auxiliary gas, the other end of each auxiliary gas channel is communicated with the laser beam channel 1, the auxiliary gas can be coaxially sprayed with a laser beam at a processing position through the laser beam channel 1, namely, the auxiliary gas and the laser beam form coaxial blowing, and the blown gas is as the auxiliary gas 8 in the figure; in the present embodiment, two auxiliary gas channels 2 are uniformly distributed on the laser nozzle head 4 around the axis of the laser beam channel 1. A plurality of auxiliary liquid channels 3 are uniformly distributed on the laser nozzle head 4 around the axis of the laser beam channel 1, one end of each auxiliary liquid channel 3 is used for inputting auxiliary liquid, the other end of each auxiliary liquid channel 3 is connected with a nozzle, the axis of each nozzle and the axis of the laser beam channel 1 form a certain included angle, and the auxiliary liquid can be sprayed at a processing position through the nozzles; in the present embodiment, two auxiliary liquid channels 3 are uniformly distributed on the laser nozzle head 4 around the axis of the laser beam channel 1.
Preferably, each nozzle is a columnar nozzle 5 capable of ejecting columnar liquid or each nozzle is a mist nozzle 6 capable of ejecting mist-like liquid.
As shown in fig. 1, in the present embodiment, the other end of each auxiliary liquid channel 3 is connected to a cylindrical nozzle 5, and each cylindrical nozzle 5 is detachably connected to a mist nozzle 6, so that the auxiliary liquid 7 can be selectively sprayed by using the cylindrical nozzle 5 or the mist nozzle 6 according to the material processing characteristics (material metal, non-metal type, material thickness, material surface quality) and the laser processing parameters (pulse width, repetition frequency, laser power), the auxiliary processing mode is flexible, and the process selectivity is enhanced.
As shown in fig. 1, the included angle between the axis of each columnar nozzle 5 and the axis of the laser beam channel 1 is 35 to 45 degrees, the included angle between the axis of each mist nozzle 6 and the axis of the laser beam channel 1 is 35 to 45 degrees, and the adjustment setting is specifically performed according to the actual situation.
According to the invention, a PLC control system is used for controlling the output of each parameter, as shown in FIG. 2, the PLC control system controls a first control module and a second control module, the first control module is used for controlling the output of the auxiliary gas according to preset parameters, namely, the first control module is used for realizing the control of the parameters of the auxiliary gas; the second control module is used for controlling the auxiliary liquid to be output according to preset parameters, namely the second control module is used for realizing the control of the parameters of the auxiliary liquid (cooling liquid). Specifically, the first control module comprises a first analog quantity control module and a first digital quantity control module, the first analog quantity control module is used for controlling the gas flow and gas pressure parameters, and the first digital quantity control module is used for controlling the gas on-off and gas on-off time interval parameters; the second control module comprises a second analog quantity control module and a second digital quantity control module, the second analog quantity control module is used for controlling liquid flow, liquid pressure and liquid temperature parameters, and the second digital quantity control module is used for controlling liquid on and off and liquid on and off time interval parameters.
Through a PLC control system, the control of the parameters (gas flow, gas pressure, gas on and off and gas on and off time) of gas and the parameters (cooling liquid flow, cooling liquid pressure, cooling liquid temperature, cooling liquid on and off and cooling liquid on and off time) of auxiliary liquid (cooling liquid) in the device for processing micropores by gas-liquid assisted laser is realized, and the accurate control of the parameters is realized.
Of course, the invention can select different auxiliary modes (gas-assisted, liquid-assisted and gas-liquid compound-assisted) by the PLC control system according to the material processing characteristics and the laser processing parameters besides the gas-liquid compound-assisted. In the gas-liquid composite auxiliary process, any gas-liquid composite auxiliary processing alternative combination can be realized through the switching time of the cooling liquid and the switching time of the gas, and the process selectivity is further enhanced.
The control hardware connection flow of the gas-liquid assisted laser micropore machining device is shown in fig. 3, a PLC (programmable logic controller) is connected with an auxiliary gas system through a first control module, the auxiliary gas system is connected through a pressure-bearing gas pipeline, a gas flowmeter is connected on the pressure-bearing gas pipeline through a first electromagnetic valve, a gas pressure gauge is controlled through a second electromagnetic valve, and finally auxiliary gas with controllable parameter quantity is connected into an auxiliary gas system access end (namely the input end of an auxiliary gas channel 2 in fig. 1) of the gas-liquid assisted laser micropore machining device through the pressure-bearing gas pipeline, so that auxiliary gas laser micropore machining is realized. The PLC controller is connected with the auxiliary liquid system through the second control module, the auxiliary liquid system is connected through a pressure-bearing liquid pipeline, a liquid flow meter is connected on the pressure-bearing liquid pipeline through a third electromagnetic valve, a liquid pressure gauge is connected through a fourth electromagnetic valve, a temperature sensor is connected to measure the liquid temperature, and finally, liquid with controllable parameter quantity is connected into an auxiliary cooling liquid system access end (namely the input end of an auxiliary liquid channel 3 in the figure 1) of the gas-liquid auxiliary laser micropore machining device through the pressure-bearing liquid pipeline, so that the laser micropore machining of the auxiliary cooling liquid is realized.
The PLC is connected with relevant control hardware through a first control module and a second control module, and after the auxiliary gas and the auxiliary liquid are connected through a pressure-bearing pipeline, the auxiliary gas and the auxiliary liquid are finally respectively connected to an auxiliary gas system connecting end (the input end of an auxiliary gas channel 2 in the figure 1) and an auxiliary cooling liquid system connecting end (the input end of an auxiliary liquid channel 3 in the figure 1) of the gas-liquid auxiliary laser micropore machining device (shown in the figure 1), so that gas-liquid auxiliary laser micropore machining is realized.
In addition, according to the invention, different auxiliary modes can be selected according to the material processing characteristics (material metal, nonmetal type, material thickness and material surface quality) and laser processing parameters (pulse width, repetition frequency and laser power), gas assistance (oxygen, hydrogen, argon, nitrogen, compressed air and the like), liquid assistance (high-pressure cooling water) and gas-liquid composite assistance can be selected, different auxiliary processing modes such as cooling liquid mist spray assistance or cooling liquid water column spray assistance can be selected during liquid assistance, the auxiliary processing modes are flexible, the process selectivity is enhanced, and the high-quality laser micropore processing is realized.
Taking a certain type of screen processing as an example: 2000 micro holes with the diameter of 0.5mm are concentrically and circumferentially distributed on the sieve with the diameter of 100mm, the wall thickness delta of the sieve is 0.5mm, and the sieve is made of high-temperature alloy materials, so that the surface of the sieve is required to be free from splashing adhesion, burn and discoloration and deformation caused by no heat accumulation. The method comprises the following steps:
(1) installing a positioning part: and mounting and positioning the part on the laser processing equipment through a tool.
(2) Determining laser processing parameters: the processing parameters are set in the program as follows:
the laser processing main technological parameters are as follows: 1) determining the laser pulse width to be 0.6 ms; 2) determining the pulse frequency to be 100 HZ; 3) determining the percentage of laser power to be 85%; 4) determining the defocusing amount to be 0 mm; 5) the feed rate was determined to be 80 mm/min.
(3) Determining gas-liquid auxiliary processing parameters: reasonable gas-liquid auxiliary processing parameters are set through a PLC as follows:
the main technological parameters of gas-liquid auxiliary processing are as follows: 1) the gas-liquid auxiliary mode is gas-liquid composite auxiliary; 2) the gas auxiliary gas source is argon; 3) the gas pressure is 0.8 MPa; 4) gas flow rate of 0.8Nm3S; 5) the gas switch time interval is 0, namely the gas switch is normally opened; 6) the auxiliary liquid cooling liquid medium is purified water; 7) the flow rate of the cooling liquid is 0.8L/min; 8) the pressure of the cooling liquid is 6 MPa; controlling the temperature of the cooling liquid to be 15-20 ℃; 9) the liquid switch time interval is 0, namely the liquid switch is normally opened; 10) cooling liquid injection mode: spraying in the form of water mist.
(4) Processing micropores by laser: the micro-holes were positioned and machined using a laser machining apparatus (the laser machining nozzle is a gas-liquid assisted laser machining device (shown in fig. 1)) for machining micro-holes.
(5) Cleaning the surface of the part: and blowing water stains and pollutants on the surface of the part by using a compressed air gun.
(6) And (3) checking the micropores of the part: and (6) checking the processing quality of the micropores.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A method for processing micropores by gas-liquid assisted laser is characterized in that a laser beam is emitted to process a position to be processed, an auxiliary gas jet processing position coaxial with the laser beam is adopted, and an auxiliary liquid jet processing position forming a certain included angle with the axis of the laser beam is adopted.
2. A method of gas-liquid assisted laser machining of micro-holes as claimed in claim 1, wherein the machining parameters are as follows: the laser pulse width is 0.5-0.8 ms, the laser pulse frequency is 60-100 HZ, the laser power percentage is 70-90%, the laser defocusing amount is-1 mm, and the feeding speed is 60-80 mm/min; the gas pressure is 0.6-0.8 MPa, and the gas flow is 0.8-1.2 Nm3The gas switch time interval is 0-1 s, wherein 0 represents normally open; the liquid flow is 0.8-1.5L/min, the liquid pressure is 6-12 MPa, the liquid temperature is 15-20 ℃, and the liquid switching time interval is 0-10 s, wherein 0 represents a normally open state.
3. The method of claim 1, wherein the auxiliary liquid is sprayed in a columnar shape or a mist shape to the machining position.
4. The device for processing the micropores by the gas-liquid assisted laser is characterized by comprising a laser nozzle head (4), wherein the center of the laser nozzle head (4) is provided with a laser beam channel (1) for emitting laser beams;
a plurality of auxiliary gas channels (2) are uniformly distributed on the laser nozzle head (4) around the axis of the laser beam channel (1), one end of each auxiliary gas channel (2) is used for inputting auxiliary gas, the other end of each auxiliary gas channel is communicated with the laser beam channel (1), and the auxiliary gas and the laser beam can be coaxially sprayed at a processing position through the laser beam channel (1);
wind on laser nozzle head (4) a plurality of supplementary liquid passageway (3), every have been seted up to the axis equipartition of laser beam passageway (1) the one end of supplementary liquid passageway (3) is used for inputing supplementary liquid, and the other end is connected with the nozzle, every the axis of nozzle with the axis of laser beam passageway (1) becomes certain contained angle, and supplementary liquid passes through the nozzle can spray at the processing position.
5. A gas-liquid assisted laser micro-hole machining apparatus according to claim 4, wherein each of the nozzles is a columnar nozzle (5) capable of ejecting a columnar liquid.
6. A device for gas-liquid assisted laser machining of micro-holes according to claim 4, characterized in that each of said nozzles is a mist nozzle (6) capable of spraying a mist of liquid.
7. A device for gas-liquid assisted laser machining of micro-holes according to claim 5, characterized in that each of said cylindrical nozzles (5) is detachably connected with a mist nozzle (6).
8. A gas-liquid assisted laser micro-hole machining device according to claim 7, wherein the included angle between the axis of each cylindrical nozzle (5) and the axis of the laser beam channel (1) is 35-45 °; the included angle between the axis of each mist nozzle (6) and the axis of the laser beam channel (1) is 35-45 degrees.
9. The apparatus of claim 4, further comprising a first control module and a second control module, wherein the first control module is configured to control the output of the assist gas according to a preset parameter, and the second control module is configured to control the output of the assist liquid according to a preset parameter.
10. The apparatus of claim 9, wherein the first control module comprises a first analog quantity control module for controlling the gas flow and gas pressure parameters and a first digital quantity control module for controlling the gas on/off and gas on/off time interval parameters; the second control module comprises a second analog quantity control module and a second digital quantity control module, the second analog quantity control module is used for controlling liquid flow, liquid pressure and liquid temperature parameters, and the second digital quantity control module is used for controlling liquid on and off and liquid on-off time interval parameters.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116604395A (en) * | 2023-06-13 | 2023-08-18 | 苏州市斯可源自动化科技有限公司 | Drilling and tapping machine and system |
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| CN103212845A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Coaxial water jet device used for laser micro machining of thin-walled tube |
| CN103116308A (en) * | 2013-01-28 | 2013-05-22 | 江苏益林金刚石工具有限公司 | PLC (programmable logic control) system of radiofrequency slab CO<2> laser device |
| CN103358027A (en) * | 2013-07-16 | 2013-10-23 | 桂林电子科技大学 | Laser processing method and system assisted by water jet and gas jet |
| KR20180070981A (en) * | 2016-12-19 | 2018-06-27 | 에이티아이 주식회사 | Laser processing apparatus |
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| CN116604395A (en) * | 2023-06-13 | 2023-08-18 | 苏州市斯可源自动化科技有限公司 | Drilling and tapping machine and system |
| CN116604395B (en) * | 2023-06-13 | 2023-11-17 | 苏州市斯可源自动化科技有限公司 | Drilling and tapping machine and system |
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